Glass wafer edge processing device

Abstract

The utility model discloses a glass wafer edge processing device, which relates to the field of industrial product processing equipment and comprises a mounting box, a mounting box is arranged on one side of the mounting box, a control device is arranged on one side, close to the mounting box, of the mounting box and comprises a mounting block, and a guide sliding rail is arranged on the mounting block and far away from the mounting box. A connecting rod is arranged on one side of the guide sliding rail, and a grinding disc is arranged at the bottom of the connecting rod. In the glass wafer edge machining process, the first control motor is started to drive the grinding disc to rotate at a high speed, operation can be carried out strictly according to a preset machining path and parameters, the grinding precision and uniformity are greatly improved, the edge roughness is effectively reduced, and the machining quality of glass wafers is remarkably improved; therefore, strict requirements of high-end electronic products on the precision of chips can be better met, and the competitiveness of the products in the market is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of industrial product processing equipment, specifically to a glass wafer edge processing device. BACKGROUND

[0002] In today's technology industry, the semiconductor and optical field develops rapidly, and the glass wafer as an important basic material, its application range expands unceasingly, has the key function from electronic chip manufacturing to optical lens production and so on multiple fields. With the market for various electronic products and optical equipment performance requirements increasing, the processing precision and quality of glass wafer also put forward higher standard, this promotes the related processing technology to innovate and develop unceasingly, to meet the needs of the industry.

[0003] At present, there are many processing equipment and methods in the field of glass wafer edge processing. The common processing device in the market has characteristics in structure and function, but there are still some unsatisfactory places. For example, the stability of part of the equipment in the polishing process is poor, it is easy to be disturbed by external factors, which makes it difficult to achieve high precision requirements for the flatness and smoothness of wafer edge. Moreover, in the dust treatment during processing, the cleaning effect of most equipment is not ideal, which not only affects the processing environment, but also may cause secondary pollution to the wafer surface, reducing the product yield.

[0004] Traditional glass wafer edge processing usually fixes the wafer on a special clamp first, and drives the polishing tool to polish the edge through a simple mechanical transmission structure. In the polishing process, the position and force of polishing are mainly controlled by manual experience or preset fixed parameters, lacking precise automatic control. For the dust generated, a simple dust collection device is generally used, which has limited dust collection range and cannot be flexibly adjusted according to the processing position, only collects most of the dust, and it is difficult to effectively filter and clean the fine dust, which needs manual complex cleaning and maintenance work.

[0005] In the control of grinding disc, the existing equipment cannot realize precise intelligent movement in multiple dimensions, it is difficult to adjust the polishing position and force in real time according to the complex wafer edge shape and processing requirements, which limits the processing precision. At the same time, the cleaning system is inefficient, cannot efficiently suck and filter the dust in different positions, cannot guarantee the cleanliness of the processing environment, and further affects the processing quality and production efficiency of the wafer, and frequent manual maintenance also increases the production cost and time cost. UTILITY MODEL CONTENTS

[0006] Therefore, the utility model aims at providing a glass wafer edge processing device to solve the technical problems of low wafer polishing precision, poor dust cleaning and unstable fixation in the prior art.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: a glass wafer edge processing device, including installation box, installation box one side is provided with installation box, installation box one side close to installation box is provided with control device, control device includes mounting block, mounting block is provided with guide sliding rail away from installation box, one side of guide sliding rail is provided with connecting rod, the bottom of connecting rod is provided with grinding disc, the top of connecting rod is provided with first control motor cooperation grinding disc, installation box is provided with mounting plate, mounting plate is provided with support base plate, support base plate is provided with wafer, the bottom of mounting plate is provided with connecting block cooperation, one side of connecting block is provided with second guide groove cooperation, one side of second guide groove is provided with fourth control motor, installation box is provided with cleaning device cooperation wafer, installation box is provided with a pair of center positioning device cooperation wafer in.

[0008] By adopting the above technical scheme, the grinding of wafers of different specifications and different positions is realized.

[0009] The utility model further sets up, cleaning device includes a pair of first guide rod, a pair of first guide rod is provided with dust absorption plate between, first guide rod is provided with first guide groove cooperation dust absorption plate.

[0010] By adopting the above technical scheme, the dust generated by grinding the wafer is sucked by moving the dust absorption plate driven by the guide rod, ensuring the cleanliness of the lens surface.

[0011] The utility model further sets up, installation box is provided with installation groove cooperation first guide rod, installation groove top is provided with fourth control motor.

[0012] By adopting the above technical scheme, the first guide rod is controlled to move up and down by the first control motor, so that the wafers of different specifications are adsorbed.

[0013] The utility model further sets up, installation block is provided with third control motor cooperation connecting rod, one side of installation block is provided with second control motor cooperation.

[0014] By adopting the above technical scheme, the left and right and up and down movement of the whole mounting block is realized by the second control motor cooperation third control motor, so that the grinding disc is controlled to grind the lenses of different positions.

[0015] The utility model further sets up, installation box and installation box bottom are provided with support rod, a plurality of universal wheels are provided on the bottom of support rod.

[0016] By adopting the above technical scheme, the whole device can move in a space.

[0017] The utility model further sets up, be connected with the gas pipe on the dust absorption plate, the gas pipe extends to the installation box, the installation box is matched with the gas pipe and is provided with the storage box, the gas pipe extends to the storage box, be provided with the guide plate in the storage box, the guide plate both sides symmetry is provided with the second guide rod, be provided with the filter plate on the guide plate.

[0018] Through the above technical scheme, the gas with dust is filtered through the filter plate, thereby the raw material is recycled, and the influence of the dust on the polishing process is prevented.

[0019] The utility model further sets up, be connected with the gas pipe on the dust absorption plate, the gas pipe extends to the installation box, the installation box is matched with the gas pipe and is provided with the storage box, the gas pipe extends to the storage box, be provided with the guide plate in the storage box, the guide plate both sides symmetry is provided with the second guide rod, be provided with the filter plate on the guide plate.

[0020] Through the above technical scheme, the wafer is adsorbed by the installation disc.

[0021] In summary, the utility model mainly has the following beneficial effects:

[0022] 1, the utility model discloses a glass wafer edge processing process, starts the first control motor and drives the grinding disc high -speed rotation, the second control motor accurately control installation block transverse displacement, the third control motor accurately adjusts the up and down position of connecting rod, thereby realizes the accurate polishing of the grinding disc to wafer edge, this intelligent multi -dimensional control can be strictly according to the preset processing path and parameter operation, greatly improves the polishing precision and uniformity, effectively reduces the edge roughness, significantly improves the processing quality of glass wafer, makes it better satisfy the rigorous requirement of high -end electronic product to chip precision, strengthens the competitiveness of product in market,

[0023] 2, the utility model discloses a polishing operation when starting, the suction pump in the installation box is started simultaneously, and strong suction is generated at the dust absorption plate, and dust-containing gas enters the storage box through the gas pipe.In this process, the fourth control motor drives the installation groove to rotate, and then the dust absorption plate adjusts the position flexibly, and the dust of different height and area is fully sucked, and the filter plate effectively intercepts and collects the dust, avoids its escape, and the efficient cleaning system not only can keep the processing environment clean and hygienic, reduce the adhesion and scratch of dust particles on the wafer surface, reduce the scrap rate, but also can provide a good working environment for the operator, guarantee the stability and continuity of the processing process, improve the overall production efficiency and economic benefit. ACCURACY

[0024] Figure 1 It is the whole structure schematic diagram of the utility model;

[0025] Figure 2 It is the partial structure schematic diagram of the utility model;

[0026] Figure 3 Part structure back view schematic diagram of the utility model;

[0027] Figure 4 Storage box structure schematic diagram of the utility model;

[0028] Figure 5 Part structure installation schematic diagram of the utility model

[0029] Figure 6 Part structure bottom schematic diagram of the utility model.

[0030] In the figure: 1, installation box;2, connecting rod;3, first control motor;4, second control motor;5, third control motor;6, wafer;7, support base plate;8, universal wheel;9, support rod;10, installation box;11, first guide rod;12, first guide slot;13, grinding disc;14, fourth control motor;15, dust absorption plate;16, mounting plate;17, gas conveying pipe;18, gas conveying groove;19, storage box;20, guide pipe;21, connecting block;22, setting disc;23, second guide slot;24, filter plate;25, second guide rod;26, guide plate;27, mounting block;28, guide slide rail;29, installation groove;30, centering positioning device;31, air suction pump. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are used only for explaining the utility model, and cannot be understood as limiting the utility model.

[0032] The embodiments of the utility model will be described below according to the overall structure of the utility model.

[0033] A glass wafer edge processing device, such as Figures 1-6The installation box 1 is provided with a mounting box 10, and the mounting box 10 is provided with a control device close to one side of the installation box 1. The control device comprises a mounting block 27, and the mounting block 27 is provided with a guide sliding rail 28 away from the mounting box 10. The guide sliding rail 28 is provided with a connecting rod 2 on one side. The connecting rod 2 is provided with a grinding disc 13 at the bottom. The connecting rod 2 is provided with a first control motor 3 at the top matched with the grinding disc 13. The installation box 1 is provided with a mounting plate 16. The mounting plate 16 is provided with a support base 7. The support base 7 is provided with a wafer 6. The mounting plate 16 is provided with a connecting block 21 at the bottom matched with it. The connecting block 21 is provided with a second guide groove 23 on one side matched with it. The second guide groove 23 is provided with a fourth control motor 14 on one side. The first control motor 3 is arranged to control the rotation of the grinding disc 13 to polish the wafer 6. The mounting block 27 is provided with a third control motor 5 matched with the connecting rod 2 on one side. The mounting block 27 is provided with a second control motor 4 on one side matched with it. The second control motor 4 is arranged to control the horizontal movement of the mounting block 27. The third control motor 5 is arranged to control the up and down movement of the connecting rod 2. Thus, the grinding disc 13 moves up and down and left and right. The wafer 6 is polished according to the polishing position requirement.

[0034] Further, the installation box 1 is provided with a cleaning device matched with the wafer 6. The cleaning device comprises a pair of first guide rods 11. A dust collection plate 15 is arranged between the pair of first guide rods 11. The first guide rods 11 are provided with first guide grooves 12 matched with the dust collection plate 15. The dust collection plate 15 moves in the first guide grooves 12 to ensure that the dust collection plate 15 moves in the installation box 1. Further, the dust collection plate 15 is connected with a gas conveying pipe 17. The gas conveying pipe 17 extends into the mounting box 10. A storage box 19 is arranged in the mounting box 10 matched with the gas conveying pipe 17. The storage box 19 is arranged in the mounting box 10 matched with the gas conveying pipe 17. The gas conveying pipe 17 extends into the storage box 19. The storage box 19 is provided with a guide plate 26. The guide plate 26 is provided with second guide rods 25 symmetrically arranged on both sides. The guide plate 26 is provided with a filter plate 24. The filter plate 24 filters the gas to collect the polishing dust on the filter plate 24. The second guide rods 25 take out the guide plate 26 to recycle the dust.

[0035] The installation box 1 is provided with a mounting groove 29 matched with the first guide rod 11. The mounting groove 29 is provided with a fourth control motor 14 at the top. The fourth control motor 14 drives the corresponding mounting groove 29 to rotate to drive the first guide rod 11 to move up and down to suck the dust on the surface of the wafer 6 at different positions to ensure the cleanliness of the lens surface.

[0036] The installation box 1 and the installation box 10 bottom are provided with support rods 9, the support rods 9 bottom are provided with a plurality of universal wheels 8, through the support rod 9 to installation box 1 and installation box 10 are supported, guarantee the normal operation of the device, simultaneously through the universal wheel 8 that is set up makes the whole device can move in space.

[0037] The connecting block 21 bottom is provided with guide pipe 20, the guide pipe 20 bottom extends to installation box 1 outside connection gas groove 18, the guide pipe 20 is connected with the installation tray 22, so that in actual use, can connect external air pump to produce negative pressure, the wafer 6 on installation tray 22 is extracted and fixed, guarantees the stability of the wafer 6 when grinding disc grinding.

[0038] The installation box 1 is provided with a pair of centering device 30 in cooperation with wafer 6, through the centering device 30 on installation tray 22 on wafer 6 is centered, guarantees the accuracy of subsequent grinding position;

[0039] In actual use, the device is moved to the appropriate working position through the bottom universal wheel 8, ensure that the surrounding environment is clean and has no obstacles, to ensure the smooth progress of the processing, check whether the device parts are in normal state, including the wear of grinding disc 13, whether the connection of each control motor is firm and the integrity of cleaning device, etc., open the external air pump connected to the bottom guide pipe 20 of connecting block 21, generate negative pressure, place the wafer 6 on the installation tray 22 on the support base plate 7, use the negative pressure to firmly extract and fix the wafer 6, ensure that the wafer 6 does not displace in the subsequent grinding process, at this time, the pair of centering device 30 in the installation box 1 on wafer 6 is centered, accurately adjusts the position of wafer 6, lays the foundation for subsequent accurate grinding;

[0040] Then set the parameters of the grinding machine, according to the material, size and required grinding accuracy of wafer 6, set the speed of the first control motor 3, the lifting stroke and speed of the third control motor 5 and the lateral movement parameters of the second control motor 4 on the control device, start the first control motor 3, drive the grinding disc 13 to rotate at high speed, prepare to grind the wafer 6;

[0041] In the actual polishing process, the second control motor 4 controls the transverse movement of the mounting block 27, and the third control motor 5 controls the up-down movement of the connecting rod 2, so as to accurately adjust the position of the grinding disc 13, so that it is in contact with the edge of the wafer 6, and the polishing of the wafer 6 is started. During the polishing process, the polishing condition is closely observed, and the parameters of the control motors are adjusted in a timely manner according to the actual needs, so as to ensure the accuracy and quality of the polishing. The dust generated during the polishing process will fly in the mounting box 1. At this time, the cleaning device starts to play a role. Synchronously, the suction pump 31 in the storage box 19 in the mounting box 10 is started, and the suction force is generated at the dust collection plate 15 through the gas conveying pipe 17. The fourth control motor 14 drives the mounting groove 29 to rotate, and then drives the first guide rod 11 to move up and down. The dust collection plate 15 moves in the first guide groove 12, and the dust in different positions in the mounting box 1 is sucked. The gas containing dust enters the storage box 19 through the gas conveying pipe 17, and the dust is collected on the filter plate 24 after being filtered by the filter plate 24. The gas is discharged. After the polishing work is carried out for a period of time, the guide plate 26 can be taken out from the storage box 19 through the second guide rod 25, and the collected dust is recycled for processing, so as to ensure the continuous and efficient operation of the cleaning device.

[0042] After the polishing is completed, when the edge polishing of the wafer 6 reaches the predetermined process requirement, the operation of the first control motor 3, the second control motor 4 and the third control motor 5 is stopped, the grinding disc 13 is stopped and returns to the initial position, the external air pump is turned off, the negative pressure adsorption of the wafer 6 is released, the polished wafer 6 is carefully taken out from the mounting disc 22 and placed in the designated storage position, so as to avoid the wafer 6 from being collided or scratched. The device is cleaned and maintained comprehensively, the wear degree of the grinding disc 13 is checked, and the grinding disc 13 is replaced if necessary. The dust remaining on the dust collection plate 15 and the filter plate 24 is cleaned, and the device is ensured to be in good condition for the next wafer polishing work.

[0043] Although the embodiments of the utility model have been shown and described, the specific embodiments are only an explanation of the utility model, and are not a limitation of the utility model. The specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner, and those skilled in the art can make modifications, replacements and variations of the embodiments without creative contribution after reading the specification without departing from the principles and purposes of the utility model. However, as long as it is within the scope of the claims of the utility model, it is protected by the patent law.

Claims

1. A glass wafer edge processing apparatus comprising a mounting box (1), characterized in that: The mounting box (1) is provided with a mounting box (10) on one side, and a control device is arranged on the mounting box (10) close to one side of the mounting box (1). The control device comprises a mounting block (27), and a guide sliding rail (28) is arranged on the mounting block (27) away from the mounting box (10). A connecting rod (2) is arranged on one side of the guide sliding rail (28). An abrasive disc (13) is arranged at the bottom of the connecting rod (2). A first control motor (3) is arranged at the top of the connecting rod (2) matched with the abrasive disc (13). A mounting plate (16) is arranged on the mounting box (1). A support base (7) is arranged on the mounting plate (16). A wafer (6) is arranged on the support base (7). A connecting block (21) is arranged at the bottom of the mounting plate (16) matched with it. A second guide groove (23) is arranged on one side of the connecting block (21) matched with it. A fourth control motor (14) is arranged on one side of the second guide groove (23). A cleaning device is arranged in the mounting box (1) matched with the wafer (6). A pair of center positioning devices (30) are arranged in the mounting box (1) matched with the wafer (6).

2. The apparatus according to claim 1, wherein: The cleaning device comprises a pair of first guide rods (11), and a dust collection plate (15) is arranged between the pair of first guide rods (11). First guide grooves (12) are formed in the first guide rods (11) matched with the dust collection plate (15).

3. The apparatus of claim 1, wherein: A mounting groove (29) is arranged on the mounting box (1) matched with the first guide rod (11). The fourth control motor (14) is arranged at the top of the mounting groove (29).

4. The apparatus of claim 1, wherein: A third control motor (5) is arranged on the mounting block (27) matched with the connecting rod (2). A second control motor (4) is arranged on one side of the mounting block (27) matched with it.

5. The apparatus of claim 1, wherein: Support rods (9) are arranged at the bottom of the mounting box (1) and the mounting box (10). A plurality of universal wheels (8) are arranged at the bottom of the support rods (9).

6. The apparatus of claim 2, wherein: The dust collection plate (15) is connected with a gas conveying pipe (17). The gas conveying pipe (17) extends into the mounting box (10). A storage box (19) is arranged in the mounting box (10) matched with the gas conveying pipe (17). The gas conveying pipe (17) extends into the storage box (19). An air suction pump (31) is arranged in the storage box (19) matched with the gas conveying pipe (17). A guide plate (26) is arranged in the storage box (19). Second guide rods (25) are symmetrically arranged on both sides of the guide plate (26). A filter plate (24) is arranged on the guide plate (26).

7. The apparatus of claim 1, wherein: A guide pipe (20) is arranged at the bottom of the connecting block (21). The guide pipe (20) extends to the outside of the mounting box (1) connected with the gas conveying groove (18). The guide pipe (20) is connected with the mounting disc (22).

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