Pulse laser deposition equipment
By introducing a scanning component and substrate rotation into the pulsed laser deposition equipment, the problem of uneven film layer on large-area substrates was solved, achieving uniform deposition and coating effects on large-size substrates.
Patent Information
- Application Number
- CN202423295194.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-31
Smart Images
Figure CN223688422U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of pulsed laser deposition, in particular to a pulsed laser deposition device. BACKGROUND
[0002] Pulsed laser deposition (PLD), also known as pulsed laser ablation (PLA), is a means for bombarding an object with a laser, and then depositing the bombarded substance on different substrates to obtain a deposit or a film. Due to a characteristic of pulsed laser deposition (PLD), the plume of the laser hitting the target material is relatively small, which can only ensure the uniformity of a small range of the substrate. In the related art, it is often difficult to deposit a large-area or large-size substrate, or the deposited substrate has poor uniformity. CONTENT OF THE UTILITY MODEL
[0003] Therefore, the present application provides a pulsed laser deposition device, which can deposit a large-area or large-size substrate, and the film on the deposited substrate has good uniformity.
[0004] According to an aspect of the present application, a pulsed laser deposition device is provided, which comprises a light source, a scanning assembly and a deposition assembly, wherein the light source is configured to emit pulsed laser light.
[0005] The scanning assembly is arranged on one side of the light source along the first direction, and comprises a first fixed mirror and a second fixed mirror arranged in sequence along the propagation direction of the pulsed laser light. The pulsed laser light passes through the first fixed mirror and the second fixed mirror in sequence, and then propagates along the second direction and is incident on the deposition assembly. The scanning assembly is configured to move relative to the light source along the first direction, so that the pulsed laser light passing through the scanning assembly can be incident on different positions of the deposition assembly.
[0006] The deposition assembly comprises a target material and a substrate, and the surface of the target material facing the substrate is configured to receive the pulsed laser light.
[0007] The first direction and the second direction intersect with each other.
[0008] In one of the embodiments, the first mirror and the second mirror each have a reflecting surface, the first reflecting surface of the first mirror faces the light source and the second mirror and is configured to reflect the pulsed laser emitted by the light source to the second mirror, and the second reflecting surface of the second mirror faces the first mirror and the deposition assembly and is configured to reflect the pulsed laser emitted by the first mirror to propagate along the second direction.
[0009] In one of the embodiments, the scanning assembly comprises a carrier configured to move relative to the light source along the first direction, and the first mirror and the second mirror are both fixed on the carrier.
[0010] In one of the embodiments, the pulsed laser deposition device further comprises a base disposed on one side of the light source and configured to support the scanning assembly, and a linear drive connected between the base and the carrier and configured to drive the carrier to move relative to the base along the first direction.
[0011] In one of the embodiments, the carrier comprises a first mounting arm extending along a third direction and a second mounting arm disposed on one side of the first mounting arm and extending along the second direction, the first mirror is disposed on one end of the first mounting arm along the third direction and located on one side of the light source along the first direction, and the second mirror is disposed on one end of the second mounting arm along the second direction and located on one side of the first mirror along the third direction.
[0012] In one of the embodiments, the first direction, the second direction and the third direction are perpendicular to each other.
[0013] In one of the embodiments, the angle between the first direction and the second direction is 45°, the first direction and the third direction are perpendicular to each other, and the angle between the second direction and the third direction is 45°.
[0014] In one of the embodiments, the scanning assembly further comprises a focusing mirror disposed on one end of the second mounting arm away from the second mirror along the second direction and configured to focus the pulsed laser passing through the second mirror to the deposition assembly.
[0015] In one of the embodiments, the linear drive is connected to one end of the first mounting arm away from the first mirror along the third direction.
[0016] In one embodiment, the deposition assembly further includes a vacuum chamber in which both the target and the substrate are disposed. The vacuum chamber has a laser window through which the pulsed laser from the scanning assembly is incident on the target.
[0017] In one embodiment, the deposition assembly further includes a rotation drive, the substrate being disposed on one side of the target along a third direction, and the substrate having a surface to be deposited facing the target and perpendicular to the third direction, the rotation drive being configured to drive the substrate to rotate about an axis parallel to the third direction.
[0018] In the aforementioned pulsed laser deposition equipment, as the scanning component moves along a first direction, the pulsed laser emitted by the light source can be focused onto different positions on the target material along the first direction. This allows for film deposition at different locations on the substrate along the first direction, enabling deposition of substrates of different sizes, or even large sizes, through the movement of the scanning component in one dimension. Simultaneously, the placement of the first and second fixed mirrors in the scanning component allows them to remain relatively stationary, requiring only the overall movement of the scanning component. This provides a stable propagation path for the pulsed laser, improves its stability, and enhances the uniformity of the material evaporated from the target material onto the substrate, thus improving the deposition effect. In other words, the pulsed laser deposition equipment of this application can deposit onto large-area or large-size substrates, and the deposited film on the substrate exhibits excellent uniformity. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of a pulsed laser deposition apparatus in one embodiment of this application.
[0020] Figure 2 for Figure 1 The diagram shows the structure of the scanning component of the pulsed laser deposition equipment.
[0021] Explanation of icon numbers:
[0022] 10. Pulsed laser deposition equipment;
[0023] 1. Light source;
[0024] 2. Scanning assembly; 21. First fixed lens; 22. Second fixed lens; 23. Carrier; 24. First mounting arm; 25. Second mounting arm; 26. Focusing lens; 27. First driving component; 28. Second driving component; 29. Third driving component;
[0025] 3. Deposition assembly; 31. Target material; 32. Substrate; 33. Vacuum chamber; 34. Laser window;
[0026] 4, base; 5, linear driving member;
[0027] F1, first direction; F2, second direction; F3, third direction. DETAILED DESCRIPTION
[0028] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art, that the present application can be practiced without using these specific details. In other instances, well-known methods have not been described in detail in order to avoid unnecessarily obscuring the present application. Therefore, the specific embodiments described herein are not intended to limit the present application, but rather, the intent is to cover all modifications and alternatives falling within the scope of the present application.
[0029] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0030] In addition, if the terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features referred to. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0031] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] In the present application, unless specifically stated and limited otherwise, if there is a description of a first feature "on" or "under" a second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "over", "above" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.
[0033] It should be noted that if an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.
[0034] Pulsed Laser Deposition (PLD) is an advanced thin film preparation technology. It uses a high-energy pulsed laser beam to irradiate a solid target, generates a high-temperature plasma, and then forms a thin film on a substrate. In the pulsed laser deposition technology, the uniformity of the thin film is indeed very important, because it directly affects the performance and application effect of the thin film. Because the plasma plume formed by laser ablation of the target is in Gaussian distribution, the deposited large-area thin film, especially the thin film on the spherical substrate, is extremely uneven, which seriously limits the application of the pulsed laser deposition technology.
[0035] Based on this, the present application provides a pulsed laser deposition device, which can deposit large-area or large-size substrates, and the film layer on the deposited substrate has better uniformity.
[0036] Referring to Figure 1 as shown, Figure 1Fig. 1 is a schematic view of a pulse laser deposition device 10 according to an embodiment of the present application. The pulse laser deposition device 10 according to the present application comprises a light source 1 for emitting a pulse laser, a scanning assembly 2 and a deposition assembly 3. The scanning assembly 2 is arranged at one side of the light source 1 along a first direction F1, and comprises a first mirror 21 and a second mirror 22 arranged in sequence along a propagation direction of the pulse laser. The pulse laser passes through the first mirror 21 and the second mirror 22 in sequence and then propagates along a second direction F2 and is incident on the deposition assembly 3. The scanning assembly 2 is arranged to be movable relative to the light source 1 along the first direction F1, so that the pulse laser passing through the scanning assembly 2 can be incident on different positions of the deposition assembly 3. In this way, the light ray is moved relative to a target 31 along a dimension of the first direction F1. The deposition assembly 3 comprises the target 31 and a substrate 32. The target 31 is arranged to receive the pulse laser and the material on the target 31 is evaporated by heat and deposited on the substrate 32, so as to coat the substrate 32. The first direction F1 and the second direction F2 intersect each other.
[0037] The pulse laser deposition device 10 according to the present application can coat different positions on the substrate 32 along a dimension of the first direction F1, so that the coating of the substrate 32 of different sizes or large size can be realized by moving the scanning assembly 2 along one dimension. Meanwhile, the first mirror 21 and the second mirror 22 of the scanning assembly 2 are arranged to be relatively static, and only the scanning assembly 2 needs to be moved as a whole, which is beneficial to provide a stable propagation path for the pulse laser, improve the stability of the pulse laser, improve the uniformity of the material evaporated from the target 31 to the substrate 32 by the pulse laser, and improve the coating effect. That is, the pulse laser deposition device 10 according to the present application can coat a large area or large size substrate 32, and the film layer on the coated substrate 32 has good uniformity.
[0038] In some embodiments, both the first fixed mirror 21 and the second fixed mirror 22 have reflective surfaces. The first reflective surface of the first fixed mirror 21 faces the light source 1 and the second fixed mirror 22, and is used to reflect the pulsed laser emitted from the light source 1 to the second fixed mirror 22. The second reflective surface of the second fixed mirror 22 faces the first fixed mirror 21 and the deposition assembly 3, and is configured to reflect the pulsed laser emitted from the first fixed mirror 21 to propagate along the second direction F2. It can be understood that the pulsed laser emitted from the light source 1 propagates along the first direction F1, and the design of the first fixed mirror 21 and the second fixed mirror 22 can propagate the pulsed laser emitted from the light source 1 along the first direction F1 to propagate along the second direction F2. Regardless of where the first fixed mirror 21 and the second fixed mirror 22 move along the first direction F1, they can receive the pulsed laser emitted from the light source 1 and change its deflection direction to propagate along the second direction F2, thereby achieving coating on the substrate 32 at different positions along the first direction F1. Furthermore, the first fixed mirror 21 and the second fixed mirror 22 are relatively stationary, which is beneficial for providing a stable propagation path for the pulsed laser and improving the coating uniformity.
[0039] In some embodiments, in conjunction with reference Figure 1 and Figure 2 As shown, Figure 2 for Figure 1 The diagram shows the structure of the scanning component 2 of the pulsed laser deposition apparatus 10. The scanning component 2 includes a carrier 23, which is configured to move relative to the light source 1 along a first direction F1. A first fixed mirror 21 and a second fixed mirror 22 are both fixedly mounted on the carrier 23. Thus, by moving the carrier 23, the first fixed mirror 21 and the second fixed mirror 22 can be moved simultaneously, allowing them to move relatively stationary. This facilitates providing a stable propagation path for the pulsed laser, improves the stability of the pulsed laser, and enhances the uniformity of the material evaporated from the target 31 onto the substrate 32, thereby improving the coating effect.
[0040] In some embodiments, continue reading Figure 1 As shown, the pulsed laser deposition apparatus 10 also includes a base 4 and a linear drive 5. The base 4 is located on one side of the light source 1 and is used to support the scanning assembly 2. The linear drive 5 is connected between the base 4 and the support 23 and is configured to drive the support 23 to move relative to the base 4 along a first direction F1. The light source 1 is located on the side of the base 4 and is configured to have a fixed relative position with the base 4. The scanning assembly 2 is located on the base 4 and is driven by the linear drive 5 to move along the first direction F1, thereby moving relative to the light source 1 along the first direction F1. This allows the pulsed laser emitted from the light source 1 to propagate to a second direction F2, enabling the pulsed laser to be incident on different positions of the deposition assembly 3. This allows the light to move relative to the target 31 in the first direction F1 dimension to deposit films on substrates 32 of different sizes.
[0041] In some embodiments, continuing to refer to Figure 1 and Figure 2 As shown, the carrier 23 comprises a first mounting arm 24 extending along a third direction F3 and a second mounting arm 25 disposed on one side of the first mounting arm 24 and extending along a second direction F2. The first mirror 21 is disposed at one end of the first mounting arm 24 along the third direction F3 and located on one side of the light source 1 along a first direction F1. The second mirror 22 is disposed at one end of the second mounting arm 25 along the second direction F2 and located on one side of the first mirror 21 along the third direction F3. The first direction F1, the second direction F2 and the third direction F3 intersect with each other. The first mounting arm 24 and the second mounting arm 25 are arranged so that the carrier 23 can support the first mirror 21 and the second mirror 22 while minimizing the size of the carrier 23, thereby reducing the footprint of the carrier 23 and facilitating the miniaturization design of the pulsed laser deposition device 10.
[0042] In some embodiments, the angle between the first direction F1 and the second direction F2 is 45°, the first direction F1 and the third direction F3 are perpendicular to each other, and the angle between the second direction F2 and the third direction F3 is 45°. That is, the pulsed laser emitted by the light source 1 propagates along the first direction F1, is reflected by the first mirror 21 by 90°, propagates along the third direction F3 to the second mirror 22, is reflected by the second mirror 22 by 45°, and finally propagates along the second direction F2 to the deposition assembly 3. In this way, the angle of the reflecting surface of the first mirror 21 relative to the first direction F1 can be adjusted, or in other words, the orientation of the reflecting surface of the first mirror 21 can be adjusted, and at the same time, the orientation of the reflecting surface of the second mirror 22 can be adjusted, thereby improving the installation convenience and debugging convenience of the scanning assembly 2.
[0043] In some embodiments, referring to Figure 1 The scanning assembly 2 further comprises a focusing mirror 26 disposed at one end of the second mounting arm 25 away from the second mirror 22 along the second direction F2 and used for focusing the pulsed laser passing through the second mirror 22 to the deposition assembly 3. The pulsed laser reflected by the second mirror 22 and propagating along the second direction F2 can pass through the focusing mirror 26 and be focused by the focusing mirror 26 onto the target material 31, thereby achieving the heating and evaporation of the material of the target material 31.
[0044] In some embodiments, continuing to refer to Figure 1The linear driving member 5 is connected to the base 4 and the first mounting arm 24 at the end of the first fixed mirror 21 away from the third direction F3. In this way, the mounting positions of the first fixed mirror 21, the second fixed mirror 22, the focusing mirror 26 and the linear driving member 5 relative to the bearing member 23 are reasonable, the integration of the whole scanning assembly 2 is high, which is conducive to reducing the size of the scanning assembly 2, reducing the floor space, and facilitating the miniaturization design of the pulsed laser deposition device 10.
[0045] In some embodiments, referring to Figure 1 The scanning assembly 2 further comprises a first driving member 27, a second driving member 28 and a third driving member 29. The first driving member 27 is connected between the first fixed mirror 21 and the first mounting arm 24, so that the first fixed mirror 21 can move relative to the first mounting arm 24 along the third direction F3. The second driving member 28 is connected between the second fixed mirror 22 and the second mounting arm 25, so that the second fixed mirror 22 can move relative to the second mounting arm 25 along the second direction F2. The third driving member 29 is connected between the focusing mirror 26 and the second mounting arm 25, so that the focusing mirror 26 can move relative to the second mounting arm 25 along the second direction F2. In this way, the flexibility of the scanning assembly 2 is achieved. It can be understood that the above adjustment is only in the debugging stage before starting the film deposition. After the formal film deposition starts, the first fixed mirror 21 and the second fixed mirror 22 are fixed to each other to maintain the temperature of the optical path, so as to improve the uniformity of the film deposition.
[0046] When the first fixed mirror 21 is moved to a suitable position on the first mounting arm 24, the first fixed mirror 21 can be locked or fixed at this position on the first mounting arm 24 by a locking structure, so that the first fixed mirror 21 is locked at a fixed position. Correspondingly, when the second fixed mirror 22 is moved to a suitable position on the second mounting arm 25, the second fixed mirror 22 can also be locked at this position on the second mounting arm 25 by another locking structure. Correspondingly, when the focusing mirror 26 is moved to a suitable position on the second mounting arm 25, the second mounting arm 25 can also be locked at the corresponding position on the second mounting arm 25 by another locking structure. In this way, the first fixed mirror 21, the second fixed mirror 22 and the focusing mirror 26 can be fixed at their respective corresponding positions, so as to facilitate the adjustment of the positions of the first fixed mirror 21, the second fixed mirror 22 and the focusing mirror 26, and improve the stability of the propagation of light by the two fixed mirrors.
[0047] In some embodiments, continuing to refer to Figure 1 The deposition assembly 3 further comprises a vacuum chamber 33, and the target material 31 and the substrate 32 are arranged in the vacuum chamber 33 to maintain the vacuum degree of the target material 31 and the substrate 32 in the working state. The vacuum chamber 33 has a laser window 34, and the pulsed laser passing through the scanning assembly 2 enters the target material 31 from the laser window 34, so that the pulsed laser can enter the vacuum chamber 33.
[0048] In some embodiments, the deposition assembly 3 further comprises a rotating driving member, the substrate 32 is arranged at one side of the target 31 along the third direction F3, and the substrate 32 has a deposition surface facing the target 31 and being perpendicular to the third direction F3, and the rotating driving member is configured to drive the substrate 32 to rotate around an axis parallel to the third direction F3. It can be understood that the scanning assembly 2 moves along the first direction F1 to realize the deposition of the substrate 32 at different positions along the first direction F1, and in combination with the arrangement that the substrate 32 rotates around the axis parallel to the third direction F3, the deposition of the substrate 32 at any position of the deposition surface can be realized, so as to further expand the deposition area of the substrate 32 and realize the large-area deposition of the substrate 32 of different sizes. Meanwhile, the rotating arrangement of the substrate 32 is beneficial to further improve the uniformity of the deposition at different positions of the substrate 32 and improve the deposition quality.
[0049] The working process of the pulse laser deposition device 10 of the present application is as follows: in the initial state, the carrier 23 is at a certain fixed position, and when the deposition starts, the light source 1 emits pulse laser, and the pulse laser can just hit the edge position of the target 31 after passing through the first fixed mirror 21 and the second fixed mirror 22. As the deposition starts, the carrier 23 moves along the first direction F1, and the light path also slowly moves to the center position of the target 31, so that the position of the pulse laser hitting the target 31 is changing, and in combination with the rotation of the substrate 32, the thin film of the large-area substrate 32 can be formed, and the maximum substrate can be 8 inches.
[0050] The pulse laser deposition device 10 of the present application can realize the deposition of different positions on the substrate 32 along the first direction F1, so that the deposition of the substrate 32 of different sizes or large sizes can be realized by the movement of the scanning assembly 2 in one dimension. In combination with the rotation of the substrate 32, the deposition of different positions on the substrate 32 can be realized. Meanwhile, the first fixed mirror 21 and the second fixed mirror 22 of the scanning assembly 2 are arranged to be relatively static, and only the whole scanning assembly 2 needs to be moved, which is beneficial to provide a stable propagation path for the pulse laser, improve the stability of the pulse laser, improve the uniformity of the material of the target 31 evaporated by the pulse laser to the substrate 32, and improve the deposition effect. The rotation of the substrate 32 is beneficial to make the thickness of the deposited film layer at different positions on the substrate 32 the same, and is beneficial to improve the deposition uniformity. That is, the pulse laser deposition device 10 of the present application can deposit the large-area or large-size substrate 32, and the film layer on the deposited substrate 32 has better uniformity.
[0051] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.
[0052] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A pulsed laser deposition apparatus, characterized by, The pulse laser deposition device comprises a light source for emitting a pulse laser, a scanning assembly, and a deposition assembly; The scanning assembly is arranged on one side of the light source along a first direction, and comprises a first fixed mirror and a second fixed mirror arranged in sequence along a propagation direction of the pulse laser. The pulse laser passes through the first fixed mirror and the second fixed mirror in sequence and then propagates along a second direction and is incident on the deposition assembly. The scanning assembly is arranged to be movable relative to the light source along the first direction, so that the pulse laser passing through the scanning assembly can be incident on different positions of the deposition assembly. The deposition assembly comprises a target and a substrate, and the target is arranged to receive the pulse laser. The first direction and the second direction intersect each other.
2. The pulsed laser deposition apparatus according to claim 1, characterized in that, The first fixed mirror and the second fixed mirror each have a reflecting surface. A first reflecting surface of the first fixed mirror is arranged to reflect the pulse laser emitted by the light source to the second fixed mirror. A second reflecting surface of the second fixed mirror is arranged to reflect the pulse laser emitted by the first fixed mirror to propagate along the second direction.
3. The pulsed laser deposition apparatus of claim 1, wherein The scanning assembly comprises a carrier arranged to be movable relative to the light source along the first direction. The first fixed mirror and the second fixed mirror are fixed on the carrier.
4. The pulsed laser deposition apparatus of claim 3, wherein The pulse laser deposition device further comprises a base arranged on one side of the light source and used to carry the scanning assembly, and a linear drive connected between the base and the carrier and arranged to drive the carrier to move relative to the base along the first direction.
5. The pulsed laser deposition apparatus of claim 4, wherein The carrier comprises a first mounting arm extending along a third direction and a second mounting arm arranged on one side of the first mounting arm and extending along the second direction. The first fixed mirror is arranged at one end of the first mounting arm along the third direction and located on one side of the light source along the first direction. The second fixed mirror is arranged at one end of the second mounting arm along the second direction and located on one side of the first fixed mirror along the third direction. The first direction, the second direction, and the third direction intersect each other.
6. The pulsed laser deposition apparatus of claim 5, wherein, The angle between the first direction and the second direction is 45°. The first direction and the third direction are perpendicular to each other, and the angle between the second direction and the third direction is 45°.
7. The pulsed laser deposition apparatus of claim 5, wherein The scanning assembly further comprises a focusing mirror arranged at one end of the second mounting arm away from the second fixed mirror along the second direction and used to focus the pulse laser passing through the second fixed mirror to the deposition assembly.
8. The pulsed laser deposition apparatus of claim 5, wherein, The linear drive is connected to one end of the first mounting arm away from the first fixed mirror along the third direction.
9. The pulsed laser deposition apparatus of claim 1, wherein, The deposition assembly further includes a vacuum chamber, the target and the substrate are both arranged in the vacuum chamber, and the vacuum chamber has a laser window through which the pulsed laser from the scanning assembly is incident on the target.
10. The pulsed laser deposition apparatus of claim 1, wherein, The deposition assembly further includes a rotation driving member, the substrate is arranged on one side of the target along a third direction, and the substrate has a plating surface facing the target and perpendicular to the third direction, and the rotation driving member is configured to drive the substrate to rotate about an axis parallel to the third direction.