Integrated circuit test die
By designing the adjustment unit and buffer structure of the integrated circuit test mold, the problems of alignment accuracy and protection in integrated circuit testing were solved, achieving efficient and accurate testing results.
Patent Information
- Application Number
- CN202520316316.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-02-25
AI Technical Summary
During the testing of integrated circuits, the compact space and small solder pins necessitate high alignment accuracy. Existing molds have installation gaps that can cause misalignment, increasing the difficulty of testing.
An integrated circuit test mold was designed, comprising an insulating base, a support frame, an adjustment unit, a cover plate, and a permanent magnet. The adjustment unit enables fine-tuning of the integrated circuit, while buffer pads and pressure bars protect the integrated circuit from friction damage.
It improves the accuracy and efficiency of integrated circuit testing, protects integrated circuits, and reduces testing difficulty and damage risk.
Smart Images
Figure CN223692487U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to integrated circuit technical field especially is related to a kind of integrated circuit test mould. BACKGROUND
[0002] Integrated circuit test mould is an important tool for testing and verifying the performance of integrated circuits. They are usually used in conjunction with automatic test equipment to ensure the reliability and functionality of integrated circuits in production and application. The design of test mould usually considers high precision and high reliability to ensure the accuracy of test results. This includes the use of high-quality materials and advanced manufacturing techniques to reduce errors in the testing process.
[0003] In the prior art, since integrated circuit is an electronic circuit that integrates multiple electronic components (such as transistors, resistors and capacitors) on a small semiconductor material (usually silicon), the spatial arrangement is very compact, resulting in very small soldering pins with chip components, which requires high accuracy for alignment when testing lead signals.
[0004] And the mould usually used to fix integrated circuit will have installation gap to facilitate the placement and retrieval of integrated circuit, so that the integrated circuit will be slightly offset when placed in the mould, thereby increasing the difficulty of subsequent testing. SUMMARY
[0005] In view of the deficiencies in the prior art, the purpose of the present utility model is to provide an integrated circuit test mould to solve the technical problems mentioned in the background art.
[0006] The above technical purpose of the utility model is realized by the following technical scheme:
[0007] An integrated circuit test mould comprises an insulating base, a placement slot for placing an integrated circuit is formed on the top of the insulating base, a long rod is placed on each of the front and rear sides of the placement slot, the right ends of the two long rods are fixedly connected by a short rod, the two long rods and the short rod are combined into a support frame for supporting the integrated circuit, an adjusting unit for adjusting the position of the integrated circuit is connected to the right side of the support frame, a protective cover is fixedly connected above the placement slot, and a cover plate for pressing the integrated circuit is rotatably connected to the side of the placement slot away from the protective cover.
[0008] The adjusting unit mainly comprises a push block, a lead screw and an adjusting knob, two push blocks are provided, recesses for accommodating the long rod and the short rod are formed on the bottoms of the two push blocks, the two push blocks are slidingly connected to the short rod and one of the long rods respectively, the top of the push block is threadedly connected with the lead screw, the end of the lead screw away from the push block extends out of the insulating base, and the adjusting knob is fixedly connected to the end.
[0009] Further, the bottom of the cover plate is provided with a mounting groove, a pressing rod is arranged in the mounting groove and corresponds to the position of the long rod, and the two ends of the pressing rod are both provided with a slide rod which is perpendicular to the pressing rod, and the front and rear sides of the mounting groove are both provided with a sliding groove, and the sliding groove is connected with the slide rod through a sliding block.
[0010] Further, the bottom of the slide rod and the top of the long rod are both provided with a placing groove, and a buffer pad which contacts the integrated circuit is fixedly connected in the placing groove.
[0011] Further, the side wall of the groove is fixedly connected with a guide block, and the side wall of the long rod and the short rod is provided with a rail groove for sliding of the guide block.
[0012] Further, the side of the cover plate close to the protective cover is embedded with a first permanent magnet, and the protective cover is connected with a second permanent magnet which is magnetically attracted to the first permanent magnet.
[0013] Further, the side of the cover plate close to the protective cover is fixedly connected with a protrusion, and the top of the protective cover is provided with an avoiding groove for avoiding the protrusion.
[0014] In summary, the utility model has at least one of the following beneficial technical effects:
[0015] 1. The integrated circuit test mold, through the adjusting unit, can fine tune the position of the integrated circuit after the integrated circuit is installed, so that the contacts on the surface of the integrated circuit can be aligned with the test instrument, the test efficiency of the integrated circuit is improved, the test precision of the integrated circuit is ensured, and the integrated circuit test mold is more practical.
[0016] 2. The integrated circuit test mold, through the pressing rod corresponding to the long rod, can avoid friction when the integrated circuit is adjusted, thereby protecting the integrated circuit, and the buffer pad arranged on the pressing rod and the long rod can reduce the pressure on the integrated circuit, avoid the integrated circuit from being damaged, and further improve the protection effect on the integrated circuit. DRAWINGS
[0017] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.
[0018] Figure 1 It is a structural schematic view of the integrated circuit test mold of the utility model.
[0019] Figure 2The utility model discloses a structure schematic diagram of the cover plate of the integrated circuit test mould.
[0020] Figure 3 The utility model discloses a structure schematic diagram of the first permanent magnet of the integrated circuit test mould.
[0021] Figure 4 The utility model discloses a structure schematic diagram of the support frame and the adjusting unit of the integrated circuit test mould.
[0022] Figure 5 The utility model discloses a structure schematic diagram of the recess of the integrated circuit test mould.
[0023] In the drawing, 1, insulating base; 2, placing groove; 3, long rod; 4, short rod; 5, adjusting unit; 51, push block; 52, screw rod; 53, adjusting knob; 6, protective cover; 7, cover plate; 8, recess; 9, mounting groove; 10, pressing rod; 11, sliding rod; 12, sliding groove; 13, sliding block; 14, support groove; 15, buffer gasket; 16, guide block; 17, track groove; 18, first permanent magnet; 19, second permanent magnet; 20, protruding block; 21, avoiding groove. DETAILED DESCRIPTION
[0024] The utility model will be further explained in detail in connection with the drawings.
[0025] Embodiment:
[0026] Reference Figure 1 - Figure 5 The utility model discloses an integrated circuit test mould, including insulating base 1, the top of insulating base 1 is seted up and is used to place the placing groove 2 of integrated circuit, and the front and back two sides of placing groove 2 are placed with a long rod 3 respectively, and the right end of two long rods 3 is fixedly connected through short rod 4, makes two long rods 3 and a short rod 4 and is spliced into a support frame for supporting integrated circuit, and the right side of support frame is connected with adjusting unit 5 of adjusting the position of integrated circuit, and placing groove 2 is located the upper fixed connection of adjusting unit 5 has protective cover 6, and the side rotationally connected with cover plate 7 for pressing integrated circuit of placing groove 2 away from protective cover 6,
[0027] Adjusting unit 5 is mainly composed of push block 51, screw rod 52 and adjusting knob 53, and push block 51 is provided with two, and the bottom of two push blocks 51 is seted up and is used to accommodate the recess 8 of long rod 3 and short rod 4, makes two push blocks 51 respectively slidingly connected on short rod 4 and one long rod 3, and the top of push block 51 is screw connected with screw rod 52, and the end away from push block 51 of screw rod 52 is stretched out insulating base 1, and is fixedly connected with adjusting knob 53.
[0028] In the embodiment, observe Figure 1 AndFigure 2 It can be found that by opening a placing groove 2 for placing the integrated circuit on the top of the insulating base 1, one long rod 3 is placed on the front and rear sides of the placing groove 2 respectively, and the right ends of the two long rods 3 are fixedly connected through a short rod 4, so that the two long rods 3 and the short rod 4 are spliced into a support frame for supporting the integrated circuit, which can facilitate the installation of the integrated circuit.
[0029] However, due to the small welding pins on the integrated circuit, the alignment accuracy requirement for the lead signal test of the integrated circuit is relatively high. In order to facilitate the placement and taking of the integrated circuit, the mold commonly used for fixing the integrated circuit will have an installation gap, so that the integrated circuit will be slightly offset when placed in the mold, thereby increasing the difficulty of subsequent testing. Therefore, in the Figure 4 It can be found that the right side of the support frame is connected with an adjusting unit 5 for adjusting the position of the integrated circuit, and the adjusting unit 5 mainly comprises a push block 51, a lead screw 52 and an adjusting knob 53. The push block 51 is provided with two, and the bottoms of the two push blocks 51 are respectively provided with recesses 8 for accommodating the long rod 3 and the short rod 4, so that the two push blocks 51 are respectively slidably connected to the short rod 4 and one of the long rods 3. The top of the push block 51 is threadedly connected with the lead screw 52, the end of the lead screw 52 away from the push block 51 extends out of the insulating base 1 and is fixedly connected with the adjusting knob 53. The placing groove 2 is fixedly connected with a protective cover 6 above the adjusting unit 5, and the side of the placing groove 2 away from the protective cover 6 is rotatably connected with a cover plate 7 for pressing the integrated circuit.
[0030] At this time, when detecting the integrated circuit, the integrated circuit is first placed on the support frame, and then the cover plate 7 is covered to fix the integrated circuit. The detection instrument contacts the integrated circuit through the square slot on the cover plate 7 for detecting the integrated circuit. When the integrated circuit is offset, the detection instrument and the contact on the integrated circuit cannot be aligned. By rotating the adjusting knob 53 on the right side of the insulating base 1, the lead screw 52 is rotated, so that the corresponding push block 51 moves along the axis direction of the lead screw 52, and the push block 51 pushes the support frame to translate left and right in the placing groove 2. Or by rotating the adjusting knob 53 on the front side of the insulating base 1, the lead screw 52 is rotated, so that the corresponding push block 51 moves along the axis direction of the lead screw 52, and the push block 51 pushes the support frame to translate forward and backward in the placing groove 2, thereby realizing the position adjustment of the integrated circuit, so that the pin contact of the integrated circuit is aligned with the detection device, and the detection efficiency can be effectively improved.
[0031] In the Figure 5 It can be seen that the side wall of the recess 8 is fixedly connected with a guide block 16, and the side walls of the long rod 3 and the short rod 4 are provided with track grooves 17 for sliding of the guide block 16, so that the support frame is more stable when being pushed by the push block 51 to translate in the placing groove 2.
[0032] In a further preferred embodiment of this utility model, such as Figure 2 and Figure 4 As shown, the bottom of the cover plate 7 is provided with an installation groove 9, and a pressure rod 10 is provided in the installation groove 9 corresponding to the position of the long rod 3. Both ends of the pressure rod 10 are provided with sliding rods 11 perpendicular to the pressure rod 10. Sliding grooves 12 are provided on the front and rear sides of the installation groove 9, and the sliding grooves 12 are connected to the sliding rods 11 through the sliding sliders 13.
[0033] Both the bottom of the slide bar 11 and the top of the long rod 3 are provided with support grooves 14, and a buffer pad 15 that contacts the integrated circuit is fixedly connected in the support groove 14.
[0034] In this embodiment, since the cover plate 7 will press down and compress the integrated circuit, the integrated circuit will rub against the cover plate 7 when adjusting its position, causing damage to the integrated circuit.
[0035] Therefore, observe Figure 2 It can be observed that by providing a mounting groove 9 at the bottom of the cover plate 7, a pressure rod 10 is provided in the mounting groove 9 corresponding to the position of the long rod 3. Both ends of the pressure rod 10 are provided with sliding rods 11 perpendicular to the pressure rod 10. Sliding grooves 12 are provided on both the front and rear sides of the mounting groove 9. The sliding grooves 12 are connected to the sliding rods 11 through sliders 13. When the cover plate 7 presses down on the integrated circuit, the pressure rod 10 and the long rod 3 cooperate to clamp the edge of the integrated circuit. When the support frame moves horizontally, the pressure rod 10, which is in close contact with the integrated circuit, will move synchronously, thereby preventing the integrated circuit from being damaged due to friction, and thus providing protection for the integrated circuit.
[0036] And combined Figure 2 and Figure 4 It can be seen that the bottom of the slide bar 11 and the top of the long bar 3 are both provided with support grooves 14. A buffer pad 15 that contacts the integrated circuit is fixedly connected in the support groove 14. After the cover plate 7 presses the integrated circuit, the edge of the integrated circuit contacts the buffer pad 15, which can reduce the pressure on the integrated circuit and further improve the protection effect of the integrated circuit.
[0037] In a further preferred embodiment of this utility model, such as Figure 1 and Figure 3 As shown, a first permanent magnet 18 is embedded on the side of the cover plate 7 near the protective cover 6, and a second permanent magnet 19 that is magnetically attracted to the first permanent magnet 18 is connected inside the protective cover 6.
[0038] The cover plate 7 is fixedly connected to a protrusion 20 on the side near the protective cover 6, and the top of the protective cover 6 is provided with a relief groove 21 for avoiding the protrusion 20.
[0039] In this embodiment, observation Figure 3It can be found that by embedding the first permanent magnet 18 on the side of the cover plate 7 close to the protective cover 6, and connecting the second permanent magnet 19 in the protective cover 6 which is magnetically attracted to the first permanent magnet 18, the cover plate 7 can be fixed by the attractive force of the first permanent magnet 18 and the second permanent magnet 19 after being pressed down, so that the looseness of the cover plate 7 affecting the test of the integrated circuit can be avoided.
[0040] However, due to the arrangement of the first permanent magnet 18 and the second permanent magnet 19, it is difficult to open the cover plate 7 after the test of the integrated circuit is completed, thereby affecting the continuous test of the integrated circuit, so in the Figure 1 It can be seen that the protrusion 20 is fixedly connected to the side of the cover plate 7 close to the protective cover 6, and the avoiding groove 21 for avoiding the protrusion 20 is arranged on the top of the protective cover 6, so that the cover plate 7 can be opened by pulling the protrusion 20 after the test of the integrated circuit is completed, and the use difficulty of the integrated circuit test mold can be effectively reduced.
[0041] The implementation principle of the above embodiment is that the cover plate 7 is opened, the integrated circuit is placed on the support frame, the cover plate 7 is closed, the integrated circuit is pressed tightly, and then the integrated circuit is tested by the detection instrument.
[0042] When the integrated circuit is placed offset so that the contact of the detection instrument and the integrated circuit cannot be aligned, the integrated circuit can be translated left and right or forward and backward in the test mold by rotating the adjusting knob 53 on the right side or the front side of the insulating base 1, so that the integrated circuit can be finely adjusted, the contact of the integrated circuit can be aligned with the detection instrument, and the test effect of the integrated circuit can be effectively improved.
[0043] The embodiments of the specific embodiment are the preferred embodiments of the utility model, and are not limited to the protection scope of the utility model, so that: any equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.
Claims
1. An integrated circuit test fixture, characterized by, The utility model provides an integrated circuit fixing device, including insulating base (1), the top of insulating base (1) is set up and is placed with the placement slot (2) for placing integrated circuit, the front and back of placement slot (2) is placed with a long pole (3) respectively, the right end of two long poles (3) is fixedly connected through short pole (4), makes two long poles (3) with a short pole (4) and is spliced into a support frame for supporting integrated circuit, the right side of support frame is connected with the adjusting unit (5) of adjusting integrated circuit position, the placement slot (2) is fixedly connected with the protective cover (6) above adjusting unit (5), the side of placement slot (2) away from protective cover (6) is rotatably connected with the cover plate (7) for pressing integrated circuit, Adjusting unit (5) is mainly composed of push block (51), screw rod (52) and adjusting knob (53), push block (51) is provided with two, the bottom of two push blocks (51) is respectively set up with the recess (8) for accommodating long pole (3) and short pole (4), make two push blocks (51) slidingly connect on short pole (4) and one long pole (3) respectively, the top of push block (51) is threadedly connected with screw rod (52), the end of screw rod (52) away from push block (51) is stretched out insulating base (1), and is fixedly connected with adjusting knob (53).
2. An integrated circuit test fixture according to claim 1, wherein, The bottom of the cover plate (7) is provided with a mounting groove (9), and a pressing rod (10) is arranged in the mounting groove (9) corresponding to the position of the long rod (3). Both ends of the pressing rod (10) are provided with a slide rod (11) perpendicular to the pressing rod (10). The front and rear sides of the mounting groove (9) are provided with a sliding groove (12), and the sliding groove (12) is connected with the slide rod (11) through a sliding block (13).
3. An integrated circuit test fixture according to claim 2, wherein, The bottom of the slide rod (11) and the top of the long rod (3) are provided with a support groove (14), and a buffer pad (15) in contact with the integrated circuit is fixedly connected in the support groove (14).
4. An integrated circuit test fixture according to claim 3, wherein, The sidewall of the recess (8) is fixedly connected with a guide block (16), and the sidewall of the long rod (3) and the short rod (4) is provided with a track groove (17) for sliding of the guide block (16).
5. An integrated circuit test fixture according to claim 4, wherein, The side of the cover plate (7) close to the protective cover (6) is embedded with a first permanent magnet (18), and the protective cover (6) is connected with a second permanent magnet (19) magnetically attracted to the first permanent magnet (18).
6. An integrated circuit test fixture according to claim 5, wherein, The side of the cover plate (7) close to the protective cover (6) is fixedly connected with a protrusion (20), and the top of the protective cover (6) is provided with an avoiding groove (21) for avoiding the protrusion (20).