Thermal resistance test tool for double-sided heat dissipation toll packaging device
By designing a thermal resistance testing fixture for double-sided heat dissipation toll-packaged devices, and using a liquid circulation channel and conductive connectors to directly contact the heat dissipation surface, the problems of inconsistent heat dissipation paths and thermal coupling effects in traditional testing methods are solved, achieving efficient and accurate thermal resistance testing.
Patent Information
- Application Number
- CN202423237763.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-27
AI Technical Summary
Traditional double-sided heat dissipation testing methods suffer from problems such as inconsistent heat dissipation paths, inability to eliminate thermal coupling effects, and a lack of thermal resistance models and evaluation methods, making it impossible to accurately test the thermal resistance of double-sided heat dissipation modules.
A thermal resistance testing fixture for double-sided heat-dissipating toll-packaged devices was designed, including heat dissipation devices and conductive connectors. The heat dissipation surface of the device under test is directly contacted through a liquid circulation channel and conductive connectors. A PCB board or conductive bolts are used instead of probes to ensure the consistency of the heat dissipation path and simplify the testing process.
It improves testing efficiency, shortens testing time, enhances heat dissipation efficiency, avoids damage to the package shape, and can accurately measure the thermal resistance of the double-sided heat dissipation module.
Smart Images
Figure CN223692310U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of thermal resistance test, especially relates to the thermal resistance test frock for double -sided heat dissipation toll package device. BACKGROUND
[0002] In the evolution process of power electronic devices towards high-density integration, high-power output and miniaturization design, its wide application greatly enriches our daily life. However, with the continuous rise of power level, the heat dissipation problem of electronic devices is increasingly prominent, which becomes the key factor restricting the further development of technology. In view of this, the importance of heat dissipation technology is self-evident, and its efficiency is directly related to the performance and service life of the product.
[0003] For some small size components that need to withstand high power, the traditional single-sided cooling structure has been difficult to meet the stringent heat dissipation requirements. In recent years, the research on double-sided cooling structure of power module is increasing, and the thermal resistance test of double-sided cooling structure usually covers the secondary heat dissipation surface of the power module with thermal insulation material, and the main heat dissipation surface is pressed on the heat sink through the interface material, and the water is continuously cooled. According to the test method of single-sided heat dissipation device, the main heat dissipation surface structure function curve is measured. Such thermal resistance test brings the following problems:
[0004] 1. Consistency problem of heat dissipation path: the traditional double-interface method test requires that the chip junction-shell heat dissipation path is consistent under two interface conditions, but direct pressing will lead to inconsistent path with silicone interface, resulting in inconsistent structure function curve in the front section, and the thermal resistance cannot be accurately tested. Therefore, the traditional double-interface method is not suitable for thermal test of double-sided heat dissipation IGBT module, and a new interface material needs to be developed to replace direct pressing to ensure the consistency of the heat dissipation path of the two interfaces.
[0005] 2. Thermal coupling effect: due to the absence of absolute thermal insulation material, the thermal coupling effect of double-sided heat dissipation module cannot be completely eliminated. This will lead to smaller measured value and simulation value of single-sided thermal resistance, and the way of inversely deducing the secondary heat dissipation surface thermal resistance according to the main heat dissipation surface and double-sided measured thermal resistance is needed to reduce the coupling effect and correct the test results.
[0006] 3. Lack of thermal resistance model and evaluation method: the existing research still uses the thermal resistance model and evaluation method of single-sided heat dissipation package, which is not applicable to double-sided heat dissipation package with double-channel heat transfer characteristics. This leads to the problems of unclear physical meaning, lack of thermal circuit model and blank evaluation method, which seriously restricts the equipment research and development, reliable operation and scale application of double-sided heat dissipation module.
[0007] Therefore, a thermal resistance test frock for double-sided heat dissipation toll package device is needed to simplify the test process and improve the heat dissipation effect. UTILITY MODEL CONTENTS
[0008] The utility model provides a thermal resistance test tool for double -sided heat dissipation toll package device, can simplify the test process, improve the heat dissipation effect.
[0009] In order to solve above-mentioned technical problem, the present application provides the following technical scheme:
[0010] The thermal resistance test tool for double -sided heat dissipation toll package device, including heat dissipation device and electrically conductive connecting piece, heat dissipation device inside is provided with liquid circulation channel, and the upper and lower heat dissipation surface of heat dissipation device and the device to be measured contact,
[0011] Electrically conductive connecting piece and heat dissipation device are detachably connected, and the pin of the device to be measured is contacted with electrically conductive connecting piece.
[0012] Further, the heat dissipation device includes an upper cold plate, a lower cold plate, and a connecting pipe.
[0013] The upper cold plate and the lower cold plate are internally provided with a liquid circulation channel.
[0014] The upper cold plate has a first water inlet and a first water outlet at both ends, respectively, which are connected to the liquid circulation channel; the lower cold plate has a second water inlet and a second water outlet at both ends, respectively, which are connected to the liquid circulation channel.
[0015] The connecting pipe is connected to the first water outlet and the second water inlet, respectively.
[0016] The upper cold plate and the lower cold plate are in contact with the upper and lower heat dissipation surfaces of the device to be measured, respectively.
[0017] Further, the electrically conductive connecting piece includes an upper PBC plate and a lower PBC plate.
[0018] The upper surface of the lower cold plate has a first accommodating groove matching the shape of the lower PBC plate, and the lower PBC plate is detachably connected in the first accommodating groove; the lower PBC plate is hollowed out at a position corresponding to the lower heat dissipation surface of the device to be measured.
[0019] The lower surface of the upper cold plate has a second accommodating groove, and the upper PBC plate is detachably connected in the second accommodating groove; the upper PBC plate is hollowed out at a position corresponding to the upper heat dissipation surface of the device to be measured.
[0020] The upper PBC plate is provided with a contact point at a position corresponding to the pin of the device to be measured.
[0021] Further, the upper PBC plate and the lower PBC plate are both provided with a terminal.
[0022] Further, the upper PBC plate protrudes from the lower surface of the upper cold plate, and the protruding thickness THK1 is equal to the thickness THK2 from the pin of the device to be measured to the upper heat dissipation surface.
[0023] Further, the upper cold plate, the upper PBC plate, the lower PBC plate and the lower cold plate are provided with first threaded holes at corresponding positions.
[0024] Further, the conductive connecting piece comprises at least two conductive bolts.
[0025] The upper cold plate is provided with at least two second threaded holes, and the interval between the second threaded holes is the same as the interval between the pins of the device to be tested.
[0026] The conductive bolt comprises a threaded column and a socket fixed to the top end of the threaded column.
[0027] The threaded column is screwed with the second threaded hole.
[0028] The lower end of the threaded column is in contact with the pin of the device to be tested.
[0029] Further, the socket is a banana socket.
[0030] In the present scheme, the heat dissipation surface of the device to be tested is directly in contact with the heat dissipation device, which can effectively improve the heat dissipation efficiency and be closer to the actual thermal resistance of the device to be tested. The PCB plate or the conductive bolt is used instead of the common probe, so that the device to be tested is directly and closely combined with the PCB plate or the conductive bolt, which not only omits the step of welding the pins of the device to be tested, but also avoids the damage to the package shape due to the larger contact surface, the enhanced current-carrying capacity and the improved test efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0031] Figure 1 It is a top view of the opened thermal resistance test tool for the double-sided heat dissipation toll package device in embodiment one.
[0032] Figure 2 It is a side view of the thermal resistance test tool for the double-sided heat dissipation toll package device in embodiment one.
[0033] Figure 3 It is a front view of the thermal resistance test tool for the double-sided heat dissipation toll package device in embodiment one.
[0034] Figure 4 It is a side view of the thermal resistance test tool for the double-sided heat dissipation toll package device in embodiment two. DETAILED DESCRIPTION
[0035] The following will be further described in detail through specific embodiments:
[0036] The marks in the drawings of the specification include: the upper cold plate 1, the lower cold plate 2, the connecting pipe 3, the upper PBC plate 4, the lower PBC plate 5, the first water inlet 6, the second water outlet 7, the first threaded hole 8, the contact 9, the plastic package material of the device to be tested 10, the pin of the device to be tested 11, the threaded column 12, the socket 13 and the fixing bolt 14.
[0037] Embodiment One
[0038] The heat resistance test tool for double-sided heat dissipation toll package device, heat dissipation device and conductive connecting piece of the embodiment;
[0039] As shown in Figure 1 , Figure 2 , Figure 3 , the heat dissipation device comprises an upper cold plate 1, a lower cold plate 2 and a connecting pipe 3.
[0040] The conductive connecting piece comprises an upper PBC plate 4 and a lower PBC plate 5.
[0041] The upper surface of the lower cold plate 2 is provided with a first accommodating groove matching the shape of the lower PBC plate 5, the lower PBC plate 5 is fixed in the first accommodating groove, and the lower PBC plate 5 is hollowed out at a position corresponding to the lower surface (i.e. the lower heat dissipation surface) of the plastic sealing material 10 of the device to be tested.
[0042] In the embodiment, the total length of the lower PBC plate 5 is 42 mm, the width is 12 mm, and the thickness is 3.5 mm.
[0043] The lower surface of the upper cold plate 1 is provided with a second accommodating groove, the upper PBC plate 4 is fixed in the second accommodating groove, and the upper PBC plate 4 is hollowed out at a position corresponding to the upper surface (i.e. the upper heat dissipation surface) of the plastic sealing material 10 of the device to be tested. The thickness THK1 of the upper PBC plate 4 protruding from the lower surface of the upper cold plate 1 is equal to the thickness THK2 of the pins 11 of the device to be tested to the upper surface of the plastic sealing material; so as to ensure that the upper surface of the plastic sealing material of the device to be tested is in contact with the lower surface of the upper cold plate 1.
[0044] The upper cold plate 1 and the lower cold plate 2 are provided with liquid circulation channels inside; the two ends of the upper cold plate 1 in the length direction are respectively provided with a first water inlet 6 and a first water outlet connected with the liquid circulation channels; the two ends of the lower cold plate 2 in the length direction are respectively provided with a second water inlet and a second water outlet 7 connected with the liquid circulation channels; the connecting pipe 3 is connected with the first water outlet and the second water inlet respectively; in the embodiment, the connecting pipe 3 adopts high-temperature-resistant rubber water pipe.
[0045] The upper PBC plate 4 and the lower PBC plate 5 are provided with circuits.
[0046] The corresponding positions of the upper cold plate 1, the upper PBC plate 4, the lower PBC plate 5 and the lower cold plate 2 are also provided with first threaded holes 8.
[0047] The upper PBC plate 4 is provided with a contact 9 at a position corresponding to the pins 11 of the device to be tested.
[0048] The upper PBC plate 4 and the lower PBC plate 5 are both provided with wiring terminals.
[0049] The embodiment takes a double-sided heat dissipation toll package device as the device to be tested.
[0050] During the test, insulating silicon grease is applied on the upper and lower heat dissipation surfaces of the device under test;
[0051] The device under test is placed on the lower cold plate 2, so that the plastic package of the device under test is located in the hollow position of the lower PBC plate 5, the lower surface of the pin of the device under test is in contact with the contact 9 of the lower PBC plate 5, and the lower surface of the plastic package is in contact with the surface of the lower cold plate 2.
[0052] The upper cold plate 1 is covered, so that the plastic package of the device under test is located in the hollow position of the upper PBC plate 4, the upper surface of the pin of the device under test is in contact with the contact 9 of the upper PBC plate 4, and the upper surface of the plastic package is in contact with the surface of the upper cold plate 1.
[0053] The upper cold plate 1 and the lower cold plate 2 are clamped and fixed to the device under test by the first threaded hole 8 of the upper cold plate 1, the upper PBC plate 4, the lower PBC plate 5, and the lower cold plate 2 through the fixing bolt 14. The upper PBC plate 4 and the lower PBC plate 5 can be replaced by removing the fixing screw to achieve detachable connection.
[0054] The wiring terminals of the upper PBC plate 4 and the lower PBC plate 5 are connected to the wiring terminals of the external power supply device through the connecting wire.
[0055] The first water inlet hole and the second water outlet 7 are connected to the water outlet and the water inlet of the external water cooler through the pipeline;
[0056] The 50% pure water and 50% ethylene glycol mixed liquid is used as the cooling liquid. When the liquid temperature is 25℃ and the liquid flow rate reaches 8L / min, the corresponding test conditions are met, and the thermal resistance test of the device under test is started. After the test is completed, a group of integral curves is obtained.
[0057] Then, a 0.5mm thick heat-conducting pad is attached to the heat dissipation surface of the device under test. After re-fixing, the second test is performed to obtain another group of integral curves. The thermal resistance data of double-sided simultaneous heat dissipation are obtained by the double-interface test method of the two different media. The final double-sided package thermal resistance is obtained by comparing and fitting the two groups of data.
[0058] During the test, first, insulating silicon grease is applied on the heat dissipation surface (i.e. the upper surface and the lower surface of the plastic package) of the device under test.
[0059] Next, the device under test is placed on the lower cold plate 2, ensuring that the plastic package of the device under test is located in the hollow position of the lower PBC plate 5, and the lower surface of the pin of the device under test is in contact with the contact 9 of the lower PBC plate 5. The lower surface of the plastic package is in contact with the surface of the lower cold plate 2.
[0060] Then, the upper cold plate 1 is placed on top, so that the molding compound of the device under test is located in the cutout position of the upper PBC board 4, and the upper surface of the pin of the device under test is in contact with the contact point 9 of the upper PBC board 4, and the upper surface of the molding compound is in contact with the surface of the upper cold plate 1.
[0061] Subsequently, by passing the first threaded hole 8 of the upper cold plate 1, the upper PBC plate 4, the lower PBC plate 5, and the lower cold plate 2 through the fixing bolt 14, the upper cold plate 1 and the lower cold plate 2 are clamped and fixed to the device under test.
[0062] Next, connect the terminals of the upper PBC board 4 and the lower PBC board 5 to the terminals of the external power supply device using connecting cables.
[0063] Next, the first water inlet and the second water outlet 7 are connected to the outlet and inlet of the external water chiller through pipes, respectively.
[0064] Then, using a mixture of 50% pure water and 50% ethylene glycol as the coolant, and after the liquid temperature reached 25°C and the liquid flow rate reached 8 L / min, the thermal resistance test of the device under test was started. At this time, a set of integral curves were recorded and obtained.
[0065] After completing the first test, attach a 0.5mm thick thermal pad to the heat dissipation surface of the device under test and fix it in place.
[0066] Finally, a second test was conducted, yielding another set of integral curves. Using a dual-interface test method with two different media, thermal resistance data for simultaneous heat dissipation on both sides was obtained. By comparing and fitting the two sets of data, the final double-sided junction thermal resistance was determined.
[0067] In this scheme, the heat dissipation surface of the device under test is made into direct contact with the heat dissipation devices (upper cold plate 1 and lower cold plate 2) to improve heat dissipation efficiency and more closely approximate the actual thermal resistance of the device under test.
[0068] The use of a PCB board instead of common probes allows the device under test to be directly and tightly attached to the PCB board. This not only eliminates the need to solder the pins of the device under test, enhancing current carrying capacity and improving testing efficiency, but also avoids damage to the package shape.
[0069] Compared to traditional solutions, using this solution in actual testing reduced the testing time for one device under test from 30 minutes to 15 minutes, halving the testing time and improving testing efficiency by 50%.
[0070] Example 2
[0071] like Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that in this embodiment, the conductive connector includes at least two conductive bolts.
[0072] The upper cold plate 1 is provided with at least two second threaded holes, and the interval between the second threaded holes is the same as the interval between the pins at two ends of the device to be tested;
[0073] The upper cold plate 1 and the lower cold plate 2 are hollow, and the upper cold plate 1 is provided with a first water inlet 6 and a first water outlet at two ends in the length direction, respectively; the lower cold plate 2 is provided with a second water inlet and a second water outlet 7 at two ends in the length direction, respectively, and the first water outlet and the second water inlet are communicated through a connecting pipe 3.
[0074] The conductive bolt comprises a threaded column 12 and a socket 13 fixed to the top end of the threaded column 12, and in the embodiment, the socket 13 is a banana socket, facilitating the access of the power lead of the external power supply device.
[0075] During the test, the device to be tested needs to be placed on the upper surface of the lower cold plate 2, the upper cold plate 1 is covered on the device to be tested, two conductive bolts are screwed into the two second threaded holes of the upper cold plate 1, the lower ends of the threaded columns 12 are in contact with the upper surfaces of the pins of the device to be tested, and the banana plug of the power lead of the external power supply device is inserted into the banana socket. The remaining test settings are the same as those in Embodiment 1.
[0076] The above is only an embodiment of the present application, and the present application is not limited to the field involved in the embodiment. The common knowledge of the specific structure and characteristics in the scheme is not described in detail here. The ordinary skilled person in the art knows all the ordinary technical knowledge in the technical field of the present application before the filing date or the priority date, can know all the prior art in the field, and has the ability to apply conventional experimental means before that date. The ordinary skilled person in the art can perfect and implement the present scheme based on the disclosure given in the present application and their own ability. Some typical known structures or known methods should not be an obstacle for the ordinary skilled person in the art to implement the present application. It should be noted that, for the skilled person in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be regarded as the protection scope of the present application. These will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.
Claims
1. A thermal resistance test fixture for a dual-sided heat dissipation toll package device, comprising a heat dissipation device and an electrically conductive connector; characterized in that, The heat dissipation device is internally provided with a liquid circulation channel; the heat dissipation device is in contact with the upper and lower heat dissipation surfaces of the device to be measured; The conductive connecting piece is detachably connected with the heat dissipation device, and the conductive connecting piece is in contact with the pins of the device to be measured.
2. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 1, wherein: The heat dissipation device comprises an upper cold plate, a lower cold plate and a connecting pipe; The upper cold plate and the lower cold plate are internally provided with a liquid circulation channel; The upper cold plate is provided with a first water inlet and a first water outlet at both ends thereof, which are connected with the liquid circulation channel; the lower cold plate is provided with a second water inlet and a second water outlet at both ends thereof, which are connected with the liquid circulation channel; The connecting pipe is connected with the first water outlet and the second water inlet respectively; The upper cold plate and the lower cold plate are in contact with the upper and lower heat dissipation surfaces of the device to be measured respectively.
3. The thermal resistance test fixture for a double-sided heat spreading toll package device of claim 2, wherein: The conductive connecting piece comprises an upper PBC plate and a lower PBC plate; The upper surface of the lower cold plate is provided with a first accommodating groove matched with the shape of the lower PBC plate, and the lower PBC plate is detachably connected in the first accommodating groove; the lower PBC plate is hollowed out at positions corresponding to the lower heat dissipation surface of the device to be measured; The lower surface of the upper cold plate is provided with a second accommodating groove, and the upper PBC plate is detachably connected in the second accommodating groove; the upper PBC plate is hollowed out at positions corresponding to the upper heat dissipation surface of the device to be measured; The upper PBC plate is provided with a contact point at a position corresponding to the pin of the device to be measured.
4. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 3, wherein: The upper PBC plate and the lower PBC plate are both provided with a wiring terminal.
5. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 3, wherein: The upper PBC plate protrudes from the lower surface of the upper cold plate, and the protruding thickness THK1 is equal to the thickness THK2 from the pin of the device to be measured to the upper heat dissipation surface.
6. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 3, wherein: Corresponding positions of the upper cold plate, the upper PBC plate, the lower PBC plate and the lower cold plate are also provided with a first threaded hole.
7. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 2, wherein: The conductive connecting piece comprises at least two conductive bolts; The upper cold plate is provided with at least two second threaded holes, and the interval between the second threaded holes is the same as the interval between the pins at both ends of the device to be measured; The conductive bolt comprises a threaded column and a socket fixed to the top end of the threaded column; The threaded column is screw-connected with the second threaded hole; The lower end of the threaded column is in contact with the pin of the device to be measured.
8. The thermal resistance test fixture for a double-sided thermal dissipating toll package device of claim 7, wherein: The socket is a banana socket.