Modularized heat dissipation structure device and electronic equipment

Abstract

The utility model relates to the technical field of structural thermal design of general electronic equipment, and discloses a modular heat dissipation structure device and electronic equipment. The device comprises a base, a phase change material layer, a heat pipe, a cooling fin, a cooling fan and an air diffuser, the phase change material layer is arranged on the base, the heat pipe is embedded in the phase change material layer, the cooling fan and the cooling fin are arranged on the phase change material layer, and the air diffuser is arranged around the cooling fan. Therefore, quick and reliable heat dissipation of the electronic equipment can be realized, the electronic equipment has the advantages of simplicity in operation, quickness in replacement and remarkable heat dissipation effect, and the problems that traditional electronic equipment is too complicated in heat dissipation, difficult in later modification and improvement and high in manpower and material resource consumption are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to general electronic equipment structure heat design technical field especially relates to a modularization heat dissipation structure device and electronic equipment. BACKGROUND

[0002] Electronic equipment heat dissipation design method has been the important research content of heat design field, and usually electronic equipment cabinet design needs to consider external heat dissipation demand, or installs stirring fan in the equipment interior and carries out the mode such as strengthening internal convection. This design will meet the problem of long time consumption and complex operation if meeting the temporary change of total scheme and partial part replacement. In order to facilitate the overall installation, replacement and debugging of equipment, the electronic equipment heat dissipation scheme is independently designed into a heat dissipation device, which is repeatedly used, can simplify the design scheme, and save a large amount of design repeated time. Therefore, a modularization heat dissipation device is needed to solve the problems of traditional electronic equipment heat dissipation being too complex, being difficult to modify and improve in later period and consuming large amount of manpower and material resources. SUMMARY

[0003] The utility model discloses a modularization heat dissipation structure device and electronic equipment can solve the problem in prior art.

[0004] The technical solution of the utility model discloses a modularization heat dissipation structure device, wherein the device includes base, phase change material layer, heat pipe, radiating fin, heat dissipation fan and flow distributor, the phase change material layer is arranged on the base, the heat pipe is buried in the phase change material layer, the heat dissipation fan and the radiating fin are arranged on the phase change material layer, and the flow distributor is arranged around the heat dissipation fan.

[0005] Preferably, the bottom surface of the base is coated with thermal conductive silicone grease.

[0006] Preferably, the heat dissipation fan is a centrifugal fan.

[0007] Preferably, the number of centrifugal fans is four.

[0008] Preferably, the radiating fin is a wave-shaped radiating fin.

[0009] Preferably, the number of flow distributors is four, and the four flow distributors form a rectangular structure around the heat dissipation fan.

[0010] Preferably, the heat dissipation fan is arranged at the center position of the base, and the radiating fin is arranged at the position around the base.

[0011] The utility model further provides an electronic equipment, wherein the electronic equipment includes the modularization heat dissipation structure device, and the device is arranged outside the electronic equipment.

[0012] Preferably, the base edge is provided with a threaded hole which cooperates with a screw to fix the base with the electronic device.

[0013] Preferably, the base is fixed with the electronic device by curing glue.

[0014] By the above technical solution, the phase change material layer, the heat pipe, the heat dissipation fin, the heat dissipation fan and the flow distributor are arranged on the base to obtain a modular heat dissipation structure device. The heat dissipation structure device is directly installed on the outer wall surface of the electronic device to realize fast and reliable heat dissipation of the electronic device. The heat dissipation structure device has the advantages of simple operation, quick replacement and remarkable heat dissipation effect, and solves the problems of complex heat dissipation of the traditional electronic device, difficult modification and improvement in the later period and large consumption of manpower and material resources. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings included are intended to provide a further understanding of the embodiments of the present application, and constitute a part of the specification, serve to explain the embodiments of the present application together with the text, and illustrate the principles of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0016] Fig. 1 A schematic view of a modular heat dissipation structure device provided in the embodiments of the present application;

[0017] Fig. 2 A sectional view of a modular heat dissipation structure device in the embodiments of the present application;

[0018] Fig. 3 A top view of a modular heat dissipation structure device in the embodiments of the present application. DETAILED DESCRIPTION

[0019] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be practiced in other embodiments that depart from these specific details.

[0020] It should be noted that, in order to avoid obscuring the present application due to unnecessary details, only the device structures and / or processing steps closely related to the scheme according to the present application are shown in the drawings, and other details not closely related to the present application are omitted.

[0021] As Figs. 1-3As shown, the utility model embodiment provides a kind of modularization heat dissipation structure device, wherein, this device includes base 1, phase change material layer 2, heat pipe 3, fin 4, heat dissipation fan 5 and flow distributor 6, the phase change material 2 layer is arranged on the base 1, the heat pipe 3 is buried in the phase change material layer 2, the heat dissipation fan 5 and the fin 4 are arranged on the phase change material layer 2, the flow distributor 6 is arranged around the heat dissipation fan 5.

[0022] Through the above technical scheme, phase change material layer, heat pipe, fin, heat dissipation fan and flow distributor can be arranged on the base, to obtain a kind of modularization heat dissipation structure device, by being directly installed on the outer wall surface of electronic equipment, the rapid reliable heat dissipation of electronic equipment can be realized, with the advantages of simple operation, quick replacement, remarkable heat dissipation effect, solve the problem that traditional electronic equipment is too complex, difficult to modify and improve later, and large in manpower and material resources.

[0023] For example, there can be cavity on the base, and the phase change material layer is formed by filling phase change material in the cavity, and the heat pipe is buried in the cavity to enhance the overall heat conduction performance of the module. On the one hand, the phase change material can absorb and store the heat from the heating equipment, achieving the effect of absorbing heat. On the other hand, the thermal conductivity of the phase change material is not high, and the heat pipe arranged around the phase change material can enhance the overall heat conduction performance of the phase change material module.

[0024] According to an embodiment of the utility model, the bottom surface of the base 1 is coated with thermal conductive silicone grease.

[0025] Therefore, the heat conduction performance between the heat dissipation device and the installation surface of the heating electronic equipment can be enhanced.

[0026] According to an embodiment of the utility model, the heat dissipation fan 5 is a centrifugal fan.

[0027] According to an embodiment of the utility model, the number of centrifugal fans is four.

[0028] According to an embodiment of the utility model, the fin 4 is a wave-shaped fin.

[0029] According to an embodiment of the utility model, the number of flow distributors 6 is four, and the four flow distributors 6 form a rectangular structure around the heat dissipation fan 5.

[0030] For example, one flow distributor is arranged at the outlet of each centrifugal fan.

[0031] Specifically, by installing 4 centrifugal fans, the fluid flow between the wave-shaped heat sinks can be enhanced. The centrifugal fan outlet has a flow diffuser, which can disperse the fan wind speed direction, enhance the inlet wind speed uniformity of the heat sink, and the heat sink spacing at different positions can be different to ensure that the fluid flow between all heat sinks is equivalent, ensuring that the heat dissipation effect of each fin is generally equivalent, thereby improving the uniform heat dissipation effect of the entire reinforced heat dissipation structure device.

[0032] According to an embodiment of the present application, the heat dissipation fan 5 is arranged at the center position of the base 1, and the heat sink 4 is arranged at the position around the base 1.

[0033] The embodiment of the present application further provides an electronic device, wherein the electronic device comprises the modular heat dissipation structure device described in the above embodiment, and the device is arranged outside the electronic device.

[0034] According to an embodiment of the present application, the base edge is provided with a threaded hole, and the threaded hole is matched with a screw to fix the base and the electronic device.

[0035] According to an embodiment of the present application, the base is fixed with the electronic device through curing glue.

[0036] That is, the threaded hole can be reserved at the base edge to match the screw installation and fixation, and the curing glue can be directly used for bonding fixation around the periphery, so that the device is convenient for use in multiple scenes.

[0037] Features described and / or shown with respect to one embodiment above can be used in one or more other embodiments in the same or similar manner, and / or in combination with or in place of features in other embodiments.

[0038] It should be emphasized that the term "comprises / comprising" as used herein indicates the presence of the stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.

[0039] The device and method above can be realized by hardware, or realized by hardware in combination with software. The present application relates to a computer readable program which, when executed by a logic component, can enable the logic component to realize the device or component described above, or enable the logic component to realize the various methods or steps described above. The present application also relates to a storage medium for storing the above program, such as a hard disk, a magnetic disk, an optical disk, a DVD, a flash memory, etc.

[0040] Many of the advantages of these embodiments are apparent from the detailed description and, thus, it is intended that the appended claims cover all such features and advantages of the embodiments. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the embodiments of the present application to the exact construction and operation described and illustrated, and accordingly, all suitable modifications and equivalents can be resorted to, falling within the scope of the application.

[0041] The portions of the present application not specifically described herein are well known to those skilled in the art.

Claims

1. A modular heat spreading structure apparatus, comprising: The device comprises a base, a phase change material layer, a heat pipe, a heat sink, a heat dissipation fan and a flow distributor, the phase change material layer is arranged on the base, the heat pipe is embedded in the phase change material layer, the heat dissipation fan and the heat sink are arranged on the phase change material layer, and the flow distributor is arranged around the heat dissipation fan.

2. The apparatus of claim 1, wherein, The bottom surface of the base is coated with a heat-conducting silicone grease.

3. The apparatus of claim 2, wherein, The heat dissipation fan is a centrifugal fan.

4. The apparatus of claim 3, wherein, The number of centrifugal fans is four.

5. The apparatus of claim 4, wherein, The heat sink is a wave-shaped heat sink.

6. The apparatus of claim 5, wherein, The number of flow distributors is four, and the four flow distributors form a rectangular structure around the heat dissipation fan.

7. The apparatus of claim 6, wherein, The heat dissipation fan is arranged at the center of the base, and the heat sink is arranged at the periphery of the base.

8. An electronic device, comprising: The electronic device comprises the modular heat dissipation structure device of any one of claims 1-7, and the device is arranged outside the electronic device.

9. The electronic device of claim 8, wherein, The edge of the base is provided with a threaded hole, which cooperates with a screw to fix the base and the electronic device.

10. The electronic device of claim 8, wherein, The base is fixed with the electronic device by curing glue.

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