Wafer bearing device and semiconductor processing equipment
By designing a combined structure of support rods and limiting components, and using point contact limiting and rotatable limiting components, the bonding problem caused by wafer warpage was solved, improving the yield of wafer processing and reducing the rework frequency.
Patent Information
- Application Number
- CN202423126562.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-12-17
AI Technical Summary
In thin-film etching processes, wafer warping causes the wafer to easily stick together when reacting with chemicals in the chemical tank, increasing defects and scrap rates.
A wafer carrier device was designed, which adopts a combination structure of support rod and limiting component. The limiting component has a protrusion for point contact limiting, and combined with a rotatable limiting component, it restricts the movement of the wafer.
It improves the wafer's positioning capability, reduces the probability of wafer bonding, lowers the rework frequency, and increases the processing yield.
Smart Images
Figure CN223693110U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, concretely relates to a wafer bearing device and semiconductor processing equipment. BACKGROUND
[0002] At present, in the wafer slot type etching process, the wafer box (Cassette) needs to be used, and the wafer (or wafer, for convenience of description, collectively referred to as wafer) is inserted into the insertion slot formed by the limiting part (Cassette pin) in the wafer box.
[0003] In the related art, the limiting part in the wafer box is constructed as a frustum structure to reduce the contact area of the limiting part and the wafer. However, due to the influence of wafer warpage, when the wafer reacts with chemicals in the chemical tank, especially when the wafer is full batch operation, the wafer bearing device (wafer box) has weak limiting ability to the wafer, and in the circulation process of the liquid medicine, the two adjacent wafers are easily adhered together, which causes the wafer to easily appear defects, increases the rework frequency and the wafer scrap rate.
[0004] In view of the above technical problems, the utility model provides a wafer bearing device and semiconductor processing equipment. UTILITY MODEL CONTENTS
[0005] A series of simplified concepts are introduced in the utility model contents part, which will be further described in detail in the specific embodiment part. The utility model contents part of the utility model does not mean to try to limit the key features and necessary technical features of the claimed technical solution, and does not mean to try to determine the protection scope of the claimed technical solution.
[0006] In view of the existing problems, according to an aspect of the present application, a wafer bearing device is provided, comprising: a main body, the main body has a containing space for containing wafers, a plurality of support rods, a plurality of the support rods are arranged on the side wall of the containing space and are arranged in the second direction, a plurality of limiting parts are arranged on each support rod in the first direction, and an insertion slot for inserting wafers is formed between adjacent limiting parts, wherein the limiting part has oppositely arranged first end and second end, the limiting part has at least one protruding part arranged between the first end and the second end, and the protruding part protrudes outward from the side wall of the limiting part; wherein the first direction and the second direction are perpendicular.
[0007] Exemplarily, the limiting member comprises a first part and a second part connected with the first part, a first end of the first part is connected with the support rod, a second end of the first part is connected with a first end of the second part, wherein the at least one protrusion comprises a first protrusion, the first protrusion is located at the second end of the first part.
[0008] Exemplarily, the number of the protrusions is two, the two protrusions comprise the first protrusion and a second protrusion, the second protrusion is located at a second end of the second part.
[0009] Exemplarily, the outer surface of the protrusion is arc surface.
[0010] Exemplarily, the width of the second protrusion along the first direction is smaller than the width of the first protrusion along the first direction.
[0011] Exemplarily, the number of the limiting members on each support rod is the same, the size of the slot formed between adjacent limiting members is the same.
[0012] Exemplarily, the top of the accommodating space is provided with an opening for passing the wafer, the device further comprises a limiting member, the limiting member is rotatably arranged at the top of the main body, the limiting member is configured to be switched between a first position and a second position, when the limiting member is located at the first position, the opening allows the wafer to enter and exit the accommodating space, when the limiting member is located at the second position, the limiting member restricts the wafer to enter and exit the accommodating space, wherein the limiting member is provided with a plurality of limiting teeth arranged at intervals along a first direction, a limiting slot for inserting and placing the wafer is formed between adjacent limiting teeth, when the limiting member is located at the second position, the limiting teeth face the accommodating space.
[0013] Exemplarily, the limiting member comprises a limiting rod, a plurality of limiting teeth are arranged at intervals along the first direction on the limiting rod, the top of the main body is provided with a groove matched with the limiting rod; the limiting rod is rotatably connected with the main body through a connecting member, the limiting rod is configured to be switched between the first position and the second position, the limiting rod located at the first position is located outside the groove and at the edge area of the opening, part of the limiting rod located at the second position is located in the groove, and the limiting rod spans the opening in the first direction.
[0014] Exemplarily, the length of the limiting member is 28-32mm, the length of the limiting tooth is 4-6mm.
[0015] According to another aspect of the present application, a semiconductor processing equipment is provided, comprising the wafer carrying device described above.
[0016] The wafer bearing device of the utility model, through the accommodating space in the main part to accommodate wafer, the support rod of supporting wafer is arranged on the main part, a plurality of limiting pieces on the support rod are used to form the slot for limiting wafer, the protruding part between the first end and the second end on the limiting piece can act on wafer, so that the point contact between wafer and limiting piece is formed, thereby better limiting wafer, the limiting capacity of the bearing device is improved, the probability of wafer sticking in the processing process is reduced, the yield of wafer processing is effectively guaranteed, and the rework frequency of wafer is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0017] The following drawings for the utility model are hereby incorporated as a part of the utility model for understanding the utility model. The drawings of the utility model show the embodiments of the utility model and the description thereof, which are used to explain the principle of the utility model.
[0018] In the drawings:
[0019] Figure 1 A schematic diagram of a wafer bearing device in the related art is shown.
[0020] Figure 2 A schematic diagram of a wafer bearing device in the embodiments of the present application is shown.
[0021] Figure 3 A structure schematic diagram of a limiting member in the embodiments of the present application is shown.
[0022] Figure 4 A structure schematic diagram of a support rod and a limiting piece in the embodiments of the present application is shown.
[0023] Reference signs: 200, wafer bearing device; 210, main part; 220, support rod; 221, limiting piece; 2211, first part; 2212, second part; 230, limiting rod; 231, limiting tooth; 240, groove; 250, connecting member. DETAILED DESCRIPTION
[0024] In the following description, a large number of specific details are given in order to provide a more thorough understanding of the utility model. However, it is obvious for those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.
[0025] It is to be understood that the present application can be carried out in various forms and that the application should not be construed to be limited to the forms set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions can be exaggerated for clarity. Like numbers refer to like elements throughout.
[0026] It will be understood that when an element or layer is referred to as being "on" or "adjacent" or "connected" or "coupled" to another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer or one or more intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on," "directly adjacent," "directly connected" or "directly coupled" to another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
[0027] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0028] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.
[0029] To fully understand this utility model, a detailed structure will be presented in the following description to illustrate the technical solution proposed by this utility model. Preferred embodiments of this utility model are described in detail below; however, in addition to these detailed descriptions, this utility model may have other embodiments.
[0030] In some related technologies, such as Figure 1 As shown, the wafer carrier includes a body 100 with a support rod 110 for supporting the wafer. The support rod 110 has a limiting element for positioning the wafer. In the thin-film etching process, due to the flow of the chemical solution inside the machine, adjacent wafers may stick together due to insufficient restraint from the carrier. When the wafers undergo a displacement reaction with the chemicals in the chemical bath, this sticking leads to poor chemical displacement, reducing the product's yield and making the wafers more prone to defects, increasing the scrap rate and rework frequency.
[0031] Therefore, given the existence of the aforementioned technical problems, such as Figure 2 As shown, this utility model proposes a wafer carrier device 200, which includes a main body 210 and a plurality of support rods 220.
[0032] The main body 210 has a receiving space for accommodating wafers. Multiple support rods 220 are disposed on the sidewalls of the receiving space and spaced apart along a second direction. Each support rod 220 has multiple limiting members 221 spaced apart along a first direction, forming slots for inserting wafers between adjacent limiting members 221. The first and second directions are substantially perpendicular. Each limiting member 221 has a first end and a second end disposed opposite to each other, and at least one protrusion disposed between the first and second ends, protruding outward from the sidewall of the limiting member 221. The number of protrusions can be reasonably set according to actual needs and is not specifically limited here.
[0033] The wafer bearing device of the utility model, through the containing space in the main body 210 to contain wafer, the support rod 220 of supporting wafer is arranged on the main body, and the plurality of limiting pieces 221 on the support rod 220 are used to form the slot for limiting wafer, the protruding part between the first end and the second end on the limiting piece 221 can act on wafer, and wafer is better limited, the limiting capacity of bearing device is improved, the probability of appearing bonding between wafers in the processing process is reduced, the yield of wafer processing is effectively guaranteed, and the rework frequency of wafer is reduced.
[0034] Compared with the limiting mode of only limiting by the tooth-shaped limiting piece on the support rod 220 in the related art, the protruding part is further formed on the limiting piece 221 in the application, the protruding part can act on wafer, the limiting capacity of wafer bearing device is improved, and the probability of appearing bonding between wafers in the processing process is reduced.
[0035] Exemplarily, the first direction can be the length direction of the main body, and the second direction can be the height direction of the main body.
[0036] Please refer to Figure 2 and Figure 3 , the top of the containing space is provided with an opening for wafer to pass through, and the wafer bearing device further comprises a limiting member, the limiting member is rotatably arranged at the top of the main body 210, and the limiting member is configured to be switchable between a first position and a second position; when the limiting member is located at the first position, the opening allows the wafer to enter and exit the containing space; when the limiting member is located at the second position, the limiting member limits the wafer to enter and exit the containing space, wherein the limiting member is provided with a plurality of limiting teeth 231 arranged at intervals along the first direction, and a limiting slot for inserting and placing the wafer is formed between adjacent limiting teeth 231; when the limiting member is located at the second position, the limiting teeth 231 face the containing space.
[0037] Exemplarily, the limiting member comprises a limiting rod 230 rotatably connected to the main body 210, and the plurality of limiting teeth 231 are arranged at intervals along the first direction on the limiting rod 230; and the top of the main body 210 is provided with a groove 240 matched with the limiting rod 230. Figure 3 It is a structure diagram of the limiting member in the application. The limiting rod 230 is provided with a plurality of limiting teeth 231, the limiting teeth 231 are uniformly arranged along the first direction (i.e. the length direction of the limiting rod 230), and a limiting slot is formed between adjacent limiting teeth 231; when the limiting member is located at the second position, on the one hand, the limiting rod can limit the wafer to prevent it from coming out of the containing space, and on the other hand, the limiting slot can limit the edge position of the wafer to prevent at least partial bonding between adjacent two wafers.
[0038] Exemplarily, one end of the limiting tooth 231 is arranged on the limiting rod 230, and the other end extends along the direction perpendicular to the limiting rod 230. Along the extending direction of the limiting tooth 231, the width gradually decreases and finally forms a toothed structure. The limiting tooth 231 is arranged as a toothed structure, considering that it needs to cooperate with the edge position of the wafer. After the wafer is installed into the accommodating space, the limiting member 221 on the supporting rod 220 has already partially limited it. The limiting groove formed by the limiting tooth 231 of the toothed structure can cooperate with the top of the wafer and the limiting groove between the limiting tooth 231 when the limiting rod 230 is switched to the second position, so as to play a limiting role. Moreover, the wafer is limited to move in the up, down, front, back, left and right directions, avoiding the problems of wafer movement, wafer collision and wafer oblique insertion. Exemplarily, the cross-sectional shape of the limiting tooth 231 includes but is not limited to a square, a triangle, a semicircle, and the present application does not limit this.
[0039] The limiting rod 230 is rotatably connected to the main body 210 through the connecting member 250. The limiting rod 230 is configured to be switched between the first position and the second position. The limiting rod 230 in the first position is located outside the groove 240 and at the edge region of the opening, that is, the limiting rod 230 in the first position can allow the wafer to enter or exit the accommodating space. The part of the limiting rod 230 in the second position is located in the groove 240, and the limiting rod 230 crosses the opening in the first direction to limit the wafer to enter or exit the accommodating space.
[0040] Exemplarily, the connecting member 250 includes connecting pieces arranged at both ends of the limiting rod 230, and connecting shafts connected with the connecting pieces. The connecting shafts are rotatably connected with the main body 210 to realize the rotatable connection between the limiting rod 230 and the main body 210. A rotation damping is arranged between the connecting member 250 and the main body 210, so as to limit the rotation of the limiting rod 230 after the limiting rod 230 enters the second position (the limiting rod 230 is in the second position), so that the current state can be stably maintained, thereby effectively limiting the wafer. Figure 2
[0041] In some embodiments, the connecting member 250 is provided with a limiting groove, and the main body 210 is provided with at least two limiting protrusions (not shown in the figure), the limiting groove and the limiting protrusions are matched, and the movement of the limiting rod 230 can further limit the wafer. When the limiting protrusion is not in contact with the limiting groove, the connecting member 250 can drive the limiting rod 230 to rotate, so that the limiting rod 230 can be switched between the first position and the second position. When the limiting protrusion is in contact with the limiting groove, the connecting member 250 and the limiting rod 230 are limited, and the limiting rod 230 can be limited in the second position or the first position.
[0042] Based on the limiting rod 230 of the embodiment, when the wafer carrier device for accommodating the wafer (such as a super-thin wafer) is placed in a chemical liquid, the wafer is prevented from floating or being washed up by the chemical liquid, and the wafer is prevented from being hit and broken or being inserted obliquely and scrapped, thereby improving the yield of wafer production. The limiting teeth 231 on the limiting rod 230 can also limit the edges of the wafers and prevent the adjacent wafers from being attached, thereby further ensuring the processing quality of the wafers.
[0043] For example, the length of the limiting teeth 231 is 4-6 mm, and the limiting teeth 231 are limited to a smaller size. During the process of the limiting rod 230 from the first position to the second position, the wafer is more easily matched with the limiting groove between the limiting teeth 231. The limiting length can be 4 mm, 5 mm, 6 mm, etc., which can be adjusted according to the size and other specific parameters of the limiting rod 230, and the embodiment of the application does not limit it. The length direction of the limiting teeth 231 is perpendicular to the length direction (i.e., the first direction) of the limiting rod 230.
[0044] In one example, the main body 210 is made of a material resistant to high temperature, acid and alkali, and wear, and further, the material constituting the main body 210 also has an anti-static function. In one embodiment, the main body 210 is made of a translucent plastic material, and different colored wafer carrier devices can be used in different semiconductor process sections. It should be noted that the wafer carrier device of the exemplary embodiment is only a hollow frame structure, so that the whole box of wafers can be immersed in a chemical liquid for chemical treatment or cleaning, but this is not limiting, and the wafer carrier device can also adopt a closed or semi-closed structure.
[0045] Please refer to Figure 2The side wall of the accommodating space includes a first side wall and a second side wall opposite to the first side wall, and the first side wall and the second side wall are both provided with a plurality of support rods 220 arranged at intervals along the second direction, and the distance between the support rod 220 arranged on the first side wall and the second side wall gradually increases or first increases and then decreases along the second direction. The distance between the support rod 220 arranged on the second side wall and the first side wall gradually increases or first increases and then decreases along the second direction. In the embodiment of the application, from the bottom of the main body 210 to the top of the main body 210, the distance between the support rod 220 on the first side wall and the support rod 220 on the second side wall gradually increases, which is also to adapt to the shape and size of the wafer.
[0046] It should be noted that the above only limits that from the bottom of the accommodating space to the upper part of the accommodating space, the distance between the support rod 220 on the first side wall and the second side wall opposite to the first side wall gradually increases or first increases and then decreases, and the support rod 220 on the second side wall is the same, but it does not limit whether the support rods on the first side wall and the second side wall are symmetrical. The number of the support rods 220 on the first side wall and the second side wall is the same, and the number of the limiters 221 on each support rod 220 is the same, and the size of the slot formed between adjacent limiters 221 is the same. Due to the error existing in the actual manufacturing process of the product, the size of the slot formed between adjacent limiters 221 is not necessarily completely the same, but as long as it is within the error range, it can be considered the same.
[0047] As shown in Figure 2 and Figure 4 , the structure of the support rod 220 and the limiter 221 in the embodiment of the application is shown in Figure 4 . The support rod 220 is arranged at intervals along the height direction of the main body 210 on the two side walls of the main body 210, a plurality of limiters 221 are arranged at intervals on each support rod 220, the limiters 221 are arranged at intervals along the first direction, and the slots for inserting and placing the wafers are formed between adjacent limiters 221.
[0048] The limiting piece 221 comprises a first part 2211 and a second part 2212 connected with the first part 2211, the first end of the first part 2211 is connected with the support rod 220, and the second end of the first part 2211 is connected with the first end of the second part 2212, that is, the first part 2211 and the second part 2212 jointly form the structure of the limiting piece 221. The protruding part comprises a first protruding part, which is located at the second end of the first part 2211. The first protruding part is located between the first part 2211 and the second part 2212 and extends outward from the side wall of the limiting piece 221. When the limiting piece 221 and the wafer interact, the first protruding part on the limiting piece 221 acts on the wafer, which can improve the limiting effect and avoid line contact between the wafer and the limiting piece 221, reduce the contact area with the wafer, and ensure the quality of wafer processing.
[0049] Exemplarily, the number of protruding parts on each limiting piece 221 is two, and the protruding part on the limiting piece 221 further comprises a second protruding part. The second protruding part is located at the second end of the second part 2212, that is, the second end of the second part 2212 protrudes in the radial direction relative to the first end of the second part 2212. Therefore, the end of the first part 2211 close to the second part 2212 forms a first protruding part protruding in the radial direction. The end of the second part 2212 away from the first part 2211 forms a second protruding part protruding in the radial direction. Finally, through the structure of the first part 2211 and the second part 2212, a double-layer tower structure of the limiting piece 221 is formed. The structure of the second protruding part on the limiting piece 221 can cooperate with the first protruding part to limit the wafer, increase the contact points between the limiting piece 221 and the wafer, avoid the adhesion between the two wafers as much as possible, reduce wafer defects, and ensure the processing quality of the wafer.
[0050] The outer surface of the first protruding part at the second end of the first part 2211 is an arc surface, and the outer surface of the second protruding part at the second end of the second part 2212 is an arc surface. The arc surface structure has a smoother feature in the transition process than the inclined surface, and there is no obvious outward protrusion at the connection. When contacting the wafer, the wafer can be effectively limited, and mechanical damage to the wafer is less likely to occur. Exemplarily, the arc surface structure is shown in the present application, but it should not be considered as a limitation. Figure 4
[0051] In addition, the convex portion is designed in an arc surface structure, which can reduce the slope of the outer surface connection, prevent the edge of the wafer from forming a cutting effect with the limiting piece 221, avoid forming burrs on the limiting piece 221 and wafer breakage caused by the burrs, and reduce the wafer rejection rate. Moreover, by changing the edges of the limiting piece 221 in contact with the wafer into arc surfaces, the contact between the wafer and the outer surface of the limiting piece 221 can be changed from surface contact to point contact, thereby further increasing the flow of chemical medicine, improving the replacement effect of the chemical medicine, and improving the appearance yield of the product.
[0052] For example, the width of the second convex portion on the second portion 2212 in the first direction is smaller than the width of the first convex portion on the first portion 2211 in the first direction, that is, the middle part of the entire limiting piece 221 has a more significant radial protrusion. When the wafer is positioned by the limiting piece 221, the first convex portion of the middle part is most likely to contact the wafer to position the wafer.
[0053] For example, the length of the limiting piece 221 is 28-32 mm, and the overall length direction is generally perpendicular to the length direction of the support rod 220. Specifically, the length can be 28 mm, 30 mm, etc., and the present application embodiment does not limit it. The limiting piece 221 in the present application has a longer length than the limiting structure in the related art, so the positioning effect on the edge part of the wafer is better. Moreover, the first convex portion of the middle part of the limiting piece 221 is more likely to directly contact the wafer, so that the lengthening does not cause the point contact between the wafer and the limiting piece 221 to become line contact, thereby reducing the impact of the structure of the limiting piece 221 itself on the wafer processing process.
[0054] The wafer carrying device in the present application embodiment first adjusts the limiting rod 230 from the second position to the first position when carrying the wafer, so that the wafer can smoothly enter the accommodation space. The edge position of the wafer is supported by the support rod 220, and the limiting pieces 221 on the support rod 220 form a slot for cooperating with the wafer and positioning the wafer. Then the position of the limiting rod 230 is adjusted to switch to the second position, thereby limiting the movement of the wafer. The limiting teeth 231 on the limiting rod 230 form a limiting slot for limiting the wafer. Therefore, the limiting of the wafer is realized by the limiting slot at the top position and the slot at the side wall position, which improves the limiting ability of the wafer carrying device. The limiting piece 221 on the support rod 220 forms a convex portion, which acts on the wafer and makes point contact with the wafer, further reducing the probability of adhesion between wafers during processing, and effectively ensuring the yield of wafer processing.
[0055] The present application embodiment also provides a semiconductor processing equipment, which comprises the wafer carrying device described above.
[0056] The wafer bearing device and the semiconductor processing equipment of the embodiment of the present application can limit the wafer through the limiting teeth 231 on the limiting rod 230 and the limiting member 221 on the supporting rod 220, improve the limiting capacity of the wafer bearing device, reduce the probability of adhesion between wafers in the processing process, and effectively ensure the yield of wafer processing.
[0057] In addition, the limiting member 221 adopts a double-tower structure composed of the first part 2211 and the second part 2212, and the first protruding part at the middle part of the limiting member 221 is more likely to directly contact the wafer, so that the wafer and the limiting member 221 can be changed from point contact to line contact due to the lengthening, the influence of the structure of the limiting member 221 itself on the wafer processing process is reduced, and the quality of wafer processing is ensured.
[0058] Although the example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are only exemplary and are not intended to limit the scope of the present application. Those of ordinary skill in the art can make various changes and modifications without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.
[0059] Similarly, it is to be understood that, in order to simplify the present application and help understand one or more of the various application aspects, in the description of the example embodiments of the present application, various features of the present application are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of the present application should not be interpreted as reflecting the intention that the claimed present application requires more features than the features explicitly recorded in each claim. Rather, as reflected by the corresponding claims, the application point lies in that the corresponding technical problem can be solved with fewer features than all the features of a certain disclosed single embodiment. Therefore, the claims following the DETAILED DESCRIPTION are hereby expressly incorporated into the DETAILED DESCRIPTION, wherein each claim itself is a separate embodiment of the present application.
[0060] In addition, those skilled in the art can understand that although some embodiments described herein include certain features rather than others included in other embodiments, the combination of features of different embodiments means that it is within the scope of the present application and forms different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.
[0061] It should be noted that the foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present application. While the application has been described with reference to preferred embodiments and illustrations, the person of ordinary skill in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words "first", "second", and "third", etc. does not imply any order. These words are to be interpreted as names.
Claims
1. A wafer carrier device, characterized in that, The device comprises: a main body having a receiving space for receiving a wafer; a plurality of support rods arranged on the sidewall of the receiving space and spaced apart along a second direction, each of the support rods having a plurality of limiting members spaced apart along a first direction, and a slot for inserting a wafer being formed between adjacent limiting members, wherein the limiting member has a first end and a second end arranged oppositely, and at least one protrusion arranged between the first end and the second end, the protrusion protruding outwardly from the sidewall of the limiting member; wherein the first direction and the second direction are perpendicular.
2. The wafer carrier apparatus of claim 1, wherein, The limiting member comprises a first part and a second part connected to the first part, a first end of the first part being connected to the support rod, and a second end of the first part being connected to a first end of the second part, wherein the at least one protrusion comprises a first protrusion, and the first protrusion is located at the second end of the first part.
3. The wafer carrier apparatus of claim 2, wherein, The number of protrusions is two, and the two protrusions comprise the first protrusion and a second protrusion, and the second protrusion is located at the second end of the second part.
4. The wafer carrier apparatus of claim 2, wherein, The outer surface of the protrusion is arc-shaped.
5. The wafer carrier apparatus of claim 3, wherein, The width of the second protrusion along the first direction is smaller than the width of the first protrusion along the first direction.
6. The wafer carrier apparatus of claim 1, wherein, The number of limiting members on each support rod is the same, and the size of the slot formed between adjacent limiting members is the same.
7. The wafer carrier apparatus of claim 1, wherein, The top of the receiving space is provided with an opening for the wafer to pass through, and the device further comprises a limiting member rotatably arranged on the top of the main body, and the limiting member is configured to be switched between a first position and a second position, when the limiting member is in the first position, the opening allows the wafer to enter and exit the receiving space, and when the limiting member is in the second position, the limiting member restricts the wafer from entering and exiting the receiving space, wherein the limiting member is provided with a plurality of limiting teeth spaced apart along the first direction, and a limiting slot for inserting a wafer is formed between adjacent limiting teeth, and when the limiting member is in the second position, the limiting teeth face the receiving space.
8. The wafer carrier apparatus of claim 7, wherein, The limiting member comprises a limiting rod, and a plurality of limiting teeth are spaced apart along the first direction on the limiting rod, and the top of the main body is provided with a groove matched with the limiting rod; the limiting rod is rotatably connected to the main body through a connecting member, and the limiting rod is configured to be switched between the first position and the second position, the limiting rod in the first position is located outside the groove and at the edge area of the opening, and part of the limiting rod in the second position is located in the groove, and the limiting rod spans the opening in the first direction.
9. The wafer carrier apparatus of claim 7, wherein, The length of the limiting member is 28-32mm, and the length of the limiting tooth is 4-6mm.
10. A semiconductor processing apparatus, characterized by comprising: The device comprises a wafer carrying device according to any one of claims 1 to 9.