Wafer loading and detecting integrated device

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer loading and detecting integrated device, which comprises a bottom frame and a back plate, and is characterized in that a mounting cavity is arranged in the bottom frame, and a box reading platform deck for bearing and identifying a wafer box and a detecting frame mechanism for detecting the wafer box and a wafer are arranged in the mounting cavity; the detection frame mechanism is arranged on the periphery of the box reading carrying table in a covering mode, and the detection frame mechanism is driven by the lifting assembly to ascend and descend on the front end face of the back plate. According to the utility model, the whole structure is simple, and the bearing function of the wafer box and the quality control function of the wafer carrying result after the cover of the wafer box is opened are integrated; the equipment size is integrally reduced, the wafer detection requirements in the wafer storage, wafer taking, cover opening and cover closing processes are considered, multiple detection operation procedures in the wafer manufacturing and machining processes are reduced, and subsequent larger manufacturing quality problems caused by pollution, bending and storage protrusion of the wafer are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, concretely is a wafer loading and detection integrated device. BACKGROUND

[0002] In the manufacturing process of semiconductor, wafer transportation is crucial to IC manufacturing. In order to ensure the quality of wafer transportation between different processes, and to avoid wafer from being contaminated by dust particles or other contaminants, more and more transportation work adopts standard transportation container, i.e. wafer box, for temporary storage.

[0003] In the processing process of wafer, it is necessary to transfer and load between multiple devices and apparatuses. The conventional operation mode is to manually carry and open and close the wafer box to adapt to each step in the processing project. However, frequent manual operation and turnover steps increase human errors, causing quality risks.

[0004] The existing AGV trolley can solve the carrying demand of wafer box. Its programmable and remotely controllable characteristics can adapt to the carrying and transfer demand in various application scenarios, and improve the efficiency of turnover carrying. However, the opening and closing actions of wafer box are still mainly operated manually. Therefore, a customized opening platform or device suitable for automatic AGV trolley is urgently needed to reduce manual operation and improve the overall automation coverage of wafer processing. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a wafer loading and detection integrated device which is simple in structure, reasonable in design, and rich in function integration.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme.

[0007] A wafer loading and detection integrated device comprises a chassis and a back plate. The chassis is internally provided with a mounting cavity. A box reading stage for carrying and identifying wafer boxes and a detection frame mechanism for detecting wafer boxes and wafers are arranged in the mounting cavity. The detection frame mechanism is covered around the box reading stage and is driven by a lifting assembly to perform lifting action on the front end surface of the back plate. The detection frame mechanism comprises a seat edge part for guiding wafer boxes, a bellows side plate for carrying the seat edge part, and a lifting back plate for driving the bellows side plate and the seat edge part to move. The lifting back plate is connected to the lifting assembly. The inner wall of the bellows side plate is provided with a wafer box state sensor and a wafer protrusion sensor. The inside of the seat edge part is provided with a cover grabbing mechanism.

[0008] During loading and detection, the box reading stage carries and fixes the wafer box. The lifting back plate is lifted by the lifting assembly, and the cover grabbing mechanism is driven to open the wafer box for grabbing. The wafer box state sensor and the wafer protrusion sensor realize detection work.

[0009] Further, the inner wall of the chassis is provided with a reinforcing side plate and an auxiliary column;

[0010] Further, the reading box carrier includes a carrier plate body provided with at least one sensing part for reading the bottom label of a wafer box and an adjusting part for fine-tuning the height of the carrier plate body; each sensing part is provided below with at least one group of antenna mounting slots for mounting a reading antenna for reading the electronic label of the wafer box.

[0011] Further, the lower end surface of the carrier plate body is provided with a locking mechanism for opening and closing the wafer box; the locking mechanism drives a locking rod to unlock and lock the cover of the wafer box; the locking mechanism includes a locking base for mounting the locking rod, a locking drive for driving the locking base, and a locking sensor for detecting the movement of the locking base to the position.

[0012] Further, the lifting assembly includes a lifting drive, a transmission wheel set driven by the lifting drive, and a transmission screw rod connected with the transmission wheel set; the lifting drive and the transmission wheel set are mounted in a mounting cavity built in the chassis, a lifting back plate is fixedly connected with a lifting block mounted on the transmission screw rod; the lifting back plate and the back plate are slidably connected through lifting slide rails;

[0013] Further, the seat rim part includes a seat rim frame for guiding the cover of the wafer box and a seat rim bottom plate for bearing the seat rim frame; the seat rim frame is of a split structure, the seat rim bottom plate is a hollow rectangular frame, and the seat rim frame is symmetrically mounted on the upper end surfaces of two opposite sides of the seat rim bottom plate; a group of mapping sensors is arranged below the seat rim bottom plate;

[0014] Further, the seat rim frame is provided with a built-in cavity, and a mounting cavity is formed between the seat rim frame and the seat rim bottom plate; a cover locking tongue driving mechanism is mounted in the mounting cavity; the cover locking tongue driving mechanism includes a cover locking tongue rotatably mounted on the seat rim bottom plate, a locking tongue drive for driving the cover locking tongue to rotate, and a locking tongue sensor for detecting whether the cover locking tongue is in place;

[0015] Further, the movement end of the locking tongue drive is connected with a locking tongue pull rod, the distal end of the locking tongue pull rod is provided with a locking tongue connecting rod and a locking tongue sensing sheet; one end of the locking tongue connecting rod is fixedly connected with the locking tongue pull rod, and the other end is rotatably connected with the cover locking tongue; when the cover locking tongue reaches a specified position, the locking tongue sensing sheet enters the sensing area of the locking tongue sensor;

[0016] Further, an avoiding line groove is formed on the inner side end surface of the bellow side plate, a plurality of equidistant mounting hole positions are formed in the avoiding line groove, and the mounting hole positions are used for assembling at least one group of first supports and second supports.

[0017] Compared with the prior art, the utility model has the beneficial effects as follows.

[0018] In specific operation, the external overhead crane transports the wafer box and the internal wafer as a whole to the top of the detection frame mechanism. The detection frame guides the wafer box to be placed on the reading platform for identification and calibration. After confirming that there are no errors, the wafer box is unlocked. After unlocking, the lifting component drives the detection frame to lift and open the box cover. The detection frame detects the wafer box and the wafer during the lifting and opening and closing process.

[0019] This integrated wafer loading and inspection device features a streamlined overall structure, combining the wafer cassette's load-bearing function with the quality control function for wafer handling after the cassette is opened. It reduces the overall size of the equipment while accommodating the wafer inspection needs during the wafer storage, retrieval, opening, and closing processes. This reduces the number of inspection steps required during wafer manufacturing and processing, minimizing wafer contamination, bending, and storage protrusion that could lead to larger manufacturing quality problems later on. Attached Figure Description

[0020] Figure 1 This is an overall oblique view schematic diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of the base frame portion of this utility model after it has been concealed.

[0022] Figure 3 This is a schematic diagram of the lifting component of this utility model;

[0023] Figure 4 This is a schematic diagram of the concealed back panel of this utility model;

[0024] Figure 5 This is a schematic diagram of the reading box platform of this utility model;

[0025] Figure 6 This is a schematic diagram of the reading box carrier of this utility model from an oblique upward view;

[0026] Figure 7 This is a schematic diagram of the detection frame mechanism of this utility model;

[0027] Figure 8 This is a schematic diagram of the detection frame mechanism of this utility model after it has been partially concealed. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] refer to Figures 1-8As shown, a wafer loading and detection integrated device includes a chassis 1 and a back plate 2, the chassis 1 is internally provided with a mounting cavity, a read box loading table 3 for carrying and identifying a wafer box and a detection frame mechanism 4 for detecting the wafer box and wafer are arranged in the mounting cavity; the detection frame mechanism 4 is covered outside the read box loading table 3, and the detection frame mechanism 4 is driven by a lifting assembly 5 to perform lifting action on the front end surface of the back plate 2; the detection frame mechanism 4 includes a seat edge part 41 for guiding the wafer box, a bellows side plate 42 for carrying the seat edge part 41, and a lifting back plate 43 for driving the bellows side plate 42 and the seat edge part 41 to move, the lifting back plate 43 is connected with the lifting assembly 5; the inner wall of the bellows side plate 42 is provided with a wafer box state sensor 47 and a wafer protrusion sensor 48, and the inside of the seat edge part 41 is provided with a cover grabbing mechanism 44;

[0030] During loading and detection, the read box loading table 3 carries and fixes the wafer box, the lifting back plate 43 is driven by the lifting assembly 5 to lift, and the cover grabbing mechanism 44 is driven to realize the opening of the wafer box to grab, and the wafer box state sensor 47 and the wafer protrusion sensor 48 realize the detection work

[0031] The lifting assembly 5 drives the detection frame mechanism 4 to open the wafer box and perform the detection work.

[0032] The outside wall of the chassis 1 is provided with an industrial control host 6, the industrial control host 6 includes an E84Port, an SMIFPort and a Host interface, the E84Port has communication capability with an automated material handling system (AMHS) and a machine loading port (LP), the SMIFPort is mainly used for opening and closing operation of a SMIF POD (Standard Mechanical Interface Pod), and scanning of wafer distribution state is performed in the process; the Host has communication capability with a PC end, so as to facilitate equipment to upgrade and maintain subsequent programs, and further improve the expansion capability.

[0033] In actual use, the external overhead crane carries the wafer box and the internal wafer to the upper part of the detection frame mechanism 4, the detection frame 4 guides the wafer box to be placed on the read box loading table 3, the identification and correction of the wafer box are performed, the wafer box is unlocked after the error is determined, the detection frame 4 is driven by the lifting assembly 5 to lift and open the cover, and the wafer box and the wafer are detected during the lifting and opening of the cover and the closing of the cover;

[0034] The wafer loading and detection integrated device has a compact overall structure, integrates the wafer box bearing function and the quality control function of wafer box opening and wafer handling result after opening, reduces the equipment volume, meets the wafer detection requirements in wafer storage, wafer taking, wafer box opening and wafer box closing, reduces the wafer detection operation process in manufacturing and processing, and reduces wafer pollution, wafer bending and wafer storage protrusion to cause subsequent manufacturing quality problems.

[0035] In the embodiment, the inner wall of the base frame 1 is provided with a reinforcing side plate 11 and an auxiliary column 12; the reinforcing side plate 11 and the auxiliary column 12 added to the inner wall of the base frame 1 can effectively ensure the structural strength of the base frame 1, and avoid quality accidents caused by deformation of the base frame 1 during wafer box placement and subsequent processing operations.

[0036] In actual use, the loading platform plate body 31 is used to bear the wafer box transported by the overhead crane, the wafer box is pre-installed with an RFID electronic tag, the information of the wafer box is read by the sensing part 311, the batch and related model information of the wafer box are obtained and recorded, the horizontal inclination angle and height of the loading platform plate body 31 are adjusted by the adjusting part 312, the horizontal position of the loading platform plate body 31 is ensured to be flush with other components at the rear end, and the integrated locking mechanism 33 drives the locking rod 32 to perform unlocking and locking actions on the box cover of the wafer box, so as to prepare for subsequent operations at the front end.

[0037] The wafer box reading and locking assembly has a compact overall structure, integrates the reading function and the wafer box opening and locking function, reduces the equipment volume, controls the equipment and labor costs, ensures correct wafer box batch circulation during transportation and subsequent processing actions, and improves the overall efficiency and quality of wafer processing.

[0038] In the embodiment, at least one group of antenna installation grooves 313 is arranged below each sensing part 311, the antenna installation grooves 313 are used to install a reading antenna 34 for reading the electronic tag of the wafer box, a plurality of groups of antenna installation grooves 313 are arranged, the reading antenna 34 can be adjusted in position as needed to adapt to wafer boxes of different sizes and wafer boxes with different tag positions, the adaptation ability of the assembly to wafer boxes of various sizes is improved, one machine is used for multiple purposes, and costs are reasonably saved.

[0039] In the embodiment, the adjusting part 312 is an adjusting top screw installed in a countersunk groove, the loading platform plate body 31 is connected with a loading platform base frame 35 by the adjusting top screw, the loading platform base frame 35 is arc-shaped by splicing three plate bodies, the adjusting part 312 is arranged at four end angles of the end surface of the loading platform plate body 31, the horizontal plane of the loading platform plate body 31 can be adjusted in height and inclination angle as needed by rotating the adjusting top screws at different positions to adapt to other equipment at the front end or the rear end, and the overall processing flow is ensured to be at the same level.

[0040] In the embodiment, the locking mechanism 33 comprises a locking base 332 for mounting the locking rod 32, a locking drive 331 for driving the locking base 332 to rotate, and a locking sensor 333 for detecting that the locking base 332 rotates to a specified position; the locking drive 331 and the locking sensor 333 are both fixed on the lower end surface of the platform plate body 31, and the locking base 332 is rotatably mounted on the lower end surface of the platform plate body 31; the locking drive 331 can be a motor, which drives the locking base 332 to rotate by a predetermined angle through a belt, and the locking base 322 rotates to drive the locking rod 32 to rotate; the locking rod 32 is usually inserted into a corresponding operation hole or operation groove on the wafer box, and rotates to realize the locking and unlocking operations of the box cover of the wafer box.

[0041] In the embodiment, the bottom of the locking base 332 is provided with a locking tab 334, which is used to trigger the locking sensor 333; when the locking base 332 rotates, the locking tab 333 rotates with it, and when the locking tab 333 rotates, it passes through the locking sensor 333, thereby triggering the locking sensor 333 installed at different positions to realize the detection and judgment of different actions, so as to ensure that the locking and unlocking actions can be converted into control signals, and facilitate the integration of the assembly into the overall automatic equipment and system.

[0042] In the embodiment, the locking sensor 333 is a groove type photoelectric switch.

[0043] In the embodiment, the wafer box is identified and recorded by the wafer box reading platform 3, and after the identification is confirmed to be correct, the bottom of the wafer box is unlocked; after the unlocking, the lifting assembly 5 further drives the detection frame mechanism 4 to perform synchronous lifting detection.

[0044] In the embodiment, when the cover is opened and the wafer is detected, the cover locking and grabbing structure 44 locks and grabs the wafer box cover, the lifting assembly drives the lifting back plate 43 to move, and then drives the bellows side plate 42 and the seat edge part 41 to lift together; during the lifting process, the wafer box state sensor 47 and the wafer protrusion sensor 48 detect the state of the wafer.

[0045] In the embodiment, the seat edge part 41 comprises a seat edge frame 411 for guiding the wafer box cover and a seat edge bottom plate 412 for bearing the seat edge frame 411; the seat edge frame 411 is a split structure, and the seat edge bottom plate 412 is a hollow rectangular frame; the seat edge frame 411 is symmetrically mounted on the upper end surfaces of the two opposite edges of the seat edge bottom plate 412; the split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring.

[0046] In this embodiment, the wafer box state sensor 47 is any one of photoelectric, magnetic induction or mechanical in-place sensing sensor. When the wafer box is placed in the designated position, the sensor will change the signal emitted by the sensor, such as shielding light, changing the magnetic field distribution, etc. The sensor receives the changed signal and processes it to determine whether the wafer box is in place; the wafer protrusion sensor 48 includes but is not limited to laser displacement sensor, spectral confocal sensor, photoelectric sensor, etc., which is used to detect the unreasonable deviation and front convexity of the wafer after and during the wafer is placed in the wafer box, to avoid damage to the wafer.

[0047] In actual use, the seat edge part 41 guides and places the auxiliary wafer box on the table plate body 31. When the cover needs to be opened for inspection, the wafer box cover is locked by the cover grabbing mechanism 44. The external lifting assembly 5 drives the lifting back plate 43 to move up and down at a constant speed. In the lifting process, the wafer box cover is grabbed by the cover grabbing mechanism 44, and the bellow side plate 42 also rises and falls together. The wafer box cover is made of transparent material. The wafer box state sensor 47 and the wafer protrusion sensor 48 also simultaneously scan and detect the wafer box and the wafer in the wafer box during the lifting process. The state information of the wafer box and the wafer is obtained as needed to avoid bending, deviation and protrusion of the wafer during wafer placement and transportation.

[0048] In this embodiment, the lifting assembly 5 includes a lifting drive 51, a transmission wheel set 52 driven by the lifting drive 51, and a transmission screw rod 54 connected with the transmission wheel set 52. The lifting drive 51 and the transmission wheel set 52 are installed in the mounting cavity in the chassis 1. The lifting back plate 43 is connected with the lifting block 53 installed on the transmission screw rod 54. The lifting back plate 43 and the back plate 2 are connected by sliding through the lifting slide rail 55. The lifting slide rail 55 is designed as double rail and double drag chain, which is respectively arranged on the two sides of the back plate 2. The double drag chain and double rail design ensures that the lifting back plate 43 can stably move up and down, and ensures the stability and safety of the whole operation.

[0049] In this embodiment, the seat edge part 41 includes a seat edge frame 411 guiding the wafer box cover and a seat edge bottom plate 412 bearing the seat edge frame 411. The seat edge frame 411 is a split structure, and the seat edge bottom plate 412 is a hollow rectangular frame. The seat edge frame 411 is symmetrically installed on the upper end face of the two opposite edges of the seat edge bottom plate 412. A set of mapping sensors 46 is arranged below the seat edge bottom plate 412. The split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring. The mapping sensor 46 is an optical reflection type sensor, which can detect the wafer surface during lifting and scanning detection to determine whether there are defects, scratches, pollution and other problems, and ensure that the wafer quality meets the production requirements.

[0050] In this embodiment, the seat edge frame 411 is provided with a cavity, and a mounting cavity is formed with the seat edge bottom plate 412. The mounting cavity is provided with a cover grabbing mechanism 44. Each seat edge frame 411 is provided with a cover grabbing mechanism 44. The cover grabbing mechanism 44 includes a cover lock tongue 446 rotatably installed on the seat edge bottom plate 412, a lock tongue driving 441 driving the cover lock tongue 446 to rotate, and a lock tongue sensor 442 detecting whether the cover lock tongue 446 is in place. The moving end of the lock tongue driving 441 is connected with a lock tongue pull rod 443. The end of the lock tongue pull rod 443 is provided with a lock tongue connecting rod 444 and a lock tongue sensing sheet 445. One end of the lock tongue connecting rod 444 is fixedly connected with the lock tongue pull rod 443, and the other end is rotatably connected with the cover lock tongue 446. When the cover lock tongue 446 reaches a specified position, the lock tongue sensing sheet 445 enters the sensing area of the lock tongue sensor 442.

[0051] In this embodiment, the lock tongue driving 441 is a pneumatic cylinder or an electric cylinder, and the lock tongue sensor 442 is an optical sensor. When the lock tongue driving 441 pulls the lock tongue pull rod 443, the lock tongue connecting rod 444 pulls and rotates the cover lock tongue 446, so that the cover lock tongue 446 is rotated out to grab and lock the wafer box cover. At the same time, the lock tongue pull rod 443 drives the lock tongue sensing sheet 445 to move, and the lock tongue sensing sheet 445 further triggers the lock tongue sensor 442. The lock tongue sensor 442 can obtain the opening and closing state of the wafer cover, so as to ensure the accuracy of the subsequent automatic action integration.

[0052] In this embodiment, a position-avoiding groove 421 is formed on the inner side surface of the bellow side plate 42. A plurality of equidistant mounting holes 422 are formed in the position-avoiding groove 421. The mounting holes 422 are used to assemble and fix at least one group of first supports 471 and second supports 481. The position-avoiding groove 421 can reasonably and effectively store wires, and improve the efficiency of installation and wiring and later maintenance and repair.

[0053] In this embodiment, the first supports 471 and the second supports 481 are used to assemble and fix the wafer box state sensor 47 and the wafer protrusion sensor 48.

[0054] In this embodiment, the seat edge frame 411 is provided with a code scanning device 45. The code scanning device 45 can scan the identification code on the wafer box cover to obtain the number and identification information of the wafer box.

[0055] In this embodiment, a group of mapping sensors 46 are arranged below the seat edge bottom plate 412. The mapping sensors 46 are optical reflection sensors. When performing lifting scanning detection, the mapping sensors 46 can detect the wafer surface to determine whether there are defects, scratches, pollution and other problems, so as to ensure that the quality of the wafer meets the production requirements.

[0056] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the scope defined by the spirit of the present application.

Claims

1. A wafer loading and inspection integrated device comprising a base frame (1) and a back plate (2), characterized in that, The chassis (1) is internally provided with a mounting cavity, and a read box carrier (3) for carrying and identifying a wafer box and a detection frame mechanism (4) for detecting the wafer box and a wafer are arranged in the mounting cavity; the detection frame mechanism (4) is arranged on the periphery of the read box carrier (3), and is driven by a lifting assembly (5) to perform lifting operation on the front end surface of the back plate (2); the detection frame mechanism (4) comprises a seat edge portion (41) for guiding the wafer box, a bellow side plate (42) for carrying the seat edge portion (41), and a lifting back plate (43) for driving the bellow side plate (42) and the seat edge portion (41) to move, and the lifting back plate (43) is connected with the lifting assembly (5); a wafer box state sensor (47) and a wafer protrusion sensor (48) are arranged on the inner wall of the bellow side plate (42), and a cover grabbing mechanism (44) is arranged in the seat edge portion (41). During loading detection, the read box carrier (3) carries and fixes the wafer box, the lifting back plate (43) is lifted by the lifting assembly (5), the cover grabbing mechanism (44) is driven to open the wafer box to grab, and the wafer box state sensor (47) and the wafer protrusion sensor (48) are used for detection operation.

2. The wafer loading and inspection integrated device of claim 1, wherein The inner wall of the chassis (1) is provided with a reinforcing side plate (11) and an auxiliary stand (12).

3. The wafer loading and inspection integrated device of claim 1, wherein The read box carrier (3) comprises a carrier plate body (31), the carrier plate body (31) is provided with at least one sensing portion (311) for reading a label on the bottom of the wafer box and an adjusting member (312) for fine-tuning the height of the carrier plate body (31); at least one group of antenna mounting grooves (313) are arranged below each sensing portion (311), and the antenna mounting grooves (313) are used for mounting a reading antenna (34) for reading the electronic label of the wafer box.

4. The wafer loading and inspection integrated device of claim 3, wherein A locking mechanism (33) for opening and closing the wafer box is mounted on the lower end surface of the carrier plate body (31); the locking mechanism (33) drives a locking rod (32) to unlock and lock the cover of the wafer box; the locking mechanism (33) comprises a locking base (332) for mounting the locking rod (32), a locking drive (331) for driving the locking base (332), and a locking sensor (333) for detecting that the locking base (332) moves to a position.

5. The wafer loading and inspection integrated device of claim 1, wherein The lifting assembly (5) comprises a lifting drive (51), a transmission wheel set (52) driven by the lifting drive (51), and a transmission screw rod (54) connected with the transmission wheel set (52); the lifting drive (51) and the transmission wheel set (52) are both mounted in the mounting cavity internally provided in the chassis (1), the lifting back plate (43) is fixedly connected with a lifting block (53) mounted on the transmission screw rod (54); the lifting back plate (43) and the back plate (2) are slidably connected through a lifting slide rail (55).

6. The wafer loading and inspection integrated device of claim 1, wherein The seat rim part (41) includes a seat rim frame (411) guiding the wafer box cover and a seat rim bottom plate (412) for bearing the seat rim frame (411); the seat rim frame (411) is a split structure, the seat rim bottom plate (412) is a hollow rectangular frame, and the seat rim frame (411) is symmetrically installed on the upper end faces of two opposite edges of the seat rim bottom plate (412); a group of mapping sensors (46) are arranged below the seat rim bottom plate (412).

7. The wafer loading and inspection integrated device of claim 6, wherein, The seat rim frame (411) is internally provided with a cavity, and forms an installation cavity with the seat rim bottom plate (412); a cover locking mechanism (44) is installed in the installation cavity; the cover locking mechanism (44) includes a cover locking tongue (446) rotatably installed on the seat rim bottom plate (412), a locking tongue drive (441) driving the cover locking tongue (446) to rotate, and a locking tongue sensor (442) detecting whether the cover locking tongue (446) is in place.

8. The wafer loading and inspection integrated device of claim 7, wherein, The movement end of the locking tongue drive (441) is connected with a locking tongue pull rod (443), the end of the locking tongue pull rod (443) is provided with a locking tongue connecting rod (444) and a locking tongue sensing sheet (445); one end of the locking tongue connecting rod (444) is fixedly connected with the locking tongue pull rod (443), and the other end is rotatably connected with the cover locking tongue (446); when the cover locking tongue (446) reaches a specified position, the locking tongue sensing sheet (445) enters the sensing area of the locking tongue sensor (442).

9. The wafer loading and inspection integrated device of claim 1, wherein, A position-avoiding line groove (421) is formed on the inner end face of the wind box side plate (42), a plurality of equidistant mounting hole positions (422) are formed in the position-avoiding line groove (421), and the mounting hole positions (422) are used for assembling at least one group of first supports (471) and second supports (481).

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