Electrocoppering tank with tank liquid circulating system

Abstract

The utility model discloses an electro-coppering bath with a bath solution circulating system, which belongs to the technical field of electroplating and comprises an electro-coppering bath, a filter is in bolted connection with the surface of the electro-coppering bath, a pressure gauge device is fixedly connected with the surface of the filter, a first rotating shaft is rotatably arranged in the electro-coppering bath, and a second rotating shaft is rotatably arranged in the first rotating shaft. A motor is fixedly connected to the surface of the electro-coppering tank, the first rotating shaft is fixedly connected to the output end of the motor, a stirring wheel is fixedly connected to the surface of the first rotating shaft, a second fixing block is fixedly connected to the surface of the electro-coppering tank, and a knocking column is slidably connected to the interior of the second fixing block. According to the electro-coppering tank with the tank liquid circulating system, an auxiliary rotating shaft is connected with a belt pulley, so that a stirring wheel stirs liquid in the electro-coppering tank, the thickness uniformity of a plating layer is ensured, the situation that the local part is too thick or too thin is avoided, the overall quality of the plating layer is improved, and the surface of the plating layer is smoother and better in compactness.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating tank technical field, concretely is a kind of electroplating copper tank with tank liquor circulating system. BACKGROUND

[0002] Electroplating process is the principle of using electrolysis to lay a layer of metal on the conductor, electroplating refers to in the salt solution containing pre-plated metal, with the plated substrate metal as cathode, through electrolysis, make the cation of pre-plated metal in plating solution deposit on the substrate metal surface, form plating layer a kind of surface processing method;In the electroplating process, impurities are easily left in the electroplating solution, affect the electroplating effect of electroplating solution, and the electroplating solution in the electroplating tank after a period of electroplating, lead to the uneven concentration of cation inside the electroplating solution, and the electroplating residue generated in the electroplating process will significantly affect the purity of electroplating solution, and will directly affect the efficiency and effect of electroplating.

[0003] In order to overcome the above-mentioned defects, the prior art 1 (application number CN201711364084.7, application date 2017-12-18 Chinese patent) a kind of electroplating copper tank liquid up and down tank circulating system, copper tank liquid adopts up and down tank circulating mode, ensure that up and down tank electroplating solution is always in circulating flow state, improve the uniformity of up and down tank copper plating, improve the working efficiency when electroplating, ensure the quality and stability of electroplating when electroplating tank works, have good market value and market prospect.

[0004] The above-mentioned device cannot stir the liquid in the electroplating tank during use, resulting in differences in the thickness of the plating layer, reducing its performance, and cannot knock the pipeline, resulting in blockage of the filter, causing the liquid not to circulate, and shortening the service life of the device. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of electroplating copper tank with tank liquor circulating system to solve the problems that the liquid in the electroplating tank cannot be stirred in the above background art, resulting in differences in the thickness of the plating layer, reducing its performance, and the pipeline cannot be knocked, resulting in blockage of the filter, causing the liquid not to circulate, and shortening the service life of the device.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of electroplating copper tank with tank liquor circulating system, including electroplating copper tank, the surface bolt connection of electroplating copper tank has filter, and the surface fixedly connected with pressure gauge of filter, and the rotation of electroplating copper tank inside is provided with No. shaft, the surface fixedly connected with motor of electroplating copper tank, and the output end fixedly connected with No. shaft of motor, and the surface fixedly connected with stirring wheel of No. shaft, the surface fixedly connected with No. 2 fixed block of electroplating copper tank, and the inside sliding connection of No. 2 fixed block has knocking column.

[0007] Preferably, the electroplating copper tank is internally fixedly connected with a circulating pipeline, and the circulating pipeline is connected through the filter, and the surface of the circulating pipeline is fixedly connected with a valve.

[0008] Preferably, the surface of the first rotating shaft is sleeved with a belt pulley, the other end of the belt pulley is sleeved with an auxiliary rotating shaft, and the surface of the auxiliary rotating shaft is fixedly connected with the stirring wheel.

[0009] Preferably, the surface of the electroplating copper tank is fixedly connected with a first fixed block, the second rotating shaft is rotatably arranged in the first fixed block, and the first fixed block is symmetrically distributed about the center of the second rotating shaft.

[0010] Preferably, the surface of the second rotating shaft and the surface of the auxiliary rotating shaft are fixedly connected with bevel gears, and the surface of the second rotating shaft is fixedly connected with a pushing block.

[0011] Preferably, the surface of the connecting disc is fixedly connected with a first spring, and the other end of the first spring is fixedly connected with a second fixed block.

[0012] Preferably, the second fixed block is symmetrically distributed about the knocking column.

[0013] Compared with the prior art, the electroplating copper tank with a tank liquid circulating system has the beneficial effects that:

[0014] The electroplating copper tank with a tank liquid circulating system is connected through the auxiliary rotating shaft and the belt pulley, so that the stirring wheel stirs the liquid in the electroplating copper tank, thereby ensuring the uniform thickness of the plating layer, avoiding the local over-thickness or over-thin condition, improving the overall quality of the plating layer, and making the plating layer surface more smooth and compact.

[0015] Further, the continuous stirring of the stirring wheel can effectively prevent the local precipitation and aggregation of the components in the tank liquid, improve the appearance and corrosion resistance of the plating layer, prolong the service life of the entire electroplating device, and reduce the equipment maintenance cost and replacement frequency.

[0016] The electroplating copper tank with a tank liquid circulating system is connected through the first spring and the second fixed block, so that the knocking column reciprocally knocks the circulating pipeline, which can effectively prevent the blockage of the circulating pipeline, loosen and fall off the substances attached to the inner wall of the pipeline, ensure that the pipeline is always unobstructed, maintain the stable operation of the tank liquid circulating system, and ensure that the electroplating process is not disturbed by the pipeline blockage problem.

[0017] Further, the pushing blocks are distributed on both sides of the electroplating copper tank, so that the residues of particles on the inner wall of the circulating pipeline are reduced, and the stability of the electrode reaction and the consistency of the plating layer quality in the electroplating process are ensured.

[0018] (3) The electroplating copper tank with the electrolyte circulating system can remove the impurity particles in the electrolyte when the liquid in the electroplating copper tank flows into the filter, avoid the influence of the impurities on the electroplating quality and the damage to other components such as the pipeline and the pump, and ensure the smooth operation of the entire electroplating liquid circulating system and the electroplating process. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic view of the electroplating copper tank and the filter connecting structure of the utility model;

[0020] Figure 2 It is a schematic view of the circulating pipeline and the valve connecting structure of the utility model;

[0021] Figure 3 It is a schematic view of the electroplating copper tank and the first fixing block connecting structure of the utility model;

[0022] Figure 4 It is a schematic view of the first rotating shaft and the stirring wheel connecting structure of the utility model;

[0023] Figure 5 It is a schematic view of the second rotating shaft and the pushing block connecting structure of the utility model;

[0024] Figure 6 It is a schematic view of the auxiliary rotating shaft and the bevel gear connecting structure of the utility model;

[0025] Figure 7 It is a schematic view of the connecting disc and the first spring connecting structure of the utility model.

[0026] In the drawing: 1, electroplating copper tank; 2, filter; 3, circulating pipeline; 4, motor; 5, first rotating shaft; 6, belt pulley; 7, auxiliary rotating shaft; 8, stirring wheel; 9, pressure gauge; 10, first fixing block; 11, second fixing block; 12, bevel gear; 13, second rotating shaft; 14, pushing block; 15, knocking column; 16, connecting disc; 17, first spring; 18, valve. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor fall within the protection scope of the utility model.

[0028] Example one: by setting the electroplating copper tank 1, filter 2 and pressure gauge 9 connection, improve the stability of the device, as shown in Figures 1-2

[0029] The electroplating copper tank 1, the surface of the filter 2 is bolted, and the filter 2 is fixedly connected with the pressure gauge 9, and the electroplating copper tank 1 is rotatably provided with a first rotating shaft 5, the surface of the electroplating copper tank 1 is fixedly connected with the motor 4, and the output end of the motor 4 is fixedly connected with the first rotating shaft 5, and the surface of the first rotating shaft 5 is fixedly connected with the stirring wheel 8, the surface of the electroplating copper tank 1 is fixedly connected with the second fixed block 11, and the second fixed block 11 is slidably connected with the knocking column 15.

[0030] The filter 2 is installed on the surface of the electroplating copper tank 1, and the electroplating copper tank 1 and the filter 2 are connected through the circulating pipeline 3, so that the tank liquid in the electroplating copper tank 1 is extracted, the tank liquid flows in the closed pipeline system, and then is sent back to the electroplating copper tank 1, forming a continuous circulating loop, ensuring that the tank liquid is in a dynamic flow state, when the liquid in the electroplating copper tank 1 flows into the inside of the filter 2, the filter 2 can remove the impurity particles in the tank liquid, avoid the influence of impurities on the electroplating quality and the damage to the pipeline, pump and other components, and ensure the smooth operation of the whole electroplating liquid circulating system and the electroplating process, at the same time, the pressure gauge 9 cooperates with it, through real-time feedback of pressure information, the staff can timely find the possible blockage of the filter 2 and other problems, and then take corresponding cleaning and maintenance measures, prevent the failure of the filter 2 from causing the unstable operation of the whole device, and improve the stability of the device.

[0031] Example two, in this embodiment, different from example one, by setting the motor 4, belt pulley 6 and stirring wheel 8 connection, improve the working efficiency of the device, as shown in Figures 3-4

[0032] The circulating pipeline 3 is fixedly connected in the electroplating copper tank 1, the circulating pipeline 3 penetrates the filter 2, the surface of the circulating pipeline 3 is fixedly connected with the valve 18, the surface of the first rotating shaft 5 is sleeved with the belt pulley 6, the other end of the belt pulley 6 is sleeved with the auxiliary rotating shaft 7, the surface of the auxiliary rotating shaft 7 is fixedly connected with the stirring wheel 8, the surface of the electroplating copper tank 1 is fixedly connected with the first fixed block 10, the inside of the first fixed block 10 is rotatably provided with the second rotating shaft 13, and the first fixed block 10 is symmetrically distributed about the center of the second rotating shaft 13.

[0033] ​​When the object is electroplated, the belt pulley 6 on the surface of the first rotating shaft 5 of the motor 4 drives the auxiliary rotating shaft 7 to rotate at the same time, and the stirring wheel 8 is installed on the surface of the first rotating shaft 5 and the surface of the auxiliary rotating shaft 7, so that when the motor 4 rotates, the stirring wheel 8 stirs the liquid in the copper plating tank 1, thereby ensuring that the plating thickness is uniform, avoiding local over-thickness or under-thickness, improving the overall quality of the plating layer, making the plating layer surface more smooth and compact, and because of the continuous stirring of the stirring wheel 8, it can effectively prevent the components in the bath from local precipitation, aggregation and other phenomena, greatly reducing the probability of such plating layer quality problems, improving the appearance and corrosion resistance of the plating layer, and prolonging the service life of the entire electroplating device, reducing equipment maintenance cost and replacement frequency.

[0034] In this embodiment, unlike embodiment two, the connection of the bevel gear 12, the connecting disc 16 and the first spring 17 makes the knocking column 15 reciprocatingly knock the circulating pipeline 3, thereby avoiding pipeline blockage, as shown in Figures 5-7

[0035] The surface of the second rotating shaft 13 and the surface of the auxiliary rotating shaft 7 are fixedly connected with the bevel gear 12, the surface of the second rotating shaft 13 is fixedly connected with the pushing block 14, the surface of the knocking column 15 is fixedly connected with the connecting disc 16, the surface of the connecting disc 16 is fixedly connected with the first spring 17, the other end of the first spring 17 is fixedly connected with the second fixed block 11, and the second fixed block 11 is symmetrically distributed about the center of the knocking column 15.

[0036] The bevel gear 12 connects the second rotating shaft 13 and the auxiliary rotating shaft 7, when the motor 4 rotates, the pushing block 14 on the surface of the second rotating shaft 13 is driven to rotate, when the pushing block 14 contacts with the knocking column 15, the pushing block 14 will push the knocking column 15 to knock the surface of the circulating pipeline 3, the first spring 17 is installed on the surface of the knocking column 15, so that the first spring 17 shrinks to the surface of the second fixed block 11, when the pushing block 14 separates from the knocking column 15, due to the elastic force of the first spring 17, the knocking column 15 returns to the initial position, thereby realizing the reciprocating knocking of the knocking column 15 to the circulating pipeline 3, which can loosen and fall off the substances attached to the inner wall of the pipeline, ensure that the pipeline inside always keeps unobstructed, maintain the stable operation of the bath liquid circulation system, ensure that the electroplating process is not disturbed by the pipeline blockage problem, and the knocking column 15 can keep the flow and speed parameters of the bath liquid circulation stable, thereby ensuring the stability of the electrode reaction and the consistency of the plating layer quality in the electroplating process.

[0037] The above is the working process of the entire device, and the contents not described in detail in the specification all belong to the existing technology known to those skilled in the art.

[0038] ​Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electroplating copper tank provided with a tank liquid circulating system, comprising an electroplating copper tank (1), the surface of the electroplating copper tank (1) is bolted with a filter (2), and the surface of the filter (2) is fixedly connected with a pressure gauge (9), and a No. 1 rotating shaft (5) is arranged in the electroplating copper tank (1); Characterized in that: The surface of the electroplating copper tank (1) is fixedly connected with an electric motor (4), and the output end of the electric motor (4) is fixedly connected with the No. 1 rotating shaft (5), and the surface of the No. 1 rotating shaft (5) is fixedly connected with a stirring wheel (8); The surface of the electroplating copper tank (1) is fixedly connected with a No. 2 fixed block (11), and the inside of the No. 2 fixed block (11) is slidably connected with a knocking column (15).

2. The electroplating copper cell provided with a cell liquid circulation system according to claim 1, characterized in that: The inside of the electroplating copper tank (1) is fixedly connected with a circulating pipeline (3), the circulating pipeline (3) penetrates the filter (2), and the surface of the circulating pipeline (3) is fixedly connected with a valve (18).

3. The electroplating copper cell with a cell liquid circulation system according to claim 1, characterized in that: The surface of the No. 1 rotating shaft (5) is sleeved with a belt pulley (6), the other end of the belt pulley (6) is sleeved with an auxiliary rotating shaft (7), and the surface of the auxiliary rotating shaft (7) is fixedly connected with the stirring wheel (8), and the auxiliary rotating shaft (7) is rotatably arranged in the electroplating copper tank (1).

4. The electroplating copper cell provided with a cell liquid circulating system according to claim 3, characterized in that: The surface of the electroplating copper tank (1) is fixedly connected with a No. 1 fixed block (10), and a No. 2 rotating shaft (13) is rotatably arranged in the inside of the No. 1 fixed block (10), and the No. 1 fixed block (10) is symmetrically distributed about the center of the No. 2 rotating shaft (13).

5. The electroplating copper cell provided with a cell liquid circulation system according to claim 4, characterized in that: The surface of the No. 2 rotating shaft (13) and the surface of the auxiliary rotating shaft (7) are fixedly connected with bevel gears (12), and the surface of the No. 2 rotating shaft (13) is fixedly connected with a pushing block (14).

6. The electroplating copper cell with a cell liquid circulation system according to claim 1, characterized in that: The surface of the knocking column (15) is fixedly connected with a connecting disc (16), the surface of the connecting disc (16) is fixedly connected with a No. 1 spring (17), and the other end of the No. 1 spring (17) is fixedly connected with a No. 2 fixed block (11).

7. The electroplating copper cell provided with a cell liquid circulation system according to claim 6, characterized in that: The No. 2 fixed block (11) is symmetrically distributed about the center of the knocking column (15).

Images