Server heat dissipation module

Abstract

The utility model provides a server heat dissipation module, which relates to the technical field of computers, and comprises a server box body, a plurality of heat conduction copper pipes are arranged in the server box body, the heat conduction copper pipes are U-shaped, placing grooves corresponding to the heat conduction copper pipes are arranged on two sides in the server box body, and the heat conduction copper pipes are arranged in the placing grooves. And a heat conducting plate is fixedly mounted in the server box body. The efficiency and maintainability of the heat dissipation system are greatly improved through the elaborate structural layout and efficient heat management in combination with the modular heat dissipation assembly, efficient heat conduction and dispersion are ensured through the modular design and the heat dissipation assembly working cooperatively, the performance and stability of a server are improved, and the service life of the server is prolonged. Heat conduction and distribution are optimized, local area heat control is enhanced, meanwhile, a convenient maintenance mode is provided for the system, and efficient and stable operation of the server is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer technology field especially is related to a server heat dissipation module. BACKGROUND

[0002] On some servers, various hardware components (such as CPU, GPU, hard disk, memory, etc.) inside the server will generate a large amount of heat when working, and the design and implementation of the heat dissipation system directly affect the stability and life of the server. At present, the internal server lacks effective cooperation, the heat conduction and dissipation efficiency is low, and due to the failure of the heat dissipation components to maximize the use of space, the mutual interference between heat sources is more, the overall heat dissipation capacity is reduced, the air flow is not smooth, the heat dissipation effect is greatly discounted, the installation angle and air volume of the fan may not effectively help the cooling of the cooling fins, the heat dissipation efficiency is reduced, the heat distribution is uneven, and the temperature in some areas is too high, affecting the overall heat dissipation effect of the system. SUMMARY

[0003] In view of the above problems, the utility model is provided to overcome the above problems or at least partially solve the above problems, and the server heat dissipation module can solve the problem of insufficient heat dissipation.

[0004] Specifically, the utility model provides a server heat dissipation module, which comprises a server box body, a plurality of heat-conducting copper pipes are arranged inside the server box body, the heat-conducting copper pipes are in the shape of the letter "U", and both sides inside the server box body are provided with placing grooves corresponding to the heat-conducting copper pipes, a heat-conducting plate is fixedly installed inside the server box body, the heat-conducting plate is in the shape of the letter "L" on the side, a slider that slides forward and backward is arranged on the lower side of the server box body, a cooling fin is rotatably connected to the outside of the slider, a filter screen is arranged on the inside of the cooling fin, a cooling fan is installed on the outside of the cooling fin, and the filter screen slides up and down on the rear side of the server box body.

[0005] Preferably, the plurality of heat-conducting copper pipes are arranged in a vertical array inside the server box body, and two heat insulation plates are arranged between adjacent two heat-conducting copper pipes, and the heat insulation plates are fixedly installed inside the server box body.

[0006] Preferably, a connecting seat is fixed on the upper side of the filter screen, and a sliding groove corresponding to the filter screen is formed in the rear side of the server box body.

[0007] Preferably, a plug is arranged on the upper part of the rear side of the server box body, a sleeve is arranged on the server box body corresponding to the plug, and a through groove corresponding to the plug is formed on the upper side of the cooling fin.

[0008] Preferably, a plurality of plug holes corresponding to the cooling fin are formed on the filter screen, and the width of the plug holes is greater than or equal to the thickness of the cooling fin.

[0009] Preferably, the inner side of the heat dissipation fin is in contact with the rear side of the heat conduction plate, and the inner side of the heat dissipation fin is provided with a plurality of insertion slots corresponding to the heat conduction copper pipes.

[0010] The server heat dissipation module has the advantages that:

[0011] 1. The server heat dissipation module has the advantages that:

[0012] 2. The server heat dissipation module has the advantages that:

[0013] In summary, the server heat dissipation module has the advantages that:

[0014] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of the embodiments of the present application when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0015] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. The same reference numbers in different drawings denote the same or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0016] Fig. 1 is a schematic structural view of a server heat dissipation module according to an embodiment of the present application;

[0017] Fig. 2 is a schematic view of an unfolded structure of a server heat dissipation module according to the present application;

[0018] Fig. 3The utility model provides a kind of server heat dissipation module's overhead section structure schematic diagram.

[0019] In the drawing: 1, server box body;2, fin;3, heat dissipation fan;4, plug bolt;5, heat-conducting copper pipe;6, sliding block;7, connecting seat;8, slot one;9, filter screen;10, slot two;11, placing groove;12, heat insulation plate;13, heat-conducting plate. DETAILED DESCRIPTION

[0020] The server heat dissipation module of the embodiments of the utility model will be described below with reference to Figs. 1-3 In the description of the present embodiment, it should be understood that the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and other features can be further included.

[0021] Unless otherwise specifically defined and limited, the terms "set", "mount", "connected", "connected", "fixed", "coupled" and other terms should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. Those skilled in the art should be able to understand the specific meaning of the above terms in the present utility model according to the specific circumstances.

[0022] In addition, in the description of the present embodiment, the first feature "above" or "below" the second feature can include direct contact between the first and second features, or it can include indirect contact between the first and second features through another feature between them. That is, in the description of the present embodiment, the first feature "above", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" or "below" the second feature can be the first feature directly below or obliquely below the second feature, or only indicates that the first feature is less than the second feature in horizontal height.

[0023] In the description of the present embodiments, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0024] With reference to Figs. 1-3 A server heat dissipation module, comprising a server box 1, a plurality of heat-conducting copper pipes 5 are arranged inside the server box 1, the heat-conducting copper pipes 5 are in the shape of the letter "U", and both sides inside the server box 1 are provided with placing grooves 11 corresponding to the heat-conducting copper pipes 5, a heat-conducting plate 13 is fixedly installed inside the server box 1, the heat-conducting plate 13 is in the shape of the letter "L" on the side, the plurality of heat-conducting copper pipes 5 are arranged in a vertical array inside the server box 1, and two heat insulation plates 12 are arranged between adjacent two heat-conducting copper pipes 5, the heat insulation plates 12 are fixedly installed inside the server box 1, the heat insulation plates 12 avoid mutual interference of heat between adjacent heat-conducting copper pipes 5, so that each copper pipe can effectively absorb the heat in the region thereof, so that the heat in different regions can be independently conducted and processed, and the overall heat dissipation efficiency is improved;

[0025] Further, the heat-conducting copper pipes 5 absorb the heat on the left and right sides inside the server box 1, and the heat-conducting plate 13 absorbs the heat on the lower side inside the server box 1 to the rear side, the heat inside the server box 1 is converged and gathered to a point for centralized heat dissipation treatment through the plurality of heat-conducting copper pipes 5 and the heat-conducting plate 13, the heat-conducting copper pipes 5 serve as a conduction channel between the heat source and the radiator, and are designed in the shape of "U", which not only effectively distributes the heat in the vertical direction, but also conducts the heat in two directions through the upper surface and the lower surface, which helps to accelerate the heat dissipation process;

[0026] Further, the inner side of the heat dissipation fin 2 is in contact with the rear side of the heat conduction plate 13, and the inner side of the heat dissipation fin 2 is provided with a plurality of insertion slots 8 corresponding to the heat conduction copper pipes 5, the inner side of the outer heat dissipation fin 2 is in contact with the rear side of the heat conduction plate 13, and the heat conduction plate 13 can conduct heat to the heat dissipation fin 2, the heat dissipation fin 2 can not only accelerate the heat dissipation of the heat conduction plate 13, but also cooperate with the heat dissipation fan 3 to dissipate heat faster and reduce the heat inside the server box 1 faster. The same heat dissipation fin 2 is in contact with the plurality of heat conduction copper pipes 5 through the inner insertion slot 8, the heat conduction copper pipe 5 can collect the heat to the unified heat dissipation fin 2 for centralized and unified heat dissipation work, the heat conduction plate 13 is in the shape of the letter "L", which is usually used to increase the contact area with the heat source, thereby improving the heat conduction efficiency. The "L" shape of the heat conduction plate 13 not only increases the contact area, but also effectively guides the heat flow to the copper pipe, and the heat dissipation effect of the heat conduction copper pipe 5 can collect the internal heat to a more efficient heat dissipation system, which considers not only the conduction of heat, but also the avoidance of excessive heat accumulation to promote the uniform dissipation of heat;

[0027] Further, the server box 1 is provided with a front and rear sliding block 6, the outer side of the sliding block 6 is rotatably connected with the heat dissipation fin 2, the inner side of the heat dissipation fin 2 is provided with a filter screen 9, the outer side of the heat dissipation fin 2 is provided with a heat dissipation fan 3, the filter screen 9 slides up and down on the rear side of the server box 1, the inner side of the heat dissipation fin 2 is in contact with the rear side of the heat conduction plate 13, and the inner side of the heat dissipation fin 2 is provided with a plurality of insertion slots 8 corresponding to the heat conduction copper pipes 5, the inner side of the heat dissipation fin 2 is in contact with the rear side of the heat conduction plate 13, and the inner side of the heat dissipation fin 2 is provided with a plurality of insertion slots 8 corresponding to the heat conduction copper pipes 5, the filter screen 9 provided on the rear side of the server box 1 is the only air inlet and air outlet of the box, the filter screen 9 can prevent dust from entering the server box 1, and can slide outwardly, but the insertion plug 4 in the insertion slot 8 must be pulled out first, and then the heat conduction copper pipe 5 is separated from the inside of the insertion slot 8, the heat dissipation fin 2 on the sliding block 6 can be rotated outward, at this time the heat dissipation fin 2 is also rotated out of the insertion slot 10 of the filter screen 9, the filter screen 9 can be pulled out upwardly through the connecting seat 7, thereby realizing the cleaning of the filter screen 9 to ensure the ventilation effect of the server box 1, and the heat dissipation fin 2 is in close contact with the heat conduction copper pipe 5, which effectively increases the diffusion area of the heat absorbed by the copper pipe, thereby realizing faster heat dissipation effect;

[0028] Further, the heat dissipation fan 3 is used to accelerate the air flow on the heat dissipation fin 2, promote the heat conduction to the external environment, the filter screen 9 and the slider 6 are designed as a movable structure, which can be conveniently cleaned and maintained, regular cleaning of the filter screen 9 can not only ensure that the external air flow is unobstructed, avoid the influence of dust on the server hardware, but also ensure that the heat dissipation efficiency is not blocked by dust, thereby maintaining the stable operation of the system, the design of the overall heat dissipation system ensures that the heat from multiple heat sources (such as CPU, hard disk, etc.) inside the server is effectively concentrated and managed, through the cooperative work of the heat conduction copper pipe 5, the heat conduction plate 13, the heat dissipation fin 2 and the fan, the high efficiency of the heat dissipation system is guaranteed to the greatest extent, and the cleanable design of the filter screen 9 also enhances the maintainability of the system.

[0029] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in this paper, many other variants or modifications conforming to the principles of the present application can be directly determined or deduced according to the content disclosed in the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. A server heat dissipation module, characterized in that, The utility model provides a server heat dissipation module, including server box (1), the inside of server box (1) is provided with several heat conduction copper pipe (5), the heat conduction copper pipe (5) is in the shape of letter "U", and both sides of the inside of server box (1) are provided with the placing groove (11) of corresponding heat conduction copper pipe (5), the inside of server box (1) is fixedly installed with heat conduction plate (13), the side letter "L" shape of heat conduction plate (13), the lower side of server box (1) is provided with front and rear sliding slider (6), the outer side of slider (6) is rotatably connected with fin (2), the inner side of fin (2) is provided with filter screen (9), the outer side of fin (2) is installed with heat dissipation fan (3), and filter screen (9) slides up and down on the rear side of server box (1).

2. The server heat dissipation module of claim 1, wherein, a plurality of heat conduction copper pipes (5) are vertically arranged in the server box (1), and two adjacent heat conduction copper pipes (5) are provided with two heat insulation plates (12) on the left and right sides, and the heat insulation plates (12) are fixedly installed in the server box (1).

3. The server heat dissipation module of claim 1, wherein, the upper side of the filter screen (9) is fixedly provided with a connecting seat (7), and the rear side of the server box (1) is provided with a sliding groove corresponding to the filter screen (9).

4. The server heat dissipation module of claim 1, wherein, the rear side of the server box (1) is provided with an insertion bolt (4) at the upper part, the server box (1) is provided with a sleeve seat corresponding to the insertion bolt (4), and the upper side of the fin (2) is provided with a through groove corresponding to the insertion bolt (4).

5. The server heat dissipation module of claim 1, wherein, the filter screen (9) is provided with a plurality of insertion grooves (10) corresponding to the fin (2) on the upper side, and the width of the insertion grooves (10) is greater than or equal to the thickness of the fin (2).

6. The server heat dissipation module of claim 1, wherein, the inner side of the fin (2) is in contact with the rear side of the heat conduction plate (13), and the inner side of the fin (2) is provided with a plurality of insertion grooves (8) corresponding to the heat conduction copper pipe (5).

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