Lifting type wafer detection assembly

By designing a lifting wafer inspection assembly that integrates lifting drive and cover gripping mechanism, automated cover opening and inspection of wafer boxes is achieved, solving the quality risks caused by manual operation in the wafer processing process and improving the degree of automation and transportation safety.

CN223693087UActive Publication Date: 2025-12-19ZHEJIANG HANS FUCHENGDE TECH CO LTD
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Patent Information

Application Number
CN202422826373.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-12-19
Estimated Expiration
2034-11-20

AI Technical Summary

Technical Problem

In existing technologies, the frequent manual operations and turnover steps during wafer processing lead to unavoidable quality risks, especially in the opening and closing of wafer cassettes, where there is a lack of automated solutions.

Method used

A lifting wafer inspection assembly was designed, which combines a lifting drive and a cover gripping mechanism, and integrates a wafer box status sensor and a protrusion sensor to achieve automated cover opening and inspection. The wafer box status is detected and the wafer is scanned during the lifting process, reducing manual operation.

Benefits of technology

This has increased the level of automation in the wafer processing, reduced quality risks caused by manual operation, and prevented problems such as bending, shifting, and protrusion of wafers during transportation, thus ensuring the safety and quality of wafers.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductors, in particular to a lifting type wafer detection assembly, which comprises a seat edge part for guiding a wafer box, an air bellow side plate for bearing the seat edge part and a lifting back plate for driving the air bellow side plate and the seat edge part, and the lifting back plate is connected with a lifting drive; a wafer box state sensor and a wafer protrusion sensor are further arranged on the inner wall of the air bellow side plate, and a cover grabbing mechanism is arranged in the base edge part; the cover grabbing structure locks and grabs a wafer box cover, the lifting drive drives the lifting back plate to move and further drives the air bellow side plate and the base edge part to lift together, and the wafer box state sensor and the wafer protrusion sensor carry out state detection on a wafer. According to the utility model, the whole structure is simple, the uncovering action and detection are integrated, the equipment volume is reduced, various working state scenes are integrated, the wafer detection requirements in the processes of wafer storage, wafer taking, uncovering and cover closing are compatible, the risk of wafers in the manufacturing and transportation processes is reduced, and the subsequent larger manufacturing quality problem caused by bending and protruding of the wafers is avoided.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, concretely is a lifting type wafer detection piece subassembly. BACKGROUND

[0002] In the manufacturing process of semiconductor, wafer conveying is crucial to IC manufacturing. In order to ensure the quality of wafer conveying between different processes, and avoid the wafer from being contaminated by dust particles or other contaminants, more and more conveying work adopts standard conveying containers, i.e. wafer boxes, for temporary storage.

[0003] In the processing process of wafer, it is necessary to transfer and load between multiple devices and apparatuses. The conventional operation mode is to manually carry and open and close the wafer box to adapt to each step in the processing project. However, frequent manual operation and turnover steps increase human errors, causing quality risks.

[0004] The existing AGV trolley can solve the carrying demand of wafer box. Its programmable and remotely controllable characteristics can adapt to the carrying and transferring demand in various application scenarios, and improve the efficiency of turnover carrying. However, the opening and closing actions of wafer box are still mainly operated manually. Therefore, a customized opening platform or device suitable for automatic AGV trolley is urgently needed to reduce manual operation and improve the overall automation coverage of wafer processing. The opening platform or device is usually large in size, and can integrate and integrate some related actions in the opening action. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a wafer detection piece subassembly which integrates lifting type opening and closing and detection actions, has a simple structure and low modification cost.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme.

[0007] A lifting type wafer detection piece subassembly includes a seat edge part for guiding a wafer box, a wind box side plate for bearing the seat edge part, and a lifting back plate for driving the wind box side plate and the seat edge part. The lifting back plate is connected to a lifting drive. The inner wall of the wind box side plate is further provided with a wafer box state sensor and a wafer protrusion sensor. The seat edge part is internally provided with a cover grabbing mechanism.

[0008] When opening the cover and detecting the wafer, the cover grabbing structure locks and grabs the cover of the wafer box. The lifting drive drives the lifting back plate to move, and then drives the wind box side plate and the seat edge part to lift together. In the lifting process, the wafer box state sensor and the wafer protrusion sensor detect the state of the wafer.

[0009] Further, the seat edge part includes a seat edge frame guiding the wafer box cover and a seat edge bottom plate for bearing the seat edge frame; the seat edge frame is a split structure, and the seat edge bottom plate is a hollow rectangular frame, and the seat edge frame is symmetrically installed on the upper end faces of two opposite edges of the seat edge bottom plate;

[0010] Further, the seat edge frame is internally provided with a cavity, and the seat edge bottom plate forms a mounting cavity, and a cover locking tongue is installed in the mounting cavity.

[0011] Further, each seat edge frame is internally provided with a cover locking tongue, a locking tongue drive driving the cover locking tongue to rotate, and a locking tongue sensor detecting whether the cover locking tongue is in place.

[0012] Further, the moving end of the locking tongue drive is connected with a locking tongue pull rod, the end of the locking tongue pull rod is provided with a locking tongue connecting rod and a locking tongue sensing sheet, one end of the locking tongue connecting rod is fixedly connected with the locking tongue pull rod, and the other end is rotatably connected with the cover locking tongue; when the cover locking tongue reaches a specified position, the locking tongue sensing sheet enters the sensing area of the locking tongue sensor.

[0013] Further, a position-avoiding line groove is formed on the inner end face of the wind box side plate, a plurality of equidistant mounting hole positions are formed in the position-avoiding line groove, and the mounting hole positions are used for assembling and fixing at least one group of first supports and second supports.

[0014] Further, the first supports and the second supports are used for assembling and fixing wafer box state sensors and wafer protrusion sensors.

[0015] Further, a code scanning device is arranged on the seat edge frame.

[0016] Further, a group of mapping sensors are arranged below the seat edge bottom plate.

[0017] Compared with the prior art, the utility model has the beneficial effects as follows:

[0018] In actual use, the utility model specifically works as follows: the external overhead crane carries the wafer box and the internal wafers to the upper portion of the seat edge part, the seat edge part guides and places the auxiliary wafer box to be positioned, the cover locking tongue is locked by the cover locking mechanism when the cover is opened and the wafer is detected, the external lifting drive uniformly drives the lifting back plate to ascend and descend, the wafer box cover is of a transparent material, the wafer box state sensor and the wafer protrusion sensor also simultaneously scan and detect the wafer box and the wafers in the wafer box in the lifting process, the state information of the wafer box and the wafers is acquired as required, and the bending, deviation and protrusion of the wafers in the wafer box in the wafer placing and transporting process are avoided.

[0019] The whole structure of the lifting type wafer detection assembly is simple, the cover opening action and detection are integrated, the equipment volume is reduced, various working state scenes are integrated, the wafer detection requirements in the wafer storage, wafer taking, cover opening and cover closing processes are considered, the wafer risks in the manufacturing and transportation processes are reduced, and the subsequent larger manufacturing quality problems caused by the bending and protrusion of the wafer are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 It is a whole oblique view schematic diagram of the utility model;

[0021] Fig. 2 It is a part hidden oblique view schematic diagram of the utility model;

[0022] Fig. 3 It is a state schematic diagram of the utility model after installation; DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0024] Reference Figs. 1-3 As shown in the figure, a lifting type wafer detection assembly comprises a seat edge part 41 for guiding a wafer box, a wind box side plate 42 for bearing the seat edge part 41 and a lifting back plate 43 for driving the wind box side plate 42 and the seat edge part 41, the lifting back plate 43 is connected with a lifting drive; the inner wall of the wind box side plate 42 is further provided with a wafer box state sensor 47 and a wafer protrusion sensor 48, the inside of the seat edge part 41 is provided with a cover grabbing mechanism 44;

[0025] When the wafer is detected, the cover grabbing mechanism 44 locks and grabs the wafer box cover, the lifting drive drives the lifting back plate 43 to move, and then drives the wind box side plate 42 and the seat edge part 41 to move up and down together, in the lifting process, the wafer box state sensor 47 and the wafer protrusion sensor 48 detect the state of the wafer.

[0026] The wafer box state sensor 47 is any one of photoelectric, magnetic induction or mechanical type in-situ sensing sensor, when the wafer box is placed in the specified position, the signal emitted by the sensor will be changed, such as shielding light, changing the magnetic field distribution, etc., the sensor receives the changed signal and processes it to judge whether the wafer box is in place; the wafer protrusion sensor 48 includes but is not limited to a laser displacement sensor, a spectral confocal sensor, a photoelectric sensor, etc., which is used for detecting unreasonable deviation and front convexity of the wafer after being placed in the wafer box and during the placing process, so as to avoid damaging the wafer.

[0027] In actual use, the external overhead crane carries the wafer box and the internal wafer as a whole to above the seat edge part 41, the seat edge part 41 guides and places the auxiliary wafer box positioning, and when opening the cover to detect the wafer, the cover of the wafer box is locked by the cover grabbing mechanism 44, the external lifting drive drives the lifting back plate 43 at a uniform speed, in the lifting process, the cover of the wafer box is grabbed by the cover grabbing mechanism 44, and the bellow side plate 42 also rises and falls together, the cover of the wafer box is of transparent material, the wafer box state sensor 47 and the wafer protrusion sensor 48 also simultaneously scan and detect the wafer box and the wafer in the wafer box reciprocatingly in the lifting process; the state information of the wafer box and the wafer is obtained as needed, so as to avoid the bending, deviation and protrusion of the wafer in the wafer detection process.

[0028] The wafer box reading and locking assembly has a simplified overall structure, integrates the cover opening action and detection, reduces the equipment volume, integrates various working state scenes, takes into account the wafer detection needs in the wafer storage, wafer taking, cover opening and cover closing processes, reduces the risk of the wafer in the manufacturing and transportation process, and avoids the subsequent larger manufacturing quality problems caused by the bending and protrusion of the wafer.

[0029] In the embodiment, the seat edge part 41 includes a seat edge frame 411 guiding the cover of the wafer box and a seat edge bottom plate 412 bearing the seat edge frame 411; the seat edge frame 411 is a split structure, the seat edge bottom plate 412 is a hollow rectangular frame, and the seat edge frame 411 is symmetrically installed on the upper end faces of two opposite edges of the seat edge bottom plate 412; the split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring.

[0030] In the embodiment, the seat edge frame 411 is internally provided with a cavity, forms a mounting cavity with the seat edge bottom plate 412, and the cover grabbing mechanism 44 is mounted in the mounting cavity; each seat edge frame 411 is provided with the cover grabbing mechanism 44, the cover grabbing mechanism 44 includes a cover lock tongue 446 rotatably installed on the seat edge bottom plate 412, a lock tongue drive 441 driving the cover lock tongue 446 to rotate, and a lock tongue inductor 442 detecting whether the cover lock tongue 446 is in place; a movement end of the lock tongue drive 441 is connected with a lock tongue pull rod 443, an end of the lock tongue pull rod 443 is provided with a lock tongue connecting rod 444 and a lock tongue inductive sheet 445; one end of the lock tongue connecting rod 444 is fixedly connected with the lock tongue pull rod 443, and the other end is rotatably connected with the cover lock tongue 446; when the cover lock tongue 446 reaches a specified position, the lock tongue inductive sheet 445 enters the sensing area of the lock tongue inductor 442.

[0031] The lock tongue drive 441 is a pneumatic cylinder or an electric cylinder, the lock tongue sensor 442 is a photoelectric sensor, when the lock tongue drive 441 pulls the lock tongue pull rod 443, the lock tongue pull rod 443 drives the lock tongue connecting rod 444 to pull and rotate the cover lock tongue 446, so that the cover lock tongue 446 is turned out to grasp and lock the wafer box cover, at the same time, the lock tongue pull rod 443 drives the lock tongue sensing sheet 445 to move, and the lock tongue sensing sheet 445 further triggers the lock tongue sensor 442; the lock tongue sensor 442 is arranged, the opening and closing cover state of the wafer cover body can be obtained, and the precision and accuracy of subsequent automatic action integration are ensured.

[0032] In the embodiment, a position-avoiding groove 421 is formed on the inner end face of the bellow side plate 42, a plurality of equidistant mounting holes 422 are formed in the position-avoiding groove 421, and the mounting holes 422 are used for assembling and fixing at least one group of first supports 471 and second supports 481; the position-avoiding groove 421 can reasonably and effectively store wires, and improves the efficiency of installation, wiring and later maintenance and repair.

[0033] In the embodiment, the first supports 471 and the second supports 481 are used for assembling and fixing the wafer box state sensor 47 and the wafer protrusion sensor 48.

[0034] In the embodiment, the seat edge frame 411 is provided with a code scanning device 45; the code scanning device 45 can scan the identification code on the wafer box cover body to obtain the number and identification information of the wafer box.

[0035] In the embodiment, a group of mapping sensors 46 are arranged below the seat edge bottom plate 412; the mapping sensors 46 are optical reflection type sensors, which can detect the wafer surface when performing lifting scanning detection, determine whether there are defects, scratches, pollution and other problems, and ensure that the quality of the wafer meets the production requirements.

[0036] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or replace them with similar ways, without deviating from the scope defined by the spirit of the present application.

Claims

1. A lift-off wafer inspection assembly, comprising: The seat edge part (41) for guiding the wafer box, the bellow side plate (42) for bearing the seat edge part (41), and the lifting back plate (43) for driving the bellow side plate (42) and the seat edge part (41) are provided, and the lifting back plate (43) is connected with the lifting drive; the inner wall of the bellow side plate (42) is further provided with the wafer box state sensor (47) and the wafer protrusion sensor (48), and the inside of the seat edge part (41) is provided with the cover grabbing mechanism (44). When the cover is opened and the wafer is detected, the cover grabbing mechanism (44) locks and grabs the wafer box cover, the lifting drive drives the lifting back plate (43) to move, and then drives the bellow side plate (42) and the seat edge part (41) to move together, and in the process of moving, the wafer box state sensor (47) and the wafer protrusion sensor (48) detect the state of the wafer.

2. The lift-off wafer inspection assembly of claim 1, wherein, The seat edge part (41) includes the seat edge frame (411) for guiding the wafer box cover and the seat edge bottom plate (412) for bearing the seat edge frame (411); the seat edge frame (411) is a split structure, and the seat edge bottom plate (412) is a hollow rectangular frame, and the seat edge frame (411) is symmetrically installed on the upper end faces of two opposite edges of the seat edge bottom plate (412).

3. The lift-off wafer inspection assembly of claim 2, wherein, The seat edge frame (411) is internally provided with a cavity, and forms an installation cavity with the seat edge bottom plate (412), and the cover grabbing mechanism (44) is installed in the installation cavity.

4. The lift-off wafer inspection assembly of claim 3, wherein, The cover grabbing mechanism (44) is installed in each seat edge frame (411), and the cover grabbing mechanism (44) includes the cover lock tongue (446) rotatably installed on the seat edge bottom plate (412), the lock tongue drive (441) for driving the cover lock tongue (446) to rotate, and the lock tongue inductor (442) for detecting whether the cover lock tongue (446) is in place.

5. The lift-off wafer inspection assembly of claim 4, wherein, The movement end of the lock tongue drive (441) is connected with the lock tongue pull rod (443), the end of the lock tongue pull rod (443) is installed with the lock tongue connecting rod (444) and the lock tongue inductive sheet (445); one end of the lock tongue connecting rod (444) is fixedly connected with the lock tongue pull rod (443), and the other end is rotatably connected with the cover lock tongue (446); when the cover lock tongue (446) reaches the specified position, the lock tongue inductive sheet (445) enters the sensing area of the lock tongue inductor (442).

6. The lift-off wafer inspection assembly of claim 1, wherein, The position-avoiding line groove (421) is formed on the inner end face of the bellow side plate (42), a plurality of equidistant installation hole positions (422) are formed in the position-avoiding line groove (421), and the installation hole positions (422) are used for assembling and fixing at least one group of first supports (471) and second supports (481).

7. The lift-off wafer inspection assembly of claim 6, wherein, The first supports (471) and the second supports (481) are used for assembling and fixing the wafer box state sensor (47) and the wafer protrusion sensor (48).

8. The lift-off wafer inspection assembly of claim 2, wherein, The seat edge frame (411) is provided with the code scanning device (45).

9. The lift-off wafer inspection assembly of claim 2, wherein, A group of mapping sensors (46) are arranged below the seat edge bottom plate (412).