Laminated diamond-graphene copper-based composite material

Abstract

The utility model provides a laminated diamond-graphene copper-based composite material. The laminated diamond-graphene copper-based composite material sequentially comprises a substrate layer, a middle layer and a metal layer from bottom to top, the middle layer comprises a copper mesh loaded with modified diamond particles and a graphene layer from bottom to top; the modified diamond particles are uniformly dispersed on the copper net; the modified diamond particles are diamond particles with graphene thin layers growing on the surfaces; the substrate layer and the metal layer are copper layers; the ratio of the layer number of the copper nets to the layer number of the graphene layers is 1: 1. According to the laminated diamond-graphene copper-based composite material, the ratio of the number of layers of the copper nets to the number of layers of the graphene layers is 1: 1, a heat flow channel in the vertical direction formed by the modified diamond particles and a heat flow channel in the transverse direction formed by the graphene layers jointly form a heat flow channel of a three-dimensional structure, interface heat resistance is eliminated and reduced, and the service life of the composite material is prolonged. And the heat conductivity of the diamond / copper material is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of metal matrix composite material, concretely relates to laminated diamond - graphene copper base composite material. BACKGROUND

[0002] With the development of integration technology, high integration semiconductor devices and chips make the power density continue to grow, and high thermal conductivity electronic packaging heat dissipation material has become an important way to solve the high efficiency heat dissipation of device and guarantee its reliability development. In recent years, diamond / copper composite material can be well matched with various packaging materials due to high thermal conductivity and flexible control of thermal expansion coefficient, and becomes the ideal packaging material of microwave solid-state power amplifier. The thermal conductivity of single-layer graphene can reach 5300W / mK, and even research shows that its thermal conductivity is as high as 6600W / mK. Excellent thermal conductivity makes graphene expected to become a heat dissipation material of high-power integrated circuit.

[0003] Diamond / copper composite material is a research hotspot of new generation electronic packaging material, but at present, the main research ideas at home and abroad are alloy matrix and diamond particle surface modification to improve the interface between diamond particle-copper, although good results have been achieved, however, in this composite structure, it is difficult to form a connected heat conduction channel between diamond particles and copper matrix, there are a large number of interfaces between diamond and copper, and it is difficult to produce synergistic effect, so that diamond is difficult to fully exert excellent thermal conductivity.

[0004] At the same time, the prior art is difficult to produce synergistic effect between graphene and diamond / copper composite material. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of laminated diamond-graphene copper base composite material to solve the problem that a large number of interfaces exist between diamond and copper in prior art, and it is difficult to produce synergistic effect between graphene and diamond / copper composite material.

[0006] In order to achieve the above-mentioned purpose, the technical scheme of a kind of laminated diamond-graphene copper base composite material of the utility model is as follows:

[0007] A kind of laminated diamond-graphene copper base composite material, from bottom to top successively includes substrate layer, intermediate layer, metal layer;The intermediate layer includes copper mesh loaded with modified diamond particles, graphene layer from bottom to top;The modified diamond particles are uniformly dispersed on the copper mesh;The modified diamond particles are diamond particles with graphene thin layer grown on the surface;The substrate layer and the metal layer are both copper layer;The number of layers of the copper mesh and the number of layers of the graphene layer is 1:1.

[0008] Compared with prior art, the utility model has the following advantages and beneficial effects:

[0009] The utility model discloses a laminated diamond - graphene copper base composite material, through adding modified diamond particle to connect upper and lower layer, form vertical direction's heat flow channel, promote longitudinal thermal conductivity, copper net can accurate control the distribution of modified diamond particle, effectively avoid the agglomeration phenomenon of diamond, optimize the thermal conductivity of copper base composite material, grow the graphene thin layer on the diamond particle surface and form modified diamond particle, can better with the mutual connection of graphene layer, reduce the thermal resistance of copper base composite material, through the layer number of copper net and the layer number of graphene layer ratio 1:1, the heat flow channel in vertical direction of modified diamond particle formation, with the heat flow channel in horizontal direction of graphene layer formation, common constitute three -dimensional structure's heat flow channel, eliminate and reduce interface thermal resistance, further improve the thermal conductivity of diamond / copper material.

[0010] Further, the number of layers of the copper mesh is at least 1 layer; the mesh count of the copper mesh is 150-300 mesh; the thickness of the copper mesh is 0.05-0.1 mm.

[0011] Beneficial effect: the number of layers of the copper mesh is at least 1 layer, the mesh count of the copper mesh is 150-300 mesh, and the thickness of the copper mesh is 0.05-0.1 mm, which is conducive to further reducing the thermal resistance of the laminated diamond-graphene copper base composite material and improving the thermal conductivity of the laminated diamond-graphene copper base composite material.

[0012] Further, the number of layers of the graphene layer is at least 1 layer; the thickness of the graphene layer is 0.05-0.1 mm.

[0013] Beneficial effect: the number of layers of the graphene layer is at least 1 layer, and the thickness of the graphene layer is 0.05-0.1 mm, which is conducive to further reducing the thermal resistance of the laminated diamond-graphene copper base composite material and improving the thermal conductivity of the laminated diamond-graphene copper base composite material.

[0014] Further, the particle size of the modified diamond particles is 0.05-0.1 mm; and the thickness of the graphene thin layer is 1-20 nm.

[0015] Beneficial effect: the particle size of the modified diamond particles is 0.05-0.1 mm, and the thickness of the graphene thin layer is 1-20 nm, which is conducive to further reducing the thermal resistance of the laminated diamond-graphene copper base composite material and improving the thermal conductivity of the laminated diamond-graphene copper base composite material.

[0016] Further, the thickness of the base layer is 0.3-0.8 mm, and the thickness of the metal layer is 0.1-0.5 mm.

[0017] Beneficial effect: the thickness of the base layer is 0.3-0.8mm, and the thickness of the metal layer is 0.1-0.5mm, which is beneficial to further reduce the thermal resistance of the stacked diamond-graphene copper-based composite material and improve the thermal conductivity of the stacked diamond-graphene copper-based composite material.

[0018] Further, the surface of the modified diamond particles is grown with a graphene thin layer by gas phase chemical deposition.

[0019] Beneficial effect: the surface of the modified diamond particles is grown with a graphene thin layer by gas phase chemical deposition, which is beneficial to further reduce the thermal resistance of the stacked diamond-graphene copper-based composite material and improve the thermal conductivity of the stacked diamond-graphene copper-based composite material.

[0020] The stacked diamond-graphene copper-based composite material of the utility model is prepared through the processes of upsetting, welding and hot pressing after the base layer, the copper mesh, the modified diamond particles, the graphene layer and the metal layer are sequentially placed through a tooling. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a structure schematic view of the stacked diamond-graphene copper-based composite material of the utility model embodiment 1.

[0022] Figure 2 It is a structure schematic view of the modified diamond particles in the utility model embodiment 1. Figure 1

[0023] Figure 3 It is a structure schematic view of the stacked diamond-graphene copper-based composite material of the utility model embodiment 2.

[0024] Figure 4 It is a structure schematic view of the modified diamond particles in the utility model embodiment 2. Figure 3

[0025] Reference signs: 1-base layer; 2-intermediate layer; 3-metal layer; 21-copper mesh; 22-modified diamond particles; 23-graphene layer; 24-graphene thin layer; 25-diamond particles. DETAILED DESCRIPTION

[0026] The embodiments of the utility model will be further described below in combination with the drawings, and it should be pointed out that, for ordinary skilled in the art, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the utility model.

[0027] The specific embodiment 1 of the stacked diamond-graphene copper-based composite material of the utility model is as follows:

[0028] As Figure 1 And Figure 2 ​​As shown, the laminated diamond-graphene copper-based composite material comprises, from bottom to top, a substrate layer 1, an intermediate layer 2, and a metal layer 3; the intermediate layer 2 comprises, from bottom to top, a copper mesh 21 loaded with modified diamond particles 22 and a graphene layer 23; the modified diamond particles 22 are uniformly dispersed on the copper mesh 21; the modified diamond particles 22 are diamond particles 25 with a graphene thin layer 24 grown on the surface; the substrate layer 1 and the metal layer 3 are both copper layers; the number of layers of the copper mesh 21 and the number of layers of the graphene layer 23 are in a ratio of 1:1; the number of layers of the copper mesh 21 is 1 layer; the mesh number of the copper mesh 21 is 150 meshes; the thickness of the copper mesh 21 is 0.1 mm; the number of layers of the graphene layer 23 is 1 layer; the thickness of the graphene layer 23 is 0.05 mm; the particle size of the modified diamond particles 22 is 0.1 mm; the thickness of the graphene thin layer 24 is 1 nm; the thickness of the substrate layer 1 is 0.3 mm, and the thickness of the metal layer 3 is 0.1 mm; the surface of the modified diamond particles 22 is grown with the graphene thin layer by gas-phase chemical deposition.

[0029] The copper layer, the copper mesh, the graphene, and the diamond particles are all products of the prior art and can be commercially available.

[0030] The specific structure of the modified diamond particles 22 is as shown in Figure 2 and Figure 4 The preparation method is described in Chinese Patent Application Publication No. CN105803420A.

[0031] The laminated diamond-graphene copper-based composite material of the utility model connects the upper and lower layers by adding modified diamond particles, forms a vertical heat flow channel, and improves the longitudinal thermal conductivity; the copper mesh can accurately control the distribution of the modified diamond particles, effectively avoids the agglomeration of the diamond particles, and optimizes the thermal conductivity of the copper-based composite material; the graphene thin layer grown on the surface of the diamond particles forms the modified diamond particles, which can better connect with the graphene layer and reduce the thermal resistance of the copper-based composite material; the number of layers of the copper mesh and the number of layers of the graphene layer are in a ratio of 1:1, the vertical heat flow channel formed by the modified diamond particles and the horizontal heat flow channel formed by the graphene layer together form a three-dimensional heat flow channel, which eliminates and reduces the interface thermal resistance and further improves the thermal conductivity of the diamond / copper material.

[0032] The specific embodiment 2 of the laminated diamond-graphene copper-based composite material of the utility model is as follows:

[0033] As shown in Figure 3 and Figure 4The difference from Example 1 is that the number of layers of the copper mesh 21 is 2 layers; the mesh number of the copper mesh 21 is 300 meshes; the thickness of the copper mesh 21 is 0.03 mm; the number of layers of the graphene layer 23 is 2 layers; the thickness of the graphene layer 23 is 0.05 mm; the particle size of the modified diamond particles 22 is 0.05 mm; the thickness of the graphene thin layer 24 is 20 nm; the thickness of the base layer 1 is 0.8 mm, and the thickness of the metal layer 3 is 0.5 mm.

Claims

1. A laminated diamond-graphene copper-based composite material, characterized by: From bottom to top, the copper mesh loaded with modified diamond particles, the graphene layer and the copper layer are sequentially arranged.

2. The LDC-Cu based composite of claim 1, wherein: The number of layers of the copper mesh is at least 1 layer; the mesh number of the copper mesh is 150-300 meshes; the thickness of the copper mesh is 0.05-0.1 mm.

3. The LDC-Cu based composite of claim 1, wherein: The number of layers of the graphene layer is at least 1 layer; the thickness of the graphene layer is 0.05-0.1 mm.

4. The LDC-Cu based composite of claim 1, wherein: The particle size of the modified diamond particles is 0.05-0.1 mm; the thickness of the graphene thin layer is 1-20 nm.

5. The LDC-Cu composite of any one of claims 1-4, wherein: The thickness of the base layer is 0.3-0.8 mm, and the thickness of the metal layer is 0.1-0.5 mm.

6. The LDC-Cu composite of any one of claims 1-4, wherein: The surface of the modified diamond particles grows a graphene thin layer by gas phase chemical deposition.

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