Wafer dispergation device, film tearing equipment and thinning and film tearing integrated system

Abstract

The utility model discloses a wafer dispergation device, a film tearing device and a thinning and film tearing integrated system. The wafer dispergation device disclosed by the embodiment of the utility model comprises a bracket; a transmission assembly; the adsorption assembly is arranged on the transmission assembly, and the adsorption assembly is used for adsorbing a wafer with a protective film attached to the surface; the first driving assembly is connected with the transmission assembly, and the first driving assembly can drive the transmission assembly to move in the first direction; a peptizing assembly; the second driving assembly is connected with the dispergation assembly, and the second driving assembly can drive the dispergation assembly to move synchronously with the adsorption assembly in the first direction; and the dispergation assembly is used for irradiating dispergation light to the surface, to which the protective film is attached, of the wafer when the dispergation assembly and the adsorption assembly synchronously move.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductors, in particular to a wafer debonding device, a film tearing device and a thinning and film tearing integrated system. BACKGROUND

[0002] The main purpose of wafer thinning is to thin the wafer to meet the manufacturing requirements of higher performance electronic devices. In this process, a wafer thinning device is needed to reduce the thickness of the wafer. Before thinning, a protective film needs to be covered on the surface of the wafer adsorbed by the carrier table, and the wafer and the protective film are connected through a photosensitive adhesive. After wafer thinning, the step of tearing off the protective film is also needed.

[0003] In the prior art, a mechanical arm is used to transport the thinned wafer to a fixed debonding device for debonding, and then the debonded wafer is placed on a wafer calibration table for positioning, and then subsequent film tearing and pasting processing is carried out. It can be seen that in the prior art, the wafer transport process after thinning and the wafer debonding process before wafer calibration are carried out independently, which not only increases the overall processing time, but also affects the efficiency of wafer processing. UTILITY MODEL CONTENT

[0004] The utility model discloses a wafer debonding device, a film tearing device and a thinning and film tearing integrated system, which can debond the wafer while transporting the wafer, thereby reducing the overall operation time of wafer processing and improving the efficiency of wafer processing.

[0005] In order to achieve the above-mentioned purpose, the application discloses a wafer debonding device, which comprises:

[0006] a support;

[0007] a transmission assembly slidably connected to the support in a first direction;

[0008] an adsorption assembly arranged on the transmission assembly, the adsorption assembly being used for adsorbing a wafer with a protective film attached to the surface of the wafer;

[0009] a first driving assembly connected with the transmission assembly, the first driving assembly being capable of driving the transmission assembly to move in the first direction;

[0010] a debonding assembly slidably connected to the support in the first direction;

[0011] A second driving assembly is connected with the debonding assembly, and the second driving assembly can drive the debonding assembly to move along the first direction synchronously with the adsorbing assembly. The debonding assembly is configured to irradiate the surface of the wafer to which the protective film is attached with debonding light when the debonding assembly moves synchronously with the adsorbing assembly.

[0012] As an optional implementation, the first driving assembly comprises a first screw rod extending along the first direction, a first nut threadedly engaged with the first screw rod and connected with the adsorbing assembly, and a first driving member connected with the first screw rod and configured to drive the first screw rod to rotate.

[0013] As an optional implementation, the second driving assembly comprises a second screw rod extending along the first direction, a second nut threadedly engaged with the second screw rod and connected with the debonding assembly, and a second driving member connected with the second screw rod and configured to drive the second screw rod to rotate.

[0014] As an optional implementation, the support comprises a first guide rod arranged in parallel with the first screw rod, and the first nut is slidably sleeved on the first guide rod.

[0015] As an optional implementation, the conveying assembly comprises a sliding module arranged on the support and configured to drive the adsorbing assembly to move along a vertical direction, and a rotating module comprising a first rotating shaft arranged on the sliding module and a rotating arm having a first end connected with the first rotating shaft and a second end connected with the adsorbing assembly, wherein the first rotating shaft is configured to rotate about an axis thereof.

[0016] As an optional implementation, the adsorbing assembly comprises an adsorbing member configured to be connected with a negative pressure generating member so as to enable the adsorbing member to adsorb the wafer.

[0017] As an optional implementation, the adsorbing assembly further comprises a first mounting member arranged on the second end of the rotating arm, a second mounting member movably connected with the first mounting member along the vertical direction, and an adsorbing member arranged on a side of the second mounting member away from the first mounting member, and a buffer member connected between the first mounting member and the second mounting member and configured to apply a buffering force to the second mounting member when the second mounting member moves along the vertical direction towards the first mounting member.

[0018] As an optional implementation, the wafer debonding device further comprises a control unit electrically connected with the first driving assembly and the second driving assembly respectively to control the adsorption assembly and the debonding assembly to move synchronously; and an angle detection member arranged on the first sliding member, the angle detection member being capable of detecting a rotation angle of the rotating arm, and the angle detection member being electrically connected with the control unit.

[0019] As an optional implementation, the debonding assembly comprises a box body, a light-transmitting opening being arranged on a surface of the box body; and an LED lamp plate arranged in an interior of the box body, the LED lamp plate being capable of generating debonding light and irradiating the wafer with the debonding light through the light-transmitting opening.

[0020] As an optional implementation, the debonding assembly further comprises a lamp plate driving assembly, the lamp plate driving assembly being arranged in the interior of the box body and connected with the LED lamp plate, the lamp plate driving assembly being capable of driving the LED lamp plate to move or rotate; and / or the rotating module further comprises a second rotating shaft, the second rotating shaft being rotatably connected between the rotating arm and the adsorption assembly, and the adsorption assembly being capable of rotating along an axis of the second rotating shaft.

[0021] As an optional implementation, the wafer debonding device further comprises an energy detection sensor arranged at the light-transmitting opening, the energy detection sensor being used to detect energy of the debonding light generated by the LED lamp plate.

[0022] A second aspect of the embodiments of the present application discloses a film tearing device, comprising: a film tearing device, the film tearing device comprising a calibration platform; and a wafer debonding device, the wafer debonding device being capable of transporting the wafer to the calibration platform.

[0023] A third aspect of the embodiments of the present application discloses a thinning and film tearing integrated system, comprising: a thinning device, the thinning device comprising a thinning platform; and a film tearing device, the calibration platform and the thinning platform being arranged along a first direction, the wafer debonding device being capable of transporting the wafer from the thinning platform to the calibration platform.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] The wafer debonding device provided by the embodiments of the present application can control the debonding assembly and the adsorption assembly to move along the first direction synchronously while the adsorption assembly drives the wafer to move along the first direction, so that the wafer can complete debonding during transportation along the first direction, the transportation and debonding processes can be performed synchronously, the wafer does not need to wait for additional transportation time before or after debonding, the idle and waiting time of the wafer processing device is reduced, the working hours required for wafer processing are shortened, and the wafer processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0027] Figure 1 Structure schematic diagram of the wafer debonding device provided by the embodiments of the present application;

[0028] Figure 2 Structure schematic diagram of the wafer debonding device provided by the embodiments of the present application;

[0029] Figure 3 Structure schematic diagram of the debonding assembly and the second driving assembly provided by the embodiments of the present application;

[0030] Figure 4 Structure schematic diagram of the adsorption assembly provided by the embodiments of the present application;

[0031] Figure 5 Structure schematic diagram of the calibration platform provided by the embodiments of the present application.

[0032] Explanation of reference signs:

[0033] 100-wafer debonding device; 1-bracket; 2-transport assembly; 21-sliding module; 22-rotation module; 221-rotation arm; 24-adsorption assembly; 241-adsorption subassembly; 242-first mounting piece; 243-second mounting piece; 244-buffer piece; 245-pressure detection device; 3-debonding assembly; 31-box body; 31a-light transmission port; 32-LED lamp plate; 33-third drag chain; 41-first driving assembly; 411-first lead screw; 412-first nut; 413-first driving piece; 414-first drag chain; 42-second driving assembly; 421-second lead screw; 422-second nut; 423-second driving piece; 5-angle detection piece; 6-energy detection sensor; 201-calibration platform. DETAILED DESCRIPTION

[0034] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0035] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meaning of these terms in the present application can be understood according to the specific situation.

[0037] In addition, the terms "mount", "set", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific situation.

[0038] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0039] The main purpose of wafer thinning is to thin the wafer to meet the manufacturing needs of higher performance electronic devices. In this process, a wafer thinning device is needed to reduce the thickness of the wafer. Before thinning, a protective film needs to be covered on the surface of the wafer adsorbed by the carrying table, and the wafer and the protective film are connected by photosensitive glue. After wafer thinning, the step of tearing off the protective film is also needed.

[0040] In the prior art, the wafer with the protective film is first thinned on a thinning device, then the thinned wafer is transported to a fixed debonding device by a mechanical arm for debonding, and finally the debonded wafer is placed on a wafer calibration table for positioning by the mechanical arm, and then a subsequent film tearing process is performed.

[0041] It can be seen that in the prior art, the wafer transport process after thinning and the wafer debonding process are performed independently before the wafer calibration process, which not only increases the overall processing time, but also affects the wafer processing efficiency.

[0042] Therefore, the embodiments of the present application disclose a wafer debonding device, a film tearing device and a thinning and film tearing integrated system, which save the processing time required for wafer processing by simultaneously performing the transportation process and the debonding process, and improve the efficiency of wafer processing.

[0043] The technical solutions of the present application will be further described below with reference to specific embodiments and drawings.

[0044] Please refer to Figure 1 and Figure 2 , Figure 1 Figure 1 is a structural schematic diagram of a wafer debonding device 100 provided by the embodiments of the present application, Figure 2 Figure 2 is another structural schematic diagram of the wafer debonding device 100 provided by the embodiments of the present application. The wafer debonding device 100 provided by the embodiments of the present application comprises: a support 1; a transmission assembly 2, which is slidingly connected to the support 1 along a first direction X; an adsorption assembly 24, which is arranged on the transmission assembly 2 and is used for adsorbing a wafer with a protective film attached to the surface of the wafer; a first driving assembly 41, which is connected to the transmission assembly 2 and can drive the transmission assembly 2 to move along the first direction X; and a debonding assembly 3, which is slidingly connected to the support 1 along the first direction X. A second driving assembly 42 is connected to the debonding assembly 3 and can drive the debonding assembly 3 to move along the first direction X synchronously with the adsorption assembly 24. The debonding assembly 3 is used for irradiating debonding light to the surface of the wafer with the protective film attached thereto when the debonding assembly 3 and the adsorption assembly 24 move synchronously.

[0045] The support 1 is the mounting basis of the entire wafer debonding device 100, and provides necessary support and positioning functions for other components of the wafer debonding device 100. Other components such as the first driving assembly 41 and the second driving assembly 42 are mounted on the support 1.

[0046] Optionally, the support 1 can be provided as an integrated structure or as a plurality of sub-mounting structures that are assembled together. The embodiments do not limit the form of the support 1.

[0047] The adsorption assembly 24 is slidably connected to the support 1 along the first direction X, and is used to adsorb the wafer with the protective film attached to the surface. Specifically, the adsorption assembly 24 is mainly responsible for stably adsorbing the wafer with the protective film attached to the surface, and keeping the wafer stable and accurately positioned during the entire processing and transportation process. The adsorption assembly 24 can ensure that the wafer will not slip, shift or be damaged during transportation and debonding.

[0048] In addition, the adsorption assembly 24 is slidably connected to the support 1 along the first direction X, so that the adsorption assembly 24 moves along the first direction X on the support 1, thereby driving the wafer on the adsorption assembly 24 to move along the first direction X.

[0049] The wafer debonding device 100 further comprises a debonding assembly 3 slidably connected to the support 1 along the first direction X, and the debonding assembly 3 is used to irradiate debonding light to the surface of the wafer with the protective film attached.

[0050] Specifically, the debonding assembly 3 activates the photosensitive component in the glue or adhesive by emitting debonding light, triggers a photochemical reaction, and makes the glue or adhesive become fragile or easy to peel off. Subsequently, through the film tearing process in the subsequent processing, the protective film irradiated by the debonding light can be removed from the surface of the wafer.

[0051] Further, the debonding assembly 3 is slidably connected to the support 1 along the first direction X, so as to ensure that the debonding assembly 3 can move along the first direction X, thereby ensuring that the debonding assembly 3 can irradiate the wafer adsorbed by the adsorption assembly 24, so that the debonding assembly 3 can debond the wafer.

[0052] The first driving assembly 41 and the second driving assembly 42 are mainly responsible for providing power to ensure that the adsorption assembly 24 and the debonding assembly 3 can move along the first direction X synchronously and stably. Through precise driving control, the first driving assembly 41 and the second driving assembly 42 can realize the coordinated movement between the adsorption assembly 24 and the debonding assembly 3, thereby ensuring that the wafer always maintains the correct position and posture during transportation and debonding, improving the accuracy and efficiency of the wafer debonding process, and also avoiding unnecessary damage to the wafer during processing.

[0053] Further, the speed at which the first driving assembly 41 and the second driving assembly 42 drive the adsorption assembly 24 and the debonding assembly 3 to move along the first direction X can be adjusted according to the different debonding time of different protective films, so as to ensure that the wafer can complete the debonding during transportation.

[0054] Optionally, the first driving assembly 41 and the second driving assembly 42 can have a driving member and a transmission assembly. The transmission assembly can be a gear transmission, a lead screw transmission, a slide rail and slide block transmission, and a belt transmission, etc., which can ensure the synchronous movement of the adsorption assembly 24 and the debonding assembly 3.

[0055] Specifically, the first driving assembly 41 is configured to control the movement of the adsorption assembly 24 along the first direction X, and the second driving assembly 42 is configured to control the movement of the debonding assembly 3 along the first direction X, so that the first driving assembly 41 and the second driving assembly 42 are directly connected with the adsorption assembly 24 and the debonding assembly 3, and the stability and reliability of the driving are ensured.

[0056] Meanwhile, the control unit is electrically connected with the first driving assembly 41 and the second driving assembly 42 respectively, so as to control the movement speed of the adsorption assembly 24 and the debonding assembly 3 respectively, so that the movement speed of the adsorption assembly 24 and the debonding assembly 3 along the first direction X is consistent, and the wafer can be continuously irradiated by the debonding light emitted by the debonding assembly 3 during the transportation.

[0057] In this way, the wafer debonding device 100 provided by the embodiment of the present application can control the debonding assembly 3 to move along the first direction X synchronously with the adsorption assembly 24 while the adsorption assembly 24 drives the wafer to move along the first direction X, so that the wafer can be debonded during the transportation along the first direction X, and the transportation and debonding processes can be performed synchronously, the wafer does not need to wait for additional transportation time before or after the debonding, the idle and waiting time of the wafer processing device is reduced, the working hours required for wafer processing are shortened, and the efficiency of wafer processing is improved.

[0058] Please refer to Figure 2 In some embodiments, the first driving assembly 41 comprises: a first lead screw 411 extending along the first direction X; a first nut 412 threadedly matched with the first lead screw 411 and connected with the adsorption assembly 24; and a first driving member 413 connected with the first lead screw 411, the first driving member 413 being capable of driving the first lead screw 411 to rotate.

[0059] The first lead screw 411 extends along the first direction X, and the surface of the first lead screw 411 is provided with threads. The first nut 412 is tightly matched with the first lead screw 411 through threads, and the inside of the first nut 412 is processed with thread grooves matched with the threads on the surface of the first lead screw 411. The first nut 412 is connected with the adsorption assembly 24, so that when the first lead screw 411 rotates under the action of the first driving member 413, the first nut 412 will move along the extension direction of the first lead screw 411, and in turn drive the adsorption assembly 24 to move.

[0060] The first driving member 413 is connected with the first screw rod 411, and the first driving member 413 can drive the first screw rod 411 to rotate. Optionally, the first driving member 413 can be a motor, a cylinder or a compressor, etc. The first driving member 413 can receive instructions from the control unit, and start, stop, accelerate or decelerate according to the instructions. By controlling the rotation speed and direction of the first driving member 413, the movement speed and position of the adsorption assembly 24 can be controlled.

[0061] In this way, the cooperation between the first screw rod 411 and the first nut 412 has high precision and high rigidity, and can realize accurate movement and positioning of the adsorption assembly 24, and also has stability and reliability. The cooperation between the first screw rod 411 and the first nut 412 and the control of the first driving member 413 together ensure the smoothness and accuracy of the adsorption assembly 24 during movement, and reduce the generation of vibration and noise.

[0062] In addition, the first driving assembly 41 can be provided with a first drag chain 414, one end of the first drag chain 414 is connected with the first nut 412, and the other end of the first drag chain 414 is connected to the support 1. The first drag chain 414 can protect and support the cables, gas pipes and other pipelines connected between the first nut 412 and the support 1, and prevent them from being abraded, pulled or damaged when the first nut 412 moves.

[0063] Please refer to Figure 3 , Figure 3 The structure diagram of the debonding assembly 3 and the second driving assembly 42 provided in the embodiments of the present application. In some embodiments, the second driving assembly 42 includes: a second screw rod 421 extending along the first direction X; a second nut 422 threadedly cooperating with the second screw rod 421 and connected with the debonding assembly 3; and a second driving member 423 connected with the second screw rod 421, and capable of driving the second screw rod 421 to rotate.

[0064] The second screw rod 421 extends along the first direction X, and the surface of the second screw rod 421 has threads. The second nut 422 is tightly cooperated with the second screw rod 421 through threads, and the inside of the second nut 422 is processed with thread grooves matched with the threads on the surface of the second screw rod 421. The second nut 422 is connected with the debonding assembly 3, so that when the second screw rod 421 rotates under the action of the second driving member 423, the second nut 422 will move along the extension direction of the second screw rod 421, thereby driving the debonding assembly 3 to move together.

[0065] The second driving member 423 is connected with the second screw rod 421, and the second driving member 423 can drive the second screw rod 421 to rotate. Optionally, the second driving member 423 can be a motor, a cylinder or a compressor, etc. The second driving member 423 can receive instructions from the control unit, and start, stop, accelerate or decelerate according to the instructions. By controlling the rotation speed and direction of the second driving member 423, the movement speed and position of the debonding assembly 3 can be controlled.

[0066] In this way, the cooperation between the second screw rod 421 and the second nut 422 has high precision and high rigidity, and can realize accurate movement and positioning of the debonding assembly 3, and also has stability and reliability. The cooperation between the second screw rod 421 and the second nut 422 and the control of the second driving member 423 together ensure the stability and accuracy of the movement of the debonding assembly 3, and reduce the generation of vibration and noise.

[0067] In some embodiments, the support 1 comprises a first guide rod, the first guide rod is arranged in parallel with the first screw rod 411, and the first nut 412 is slidably sleeved on the first guide rod.

[0068] The first guide rod is arranged in parallel with the first screw rod 411 as part of the support 1. The first guide rod can provide additional support and guidance to the first nut 412, so as to ensure that the first nut 412 does not rotate during movement along the extension direction of the first screw rod 411.

[0069] Specifically, since the first nut 412 is threadedly connected with the first screw rod 411, when the first screw rod 411 rotates, the first nut 412 will move along the first screw rod 411. The presence of the first guide rod effectively prevents the rotation of the first nut 412 during movement, thereby ensuring that the orientation of the adsorption assembly 24 remains consistent during movement along the first direction X.

[0070] Similarly, the support 1 can also comprise a second guide rod, the second guide rod is arranged in parallel with the second screw rod 421, and the second nut 422 is slidably sleeved on the second guide rod.

[0071] The second guide rod is arranged in parallel with the second screw rod 421 as part of the support 1. The second guide rod can provide additional support and guidance to the second nut 422, so as to ensure that the second nut 422 does not rotate during movement along the extension direction of the second screw rod 421.

[0072] Specifically, since the second nut 422 is threadedly engaged with the second screw rod 421, when the second screw rod 421 rotates, the second nut 422 will move along the second screw rod 421. The presence of the second guide rod effectively prevents the second nut 422 from rotating during movement, thereby ensuring that the orientation of the gluing assembly 3 remains consistent during movement in the second direction.

[0073] Alternatively, in addition to the cooperation of the second screw rod 421 and the second nut 422, the gluing device can also be provided with other transmission assemblies, such as a sliding rail and sliding block cooperation, and the like. The two sets of transmission assemblies can be arranged in a horizontal direction and driven by a second driving member 423 to ensure the stability of the gluing device during movement.

[0074] In addition, the second driving assembly 42 can be provided with a second drag chain, one end of the second drag chain being connected to the second nut 422, and the other end of the second drag chain being connected to the support 1. The second drag chain can protect and support cables, air pipes and other pipelines connected between the second nut 422 and the support 1, preventing them from being abraded, pulled or damaged when the second nut 422 moves.

[0075] Please refer to Figure 1 and Figure 2 In some embodiments, the conveying assembly 2 includes a sliding module 21 arranged on the support, the sliding module 21 being capable of moving the adsorption assembly 24 in a vertical direction; and a rotating module 22, the rotating module 22 including a rotating shaft and a rotating arm 221, the rotating shaft being arranged on the sliding module 21, and the first end of the rotating arm 221 being connected to the rotating shaft, the rotating shaft being capable of rotating about the axis of the rotating shaft.

[0076] Specifically, the sliding module 21 can include a first guide arranged on the support 1 and extending in a vertical direction; and a first sliding member slidably arranged on the first guide.

[0077] The first guide is arranged on the support 1 and extends in a vertical direction. The first sliding member is slidably arranged on the first guide. The first sliding member is capable of stable sliding along the extension direction of the first guide, thereby adjusting the height of the wafer adsorbed by the adsorption assembly 24. The sliding module 21 further includes a vertical driving member for driving the first sliding member to move in a vertical direction relative to the first guide 21.

[0078] The rotating module 22 comprises a rotating shaft and a rotating arm 221. The rotating shaft is arranged on the sliding module 21 and serves as the rotation center of the rotating arm 221, and can stably rotate around its own axis. The first end of the rotating arm 221 is tightly connected with the rotating shaft, so as to ensure the stability and accuracy of the rotating arm 221 during rotation. The second end of the rotating arm 221 is connected with the adsorbing assembly 24, so that the adsorbing assembly 24 rotates together with the rotating arm 221 when the rotating shaft rotates, thereby realizing the rotation adjustment of the wafer.

[0079] In this way, the first guide, the first sliding piece and the rotating module 22 can move the adsorbing assembly 24 in the vertical direction and the rotation direction of the rotating arm 221, so that the adsorbing assembly 24 can drive the wafer to move between different processing devices, facilitating the cooperation between the wafer debonding device 100 and other processing devices.

[0080] Please refer to Figure 4 , Figure 4 The structure diagram of the adsorbing assembly 24 provided in the embodiments of the present application, in some embodiments, the adsorbing assembly 24 comprises: an adsorbing member 241, which is used to communicate with the negative pressure generating member, so that the adsorbing member 241 can adsorb the wafer.

[0081] The adsorbing member 241 can communicate with the negative pressure generating member, and when the negative pressure generating member works, the negative pressure generating member can generate a negative pressure area in the adsorbing member 241, which can generate an inward adsorbing force on the wafer, so that the adsorbing member 241 can stably adsorb the wafer. Optionally, a protective layer can be arranged on the surface of the adsorbing member 241 to prevent the adsorbing member 241 from damaging the surface of the wafer during adsorption.

[0082] When the wafer is taken and loaded, the transmission assembly 2 drives the adsorbing assembly 24 to the upper side of the wafer, and after the adsorbing member 241 contacts the wafer, the adsorbing member 241 generates an adsorbing force on the wafer, so as to fix the wafer on the adsorbing assembly 24, thereby improving the stability of the wafer during processing, and also making the wafer more easily positioned and rotated.

[0083] In addition, since the wafer is usually made of fragile material, the adsorbing force of the adsorbing member 241 needs to be accurately controlled to avoid damaging the wafer and to ensure that the wafer will not fall off. The wafer debonding device 100 can also be provided with a pressure detection device 245 for detecting the air pressure of the negative pressure area in the adsorbing member 241, so as to ensure that the wafer can be stably adsorbed on the adsorbing surface of the adsorbing member 241.

[0084] Optionally, the pressure detection device 245 can be arranged in multiple numbers to match wafers of different sizes, so as to more accurately control the pressure value between the adsorbing member 241 and the wafer, and prevent the wafer from shaking or falling off during transportation.

[0085] Please see Figure 4 In some embodiments, the adsorption assembly 24 further includes: a first mounting member 242 disposed at the second end of the rotating arm 221; a second mounting member 243 movably connected to the first mounting member 242 in a vertical direction, with the adsorption member 241 disposed on the side of the second mounting member 243 away from the first mounting member 242; and a buffer member 244 connected between the first mounting member 242 and the second mounting member 243, which can apply a buffering force to the second mounting member 243 when the second mounting member 243 moves towards the first mounting member 242 in a vertical direction.

[0086] Specifically, the first mounting member 242, serving as the fixed part of the adsorption assembly 24, is disposed at the second end of the rotating arm 221, ensuring that the entire adsorption assembly 24 can move with the rotation of the rotating arm 221, providing a reliable support platform for the wafer. The second mounting member 243, serving as the movable part of the adsorption assembly 24, is connected to the first mounting member 242 in the vertical direction.

[0087] The buffer 244 is connected between the first mounting member 242 and the second mounting member 243. When loading and unloading wafers, the transfer assembly 2 drives the adsorption assembly 24 to move vertically downward, so that the second mounting member 243 carries the adsorption member 241 to contact the wafer. The buffer 244 can absorb the pressure of the first mounting member 242 on the second mounting member 243, thereby preventing the adsorption member 241 from exerting excessive pressure on the wafer and causing damage to the wafer.

[0088] Alternatively, during wafer unloading, the transfer component 2 moves the adsorption component 24 above the calibration platform and vertically downwards. The adsorption component carrying the wafer, carried by the second mounting component 243, contacts the calibration platform. The buffer component 244 absorbs the pressure of the calibration platform on the wafer, thereby preventing excessive pressure from the calibration platform and damage to the wafer. Optionally, the buffer component 244 can be a spring, a slab, or rubber, etc., and this application embodiment does not limit this.

[0089] Please see Figure 2 In some embodiments, the wafer de-adhesion device 100 further includes: a control unit, which is electrically connected to the first drive assembly 41 and the second drive assembly 42 respectively, to control the adsorption assembly 24 and the de-adhesion assembly 3 to move synchronously; and an angle detection element 5, which is disposed on the sliding module 21, and can detect the rotation angle of the rotating arm 221. The angle detection element 5 is electrically connected to the control unit, and the control unit can control the rotation angle of the rotating arm 221.

[0090] The angle detection member 5 can capture the rotation angle of the rotating arm 221 in real time and convert it into an electrical signal for transmission and processing. In the wafer debonding device 100, the angle detection member 5 communicates with the control unit through electrical connection. When the rotating arm 221 rotates, the angle detection member 5 captures the change and converts it into a corresponding electrical signal to send to the control unit. After receiving these signals, the control unit analyzes and processes them to control the rotation angle of the rotating arm 221.

[0091] Please refer to Figure 1 In some embodiments, the debonding assembly 3 comprises a box body 31, the surface of the box body 31 is provided with a light transmission port 31a; an LED light plate 32 is arranged inside the box body 31, and the LED light plate 32 can generate debonding light and make the debonding light irradiate the wafer through the light transmission port 31a.

[0092] The box body 31 serves as the main structure of the entire debonding assembly 3, not only providing stable support for the LED light plate 32 and the LED light plate 32 driving assembly, but also allowing the light generated by the LED light plate 32 to irradiate the wafer through the light transmission port 31a provided on the surface of the box body 31. The design of the light transmission port 31a fully considers the transmission efficiency of the debonding light, and uses a material with light transmission performance to ensure that the debonding light can penetrate the light transmission port 31a and irradiate the wafer.

[0093] The LED light plate 32 is the core component of the debonding assembly 3 and is responsible for generating debonding light. The LED light plate 32 is arranged inside the box body 31 to ensure that the light can be transmitted through the light transmission port 31a to the maximum extent. It can be understood that the LED light plate 32 is usually composed of multiple high-brightness and low-energy-consumption LED lamp beads, which can emit uniform and stable light to provide debonding light for wafer debonding.

[0094] In some embodiments, the area of the light emitting surface of the LED light plate 32 is not less than the area of the wafer, which can directly irradiate the entire surface of the wafer.

[0095] In some embodiments, the debonding assembly 3 further comprises an LED light plate 32 driving assembly, which is located inside the box body 31 and connected to the LED light plate 32, and the LED light plate 32 driving assembly can drive the LED light plate 32 to move or rotate; and / or, the rotating module 22 further comprises a second rotating shaft, which is rotatably connected between the rotating arm 221 and the adsorption assembly 24, and the adsorption assembly 24 can rotate along the axis of the second rotating shaft. It can be understood that the area of the light emitting surface of the LED light plate 32 can be set to be smaller than the area of the wafer, and through the relative movement between the LED light plate 32 and the adsorption assembly 24, the debonding light emitted by the LED light plate 32 can scan and irradiate the entire surface of the wafer.

[0096] The LED light plate 32 driving assembly is responsible for controlling the movement of the LED light plate 32 to achieve more flexible and uniform lighting effects. The LED light plate 32 driving assembly is located inside the box 31 and is connected to the LED light plate 32. Through the control of the LED light plate 32 driving assembly, the LED light plate 32 can move or rotate in the horizontal direction, thereby adjusting the illumination angle and range of the light, improving the flexibility and adaptability of the debonding.

[0097] In addition, the debonding assembly 3 can be provided with a third drag chain 33, one end of the third drag chain 33 being connected to the LED light plate 32 driving assembly, and the other end of the third drag chain 33 being connected to the support 1. The third drag chain 33 can protect and support the cables, air pipes and other pipelines connected between the LED light plate 32 driving assembly and the support 1, preventing them from being abraded, pulled or damaged when the LED light plate 32 driving assembly moves.

[0098] Please refer to Figure 2 In some embodiments, the wafer debonding device 100 further comprises an energy detection sensor 6 arranged at the light transmission port 31a, which is used to detect the energy of the debonding light generated by the LED light plate 32.

[0099] The energy detection sensor 6 is arranged at the light transmission port 31a, so that the sensor can directly contact the debonding light emitted by the LED light plate 32. The energy detection sensor 6 can measure the energy intensity of the debonding light.

[0100] Specifically, when the LED light plate 32 starts to work, it will generate debonding light of a certain intensity and wavelength, which will irradiate onto the wafer through the light transmission port 31a. At the same time, the energy detection sensor 6 will also capture these lights and perform energy detection on them. The energy detection sensor 6 will convert the detected energy value into an electrical signal and transmit it to the control unit through the circuit.

[0101] Further, after receiving the signal sent by the energy detection sensor 6, the control unit will analyze and process it to determine whether the energy of the current debonding light meets the requirements of wafer processing. If the energy is too low, the control unit may issue an instruction to adjust the power or brightness of the LED light plate 32 to ensure that the energy of the debonding light meets the requirements. Further, the debonding light emitted by the LED light plate 32 is UV light.

[0102] Please refer to Figure 5 , Figure 5A structural schematic diagram of the calibration platform 201 provided by the embodiment of the present application is shown. The second aspect of the embodiment of the present application discloses a film tearing device, which comprises a film tearing device, the film tearing device comprising the calibration platform 201; and a wafer debonding device 100, the wafer debonding device 100 being capable of transporting the wafer to the calibration platform 201. Since the film tearing device provided by the embodiment of the present application comprises the wafer debonding device 100 provided by the first aspect of the present application, the film tearing device has the beneficial effects of any of the wafer debonding devices 100 described above, which will not be repeated here.

[0103] It can be understood that after the wafer debonding device 100 completes debonding during transportation, the wafer debonding device 100 is capable of transporting the wafer to the calibration platform 201 of the film tearing device, so that the wafer can complete the subsequent film tearing process on the film tearing device.

[0104] The third aspect of the embodiment of the present application discloses a thinning and film tearing integrated system, which comprises a thinning device, the thinning device comprising a thinning platform; a film tearing device, the calibration platform 201 and the thinning platform being arranged at intervals along a first direction X, and the wafer debonding device 100 being capable of transporting the wafer from the thinning platform to the calibration platform 201.

[0105] Since the thinning and film tearing integrated system provided by the embodiment of the present application comprises the wafer debonding device 100 provided by the first aspect of the present application, the thinning and film tearing integrated system has the beneficial effects of any of the wafer debonding devices 100 described above, which will not be repeated here.

[0106] Specifically, the wafer first completes the thinning process on the thinning device, then the wafer debonding device 100 is capable of adsorbing the wafer on the thinning platform to the adsorption assembly 24 of the wafer debonding device 100, and finally transports the wafer to the calibration platform 201 of the film tearing device and completes debonding during transportation.

[0107] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer de-resining device, characterized in that, The application relates to a wafer debonding device. The device comprises a support, a transmission assembly slidably connected to the support along a first direction, an adsorption assembly arranged on the transmission assembly, the adsorption assembly being used for adsorbing a wafer with a protective film attached to a surface of the wafer, a first driving assembly connected to the transmission assembly, the first driving assembly being capable of moving the transmission assembly along the first direction, a debonding assembly slidably connected to the support along the first direction, a second driving assembly connected to the debonding assembly, the second driving assembly being capable of moving the debonding assembly along the first direction synchronously with the adsorption assembly, and the debonding assembly being used for irradiating a surface of the wafer with the protective film attached thereto with debonding light when the debonding assembly moves synchronously with the adsorption assembly. The transmission assembly comprises a sliding module arranged on the support, the sliding module being capable of moving the adsorption assembly along a vertical direction, and a rotating module comprising a first rotating shaft arranged on the sliding module and a rotating arm, a first end of the rotating arm being connected to the first rotating shaft, the rotating arm being capable of rotating around an axis of the first rotating shaft, and a second end of the rotating arm being connected to the adsorption assembly. The adsorption assembly comprises an adsorption member used for being connected to a negative pressure generating member so that the adsorption member is capable of adsorbing the wafer. The adsorption assembly further comprises a first mounting member arranged on the second end of the rotating arm, a second mounting member movably connected to the first mounting member along the vertical direction, the adsorption member being arranged on a side of the second mounting member away from the first mounting member, and a buffer member connected between the first mounting member and the second mounting member, the buffer member being capable of applying a buffer force to the second mounting member when the second mounting member moves towards the first mounting member along the vertical direction. The wafer debonding device further comprises a control unit electrically connected to the first driving assembly and the second driving assembly respectively so as to control synchronous movement of the adsorption assembly and the debonding assembly, and an angle detecting member arranged on the sliding module, the angle detecting member being capable of detecting a rotating angle of the rotating arm, the angle detecting member being electrically connected to the control unit, and the control unit being capable of controlling the rotating angle of the rotating arm. The debonding assembly comprises a box body, a light-transmitting opening being arranged on a surface of the box body, and an LED lamp plate arranged in an interior of the box body, the LED lamp plate being capable of generating debonding light and irradiating the wafer with the debonding light through the light-transmitting opening.

2. The wafer debonding apparatus of claim 1, wherein 7. The wafer debonding device according to claim 6, wherein the debonding assembly further comprises a lamp plate driving assembly located in the interior of the box body and connected to the LED lamp plate, the lamp plate driving assembly being capable of moving or rotating the LED lamp plate, and / or ​ ​ 3. The wafer debonding apparatus of claim 2, wherein ​ ​ 4. The wafer debonding apparatus of claim 3, wherein ​ ​ ​ ​ 5. The wafer debonding apparatus of claim 2, wherein ​ ​ ​ 6. The wafer debonding apparatus of claim 2, wherein ​ ​ ​ ​ ​ The rotating module further comprises a second rotating shaft for driving the adsorption assembly to rotate along an axis of the second rotating shaft.

8. The wafer debonding apparatus of claim 6, wherein The wafer debonding device further comprises: An energy detection sensor disposed at the light transmission port, the energy detection sensor being configured to detect energy of the debonding light generated by the LED light board.

9. A film tearing apparatus characterized by, Comprising: A calibration platform; The wafer debonding device of any one of claims 1-8, the wafer debonding device being configured to transport the wafer to the calibration platform.

10. A thinning and tear-off integrated system, characterized by, Comprising: A thinning device; The film tearing device of claim 9, the wafer debonding device being configured to receive the wafer from the thinning device and transport the wafer to the calibration platform.

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