Grinding system and chemical mechanical polishing equipment

Abstract

The utility model discloses a grinding system and chemical mechanical polishing equipment, specifically, the grinding system comprises at least two grinding lines which are arranged at intervals, the grinding lines are used for processing wafers, a maintenance channel is formed between the grinding lines which are arranged at intervals, the maintenance channel is provided with a loading mechanism, and the loading mechanism can move in the extension direction of the maintenance channel. Based on the arrangement, one side of the maintenance channel can form the entrance and exit and communicate with the outside, when the grinding system needs to be repaired or maintained, the loading mechanism can be moved to the side, away from the entrance and exit, of the maintenance channel, maintenance personnel can enter the maintenance channel from the outside through the entrance and exit, and maintenance of all devices in the grinding system is achieved; and maintenance and debugging of components in the equipment are facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to chemical mechanical polishing grinding technical field especially, relate to a kind of grinding system and chemical mechanical polishing equipment. BACKGROUND

[0002] Chemical mechanical polishing (CMP) is the key step of wafer manufacturing, which reduces the unevenness of wafer surface. The grinding system of the existing chemical mechanical polishing equipment generally does not have a channel for maintenance personnel to enter the interior of the equipment, which makes it difficult to maintain the equipment. For example, when repairing the grinding unit, the maintenance personnel need to stand with their heads down on the polishing pad to repair and replace it, which is inconvenient to operate and can easily damage the polishing pad and contaminate the grinding unit. In addition, the chemical mechanical polishing equipment has high requirements for the overall size of the equipment. If a maintenance channel is additionally created, the overall size of the equipment will be enlarged, which will increase the occupied space of the factory building and is not conducive to the overall layout of the production line. SUMMARY

[0003] The utility model aims at the technical problems existing in the background art and provides a grinding system, which includes at least two grinding lines. The grinding lines are used for processing wafers, and adjacent grinding lines are arranged at intervals to form a maintenance channel. The maintenance channel is provided with a loading mechanism, and the loading mechanism can move in the extension direction of the maintenance channel.

[0004] Further, the grinding lines are arranged on the upper and lower sides of the grinding system. The grinding line includes a machine base and a grinding unit arranged on the machine base. The machine base is provided with a connecting mechanism on one side wall facing the maintenance channel. The loading mechanism is connected with the connecting mechanism and can move relative to the connecting mechanism.

[0005] Further, the loading mechanism includes a loading table and a lifting piece. The lifting piece includes a lifting part and a connecting part. The lifting part is connected with the loading table, and the connecting part is connected with the connecting mechanism. The connecting part cooperates with the connecting mechanism to realize the movement of the lifting piece relative to the connecting mechanism. The lifting part is used to realize the lifting of the loading table.

[0006] Further, the loading table further includes a plurality of positioning parts arranged obliquely. The positioning parts are arranged on the side of the loading table to realize the positioning of the wafer.

[0007] Further, the grinding unit includes a polishing pad and a grinding assembly. The grinding assembly includes a support seat and a grinding head assembly connected with the support seat. The support seat is arranged on one side of the polishing pad, and the grinding head assembly is arranged above the polishing pad. The grinding head assembly can move transversely relative to the support seat to move towards the side of the polishing pad.

[0008] Further, the support base comprises a support portion arranged to extend outwardly, and the grinding head assembly comprises a connecting portion and a grinding head arranged below the connecting portion, and the connecting portion is connected with the support portion.

[0009] Further, a sliding groove is arranged on the support portion, a sliding rack is arranged in the sliding groove, and a sliding wheel is arranged on one side of the connecting portion in a protruding manner, and the sliding wheel is arranged in the sliding groove and connected with the sliding rack.

[0010] Further, the grinding unit further comprises a grinding table for carrying the grinding pad, and a liquid supply device, a grinding pad trimmer, a trimmer cleaner and a grinding pad cleaner arranged around the grinding table.

[0011] Further, the grinding line further comprises a cleaning mechanism arranged at the wafer loading station.

[0012] Further, the utility model also provides a chemical mechanical polishing equipment which comprises the grinding system of the utility model.

[0013] Compared with the prior art, the utility model has the following beneficial technical effects: the utility model forms a maintenance passage between the grinding lines arranged at intervals, and the loading mechanism is movably arranged in the maintenance passage, one side of the maintenance passage can form an entrance and communicate with the outside, when the grinding system needs to be maintained, the loading mechanism can be moved to the side of the maintenance passage away from the entrance, the maintenance personnel can enter the maintenance passage from the outside through the entrance, the maintenance of each device in the grinding system is realized, the components inside the equipment are convenient to maintain and debug, further, the utility model arranges the maintenance passage in the grinding system, and simultaneously uses the maintenance passage as the arrangement area and the moving area of the loading mechanism, so that the maintenance passage of the utility model does not occupy the additional space of the grinding system, that is, the utility model adds a maintenance passage for the maintenance personnel to maintain the equipment through reasonable layout, and the technical problem of difficult maintenance of the existing equipment is solved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a perspective view of the utility model;

[0015] Figure 2 It is a top view of the utility model;

[0016] Figure 3 It is a partial enlarged view of the utility model;

[0017] Figure 4 It is another partial enlarged view of the utility model. DETAILED DESCRIPTION

[0018] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other in the case of no conflict.

[0019] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or components indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0020] In the description of the utility model, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be specifically connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two components. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0021] The specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0022] As Figures 1-4 The utility model provides a kind of grinding system, including at least two interval setting grinding line 10, grinding line 10 is used to realize the processing and polishing of wafer, optionally, grinding line 10 can be set in the upper and lower sides of grinding system, maintenance passage 20 is formed between two grinding lines 10, in addition, grinding line 10 can also be set into several, several grinding lines 10 are arranged side by side and interval in grinding system, maintenance passage 20 is formed between interval setting grinding line 10, further, grinding system further includes loading mechanism 11, loading mechanism 11 is arranged in maintenance passage 20, and it can be moved in the extension direction of maintenance passage 20, to transport wafer to grinding line 10 and process and polish.

[0023] It can be understood that the utility model discloses a maintenance passage 20 is formed between the interval setting grinding line 10, and the loading mechanism 11 is movably arranged in maintenance passage 20, one side of maintenance passage 20 can form entrance 13 and communicate with the outside, when the grinding system needs to be maintained or maintained, the loading mechanism 11 can be moved to the side of maintenance passage 20 away from entrance 13, and the maintenance personnel can enter maintenance passage 20 from entrance 13 from the outside, realize the maintenance of each device in the grinding system, facilitate the maintenance debugging of the component inside the equipment, further, the utility model discloses that maintenance passage 20 is arranged in the grinding system, and simultaneously as the setting area and the moving area of loading mechanism 11, namely the maintenance passage 20 of the utility model discloses does not occupy the additional space of the grinding system. Based on the above setting, the utility model discloses a reasonable layout, under the condition of guaranteeing the overall volume of equipment unchanged, adds a maintenance passage 20 for the maintenance personnel to maintain the equipment, and solves the technical problem of difficult maintenance of the existing equipment.

[0024] Further, in some embodiments, the grinding line 10 includes a base 101 and a grinding unit 102 arranged on the base 101, the base 101 is used to carry the grinding unit 102, and the grinding unit 102 is used to receive the wafer from the loading mechanism 11 to realize the grinding of the wafer. Further, the base 101 is provided with a connecting mechanism 1011 on the side wall facing the maintenance passage 20, the loading mechanism 11 is connected with the connecting mechanism 1011 and can move relative to the connecting mechanism 1011. Optionally, the connecting mechanism 1011 can include a slide rail or a sliding chain or a transmission belt arranged on the side wall of the base 101. The loading mechanism 11 is connected with the connecting mechanism 1011 and driven by a driving member such as a motor to move along the side wall of the base 101, so as to realize the movement of the loading mechanism 11 in the extension direction of the maintenance passage 20.

[0025] Further, in some embodiments, the loading mechanism 11 includes a loading table 111 and a lifting member 112, the loading table 111 is used to carry the wafer, and the lifting member 112 is used to drive the loading table 111 to move up and down, and also serves as an intermediate component for connecting the loading table 111 with the connecting mechanism 1011. Optionally, the lifting member 112 includes a lifting part and a connecting part, the lifting part is connected with the loading table 111, and the connecting part is connected with the connecting mechanism 1011. The connecting part cooperates with the connecting mechanism 1011 to realize the movement of the lifting member 112 relative to the connecting mechanism 1011, and the lifting part is used to realize the lifting of the loading table 111.

[0026] Further, in some embodiments, the loading table 111 further includes a plurality of positioning parts arranged in an inclined manner, which can be smooth rod-shaped members arranged around the side of the loading table 111 to realize the positioning and guiding of the wafer.

[0027] Further, in some embodiments, the grinding unit 102 comprises a grinding pad 1021 and a grinding assembly 1022, the grinding assembly 1022 comprises a support base 10221 and a grinding head assembly 10222 connected with the support base 10221, the support base 10221 is arranged on one side of the grinding pad 1021, and the grinding head assembly 10222 is arranged above the grinding pad 1021, and the grinding head assembly 10222 is transversely movable relative to the support base 10221 to move the grinding head assembly 10222 towards the circumferential side of the grinding pad 1021. As an implementation, the grinding pad 1021 can form a feeding station and a maintenance station on both sides of the periphery thereof respectively, and the grinding head assembly 10222 can move back and forth between the feeding station and the maintenance station. Through the above arrangement, when the wafer is processed, the grinding head assembly 10222 can be controlled to move to the feeding station to realize feeding of the wafer, and after the grinding head assembly 10222 obtains the wafer, the grinding head assembly 10222 can move back to the grinding pad 1021 to realize processing and grinding of the wafer. When the grinding head assembly 10222 needs to be maintained and replaced, the grinding head assembly 10222 can be controlled to move to the maintenance station, and at this time, the maintenance personnel can maintain and replace the grinding head assembly 10222 on one side of the grinding pad 1021, which is convenient to operate. It can be understood that, based on the grinding unit 102 of the utility model, the maintenance personnel only need to be on one side of the grinding pad 1021 to realize maintenance and replacement of the grinding head assembly 10222, which is safe and convenient to operate, and solves the technical problem of the prior art that the maintenance personnel need to stand on the grinding pad to maintain and replace the grinding head assembly 10222, which is inconvenient to operate and can easily damage the grinding pad and pollute the grinding unit.

[0028] Further, in some embodiments, the support base 10221 comprises a support portion 10223 arranged to extend outwardly, the grinding head assembly 10222 comprises a connecting portion 10224 and a grinding head 10228 arranged below the connecting portion 10224, the connecting portion 10224 is connected with the support portion 10223, and optionally, the support portion 10223 is provided with a sliding groove 10225, the sliding groove 10225 is provided with a sliding rack 10226, and the connecting portion 10224 is provided with a sliding wheel 10227 on one side and arranged in the sliding groove 10225 and connected with the sliding rack 10226.

[0029] Further, in some embodiments, the polishing unit 102 further comprises a polishing table 1023 for carrying the polishing pad 1021, and a liquid supply device 1024, a pad conditioner 1025, a conditioner cleaner 1026 and a pad cleaner 1027 arranged around the periphery of the polishing table 1023, the liquid supply device 1024 cooperates with the pad conditioner 1025 to achieve conditioning of the polishing pad 1021, the conditioner cleaner 1026 is used to clean the pad conditioner 1025, and the pad cleaner 1027 is used to flush the polishing pad 1021 when the pad conditioner 1025 conditions the polishing pad 1021, so as to prevent conditioning residues from entering the wafer processing area and damaging the wafer.

[0030] Further, in some embodiments, the polishing line 10 further comprises a cleaning mechanism 12 arranged at the wafer loading station, which can be a cleaning ring arranged between the polishing head 10228 and the loading table 111, and the cleaning ring can spray cleaning liquid from both upper and lower ends to clean the wafer, specifically, when the wafer processing is completed, the polishing head 10228 can be moved to the loading station, at this time, the upper part of the cleaning mechanism 12 sprays cleaning liquid to achieve pre-cleaning of the lower surface of the wafer, and then the wafer is placed on the loading table 111, at this time, the lower part of the cleaning mechanism 12 sprays cleaning liquid to achieve pre-cleaning of the upper surface of the wafer.

[0031] Further, the utility model also provides a chemical mechanical polishing equipment, including the polishing system of the utility model.

[0032] The above is one or more embodiments provided in combination with specific content, and the specific implementation of the utility model is not limited to these descriptions. Any approximation, similarity or replacement of the method and structure of the utility model, or any technical deduction or replacement under the concept of the utility model, should be regarded as the protection scope of the utility model.

Claims

1. A polishing system comprising at least two polishing lines (10) for processing wafers, characterized in that, Adjacent grinding lines (10) are spaced apart to form a maintenance channel (20), which is provided with a loading mechanism (11) that can move in the extension direction of the maintenance channel (20).

2. The grinding system according to claim 1, characterized in that, The grinding line (10) is arranged on the upper and lower sides of the grinding system. The grinding line (10) includes a base (101) and a grinding unit (102) arranged on the base (101). The base (101) has a connecting mechanism (1011) on one side wall facing the maintenance channel (20). The loading mechanism (11) is connected to the connecting mechanism (1011) and can move relative to the connecting mechanism (1011).

3. The grinding system according to claim 2, characterized in that, The loading mechanism (11) includes a loading platform (111) and a lifting component (112). The lifting component (112) includes a lifting part and a connecting part. The lifting part is connected to the loading platform (111), and the connecting part is connected to the connecting mechanism (1011). The connecting part cooperates with the connecting mechanism (1011) to realize the movement of the lifting component (112) relative to the connecting mechanism (1011). The lifting part is used to realize the lifting of the loading platform (111).

4. A grinding system according to claim 3, characterized in that, The loading stage (111) also includes several protruding and inclined positioning parts, which are arranged around the loading stage (111) to achieve the positioning function of the wafer.

5. A grinding system according to claim 2, characterized in that, The grinding unit (102) includes a grinding pad (1021) and a grinding assembly (1022). The grinding assembly (1022) includes a support base (10221) and a grinding head assembly (10222) connected to the support base (10221). The support base (10221) is disposed on one side of the grinding pad (1021), and the grinding head assembly (10222) is disposed above the grinding pad (1021). The grinding head assembly (10222) can move laterally relative to the support base (10221) so that the grinding head assembly (10222) moves toward the circumferential direction of the grinding pad (1021).

6. A grinding system according to claim 5, characterized in that, The support base (10221) includes an outwardly extending support portion (10223), and the grinding head assembly (10222) includes a connecting portion (10224) and a grinding head (10228) disposed below the connecting portion (10224). The connecting portion (10224) is connected to the support portion (10223).

7. A grinding system according to claim 6, characterized in that, The support part (10223) is provided with a sliding groove (10225), and a sliding rack (10226) is provided in the sliding groove (10225). The connecting part (10224) has a sliding wheel (10227) protruding on one side. The sliding wheel (10227) is provided in the sliding groove (10225) and is connected to the sliding rack (10226).

8. A grinding system according to claim 5, characterized in that, The grinding unit (102) also includes a grinding table (1023) for carrying the grinding pad (1021) and a liquid supply device (1024), a grinding pad trimmer (1025), a trimmer cleaner (1026), and a grinding pad cleaner (1027) disposed around the grinding table (1023).

9. A grinding system according to claim 1, characterized in that, The grinding line (10) also includes a cleaning mechanism (12), which is located at the wafer loading station.

10. A chemical mechanical polishing apparatus, characterized in that, Includes the grinding system described in any one of claims 1-9.

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