Multi-frequency metal detector

Abstract

The utility model discloses a multi-frequency metal detector which comprises a single-chip microcomputer master controller, a key module, a receiving module, a transmitting module, an FM module, a single-chip microcomputer programming module, an adjustable power supply module, a frequency mixing control module, a power supply module, a sound amplification module and a storage module. Wherein the transmitting module is provided with an H-bridge structure, and the H-bridge structure is connected in series with an LC to generate sine wave current potential eddy current to perform same-frequency resonance on various metals; the key module, the receiving module, the transmitting module, the FM module, the single-chip microcomputer programming module, the adjustable power supply module and the frequency mixing control module are electrically connected with the single-chip microcomputer master controller. The power supply module, the sound amplification module and the storage module are electrically connected with the frequency mixing control module. The multi-frequency metal detector provided by the utility model is stable in operation, high in efficiency, capable of generating 144 frequencies, strong in signal and high in metal detection efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic field especially relates to a multi -frequency metal detector. BACKGROUND

[0002] The underground metal detector is a kind of equipment made by advanced technology, mainly used for detecting and identifying the metal objects buried underground.

[0003] The underground metal detector mainly works by the principle of electromagnetic induction. The detection disc (containing coil) in the equipment will generate a magnetic field when alternating current passes through, and if the detected object is a metal object, it will be activated by this magnetic field, and then generate an interactive magnetic field to affect the original magnetic field of the detection disc. The host computer will indicate the detection result in the form of sound and digital display after receiving the signal and related processing.

[0004] The present application inventors found at least the following technical problems in the prior art in the process of realizing the utility model embodiment multi -frequency metal detector:

[0005] The existing metal detector adopts half-bridge structure or single tube structure, and the work is unstable, and the efficiency is not high. Moreover, the existing metal detector has single frequency, cannot obtain more metal information, power is insufficient and cannot reach the best state, and false alarm is prone to occur. Due to the complex output end circuit of half-bridge structure, the power is unstable, and the cost is high to realize frequency mixing.

[0006] In summary, the existing metal detector cannot meet the actual use requirement. UTILITY MODEL CONTENT

[0007] The utility model embodiment provides a multi -frequency metal detector, solves the problem that the existing metal detector cannot meet the actual use requirement.

[0008] The utility model embodiment provides a multi -frequency metal detector, comprising:

[0009] Single-chip microcomputer master control unit;

[0010] Key module is connected with single-chip microcomputer master control unit electrically;

[0011] Receiving module is connected with single-chip microcomputer master control unit electrically;

[0012] Transmitting module is connected with single-chip microcomputer master control unit electrically, and the transmitting module has H bridge structure, and H bridge structure is connected in series LC and generates sinusoidal wave current potential eddy current to multiple metals same frequency resonance;

[0013] FM module is connected with single-chip microcomputer master control unit electrically;

[0014] Single-chip microcomputer burning module is connected with single-chip microcomputer master control unit electrically;

[0015] An adjustable power module is electrically connected with the single-chip main controller.

[0016] A mixing control module is electrically connected with the single-chip main controller.

[0017] A power supply module is electrically connected with the mixing control module.

[0018] A sound amplification module is electrically connected with the mixing control module.

[0019] A storage module is electrically connected with the mixing control module.

[0020] Optionally, the H-bridge structure in the transmitting module comprises a first transmitting chip and a second transmitting chip connected in parallel.

[0021] Optionally, the first transmitting chip and the second transmitting chip are both YDL71 type transmitting chips.

[0022] Optionally, the transmitting module further comprises a third transmitting chip.

[0023] Optionally, the third transmitting chip is specifically a YDL527 type transmitting chip.

[0024] Optionally, the transmitting module further comprises a mixing chip.

[0025] Optionally, the transmitting module further comprises a probe disc coil receiving end.

[0026] Optionally, the mixing control module specifically comprises:

[0027] a mixing control chip;

[0028] A backlight sub-module is electrically connected with the mixing control chip.

[0029] A setting sub-module is electrically connected with the mixing control chip.

[0030] A reset sub-module is electrically connected with the mixing control chip.

[0031] A serial port sub-module is electrically connected with the mixing control chip.

[0032] Optionally, the mixing control chip is specifically a YDL01RCT6 type mixing control chip.

[0033] Optionally, the control chip in the single-chip main controller is specifically an STM32F100C8T6 type control chip.

[0034] One or more technical solutions provided in the embodiments of the utility model have at least the following technical effects or advantages:

[0035] The transmitting module of the metal detector adopts an H-bridge structure, the H-bridge structure is connected in series with LC to generate a sinusoidal current potential eddy current to resonate with multiple metals at the same frequency, and the metal detector is stable in operation and high in efficiency; the metal detector is additionally provided with a frequency mixing control module, 144 frequencies can be generated, the signal is strong, and the metal detection efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 It is a structural diagram of a multi-frequency metal detector in an embodiment of the utility model;

[0037] Figure 2 It is a circuit diagram of an FM module in an embodiment of the utility model;

[0038] Figure 3 It is a circuit diagram of a key module in an embodiment of the utility model;

[0039] Figure 4 It is a circuit diagram of a storage module in an embodiment of the utility model;

[0040] Figure 5 It is a circuit diagram of a single-chip microcomputer burning module in an embodiment of the utility model;

[0041] Figure 6 It is a circuit diagram of a single-chip microcomputer main controller in an embodiment of the utility model;

[0042] Figure 7 It is a circuit diagram of a power supply module in an embodiment of the utility model;

[0043] Figure 8 It is a circuit diagram of a transmitting module in an embodiment of the utility model;

[0044] Figure 9 It is a circuit diagram of a frequency mixing control module in an embodiment of the utility model;

[0045] Figure 10 It is a circuit diagram of a receiving module in an embodiment of the utility model;

[0046] Figure 11 It is a circuit diagram of an adjustable power supply module in an embodiment of the utility model;

[0047] Figure 12 It is a circuit diagram of a sound amplification module in an embodiment of the utility model;

[0048] In the figure: C56 - fifty-sixth capacitor; C57 - fifty-seventh capacitor; Y4 - fourth crystal oscillator; C59 - fifty-ninth capacitor; R56 - fifty-sixth resistor; U10 - FM chip; C54 - fifty-fourth capacitor; C60 - sixtieth capacitor; R51 - fifty-first resistor; R53 - fifty-third resistor; C53 - fifty-third capacitor; ANT1 - antenna;

[0049] S3 - third switch; S4 - fourth switch; S5 - fifth switch; S6 - sixth switch; S7 - seventh switch; S8 - eighth switch;

[0050] U9 - storage chip; R48 - forty-eighth resistor; R49 - forty-ninth resistor; C39 - thirty-ninth capacitor; R50 - fiftieth resistor; C42 - forty-second capacitor; C43 - forty-third capacitor; C44 - forty-fourth capacitor; C45 - forty-fifth capacitor; C46 - forty-sixth capacitor;

[0051] R1 - first resistor; D1 - first diode; P2 - jumper cap; R11 - eleventh resistor; R13 - thirteenth resistor; R16 - sixteenth resistor; R19 - nineteenth resistor; P3 - single-chip microcomputer master control burning port; C14 - fourteenth capacitor; D3 - common cathode diode;

[0052] R32 - thirty-second resistor; C31 - thirty-first capacitor; Y1 - first crystal oscillator; C32 - thirty-second capacitor; R46 - forty-sixth resistor; C33 - thirty-third capacitor; C34 - thirty-fourth capacitor; C35 - thirty-fifth capacitor; C36 - thirty-sixth capacitor; C38 - thirty-eighth capacitor; C40 - fortieth capacitor; C47 - forty-seventh capacitor; U6 - main control chip;

[0053] P5 - power input end; F1 - first fuse; Q1 - first power NMOS tube; D4 - fourth diode; R26 - twenty-sixth resistor; C21 - fourth electrolytic capacitor; VR1 - first three-terminal voltage regulator; C20 - twentieth capacitor; C19 - nineteenth capacitor; VR2 - second three-terminal voltage regulator; C25 - twenty-fifth capacitor; C26 - twenty-sixth capacitor; S1 - first switch;

[0054] R22 - Twenty-second resistance; R25 - Twenty-fifth resistance; U4 - First transmitting chip; U5 - Second transmitting chip; L1 - First inductor; R23 - Twenty-third resistance; C22 - Twenty-second capacitor; P4 - Probe coil receiving end; D5 - Fifth diode; L3 - Third inductor; R29 - Twenty-ninth resistance; R31 - Thirty-first resistance; L2 - Second inductor; R30 - Thirtieth resistance; C27 - Twenty-seventh capacitor; R33 - Thirty-third resistance; R34 - Thirty-fourth resistance; R35 - Thirty-fifth resistance; R37 - Thirty-seventh resistance; R38 - Thirty-eighth resistance; C28 - Twenty-eighth capacitor; IC1 - Mixing chip; R45 - Forty-fifth resistance; Q4 - Fourth triode; R41 - Forty-first resistance; R43 - Forty-third resistance; R42 - Forty-second resistance; Q5 - Fifth triode; R47 - Forty-seventh resistance, U7 - Third transmitting chip;

[0055] R27 - Twenty-seventh resistance, Q2 - Second triode; J1 - Mixing control writing port; SW1 - Setting switch; R28 - Twenty-eighth resistance; C24 - Twenty-fourth capacitor; C23 - Twenty-third capacitor; R24 - Twenty-fourth resistance; SW2 - Reset switch; J2 - Serial port; C30 - Thirtieth capacitor; VR3 - Third three-terminal voltage regulator; C29 - Twenty-ninth capacitor; R36 - Thirty-sixth resistance; D6 - Light-emitting diode; Q3 - Third power MOS tube; R39 - Thirty-ninth resistance; R40 - Forty-first resistance; P6 - Display screen interface; C50 - Fiftieth capacitor; C51 - Fifty-first capacitor; U8 - Mixing control chip; R44 - Forty-fourth resistance; S2 - Second switch; C41 - Forty-first capacitor, Y2 - Second crystal oscillator; C49 - Forty-ninth capacitor; R52 - Fifty-second resistance; C37 - Thirty-seventh capacitor; C48 - Forty-eighth capacitor; Y3 - Third crystal oscillator; C52 - Fifty-second capacitor;

[0056] C4 - First electrolytic capacitor; C5 - Second electrolytic capacitor; C6 - Sixth capacitor; R9 - Ninth resistance; R15 - Fifteenth resistance; C11 - Eleventh capacitor; D2 - Second diode; R2 - Second resistance; C1 - First capacitor; R3 - Third resistance; R4 - Fourth resistance; P1 - Probe coil receiving end; C2 - Second capacitor; R10 - Tenth resistance; R7 - Seventh resistance; R6 - Sixth resistance; U1 - Receiving chip; C3 - Third capacitor; C9 - Ninth capacitor; C13 - Thirteenth capacitor; C16 - Sixteenth capacitor; R20 - Twentieth resistance; R14 - Fourteenth resistance; C12 - Twelfth capacitor; C15 - Fifteenth capacitor; R18 - Eighteenth resistance;

[0057] C55-55th capacitor; C58-58th capacitor; R55-55th resistor; IC2-adjustable power supply chip; V1-4th three-terminal voltage regulator; R54-54th resistor; R57-57th resistor; JC1-jumper;

[0058] R8-8th resistor; R12-12th resistor; C10-10th capacitor; R5-5th resistor; C7-7th capacitor; C8-3rd electrolytic capacitor; LS1-speaker; U2-1st sound chip; U3-2nd sound chip; R17-17th resistor; C17-17th capacitor; R21-21st resistor; C18-18th capacitor. DETAILED DESCRIPTION

[0059] The utility model discloses a multi -frequency metal detector, solved the existing metal detector and cannot satisfy the problem of actual use demand.

[0060] In order to better understand the above-mentioned multi -frequency metal detector, the following will be combined with the specific embodiment of the description and detailed description of the drawings. Obviously, the embodiment described in the utility model is a part of the embodiment of the utility model, rather than all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor are within the scope of the utility model protection.

[0061] As Figure 1 The utility model discloses a multi -frequency metal detector, including: singlechip master control ware, button module, receiving module, transmitting module, FM module, singlechip burning module, adjustable power module, mix frequency control module, power supply module, sound amplification module, storage module, wherein, transmitting module has H bridge structure, and H bridge structure series connection LC generates sinusoidal wave current potential eddy current to the same frequency resonance of multiple metals, button module, receiving module, transmitting module, FM module, singlechip burning module, adjustable power module and mix frequency control module all with singlechip master control ware Electric connection, power supply module, sound amplification module and storage module all with mix frequency control module Electric connection.

[0062] The transmitting module of the metal detector adopts the H bridge structure, and the H bridge structure series connection LC generates sinusoidal wave current potential eddy current to the same frequency resonance of multiple metals, and is stable, efficient.

[0063] The metal detector of the utility model increases the mixing control module, can produce 144 kinds of frequency, including: 3968HZ, 3989HZ, 4010HZ, 4032HZ, 4054HZ, 4076HZ, 4098HZ, 4120HZ, 4143HZ, 4166HZ, 4189HZ, 4213HZ, 4237HZ, 4261HZ, 4285HZ, 4310HZ, 4335HZ, 4360HZ, 4385HZ, 4411HZ, 44374464HZ, 4491HZ, 4518HZ, 4545HZ, 4573HZ, 4601HZ, 4629HZ, 4658HZ, 4687HZ, 4716HZ, 4746HZ, 4777HZ, 4807HZ, 4838HZ, 4870HZ, 4901HZ, 4934HZ, 4966HZ, 5000HZ, 5033HZ, 5067HZ, 5102HZ, 5136HZ, 5172HZ, 5208HZ, 5244HZ, 5281HZ, 5319HZ, 5357HZ, 5395HZ, 5434HZ, 5474HZ, 5514HZ, 5555HZ, 5597HZ, 5639HZ, 5681HZ, 5725HZ, 5769HZ, 5813HZ, 5859HZ, 5905HZ, 5952HZ, 6000HZ, 6048HZ, 6097HZ, 6147HZ, 6198HZ, 6250HZ, 6302HZ, 6355HZ, 6410HZ, 6465HZ, 6521HZ, 6578HZ, 6637HZ, 6696HZ, 6756HZ, 6818HZ, 6880HZ, 6944HZ, 7009HZ, 7075HZ, 7142HZ, 7211HZ, 7281HZ, 7352HZ, 7425HZ, 7500HZ, 7575HZ, 7653HZ, 7731HZ, 7812HZ, 7894HZ, 7978HZ, 8064HZ, 8152HZ, 8241HZ, 8333HZ, 8426HZ, 8522HZ, 8620HZ, 8720HZ, 8823HZ, 8928HZ, 9036HZ, 9146HZ, 9259HZ, 9375HZ, 9493HZ, 9615HZ, 9740HZ, 9868HZ, 10000HZ, 10135HZ, 10273HZ, 10416HZ, 10563HZ, 10714HZ, 10869HZ, 11029HZ, 11194HZ, 11363HZ, 11538HZ, 11718HZ, 11904HZ, 12096HZ, 12295HZ, 12500HZ, 12711HZ, 12931HZ, 13157HZ, 13392HZ, 13636HZ,13888HZ, 14150HZ, 14423HZ, 14705HZ, 15000HZ, 15306HZ, 15625HZ, 15953HZ, 16301HZ, 16666 HZ, HZ, 17045HZ, 17441HZ, 17857HZ, 18292HZ, 18750HZ, 19230HZ, 19736HZ, 20270HZ and 20833HZ. ,

[0064] (a) FM module

[0065] like Figure 2 As shown, the FM module mainly includes the FM chip U10, which is specifically the YDL0803L type FM chip.

[0066] Pin 4 of FM chip U10 is electrically connected to VDD and the first terminal of capacitor C56 (56th capacitor), with the second terminal of C56 grounded. Pins 5 and 1 of FM chip U10 are grounded. Pin 2 of FM chip U10 is electrically connected to the first terminal of capacitor C57 (57th capacitor) and the first terminal of crystal oscillator Y4 (4th crystal oscillator), with the second terminal of C57 grounded. The second terminal of crystal oscillator Y4 is electrically connected to pin 3 of FM chip U10 and the first terminal of capacitor C59 (59th capacitor), with the second terminal of C59 grounded. Pin 8 of FM chip U10 is electrically connected to resistor R56 (56th resistor). Pin 16 of FM chip U10 is electrically connected to antenna ANT1 (53rd capacitor). Pin 7 of FM chip U10 is connected to the first terminal of capacitor C54 (54th generation). Pin 6 of FM chip U10 is connected to the first terminal of capacitor C60 (60th generation). The second terminals of capacitors C54 and C60 are electrically connected, and both are electrically connected to the second terminals of resistors R51 (51st generation) and R53 (53rd generation). The second terminal of resistor R51 is electrically connected to the first terminal of resistor R53 (53rd generation). The first terminal of resistor R51 is electrically connected to SO1. The second terminal of resistor R53 is grounded. Pins 9, 11, 12, and 15 of FM chip U10 are grounded. Pin 10 of FM chip U10 is electrically connected to VDD, pin 13 is electrically connected to EE-SDA, and pin 14 is electrically connected to EE-SCL.

[0067] (ii) Button Module

[0068] like Figure 3 As shown, the button module mainly includes the third switch S3, the fourth switch S4, the fifth switch S5, the sixth switch S6, the seventh switch S7, and the eighth switch S8.

[0069] The first end of the third switch S3 is electrically connected with BTN0, and the second end of the third switch S3 is grounded. The first end of the fourth switch S4 is electrically connected with BTN1, and the second end of the fourth switch S4 is grounded. The first end of the fifth switch S5 is electrically connected with BTN2, and the second end of the fifth switch S5 is grounded. The first end of the sixth switch S6 is electrically connected with BTN3, and the second end of the sixth switch S6 is grounded. The first end of the seventh switch S7 is electrically connected with BTN4, and the second end of the seventh switch S7 is grounded. The first end of the eighth switch S8 is electrically connected with BTN5, and the second end of the eighth switch S8 is grounded.

[0070] (Three) storage module

[0071] As shown in Figure 4 , the storage module mainly includes a storage chip U9, the first pin, the second pin, the third pin, the fourth pin and the seventh pin of the storage chip U9 are grounded, VDD is electrically connected with the eighth pin of the storage chip U9, the first end of the forty-eighth resistor R48, the first end of the forty-ninth resistor R49 and the first end of the thirty-ninth capacitor C39. The second end of the forty-eighth resistor R48 is electrically connected with EE-SCL and the sixth pin of the storage chip U9, the second end of the forty-ninth resistor R49 is electrically connected with EE-SDA and the fifth pin of the storage chip U9, and the second end of the thirty-ninth capacitor C39 is grounded.

[0072] PB2 is electrically connected with the first end of the fiftieth resistor R50, and the second end of the fiftieth resistor R50 is grounded. VREF+ is electrically connected with the first end of the forty-second capacitor C42 and the first end of the forty-third capacitor C43, and the second end of the forty-second capacitor C42 and the second end of the forty-third capacitor C43 are grounded.

[0073] VDD is electrically connected with the first end of the forty-fourth capacitor C44, the first end of the forty-fifth capacitor C45 and the first end of the forty-sixth capacitor C46, and the second end of the forty-fourth capacitor C44, the second end of the forty-fifth capacitor C45 and the second end of the forty-sixth capacitor C46 are grounded.

[0074] (Four) single-chip microcomputer programming module

[0075] As shown in Figure 5 , the single-chip microcomputer programming module mainly includes a jumper cap P2, a single-chip microcomputer master control programming port P3 and a common cathode diode D3.

[0076] HLED is electrically connected with the first segment of the first resistor R1, the second end of the first resistor R1 is electrically connected with the input end of the first diode D1, and the output end of the first diode D1 is grounded.

[0077] The first pin of the jumper cap P2 is electrically connected with VDD, BOOT0 is electrically connected with the first end of the eleventh resistor R11 and the first end of the thirteenth resistor R13, the second end of the eleventh resistor R11 is electrically connected with the second pin of the jumper cap P2, and the second end of the thirteenth resistor R13 is grounded.

[0078] The first pin of the single-chip microcomputer main control burning port P3 is electrically connected with RS-RX through the sixteenth resistor R16, the second pin of the single-chip microcomputer main control burning port P3 is grounded, and the third pin of the single-chip microcomputer main control burning port P3 is electrically connected with RS-TX through the nineteenth resistor R19.

[0079] The third end of the common cathode diode D3 is electrically connected with the first end of the fourteenth capacitor C14 and VBAT1, the second end of the fourteenth capacitor C14 is grounded, the first end of the common cathode diode D3 is electrically connected with VDD, and the second end of the common cathode diode D3 is electrically connected with VB1.

[0080] (five) single-chip microcomputer main control unit

[0081] As shown in Figure 6 , the single-chip microcomputer main control unit mainly comprises a main control chip U6, and the main control chip U6 is specifically a control chip of the STM32F100C8T6 type.

[0082] The PA1 pin of the main control chip U6 is electrically connected with UP-CTR, the PA2 pin is electrically connected with BRIGHT, the PA3 pin is electrically connected with PWM, the PA4 pin is electrically connected with SOUND, the PA5 pin is electrically connected with SIN-C, the PA7 pin is electrically connected with U-RX, the PA9 pin is electrically connected with RS-TX, the PA10 pin is electrically connected with RS-RX, the PA12 pin is electrically connected with HLED, the PA13 / JTMS / SWDIO pin is electrically connected with SWDIO, the PA14 / JTCK / SWCLK pin is electrically connected with SWCLK, the PA15 / JTDI pin is electrically connected with LCD-B3, the BOOT0 pin is electrically connected with BOOT0, the PB1 pin is electrically connected with 1-TX, the PB3 / JTDO pin is electrically connected with LCD-B4, the PB4 / JNTRST pin is electrically connected with BTN5, the PB5 pin is electrically connected with BTN4, the PB6 pin is electrically connected with BTN3, the PB7 pin is electrically connected with BTN2, the PB8 pin is electrically connected with BTN1, the PB9 pin is electrically connected with BTN0, the PB10 pin is electrically connected with TX, the PB12 pin is electrically connected with LCD-B15, the PB13 pin is electrically connected with LCD-A11, the PB14 pin is electrically connected with LCD-A12, the PB15 pin is electrically connected with LCD-A15, the PC13-TAMPER-RTC pin is electrically connected with EE-SDA, the PC14-OSC32_IN pin is electrically connected with EE-SCL, and the PC15-OSC32_OUT pin is electrically connected with SW.

[0083] The OSC_IN / PD0 pin of the main control chip U6 is electrically connected with the first end of the thirty-first capacitor C31 and the first end of the first crystal oscillator Y1, the OSC_OUT / PD1 pin of the main control chip U6 is electrically connected with the first end of the forty-sixth resistor R46, the second end of the forty-sixth resistor R46 is electrically connected with the second end of the first crystal oscillator Y1 and the first end of the thirty-second capacitor C32, and the second end of the thirty-first capacitor C31 and the second end of the thirty-second capacitor C32 are grounded.

[0084] The NRST pin of the main control chip U6 is grounded through the thirty-third capacitor C33, the VDD is electrically connected with the VBAT pin of the main control chip U6, the first end of the thirty-fourth capacitor C34, the first end of the thirty-fifth capacitor C35, the VDD_1 pin of the main control chip U6, the VDD_2 pin of the main control chip U6, the VDD_3 pin of the main control chip U6, the first end of the thirty-sixth capacitor C36, the first end of the thirty-eighth capacitor C38, the second end of the thirty-fourth capacitor C34, the second end of the thirty-fifth capacitor C35, the second end of the thirty-sixth capacitor C36, and the second end of the thirty-eighth capacitor C38 are grounded. The VDDA is electrically connected with the first end of the forty-seventh capacitor C47, the first end of the fourth capacitor C40 and the VDDA pin of the main control chip U6, and the second end of the forty-seventh capacitor C47 and the second end of the fourth capacitor C40 are grounded.

[0085] The PB2 / BOOT1 pin of the main control chip U6 is grounded through the thirty-second resistor R32. The VSS_1 pin of the main control chip U6, the VSS_2 pin of the main control chip U6, the VSS_3 pin of the main control chip U6 and the VSSA pin of the main control chip U6 are grounded.

[0086] (Six) power supply module

[0087] As shown in Figure 7 , the power supply module mainly includes a power input end P5, a first three-terminal voltage regulator VR1 and a second three-terminal voltage regulator VR2.

[0088] The first pin of the power input end P5 is grounded through the first switch S1, the second pin of the power input end P5 is electrically connected with the source electrode of the first power NMOS tube Q1 through the first fuse F1, UPWR is electrically connected with the drain electrode of the first power NMOS tube Q1, the output end of the fourth diode D4, the first end of the fourth electrolytic capacitor C21, the VIN pin of the first three-terminal voltage regulator VR1, the VIN pin of the second three-terminal voltage regulator VR2, the first end of the twenty-fifth capacitor C25 and the first end of the twentieth capacitor C20, the input end of the fourth diode D4 is electrically connected with the gate electrode of the first power NMOS tube Q1 and the first end of the twenty-sixth resistor R26, the second end of the twenty-sixth resistor R26 is grounded, the second end of the fourth electrolytic capacitor C21 is grounded, the second end of the twenty-fifth capacitor C25 is grounded, the second end of the twentieth capacitor C20 is grounded, the GND pin of the first three-terminal voltage regulator VR1 is grounded, VDD is electrically connected with the VOUT pin of the first three-terminal voltage regulator VR1 and the first end of the nineteenth capacitor C19, the second end of the nineteenth capacitor C19 is grounded, VDDA is electrically connected with the VOUT end of the second three-terminal voltage regulator VR2 and the first end of the twenty-sixth capacitor C26, the second end of the twenty-sixth capacitor C26 is grounded, and the GND end of the second three-terminal voltage regulator VR2 is grounded.

[0089] (seven) transmitting module

[0090] As shown in Figure 8 the transmitting module mainly includes a first transmitting chip U4, a second transmitting chip U5, a probe coil receiving end P4, a mixing chip IC1 and a third transmitting chip U7, the first transmitting chip U4 is specifically a YDL71 type transmitting chip, the second transmitting chip U5 is specifically a YDL71 type transmitting chip, the third transmitting chip U7 is specifically a YDL527 type transmitting chip, and the mixing chip IC1 is specifically a YDL74S type mixing chip.

[0091] The first pin of the probe coil receiving end P4 is electrically connected with the first end of the first inductor L1, the first end of the twenty-third resistor R23 and the first end of the twenty-second capacitor C22, and the second end of the twenty-second capacitor C22 is electrically connected with GND1. The second end of the first inductor L1 is electrically connected with the eighth pin of the first transmitting chip U4, the seventh pin of the first transmitting chip U4, the sixth pin of the first transmitting chip U4, the fifth pin of the first transmitting chip U4 and the second end of the twenty-third resistor R23. The first pin of the first transmitting chip U4 is electrically connected with GND1, the second pin of the first transmitting chip U4 is electrically connected with the first end of the twenty-second resistor R22, the fourth pin of the first transmitting chip U4 is electrically connected with the first end of the twenty-fifth resistor R25, and A is electrically connected with the second end of the twenty-second resistor R22 and the second end of the twenty-fifth resistor R25. The third pin of the first transmitting chip U4 is electrically connected with the input end of the fifth diode D5, the first end of the third inductor L3 and the third pin of the second transmitting chip U5. The output end of the fifth diode D5 and the second end of the third inductor L3 are electrically connected with VDD-COIL.

[0092] The second pin of the probe coil receiving end P4 is electrically connected with the first end of the second inductor L2, the first end of the thirtieth resistor R30 and the first end of the twenty-seventh capacitor C27, and the second end of the twenty-seventh capacitor C27 is electrically connected with GND1. The second end of the second inductor L2 is electrically connected with the eighth pin of the second transmitting chip U5, the seventh pin of the second transmitting chip U5, the sixth pin of the second transmitting chip U5, the fifth pin of the second transmitting chip U5 and the second end of the thirtieth resistor R30. The first pin of the second transmitting chip U5 is electrically connected with GND1, the second pin of the second transmitting chip U5 is electrically connected with the first end of the twenty-ninth resistor R29, the fourth pin of the first transmitting chip U4 is electrically connected with the first end of the thirty-first resistor R31, and B is electrically connected with the second end of the twenty-ninth resistor R29 and the second end of the thirty-first resistor R31.

[0093] 1-TX electrically connected to the first end of the thirty-third resistor R33 and the first end of the twenty-eighth capacitor C28, the second end of the thirty-third resistor R33 is electrically connected to the first end of the thirty-fourth resistor R34, the first end of the thirty-seventh resistor R37 and GND1, the second end of the thirty-fourth resistor R34 is grounded through the thirty-fifth resistor R35, the second end of the thirty-seventh resistor R37 is grounded through the thirty-eighth resistor R38, and the second end of the twenty-eighth capacitor C28 is grounded.

[0094] In the mixing chip IC1, the first pin is electrically connected to silver 11.75KHZ, the second pin is electrically connected to TX, the third pin is grounded, and the fifth pin is electrically connected to VDD.

[0095] In the third transmitting chip U7, the third pin is grounded, the fourth pin is electrically connected to INB, the seventh pin is electrically connected to A, the sixth pin is electrically connected to VDD-COIL, and the fifth pin is electrically connected to B.

[0096] The fourth pin of IC1 is electrically connected to the first end of the forty-fifth resistor R45, the second end of the forty-fifth resistor R45 is electrically connected to the first end of the forty-seventh resistor R47 and the base of the fourth transistor Q4, the second end of the forty-seventh resistor R47 is grounded, the emitter of the fourth transistor Q4 is grounded, the collector of the fourth transistor Q4 is electrically connected to the first end of the forty-first resistor R41, the first end of the forty-third resistor R43 and INB, the second end of the forty-first resistor R41 is electrically connected to VDD-COIL and the first end of the forty-second resistor R42, the second end of the forty-third resistor R43 is electrically connected to the base of the fifth transistor Q5, the emitter of the fifth transistor Q5 is grounded, and the collector of the fifth transistor Q5 is electrically connected to the second end of the forty-second resistor R42 and the second pin of the third transmitting chip U7.

[0097] (Eight) mixing control module

[0098] As shown in Figure 9 , the mixing control module mainly includes a mixing control chip U8, a display screen interface P6, a third three-terminal voltage regulator VR3, a mixing control writing port J1 and a serial port J2, and the mixing control chip U8 is specifically a YDL01RCT6 type mixing control chip.

[0099] In the mixing control chip U8, its PA2 pin is electrically connected with copper 16.76KHZ, its PA3 pin is electrically connected with silver 11.75KHZ, its PA4 pin is electrically connected with gold 11.7KHZ, its PA5 pin is electrically connected with lamp PA5, its PA6 pin is electrically connected with sound PA6, its PA11 pin is electrically connected with LCD-A11, its PA12 pin is electrically connected with LCD-A12, its PA13 / JTMS / SWDIO pin is electrically connected with PA13, its PA14 / JTCK / SWCLK pin is electrically connected with PA14, its PA15 / JTDI pin is electrically connected with LCD-A15, its BOOT0 pin is electrically connected with BOOT01, its NRST pin is electrically connected with NRST, its VBAT pin is electrically connected with VBAT1, its PB2 / BOOT1 pin is electrically connected with PB2, its PB3 / JTDO pin is electrically connected with LCD-B3, its PB4 / JNTRST pin is electrically connected with LCD-B4, its PB5 pin is electrically connected with LCD-B5, its PB6 pin is electrically connected with LCD-B6, its PB7 pin is electrically connected with LCD-B7, its PB8 pin is electrically connected with LCD-B8, its PB9 pin is electrically connected with LCD-B9, its PB15 pin is electrically connected with LCD-B15, and its PC13-TAMPER-RTC pin is electrically connected with PC13.

[0100] The first end of the forty-fourth resistor R44 and the first end of the second switch S2 are electrically connected to the PA1 pin of the mixing control chip U8, the second end of the forty-fourth resistor R44 is electrically connected to 3.3V voltage, and the second end of the second switch S2 is grounded. The first end of the forty-first capacitor C41 and the first end of the second crystal oscillator Y2 are electrically connected to the OSC_IN / PD0 pin of the mixing control chip U8, the second end of the forty-first capacitor C41 is grounded, and the second end of the second crystal oscillator Y2 is electrically connected to the first end of the forty-ninth capacitor C49 and the OSC_OUT / PD1 pin of the mixing control chip U8, and the second end of the forty-ninth capacitor C49 is grounded. The VDD_1 pin of the mixing control chip U8, the VDD_2 pin of the mixing control chip U8 and the VDD_3 pin of the mixing control chip U8 are electrically connected to 3.3V voltage and the first end of the fifty-second resistor R52, and the second end of the fifty-second resistor R52 is electrically connected to VREF+ and the VDDA / VREF+ pin of the mixing control chip U8. The VCAP1 pin of the mixing control chip U8 is grounded through the thirty-seventh capacitor C37. The first end of the forty-eighth capacitor C48 and the first end of the third crystal oscillator Y3 are electrically connected to the PC14-OSC32_IN pin of the mixing control chip U8, the second end of the forty-eighth capacitor C48 is grounded, and the second end of the third crystal oscillator Y3 is electrically connected to the PC15-OSC32_OUT pin of the mixing control chip U8 and the first end of the fifty-second capacitor C52, and the second end of the fifty-second capacitor C52 is grounded. The VSS_1 pin of the mixing control chip U8, the VSS_2 pin of the mixing control chip U8, the VSS_3 pin of the mixing control chip U8 and the VSSA pin of the mixing control chip U8 are grounded.

[0101] In the display screen interface P6, the first pin thereof is grounded, the second pin thereof is electrically connected to VDD, the third pin thereof is grounded through the fiftieth capacitor C50, the fourth pin thereof is electrically connected to the first end of the fifty-first capacitor C51, the fifth pin thereof is electrically connected to the second end of the fifty-first capacitor C51, the sixth pin thereof is grounded, the seventh pin thereof is electrically connected to VDD, the eighth pin thereof is electrically connected to LCD-B8, the ninth pin thereof is electrically connected to LCD-B9, the eighteenth pin thereof is electrically connected to LCD-B7, the nineteenth pin thereof is electrically connected to LCD-B6, and the twentieth pin thereof is electrically connected to LCD-B5.

[0102] 3.3V voltage is electrically connected to the first end of the thirty-sixth resistor R36, the second end of the thirty-sixth resistor R36 is connected to the input end of the light emitting diode D6, the output end of the light emitting diode D6 is electrically connected to the drain of the third power MOS tube Q3, the source of the third power MOS tube Q3 is grounded, the gate of the third power MOS tube Q3 is electrically connected to the first end of the thirty-ninth resistor R39 and the first end of the fortieth resistor R40, the second end of the thirty-ninth resistor R39 is electrically connected to the lamp PA5, and the second end of the fortieth resistor R40 is grounded.

[0103] The VIN pin of the third three-terminal voltage regulator VR3 is electrically connected to UPWR and the first end of the thirtieth capacitor C30, the second end of the thirtieth capacitor C30 is grounded, the GND pin of the third three-terminal voltage regulator VR3 is grounded, and the VOUT pin of the third three-terminal voltage regulator VR3 is electrically connected to 3.3V voltage and the first end of the twenty-ninth capacitor C29, the second end of the twenty-ninth capacitor C29 is grounded.

[0104] The first pin of the serial port J2 is electrically connected to 3.3V voltage, the second pin of the serial port J2 is electrically connected to PA13, the third pin of the serial port J2 is electrically connected to PA14, and the fourth pin of the serial port J2 is grounded.

[0105] NRST is electrically connected to the first end of the twenty-fourth resistor R24, the second end of the reset switch SW2 and the first end of the twenty-third capacitor C23, the second end of the twenty-third capacitor C23 is grounded, the first end of the reset switch SW2 is grounded, and the second end of the twenty-fourth resistor R24 is electrically connected to 3.3V voltage.

[0106] The second end of the setting switch SW1 is electrically connected to 3.3V voltage, the first end of the setting switch SW1 is electrically connected to BOOT01, the first end of the twenty-eighth resistor R28 and the first end of the twenty-fourth capacitor C24, the second end of the twenty-eighth resistor R28 is grounded, and the second end of the twenty-fourth capacitor C24 is grounded.

[0107] The first pin of the mixing control burning port J1 is electrically connected to VDD, the second pin of the mixing control burning port J1 is electrically connected to the collector of the second triode Q2, the emitter of the second triode Q2 is grounded, and the base of the second triode Q2 is electrically connected to BRIGHT through the twenty-seventh resistor R27.

[0108] (nine) receiving module

[0109] As shown in Figure 10 , the receiving module mainly includes a receiving chip U1 and a probe disc coil receiving end P1, and the receiving chip U1 is specifically a MCP6022 type receiving chip.

[0110] The first pin of the probe coil receiving end P1 is grounded, the second pin of the probe coil receiving end P1 is electrically connected with the first end of the ninth capacitor C9 and the first end of the second capacitor C2, the second end of the ninth capacitor C9 is grounded, the second end of the second capacitor C2 is electrically connected with the first end of the tenth resistor R10, the second end of the tenth resistor R10 is electrically connected with the input end of the second diode D2, the first end of the second resistor R2 and the third pin of the receiving chip U1. The output end of the second diode D2 is electrically connected with VDDA, the second end of the second resistor R2 is electrically connected with the sixth pin of the receiving chip U1 and the seventh pin of the receiving chip U1.

[0111] The SIN-C is electrically connected with the first end of the fourth resistor R4, the second end of the fourth resistor R4 is electrically connected with the first end of the third resistor R3 and the first end of the third capacitor C3, the second end of the third resistor R3 is electrically connected with the first end of the first capacitor C1, the first end of the sixth resistor R6, the second pin of the receiving chip U1 and the first end of the twentieth resistor R20, the second end of the third capacitor C3 is grounded. The second end of the first capacitor C1 is electrically connected with the second end of the sixth resistor R6, the first end of the seventh resistor R7 and the first pin of the receiving chip U1, the second end of the seventh resistor R7 is electrically connected with U-RX and the first end of the thirteenth capacitor C13, the second end of the thirteenth capacitor C13 is grounded, the fourth pin of the receiving chip U1 is grounded. The second end of the twentieth resistor R20 is grounded through the sixteenth capacitor C16.

[0112] The VDDA is electrically connected with the eighth pin of the receiving chip U1, the first end of the fourteenth resistor R14 and the first end of the twelfth capacitor C12, the second end of the fourteenth resistor R14 is electrically connected with the fifth pin of the receiving chip U1, the first end of the fifteenth capacitor C15 and the first end of the eighteenth resistor R18, the second end of the fifteenth capacitor C15 is grounded, the second end of the eighteenth resistor R18 is grounded, the second end of the twelfth capacitor C12 is grounded.

[0113] The UPWR is electrically connected with the first end of the first electrolytic capacitor C4, the first end of the second electrolytic capacitor C5, the first end of the sixth capacitor C6 and the first end of the ninth resistor R9, the second end of the first electrolytic capacitor C4 is grounded, the second end of the second electrolytic capacitor C5 is grounded, the second end of the sixth capacitor C6 is grounded, the second end of the ninth resistor R9 is electrically connected with UP-CTR, the first end of the fifteenth resistor R15 and the first end of the eleventh capacitor C11, the second end of the fifteenth resistor R15 is grounded, the second end of the eleventh capacitor C11 is grounded.

[0114] (10) Adjustable power supply module

[0115] As shown in Figure 11 , the adjustable power supply module mainly includes an adjustable power supply chip IC2 and a fourth three-terminal voltage regulator V1, and the adjustable power supply chip IC2 is specifically an LM321 type adjustable power supply chip.

[0116] The third pin of the fourth three-terminal voltage regulator V1 is electrically connected to UPWR, the first end of the fifty-fifth capacitor C55 and the fifth pin of the adjustable power supply chip IC2, the second end of the fifty-fifth capacitor C55 is grounded, the first pin of the fourth three-terminal voltage regulator V1 is electrically connected to the fourth pin of the adjustable power supply chip IC2, the first end of the jumper JC1 and the first end of the fifty-seventh resistor R57, the second end of the jumper JC1 is grounded, the second end of the fifty-seventh resistor R57 is electrically connected to the third pin of the adjustable power supply chip IC2 and the first end of the fifty-fourth resistor R54, the second end of the fifty-fourth resistor R54 is grounded, the second pin of the adjustable power supply chip IC2 is grounded, the first pin of the adjustable power supply chip IC2 is electrically connected to the first end of the fifty-eighth capacitor C58 and the first end of the fifty-fifth resistor R55, the second end of the fifty-eighth capacitor C58 is grounded, and the second end of the fifty-fifth resistor R55 is electrically connected to PWM.

[0117] (11) Sound amplification module

[0118] As shown in Figure 12 , the sound amplification module mainly includes a first sound chip U2 and a second sound chip U3, and the first sound chip U2 is specifically an MC34119 type sound chip.

[0119] In the second sound chip U3, the first pin is electrically connected to the sound PA6, the second pin is grounded, the third pin is electrically connected to the sound, the sixth pin is electrically connected to the sound, the fifth pin is electrically connected to VDD, the fourth pin is electrically connected to SO1 and the first end of the seventeenth capacitor C17. The second end of the seventeenth capacitor C17 is electrically connected to the first end of the twenty-first resistor R21, the second end of the twenty-first resistor R21 is electrically connected to the fourth pin of the first sound chip U2, the first end of the seventeenth resistor R17 and the first end of the eighteenth capacitor C18, the second end of the seventeenth resistor R17 is electrically connected to the second end of the eighteenth capacitor C18, the fifth pin of the first sound chip U2 and the first end of the loudspeaker LS1.

[0120] The first pin of the first sound chip U2 is electrically connected to the first end of the eighth resistor R8 and the first end of the twelfth resistor R12, the second end of the eighth resistor R8 is electrically connected to SW, and the second end of the twelfth resistor R12 is grounded. The third pin of the first sound chip U2 is grounded through the tenth capacitor C10. The eighth pin of the first sound chip U2 is electrically connected to the second end of the loudspeaker LS1 through the fifth resistor R5, the seventh pin of the first sound chip U2 is grounded, the sixth pin of the first sound chip U2 is electrically connected to the first end of the seventh capacitor C7, UPWR and the first end of the third electrolytic capacitor C8, the second end of the seventh capacitor C7 is grounded, and the second end of the third electrolytic capacitor C8 is grounded.

[0121] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.

Claims

1. A multi-frequency metal detector, characterized in that, The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller.

2. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller.

3. The multi-frequency metal detector of claim 2, wherein, The application relates to a single-chip microcomputer main controller.

4. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller.

5. The multi-frequency metal detector of claim 4, wherein, The application relates to a single-chip microcomputer main controller.

6. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller.

7. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller.

8. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller.

9. The multi-frequency metal detector of claim 8, wherein, The application relates to a single-chip microcomputer main controller.

10. The multi-frequency metal detector of claim 1, wherein, The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to a single-chip microcomputer main controller. The application relates to

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