Guide rail type switching power supply and casing type switching power supply

Abstract

The utility model discloses a glue filling technology, and provides a solution for optimizing the layout of a high-density power supply product, which comprises at least one or more electronic devices, a glue filling material and a PCB (Printed Circuit Board), the glue filling material is not limited to epoxy resin, a surrounding piece can be added aiming at the glue filling mode, but the glue filling material is not limited to one of sealants and an epoxy board; the electronic device is surrounded by the pouring glue, the surrounding shape can be irregular, and the pouring glue is filled and covers the electronic device, so that the layout design of a high-density product is improved, and the processing cost of a sub-board and the number of PCBs (Printed Circuit Board) can be reduced. According to the utility model, through a glue pouring process, the combination and integrated manufacturing of the mother board and the son board is realized by welding and assembling a plurality of boards, so that the welding quantity of the boards is reduced, the manufacturing quantity of the boards can be reduced by about 30%, and the cost is effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to switch power supply made of glue filling process, especially relates to a guide rail type switch power supply and a cabinet type switch power supply which can reduce product cost and improve product manufacturability. BACKGROUND

[0002] With the rapid development of electronic products, the application of electronic products is more and more. Therefore, the use of high-density switch power supply products also gradually increases, and the layout and process design of switch power supply products are more and more complex. The traditional production process of sub-motherboard may affect product quality and high-cost manufacturing, which affects the product in the market and is not conducive to competition.

[0003] In addition, the switch power supply isolation band needs to meet the insulation distance required by safety certification. The higher the input voltage, the higher the safety distance requirement, and the longer the distance. Therefore, the product design is limited, and the volume is large. The conventional product overall potting method reduces the pollution level or realizes solid insulation, reduces the safety distance, but this method increases the weight of the product and the cost is high.

[0004] In actual high-voltage application occasions, these shortcomings will be further expanded, such as in a high input voltage (more than 1000V) circuit, if the general optocoupler is still used, it does not meet the safety distance requirement at all. Therefore, special optocouplers with large pin pitch are required. There are also special optocouplers with large pin pitch at present, but the material cost is too high, and the development cost is large. The overall potting method leads to high weight of the product and low power density, which is difficult to meet the development requirements of green power supply. INVENTION CONTENTS

[0005] The utility model aims at overcoming the process difficulty in the prior art, and provides a glue filling process to solve the process problem of product structure design that cannot be laid out and sub-motherboard integrated manufacturing.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A guide rail type switch power supply comprises a PCB circuit board and a safety device, the safety device adopts local glue filling to form a glue filling module encapsulated on the PCB circuit board, so as to form solid isolation of the safety device instead of air isolation, shorten the safety distance of the safety device from 32mm to 8mm, and save a PCB circuit board layout empty area for arranging a sub-board or other electronic devices on the PCB circuit board.

[0008] Preferably, the glue filling module is a square structure, a square-like structure, or an irregular shape structure.

[0009] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0010] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0011] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0012] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0013] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0014] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0015] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0016] Preferably, the glue-filling module is formed by surrounding and covering the electronic devices by glue-filling, and the package top surface is a plane, and the thickness of the package top surface to the highest electronic device top end is greater than or equal to 0.4 mm.

[0017] As described above, the switch power supply of the utility model, including at least 1 or more electronic devices, glue-filling material, PCB, the glue-filling material is not limited to epoxy resin, can increase the surrounding piece for glue-filling mode, but not limited to a kind of sealing glue, epoxy board, not limited to shape size, can be irregular shape, glue-filling surrounds the structure mode of electronic device, glue-filling fills and covers electronic device, improves high-density product layout design.

[0018] The switch power supply has the advantages that: the glue pouring process solves the high-density product layout design, realizes reduction of sub-board manufacturing, and reduces the number by about 30%, and the cost is lower, and the sub-mother board integrated manufacturing process is simpler. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure schematic view before glue pouring of the first embodiment of the utility model;

[0020] Figure 2 It is a structure schematic view after glue pouring of the first embodiment of the utility model;

[0021] Figure 3 It is a structure schematic view of the glue pouring module including multiple electronic devices of the first embodiment of the utility model;

[0022] Figure 4 It is an effect picture after the glue pouring module encapsulating multiple electronic devices of the first embodiment of the utility model;

[0023] Figure 5 It is a structure schematic view before glue pouring of the glue pouring module of the second embodiment of the utility model;

[0024] Figure 6 It is an effect picture after glue pouring of the glue pouring module of the second embodiment of the utility model;

[0025] Figure 7 It is a board empty area structure schematic view of the PCB circuit board of the utility model;

[0026] Wherein, the reference signs in the above-mentioned drawings are as follows: 10.PCB circuit board, 20.electronic device, 30.surrounding piece, 40.glue pouring piece DETAILED DESCRIPTION

[0027] The utility model / invention and its advantages will be further explained in detail in combination with specific implementation manners and the drawings of the specification, but the specific implementation manner of the utility model / invention is not limited to this.

[0028] For example, Figures 1 to 4As shown, the switch power supply of the first embodiment of the utility model, including PCB circuit board 10 and electronic device 20, electronic device preferably is safety device, safety device adopts partial glue filling to form the glue filling module that is encapsulated on PCB circuit board 10, to form the solid insulation of safety device instead of air isolation, make the safety distance of safety device shorten from 32mm to 8mm, to save the layout empty area of PCB circuit board, this layout empty area is used to arrange a daughterboard or other electronic device on PCB circuit board, to realize the quantity of plug-in daughterboard can reduce about 30%. Wherein, the glue filling module is formed by the surrounding piece 30 of the peripheral closure effect and the glue filling piece 40 filled in the surrounding piece for wrapping safety device, and the electronic device that can be wrapped by glue filling piece 40 includes safety device and / or non-safety electronic device, the number of wrapped electronic device can be 1, also can be multiple, and it is determined according to the optimization demand of PCB circuit layout. Safety device includes but is not limited to optical coupling, digital isolator or transformer. The encapsulation material fills and covers safety device, can strengthen to meet solid insulation or reduce pollution level.

[0029] Preferably, the electronic device encapsulated on the PCB circuit board by local glue filling includes safety device and / or non-safety electronic device, and the overall size is less than or equal to the square area surrounded by a length of 32 mm and a width of 32 mm. The height of the glue filling module on the PCB circuit board is greater than or equal to 5 mm.

[0030] Preferably, as shown in Figure 3 and Figure 4 the glue filling module of the switch power supply of the first embodiment of the utility model, including PCB circuit board 10, electronic device 20, surrounding piece 30 and glue filling piece 40, wherein, the glue filling material used by glue filling piece can be epoxy resin, or other materials with similar filling and packaging functions. The surrounding piece with peripheral closure effect is added to the glue filling mode, which can be a square, rectangular, square-like or rectangular-like frame structure, and the material can be a surrounding structure or an epoxy plate. The encapsulation top surface formed by the glue filling module covering the electronic device 20 is a plane, and the height difference between the encapsulation top surface and the highest electronic device top end is greater than or equal to 0.4 mm, or the wrapping thickness of the encapsulation top surface to the highest electronic device top end is greater than or equal to 0.4 mm. The surrounding piece surrounds the electronic device, and the encapsulation material fills and covers the electronic device, so that the electronic device is completely invisible, and the number of daughterboards is reduced by integrating the motherboard and daughterboard.

[0031] As shown in Figure 6The second embodiment of the utility model shows the structure schematic diagram of the glue pouring module of the switching power supply, and the difference from the first embodiment is that the shape of the surrounding part is irregular; the irregular shape can be a square structure with irregular local shape, or can be an overall irregular shape structure. The irregular surrounding part surrounds the electronic device, and the glue filling material covers the electronic device, so that the electronic device is completely invisible, and the sub-mother board integration is realized to reduce the number of sub-boards.

[0032] Compared with the prior art, due to the limitation of the safety distance in the authentication standard, the electrical clearance and the creepage distance of the primary and secondary of the switching power supply increase with the increase of the system input voltage, and the distance requirement increases to tens of millimeters or even longer, and the product volume and other designs are limited. The switching power supply of the utility model forms an effective solid isolation body by locally pouring the key devices such as the safety device with the special structure scheme described above to replace the air isolation, for example, the switching power supply product of 960W power section, as shown in Figure 7 The safety distance of the safety device can be shortened from 32mm to 8mm, so that nearly 24mm of the layout area of the PCB circuit board is saved, and the saved area is mainly the circuit performance compensation circuit used because of the insufficient safety distance of the safety device. After the layout area is emptied, the electronic device of a sub-board or other performance improvement circuit can be arranged on the PCB circuit board, so that the number of plug-in sub-boards is reduced by about 30%, and a new space for circuit performance improvement is provided. According to the common guide rail type or shell type switching power supply, 2-4 sub-boards are generally used, and basically one sub-board can be reduced. According to this improvement method, the power section of the switching power supply product of the utility model can be applied to products of about 240W. Further downward due to the small product size itself, the applicability and practicability are not strong.

[0033] The above embodiments are only used to help understand the method and core idea of the utility model, and for ordinary skilled persons in the art, without departing from the principle of the utility model, other equivalent application schemes and some improvements and modifications of the utility model can be naturally thought of through the above description and examples, and all fall within the protection scope of the claims of the utility model.

Claims

1. A rail mounted switching power supply comprising a PCB circuit board and a safety device, characterized in that: The safety device adopts local glue filling to form a glue filling module encapsulated on the PCB circuit board, so as to form solid isolation of the safety device instead of air isolation, shorten the safety distance of the safety device from 32 mm to 8 mm, and save a PCB circuit board layout empty area for arranging a daughter board or other electronic devices on the PCB circuit board.

2. The rail power supply of claim 1, wherein: The glue filling module is in a square structure, a square-like structure, or an irregular shape structure.

3. The switching power supply of claim 1, wherein: The glue filling module is formed by surrounding and covering the electronic devices with glue, and the encapsulation top surface is a plane, and the wrapping thickness of the encapsulation top surface to the top end of the highest electronic device is greater than or equal to 0.4 mm.

4. The rail power supply of claim 1, wherein: The glue filling module adopts local glue filling to encapsulate electronic devices including safety devices and / or non-safety electronic devices on the PCB circuit board, and the overall size is less than or equal to a square area with a length of 32 mm and a width of 32 mm.

5. The rail power supply of claim 1, wherein: The glue filling module is formed by surrounding pieces with a peripheral closing effect and glue pieces filled in the surrounding pieces for wrapping safety devices.

6. A chassis mounted switching power supply comprising a PCB circuit board and a safety device, characterized in that: The safety device adopts local glue filling to form a glue filling module encapsulated on the PCB circuit board, so as to form solid isolation of the safety device instead of air isolation, shorten the safety distance of the safety device from 32 mm to 8 mm, and save a PCB circuit board layout empty area for arranging a daughter board or other electronic devices on the PCB circuit board.

7. The chassis mounted switching power supply of claim 6 wherein: The glue filling module is in a square structure, a square-like structure, or an irregular shape structure.

8. The chassis mounted switching power supply of claim 6 wherein: The glue filling module is formed by surrounding and covering the electronic devices with glue, and the encapsulation top surface is a plane, and the wrapping thickness of the encapsulation top surface to the top end of the highest electronic device is greater than or equal to 0.4 mm.

9. The chassis mounted switching power supply of claim 6 wherein: The glue filling module adopts local glue filling to encapsulate electronic devices including safety devices and / or non-safety electronic devices on the PCB circuit board, and the overall size is less than or equal to a square area with a length of 32 mm and a width of 32 mm.

10. The chassis mount switching power supply of claim 6, wherein: The height of the glue filling module on the PCB circuit board is greater than or equal to 5 mm.

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