Integrated circuit heat dissipation device
The spring connection structure simplifies the disassembly and assembly of the cooling fan and the design of the sealing ring, solving the problems of cumbersome disassembly and assembly and poor sealing of traditional integrated circuit heat dissipation devices, and achieving convenient maintenance and efficient heat dissipation.
Patent Information
- Application Number
- CN202520010707.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Traditional integrated circuit heat dissipation devices are cumbersome to disassemble and repair, and their poor sealing can lead to dust penetration, affecting heat dissipation.
The spring connection structure makes it easy to disassemble and assemble the cooling fan, and the combination of the sealing ring and the spring improves the sealing performance and prevents dust from penetrating.
It enables quick assembly and disassembly of the cooling fan and has a strong seal to prevent dust from entering and maintain good heat dissipation.
Smart Images
Figure CN223681405U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit heat dissipation device, especially relates to an integrated circuit heat dissipation device. BACKGROUND
[0002] Integrated circuit has the advantages of small size, light weight, few lead wires and welding points, long service life, high reliability, good performance, low cost and easy mass production.
[0003] The integrated circuit heat dissipation device on the market has the following problems in use:
[0004] 1. When the traditional integrated circuit heat dissipation device is applied, the heat dissipation fan on the integrated circuit heat dissipation device is usually fixed by screws, so that it is more troublesome to disassemble and assemble the heat dissipation fan for maintenance or repair, and the maintenance personnel need to spend time and effort in operation.
[0005] 2. When most integrated circuit heat dissipation devices are applied, the heat dissipation device is usually installed on the surface of the integrated circuit by bolts, and there is a gap between the bottom and the integrated circuit bonding part, so that dust will inevitably penetrate into the gap after long-term use, resulting in a decrease in the heat dissipation effect of the heat dissipation device, and the sealing performance of the bottom of the heat dissipation device and the integrated circuit bonding part is poor. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing an integrated circuit heat dissipation device to solve the technical problems in the background art.
[0007] To achieve the above-mentioned purpose, the specific technical scheme of the utility model is as follows: an integrated circuit heat dissipation device, comprising a heat sink, the top of the heat sink is fixedly connected with a fixed plate, the top of the fixed plate is installed with a connecting plate, the outer part of the connecting plate is fixedly connected with a first spring, the other end of the first spring is fixedly connected with a connecting block, the first spring is compressed between the connecting plate and the connecting block, the outer part of the connecting block is installed with a plug rod, the plug rod penetrates through the inner part of the connecting plate, the plug rod is inserted into a plug hole, the plug hole is arranged on the surface of a fan shell, a pinch block is installed on the surface of the connecting block, so that when the maintenance personnel maintain or repair the heat dissipation fan, the pinch block can be pinched and pulled outwards with force, the plug rod is pulled out of the plug hole in the fan shell, the fan shell and the heat dissipation fan can be removed, the maintenance personnel can conveniently overhaul them, after the overhaul is completed, the pinch block is pinched and pulled outwards again, the plug rod is aligned with the plug hole, and the pinch block is released, the elastic force of the spring outside the connecting plate can insert the plug rod into the plug hole, so that the heat dissipation fan can be fixed, and the disassembly and assembly of the heat dissipation fan are more convenient for the maintenance personnel to operate, which saves time and effort.
[0008] Preferably, the fin external mounting fixed frame, the fixed frame bottom recess, the recess inner wall fixed connection second spring, the second spring the other end fixed connection sealing ring, the sealing ring bottom installation rubber pad, so that the staff will heat dissipation device installed on the integrated circuit, and the external installation of the fixed frame will paste the integrated circuit surface, the fixed frame bottom recess inside is equipped with sealing ring, because the sealing ring top fixed connection second spring, the other end of the second spring is fixedly connected to the inner wall of the recess, when the fixed frame is pasted on the surface of the integrated circuit, the sealing ring is pressed and the spring is compressed, so that the spring will continuously press the sealing ring on the surface of the integrated circuit, and the rubber pad is tightly pasted with the surface of the integrated circuit, so that after long-term use of the heat dissipation device, dust can be effectively prevented from penetrating into the gap, so that the heat dissipation effect of the heat dissipation device is not reduced, and the sealing property of the heat dissipation device bottom and the integrated circuit pasting part is better.
[0009] Preferably, the fan shell is internally provided with a supporting rod, and the supporting rod is provided with a heat dissipation fan at the top.
[0010] Preferably, the fixed frame is externally provided with a fixed block, and the fixed block is symmetrically distributed, so that the staff can conveniently install the heat dissipation device.
[0011] Preferably, the fixed block is internally provided with an inner threaded ring, and the inner threaded ring is internally provided with a threaded rod, so that the heat dissipation device can be effectively fixed on the integrated circuit through the inner threaded ring and the threaded rod.
[0012] Preferably, the threaded rod penetrates through the fixed block, and the threaded rod is provided with a knob at the top, so that the staff can conveniently rotate the threaded rod.
[0013] The integrated circuit heat dissipation device has the following advantages:
[0014] 1. The integrated circuit heat dissipation device, through the fixed connection of the fixed plate on the top of the heat dissipation fin, the installation of the connecting plate on the top of the fixed plate, the fixed connection of the first spring outside the connecting plate, the fixed connection of the connecting block on the other end of the first spring, the compression of the first spring between the connecting plate and the connecting block, the installation of the plug rod outside the connecting block, the penetration of the plug rod into the connecting plate, the insertion of the plug rod into the plug hole, the installation of the pinch block on the surface of the connecting block, and the outward pulling of the plug rod from the plug hole by pinching the pinch block when the maintenance personnel maintains or repairs the heat dissipation fan, the fan shell and the heat dissipation fan can be removed, the maintenance personnel can conveniently overhaul the heat dissipation fan, the plug rod is inserted into the plug hole by the spring rebound force when the pinch block is loosened after the overhaul, the heat dissipation fan is fixed, the heat dissipation fan is convenient to disassemble and assemble, and the maintenance personnel saves time and effort when operating;
[0015] 2. The integrated circuit heat dissipation device, through the fixed connection of the fixed frame outside the heat dissipation fin, the opening of the groove in the bottom of the fixed frame, the fixed connection of the second spring in the inner wall of the groove, the fixed connection of the sealing ring on the other end of the second spring, and the installation of the rubber pad on the bottom of the sealing ring, when the workers install the heat dissipation device on the integrated circuit, the fixed frame outside the heat dissipation fin is attached to the surface of the integrated circuit, the groove in the bottom of the fixed frame is provided with the sealing ring, the top of the sealing ring is fixedly connected with the second spring, the other end of the second spring is fixedly connected with the inner wall of the groove, the fixed frame is attached to the surface of the integrated circuit, the sealing ring is pressed and the spring is compressed, the spring rebound force continuously presses the sealing ring on the surface of the integrated circuit, the rubber pad is tightly attached to the surface of the integrated circuit, dust can be effectively prevented from penetrating into the gap after long-term use of the heat dissipation device, the heat dissipation effect of the heat dissipation device is not reduced, and the sealing property of the heat dissipation device bottom attached to the integrated circuit is high. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.
[0017] Figure 1 It is a schematic diagram of the overall structure of the present application;
[0018] Figure 2 It is a schematic diagram of the second spring structure of the present application;
[0019] Figure 3 For the utility model Figure 1 A part of enlargement in middle A;
[0020] Figure 4 For the utility model Figure 1 B part of enlargement in middle.
[0021] Marked in the figure: 1, fin; 2, fixed frame; 3, fixed plate; 4, connecting plate; 5, fan housing; 6, cooling fan; 7, jack; 8, support rod; 9, recess; 10, second spring; 11, rubber pad; 12, sealing ring; 13, plug rod; 14, pinch block; 15, connecting block; 16, first spring; 17, fixed block; 18, internal thread ring; 19, threaded rod; 20, knob. DETAILED DESCRIPTION
[0022] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the embodiments of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.
[0023] In the description of the embodiments of the present application, it is to be understood that the orientation or positional relationship indicated by the terms "length", "vertical", "horizontal", "top", "bottom" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0024] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.
[0025] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, or it can be communicated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0026] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. For simplicity of the present application, the components and settings of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.
[0027] In order to better understand the purpose, structure and function of the present application, the present application will be further described in detail below in combination with the drawings.
[0028] As shown in Figures 1-4 The present application discloses a heat dissipation device for integrated circuits, which comprises a heat dissipation fin 1, a fixed plate 3 fixedly connected to the top of the heat dissipation fin 1, a connecting plate 4 installed on the top of the fixed plate 3, a first spring 16 fixedly connected to the outside of the connecting plate 4, a connecting block 15 fixedly connected to the other end of the first spring 16, the first spring 16 being compressed between the connecting plate 4 and the connecting block 15, a plug rod 13 installed on the outside of the connecting block 15, the plug rod 13 penetrating through the inside of the connecting plate 4, the plug rod 13 being inserted into a plug hole 7 provided on the surface of a fan shell 5, and a pinch block 14 installed on the surface of the connecting block 15. In this way, when the maintenance personnel maintain or repair the heat dissipation fan 6, they can pinch the pinch block 14 and pull it outwards with force, so as to pull out the plug rod 13 from the inside of the plug hole 7 of the fan shell 5, and then remove the fan shell 5 and the heat dissipation fan 6, which is convenient for the maintenance personnel to overhaul. After the overhaul is completed, the pinch block 14 is pinched and pulled outwards again, and the plug rod 13 is aligned with the position of the plug hole 7, and then the pinch block 14 is released. The spring rebound force outside the connecting plate 4 will insert the plug rod 13 into the inside of the plug hole 7, so as to fix the heat dissipation fan 6. In this way, when the maintenance personnel maintain or repair the heat dissipation fan 6 in the future, the disassembly and assembly are relatively simple, and the maintenance personnel can save time and effort when operating.
[0029] The fixing frame 2 is externally mounted on the fin 1, a groove 9 is formed in the bottom of the fixing frame 2, the second spring 10 is fixedly connected to the inner wall of the groove 9, the other end of the second spring 10 is fixedly connected to the sealing ring 12, and the rubber pad 11 is mounted at the bottom of the sealing ring 12. When the staff installs the heat dissipation device on the integrated circuit, the fixing frame 2 externally mounted on the fin 1 will fit the surface of the integrated circuit, the groove 9 formed in the bottom of the fixing frame 2 is internally provided with the sealing ring 12, the top of the sealing ring 12 is fixedly connected to the second spring 10, the other end of the second spring 10 is fixedly connected to the inner wall of the groove 9, and the fixing frame 2 will extrude the sealing ring 12 and compress the spring when it fits the surface of the integrated circuit, so that the elastic force of the spring will continuously press the sealing ring 12 on the surface of the integrated circuit, and the rubber pad 11 is tightly fitted with the surface of the integrated circuit, so that after long-term use of the heat dissipation device, dust can be effectively prevented from penetrating into the gap, and the heat dissipation effect of the heat dissipation device will not be reduced, and the sealing performance of the heat dissipation device at the bottom and the integrated circuit fitting part is better.
[0030] The support rod 8 is installed in the fan housing 5, and the heat dissipation fan 6 is installed at the top of the support rod 8. Through the structure of the support rod 8, the heat dissipation fan 6 is effectively supported.
[0031] The fixing block 17 is fixedly connected to the outside of the fixing frame 2, and the fixing block 17 is symmetrically distributed. Through the structure of the fixing block 17, the staff can conveniently install the heat dissipation device.
[0032] The inner threaded ring 18 is installed at the top of the fixing block 17, and the threaded rod 19 is screwedly connected to the inside of the inner threaded ring 18. Through the structure of the inner threaded ring 18 and the threaded rod 19, the heat dissipation device can be effectively fixed on the integrated circuit.
[0033] The threaded rod 19 penetrates through the inside of the fixing block 17, and the knob 20 is arranged at the top end of the threaded rod 19. Through the structure of the knob 20, the staff can conveniently rotate the threaded rod 19.
[0034] The working principle of the integrated circuit heat dissipation device is as follows: when the heat dissipation device is used, first, the fixed block 17 and the internal thread ring 18 outside the fixed frame 2 are used to install the heat dissipation device on the integrated circuit by using the threaded rod 19 and the knob 20, then when the maintenance personnel maintain or repair the heat dissipation fan 6, the plug rod 13 is pulled out of the plug hole 7 in the fan shell 5 by pinching the pinch block 14 and pulling it outward, so that the fan shell 5 and the heat dissipation fan 6 can be removed, and the maintenance personnel can conveniently overhaul them, and after the overhaul is completed, the pinch block 14 is pinched and pulled outward, and the plug rod 13 is aligned with the plug hole 7 position, and then the pinch block 14 is released, the elastic force of the spring outside the connecting plate 4 can insert the plug rod 13 into the plug hole 7, so that the heat dissipation fan 6 can be fixed, and when the maintenance personnel maintain or repair the heat dissipation fan 6 in the later period, the disassembly and assembly are relatively simple, and the maintenance personnel can save time and effort when operating, and then the fixed frame 2 is installed outside the heat dissipation fin 1, and the groove 9 is formed in the bottom of the fixed frame 2, then the second spring 10 is fixedly connected to the inner wall of the groove 9, and the other end of the second spring 10 is fixedly connected to the sealing ring 12, and then the rubber pad 11 is installed at the bottom of the sealing ring 12, so that when the working personnel install the heat dissipation device on the integrated circuit, the fixed frame 2 installed outside the heat dissipation fin 1 is attached to the surface of the integrated circuit, the groove 9 formed in the bottom of the fixed frame 2 is provided with the sealing ring 12, the top of the sealing ring 12 is fixedly connected to the second spring 10, the other end of the second spring 10 is fixedly connected to the inner wall of the groove 9, and when the fixed frame 2 is attached to the surface of the integrated circuit, the sealing ring 12 is pressed and the spring is compressed, so that the elastic force of the spring can continuously press the sealing ring 12 on the surface of the integrated circuit, and the rubber pad 11 is tightly attached to the surface of the integrated circuit, so that after the heat dissipation device is used for a long time, dust can be effectively prevented from penetrating into the gap, and the heat dissipation effect of the heat dissipation device will not be reduced, and the sealing performance of the part where the bottom of the heat dissipation device is attached to the integrated circuit is high.
[0035] It can be understood that the utility model is described through some embodiments, and those skilled in the art know that various changes or equivalent replacements can be made to these features and embodiments without departing from the spirit and scope of the utility model. In addition, under the guidance of the utility model, these features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the utility model. Therefore, the utility model is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the scope protected by the utility model.
Claims
1. An integrated circuit heat sink device comprising a heat sink (1), characterized by: The fin (1) top fixedly connected to the fixed plate (3), the fixed plate (3) top mounted to the connecting plate (4), the connecting plate (4) outside fixedly connected to the first spring (16), the other end of the first spring (16) fixedly connected to the connecting block (15), the first spring (16) compressed between the connecting plate (4) and the connecting block (15), the connecting block (15) outside mounted to the plug rod (13), the plug rod (13) through the inside of the connecting plate (4), the plug rod (13) inserted into the insertion hole (7), the insertion hole (7) is opened on the surface of the fan shell (5), the connecting block (15) surface mounted to the pinch block (14).
2. The integrated circuit heat dissipating device of claim 1, wherein: The fin (1) outside mounted to the fixed frame (2), the fixed frame (2) bottom recess (9), the recess (9) inner wall fixedly connected to the second spring (10), the other end of the second spring (10) fixedly connected to the sealing ring (12), the sealing ring (12) bottom mounted to the rubber pad (11).
3. The integrated circuit heat dissipating device of claim 1, wherein: The fan shell (5) inside mounted to the support rod (8), the support rod (8) top mounted to the cooling fan (6).
4. The integrated circuit heat dissipating device of claim 2, wherein: The fixed frame (2) outside fixedly connected to the fixed block (17), the fixed block (17) is symmetrically distributed.
5. The integrated circuit heat dissipating device of claim 4, wherein: The fixed block (17) top mounted to the internal thread ring (18), the internal thread ring (18) internally threaded connection screw rod (19).
6. The integrated circuit heat dissipating device of claim 5, wherein: The screw rod (19) through the inside of the fixed block (17), the screw rod (19) top end provided with a knob (20).