Multilayer board with exposed inner layer bonding pad

Abstract

The utility model discloses a multilayer board with an exposed inner-layer bonding pad. The multi-layer substrate is provided with an exposed bonding pad; the curing plate is pressed on the multi-layer substrate and is provided with a first hole position opposite to the bonding pad; and the single-sided board is pressed on the curing board and is provided with a second hole position opposite to the first hole position. The curing plate and the single-sided plate are sequentially arranged at the upper end of the multi-layer substrate, drilling is carried out at the position corresponding to the bonding pad so that the bonding pad can be cut open and exposed, due to the fact that the two plates are additionally arranged, certain pressure exists during drilling, the drilling force can be better controlled, the bonding pad is prevented from being damaged by cutting, and through the design, the laser technology is replaced, and the production efficiency is improved. The process optimization is realized, the rejection rate is reduced, and the quality is better guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of PCB especially relates to a multilayer board with inner layer pads exposed. BACKGROUND

[0002] The corresponding position of the pad (PAD) that needs to be exposed after pressing is ablated by laser technology to make the inner layer exposed. Currently, the depth of laser ablation of the outer layer resin is not easy to control; the copper foil of the pad (PAD) that needs to be exposed is easily ablated by laser ablation of the resin; secondly, the cost of laser ablation is high, and ordinary factories cannot configure expensive laser drilling equipment. SUMMARY

[0003] To solve the above problems, the technical scheme provides a multilayer board with inner layer pads exposed.

[0004] To achieve the above purpose, the technical scheme is as follows:

[0005] A multilayer board with inner layer pads exposed, comprising:

[0006] A multilayer substrate provided with exposed pads;

[0007] A curing plate pressed on the multilayer substrate, which is provided with a first hole position opposite the pad;

[0008] A single-sided board pressed on the curing plate, which is provided with a second hole position opposite the first hole position.

[0009] In some embodiments, the curing plate is a no-flow prepreg PP material.

[0010] In some embodiments, the multilayer substrate includes an upper plate and a lower plate, the upper plate is covered with a first heat dissipation copper foil, the lower plate is covered with a second heat dissipation copper foil, the upper plate and the lower plate are provided with heat dissipation holes in the first heat dissipation copper foil and the second heat dissipation copper foil, the heat dissipation holes are provided with heat conduction strips, and the second heat dissipation copper foil is provided with a window.

[0011] In some embodiments, the area of the second heat dissipation copper foil is larger than that of the first heat dissipation copper foil.

[0012] The application has the following advantages:

[0013] The application sequentially provides a curing plate and a single-sided board on the upper end of the multilayer substrate, drills holes in the corresponding position of the pad to cut the pad and expose it, and adds two plates to control the drilling force and prevent the pad from being damaged. Through the design, the laser technology is replaced, the process is optimized, the scrap rate is reduced, and the quality is more reliable. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced.

[0015] Figure 1 is a structural schematic diagram of the embodiment of the present application Figure 1 ;

[0016] Figure 2 is a structural schematic diagram of the embodiment of the present application Figure 2 . DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical schemes and beneficial effects solved by the present application more clearly understood, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0018] Please refer to Figures 1-2 , a multi-layer board with exposed inner layer pads, comprising;

[0019] A multi-layer substrate 1 is provided with exposed pads 101;

[0020] A curing plate 2 is pressed on the multi-layer substrate 1, and a first hole site 201 is provided opposite the pad 101;

[0021] A single-sided board 3 is pressed on the curing plate 2, and a second hole site 301 is provided opposite the first hole site 3.

[0022] The present application is provided with a curing plate and a single-sided board on the upper end of the multi-layer substrate, and the pads are drilled at the corresponding positions to expose the pads. Since two plates are added, there is a certain pressure when drilling, so that the drilling force can be better controlled to prevent the pads from being damaged. Through this design, the laser technology is replaced, the process is optimized, the scrap rate is reduced, and the quality is more guaranteed.

[0023] In the present embodiment, the curing plate 2 is made of a no-flowing glue semi-cured sheet PP material.

[0024] In the present embodiment, the multi-layer substrate 1 includes an upper plate 11 and a lower plate 12, the upper plate 11 is covered with a first heat dissipation copper foil 13, the lower plate 12 is covered with a second heat dissipation copper foil 14, the upper plate 11 and the lower plate 12 are provided with heat dissipation holes at the first heat dissipation copper foil 13 and the second heat dissipation copper foil 14, the heat dissipation holes are provided with heat conduction strips 15, and the second heat dissipation copper foil 14 is provided with a window 16.

[0025] The application effectively increases the heat dissipation area through the first heat dissipation copper foil, and then transmits the absorbed heat to the second heat dissipation copper foil of the lower plate through the heat conduction strip. Since the second heat dissipation copper foil is designed with windows, the heat is well discharged from the windows, thereby achieving good heat dissipation performance.

[0026] In the embodiment, the second heat dissipation copper foil 14 has a larger area than the first heat dissipation copper foil 13, further improving the heat dissipation performance.

[0027] The above description is only the preferred embodiment of the application, and is not intended to limit the scope of the application. Other embodiments with the same or similar principles and basic structures as the application are within the scope of the application.

Claims

1. A multi-layer board in which inner layer pads are exposed, characterized by, Comprise; Multilayer substrate (1), the multilayer substrate (1) is provided with exposed pad (101); Curing plate (2) is pressed together on the multilayer substrate (1), and first hole site (201) is provided opposite the pad (101); Single-sided board (3) is pressed together on the curing plate (2), and second hole site (301) is provided opposite the first hole site (201).

2. The multi-layer board with inner layer pads exposed according to claim 1, wherein: The curing plate (2) is not gluey semi-cured sheet PP material.

3. The multi-layer board with inner layer pads exposed according to claim 2, wherein: The multilayer substrate (1) includes upper plate (11) and lower plate (12), the upper plate (11) is covered with first heat dissipation copper foil (13), the lower plate (12) is covered with second heat dissipation copper foil (14), the upper plate (11) and lower plate (12) are located in the first heat dissipation copper foil (13) and second heat dissipation copper foil (14) and is provided with heat dissipation hole, the heat dissipation hole is through with heat conduction strip (15), the second heat dissipation copper foil (14) is provided with window (16).

4. The multi-layer board with inner layer pads exposed according to claim 3, wherein: The second heat dissipation copper foil (14) area is greater than the first heat dissipation copper foil (13).

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