Heat dissipation device of LRM module

Abstract

The utility model provides a heat dissipation device of an LRM module, and belongs to the technical field of LRM modules in electronic equipment, the heat dissipation device specifically comprises a connecting screw rod, a limiting nut and a plurality of wedge blocks, the plurality of wedge blocks are sequentially arranged on the connecting screw rod in a sleeving manner, the limiting nut is arranged at the end part of the connecting screw rod in a sleeving manner, the contact surface of each wedge block and the adjacent wedge block is set to be an inclined surface, and the inclined surface is arranged at the end part of the connecting screw rod. One side face, in the axis direction of the connecting screw, of each wedge-shaped block is arranged to be a locking area, the wedge-shaped blocks are locked by rotating the limiting nuts, the other side face, in the axis direction of the connecting screw, of each wedge-shaped block is connected with at least one heat conduction connecting structure, and the ends, away from the wedge-shaped blocks, of the heat conduction connecting structures are connected with heat conduction structures. Each heat conduction structure is connected with at least one heat conduction connection structure, and the heat conduction structures are fixed to the hot spot positions of the LRM modules. The heat conduction efficiency of the concentrated heating part of the LRM module is improved, the performance is excellent, and the structural reliability is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LRM module in electronic equipment, and particularly relates to a heat dissipation device of LRM module. BACKGROUND

[0002] With the development of high-performance and high-integration electronic equipment technology, the heat dissipation design problem of concentrated heat source under the structure of LRM (locally replaceable module) module is becoming more and more serious. The LRM module uses high-performance and high-integration chips, and at the same time, a high-temperature hot spot is formed inside, which greatly reduces the reliability of the product. Therefore, it is necessary to increase the heat passage on the basis of ensuring the locking force of the LRM module to reduce the hot spot temperature in the LRM module, and thus improve the reliability of the product. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides a heat dissipation device of LRM module, which at least partially solves the heat dissipation design problem of concentrated heat spot under the structure of LRM module in the prior art.

[0004] The present application provides a heat dissipation device of LRM module, which comprises a connecting screw, a limiting nut and a plurality of wedge-shaped blocks. The plurality of wedge-shaped blocks are sequentially sleeved on the connecting screw, and the limiting nut is sleeved on the end of the connecting screw. The contact surface of each wedge-shaped block and the adjacent wedge-shaped block is an inclined surface. One side of each wedge-shaped block in the axial direction of the connecting screw is a locking area. The wedge-shaped block is locked by rotating the limiting nut. The other side of each wedge-shaped block in the axial direction of the connecting screw is connected to at least one heat conduction connecting structure. The heat conduction connecting structure is connected to a heat conduction structure at one end away from the wedge-shaped block. Each heat conduction structure is connected to at least one heat conduction connecting structure. The heat conduction structure is fixed to the hot spot position on the LRM module.

[0005] According to a specific implementation manner of the present application, the heat conduction connecting structure is a flexible heat conduction connecting structure.

[0006] According to a specific implementation manner of the present application, the flexible heat conduction connecting structure is a metal woven heat conduction rope, a high-heat-conduction metal film or a flexible heat pipe.

[0007] According to a specific implementation manner of the present application, the other side of each wedge-shaped block in the axial direction of the connecting screw is provided with a vertical extension edge perpendicular to the side. The heat conduction connecting structure is connected through the extension edge.

[0008] According to a specific implementation manner of the present application, the heat conduction structure is a heat conduction block.

[0009] According to a specific implementation manner of the embodiment of the present application, the heat conduction block is provided with a mounting hole, and the heat conduction block is fixed at the hot spot position on the LRM module through cooperation of the mounting hole and the connecting piece.

[0010] According to a specific implementation manner of the embodiment of the present application, the connecting manner of the heat conduction connecting structure and the heat conduction structure is set as screw connection, welding, bonding or riveting.

[0011] According to a specific implementation manner of the embodiment of the present application, the wedge-shaped blocks are set as three blocks.

[0012] Beneficial effects:

[0013] The heat dissipation device of the LRM module in the embodiment of the present application realizes expansion of the heat dissipation path of the target hot spot by setting the heat conduction connecting structure and the heat conduction structure, reduces the temperature hot spot in the LRM module, and improves the overall reliability of the product; the product has excellent performance, high structural reliability, and high engineering application value. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0015] Figure 1 It is a structural diagram of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0016] Figure 2 It is an installation diagram of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0017] Figure 3 It is an upper wedge-shaped block of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0018] Figure 4 It is a middle wedge-shaped block of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0019] Figure 5 It is a lower wedge-shaped block of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0020] Figure 6 It is a heat conduction block of the heat dissipation device of the LRM module according to an embodiment of the present application;

[0021] Figure 7 It is a combined installation form of the flexible heat conduction connecting structure according to an embodiment of the present application.

[0022] In the diagram: 1. Upper wedge block; 2. Middle wedge block; 3. Lower wedge block; 4. Connecting screw; 5. Limiting nut; 6. Heat conduction connection structure; 7. Heat conduction block; 8. Locking area; 9. Heat conduction connection area; 10. Mounting hole; 11. Heat conduction connection structure mounting platform. Detailed Implementation

[0023] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0024] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0026] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0027] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0028] The embodiment of the present application provides a heat dissipation device of an LRM module, to solve the problem of concentrated hotspot heat dissipation design under the structure form of the LRM module in the electronic equipment. The heat dissipation path of the target hotspot is expanded, the temperature hotspot in the LRM module is reduced, and the overall reliability of the product is improved. The following will be described in detail with reference to Figures 1 to 7 .

[0029] With reference to Figure 1 and Figure 2 , the heat dissipation device of the LRM module comprises a connecting screw rod 4, a limiting nut 5 and a plurality of wedge-shaped blocks, the plurality of wedge-shaped blocks are sequentially sleeved on the connecting screw rod 4, the limiting nut 5 is sleeved on the end of the connecting screw rod 4, the contact surface of each wedge-shaped block and the adjacent wedge-shaped block is provided as an inclined surface, one side of each wedge-shaped block in the axial direction of the connecting screw rod 4 is provided as a locking area 8, the wedge-shaped block is locked by rotating the limiting nut 5, the other side of each wedge-shaped block in the axial direction of the connecting screw rod 4 is connected with at least one heat conduction connecting structure 6, one end of the heat conduction connecting structure 6 away from the wedge-shaped block is connected with a heat conduction structure, each heat conduction connecting structure 6 is connected with at least one heat conduction connecting structure 6, and the heat conduction structure is fixed to the hotspot position on the LRM module.

[0030] In the embodiment, the heat conduction connecting structure 6 and the heat conduction structure are arranged to conduct heat to the outside, the heat dissipation path of the target hotspot is expanded, the temperature hotspot in the LRM module is reduced, and the overall reliability of the product is improved; the product has excellent performance, high structural reliability, and high engineering application value.

[0031] In specific implementation, the heat conduction connecting structure 6 is a flexible heat conduction connecting structure, and the flexible heat conduction connecting structure is a metal woven heat conduction rope, a high-thermal-conductivity metal film or a flexible heat pipe.

[0032] The flexible heat conduction connecting structure is usually made of a material with high thermal conductivity, has a certain softness, and can be disassembled and combined.

[0033] Further, the other side of each wedge-shaped block in the axial direction of the connecting screw rod 4 is provided with an extension edge perpendicular to the side, and the extension edge is connected with the heat conduction connecting structure 6 with reference to the heat conduction connecting area 9 in Figures 3 to 5 .

[0034] In specific implementation, the connection mode of the heat conduction connecting structure 6 and the heat conduction structure can be screw connection, welding, bonding and riveting.

[0035] Further, the heat conduction structure is arranged as a heat conduction block 7, with reference to Figure 6The heat-conducting block 7 is provided with a mounting hole 10, and the heat-conducting block 7 is fixed on the hot spot position of the LRM module through cooperation of the mounting hole 10 and the connecting piece. The heat-conducting block 7 is further provided with a convex heat-conducting connecting structure mounting table 11 for connecting the heat-conducting connecting structure 6. The heat-conducting block 7 quickly realizes heat conduction of the heat of the hot spot, reduces the temperature of the hot spot, and improves the reliability of the product.

[0036] According to the number and layout of the hot spots on the LRM module, the heat-conducting connecting structure 6 is split and combined to increase the heat dissipation passage of the heat of the hot spot. Figure 7 As shown in FIG. 6, for example, one end of the heat-conducting connecting structure 6 is connected with a wedge-shaped block, and the other end of the heat-conducting connecting structure 6 is connected to the heat-conducting connecting structure mounting table 11 and then connected to another wedge-shaped block. Alternatively, a plurality of heat-conducting connecting structures 6 can be simultaneously connected to one wedge-shaped block.

[0037] In one embodiment, the wedge-shaped blocks are provided as three blocks, i.e., an upper wedge-shaped block 1, a middle wedge-shaped block 2 and a lower wedge-shaped block 3. Figures 3 to 5 For the upper wedge-shaped block 1, one side close to the middle wedge-shaped block 2 is provided as an inclined surface, and for the lower wedge-shaped block 3, one side close to the middle wedge-shaped block 2 is also provided as an inclined surface, and the two sides of the middle wedge-shaped block 2 are respectively matched with the inclined surfaces of the upper wedge-shaped block 1 and the lower wedge-shaped block 3.

[0038] The embodiment provided by the utility model realizes efficient heat conduction of the concentrated heat parts of the modules in the electronic equipment through the heat dissipation device of the LRM module, increases the heat passage of the concentrated heat parts, and thus solves the problem of local high temperature of the modules of the electronic equipment.

[0039] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical range disclosed by the present application can be easily thought by those skilled in the art, and should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipating device for an LRM module, characterized by, The device comprises a connecting screw rod (4), a limiting nut (5) and a plurality of wedge-shaped blocks, the plurality of wedge-shaped blocks are sequentially sleeved on the connecting screw rod (4), the limiting nut (5) is sleeved on the end of the connecting screw rod (4), the contact surface of each wedge-shaped block and the adjacent wedge-shaped block is provided as an inclined surface, one side of each wedge-shaped block in the axial direction of the connecting screw rod (4) is provided as a locking area (8), the wedge-shaped block is locked by rotating the limiting nut (5), the other side of each wedge-shaped block in the axial direction of the connecting screw rod (4) is connected with at least one heat conduction connecting structure (6), the heat conduction connecting structure (6) is connected with a heat conduction structure at the end away from the wedge-shaped block, each heat conduction structure is connected with at least one heat conduction connecting structure (6), and the heat conduction structure is fixed on the hot spot position of the LRM module.

2. The heat dissipating device of the LRM module according to claim 1, characterized in that, The heat conduction connecting structure (6) is provided as a flexible heat conduction connecting structure.

3. The heat dissipating device of the LRM module according to claim 2, wherein, The flexible heat conduction connecting structure (6) is provided as a metal woven heat conduction rope, a high-thermal-conductivity metal film or a flexible heat pipe.

4. The heat dissipating device of the LRM module according to claim 1, wherein, The other side of each wedge-shaped block in the axial direction of the connecting screw rod (4) is provided with an extension edge perpendicular to the side, and the heat conduction connecting structure (6) is connected through the extension edge.

5. The heat dissipating device of the LRM module according to claim 1, wherein, The heat conduction structure is provided as a heat conduction block (7).

6. The heat dissipating device of the LRM module according to claim 5, wherein, The heat conduction block (7) is provided with a mounting hole (10), and the heat conduction block (7) is fixed on the hot spot position of the LRM module through cooperation of the mounting hole (10) and a connecting piece.

7. The heat dissipating device of the LRM module according to claim 1, wherein, The connecting mode of the heat conduction connecting structure (6) and the heat conduction structure is provided as screw connection, welding, bonding or riveting.

8. The heat dissipating device of the LRM module according to claim 1, wherein, The wedge-shaped block is provided as three blocks.

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