Film pasting device for wafer thinning
The automated wafer thinning lamination device solves the problem of uneven lamination caused by manual lamination, achieving uniform lamination and improving wafer quality and production efficiency.
Patent Information
- Application Number
- CN202423162597.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-20
AI Technical Summary
During manual film application, uneven film tension can lead to uneven film application, which can easily cause air bubbles and wrinkles, affecting wafer quality and the reliability of subsequent processing.
An automated wafer thinning lamination device is used, including a base, a dicing table, a U-shaped frame, guide rollers, pressure rollers, limit rollers, and moving components. Through the coordinated action of a rotary motor, cylinders, and sensors, the lamination is automatically pulled out, pressed, and bonded, ensuring that the lamination is uniformly bonded to the wafer surface.
It improves the flatness and adhesion of wafer film, reduces bubbles and wrinkles, enhances the reliability and yield of subsequent wafer processing, shortens film application time, and improves production efficiency.
Smart Images
Figure CN223701697U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to wafer thinning film pasting technical field, specifically point wafer thinning film pasting device. BACKGROUND
[0002] In the wafer thinning process, in order to protect the wafer from damage in subsequent processing procedures (such as cutting, handling, etc.), a protective film needs to be pasted on the wafer surface. The traditional film pasting method mainly relies on manual operation. The operator manually pulls out the film, presses it tightly on the cutting table, and then manually pushes the pressure roller to press the film tightly on the cutting table, so that the film covers the wafer. Finally, a scribing tool is used to go around the wafer once, and the excess film is scribed along the edge of the wafer.
[0003] This manual film pulling-out method cannot guarantee that the pulling force or pressure is uniform every time the film is pasted. Uneven stress can cause the film to deform, the film pasting uniformity is uneven, and defects such as bubbles and wrinkles occur, affecting the quality of the wafer and the reliability of subsequent processing. SUMMARY
[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a wafer thinning film pasting device, which effectively solves the problem that manual film pulling-out is prone to uneven stress, resulting in bubbles and wrinkles.
[0005] In order to achieve the above functions, the utility model adopts the following technical scheme: a wafer thinning film pasting device, comprising a base, a cutting table is arranged in the base, a U-shaped rack is movably arranged in the base, the cutting table is located in the rack, a guide roller is arranged at the rear side of the rack, a pressure roller is arranged at the front side of the rack, a moving assembly is arranged at the bottom of the rack, a limiting roller is further arranged beside the pressure roller on the rack, and the film is pressed between the pressure roller and the limiting roller and is sent to the cutting table by the moving assembly.
[0006] Preferably, a pressing assembly is arranged between the limiting roller and the rack; the pressing assembly comprises a rotary motor, a connecting shaft and a connecting plate, the rotary motor is fixed on the outer side of the rack, the output end of the rotary motor is fixedly connected with the connecting shaft, one end of the connecting shaft is fixedly connected with the connecting plate, and the limiting roller is fixed at the bottom of the connecting plate; the limiting roller and the pressure roller rotate coaxially, and the limiting roller is located outside the pressure roller.
[0007] Preferably, a pressing plate is arranged in front of the pressure roller on the rack, a fixed block is fixed on the inner side of the rack, a second air cylinder is fixed on the fixed block, and the top of the second air cylinder is fixedly connected with the bottom of the pressing plate.
[0008] Preferably, the moving assembly comprises a threaded rod, a limiting rod, a limiting groove and a driving motor, the limiting groove is arranged in the base and located on both sides of the cutting table, the rack bottom is slidably arranged on the limiting groove, the threaded rod is rotatably arranged in the limiting groove and threadedly connected with the rack, the driving motor fixedly connected with one end of the threaded rod is fixed on the outer side of the base, and the limiting rod is arranged in the limiting groove away from the threaded rod and fixed on the inner side of the limiting groove.
[0009] Preferably, the lifting cylinder is fixed on the top of the rack above the compression roller, the movable end of the bottom of the lifting cylinder is fixedly connected with a horizontal top plate, the pressure regulating cylinder is fixed on both sides of the top plate, the movable end of the bottom of the pressure regulating cylinder is fixedly connected with a side plate, and the compression roller is fixed on the outer side of the side plate.
[0010] Preferably, the infrared sensor is arranged on the outer side of the front end of the cutting table.
[0011] The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 1 ;
[0013] Figure 2 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 2 ;
[0014] Figure 3 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 3 ;
[0015] Figure 4 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 4 ;
[0016] Figure 5 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 1 ;
[0017] Figure 6 The wafer thinning film pasting device has the beneficial effects that: the wafer is automatically pulled, pressed and pasted, the film is uniformly pasted on the wafer surface in the pasting process, the quality problems such as bubbles and wrinkles are effectively avoided, the flatness and the adhesion after the wafer is pasted are improved, the reliability and the yield in the subsequent processing process are improved, compared with the traditional manual pasting method, the pasting time of a single wafer is shortened, and the production efficiency is improved. Figure 2 .
[0018] Wherein, 1, base, 2, cutting table, 3, rack, 4, moving assembly, 5, guide roller, 6, compression roller, 7, limit roller, 8, compression assembly, 9, rotary motor, 10, connecting shaft, 11, connecting plate, 12, pressing plate, 13, cylinder two, 14, threaded rod, 15, limit rod, 16, limit groove, 17, drive motor, 18, lifting cylinder, 19, top plate, 20, pressure regulating cylinder, 21, side plate, 22, infrared sensor, 23, fixed block. DETAILED DESCRIPTION
[0019] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance. The present application will be further described in detail below in conjunction with the drawings.
[0021] As Figures 1-6 shown, the wafer thinning film device provided by the present application comprises a base 1, a cutting table 2 is arranged in the base 1, a U-shaped rack 3 is movably arranged in the base 1, the cutting table 2 is located in the rack 3, a guide roller 5 is arranged at the rear side of the rack 3, a compression roller 6 is arranged at the front side of the rack 3, and the film is conveyed to the lower side of the compression roller 6 through the guide roller 5;
[0022] As Figure 4As shown, the bottom of the rack 3 is provided with a moving assembly 4, which drives the rack 3 to move forward and backward relative to the cutting table 2. A limiting roller 7 is further provided on the rack 3 beside the compression roller 6. The film to be pressed is sent to the cutting table 2 by the moving assembly 4 between the compression roller 6 and the limiting roller 7. The moving assembly 4 includes a threaded rod 14, a limiting rod 15, a limiting groove 16 and a driving motor 17. The limiting groove 16 is arranged in the base 1 and located on both sides of the cutting table 2. The bottom of the rack 3 is slidably arranged on the limiting groove 16. The threaded rod 14 is rotatably arranged in the limiting groove 16 and threadedly connected with the rack 3. The driving motor 17 is fixedly connected with one end of the threaded rod 14 on the outer side of the base 1. The limiting rod 15 is arranged in the limiting groove 16 on the side away from the threaded rod 14 and penetrates through the rack 3 and is fixed on the inner side of the limiting groove 16. The driving motor 17 drives the threaded rod 14 to rotate, and the threaded rod 14 drives the rack 3 to move, thereby driving the compression plate 12 and the compression roller 6 to move as a whole.
[0023] As shown in Figure 6 , a pressing assembly 8 is arranged between the limiting roller 7 and the rack 3. The pressing assembly 8 includes a rotating motor 9, a connecting shaft 10 and a connecting plate 11. The rotating motor 9 is fixed on the outer side of the rack 3. The connecting shaft 10 is fixedly connected with the output end of the rotating motor 9. The connecting plate 11 is fixedly connected with one end of the connecting shaft 10. The limiting roller 7 is fixed on the bottom of the connecting plate 11. The limiting roller 7 and the compression roller 6 are coaxially rotatable. The limiting roller 7 is located outside the compression roller 6. The film to be pressed is pressed between the bottom of the compression roller 6 and the limiting roller 7. The rotating motor 9 drives the connecting shaft 10 and the connecting plate 11 to rotate, thereby driving the limiting roller 7 to rotate.
[0024] As shown in Figure 3 , 4 , 5, 6, a lifting cylinder 18 is fixed on the top of the rack 3 above the compression roller 6. A horizontal top plate 19 is fixedly connected with the movable end of the lifting cylinder 18 at the bottom. Pressure regulating cylinders 20 are fixed on both sides of the top plate 19. Side plates 21 are fixedly connected with the movable ends of the pressure regulating cylinders 20 at the bottom. The compression roller 6 is fixed on the outer side of the side plates 21. The lifting cylinder 18 drives the compression roller 6 to move downward, so that the roller can contact or separate from the film material and the wafer during the film pasting process. The pressure regulating cylinders 20 are used to accurately control the pressure applied on the roller, so as to ensure that the roller has a suitable extrusion force on the film material and the wafer during the film pasting, so that the film can be flatly pasted on the surface of the wafer. The pressure adjusting range can be set according to the requirements of the film.
[0025] As shown in Figure 3 , 5As shown in FIG. 6, the frame 3 is provided with a pressing plate 12 in front of the pressing roller 6, the inner side of the frame 3 is fixed with a fixed block 23, the fixed block 23 is fixed with a cylinder 13, the top of the cylinder 13 is fixedly connected to the bottom of the pressing plate 12, the cylinder 13 drives the pressing plate 12 to move downward, the pressing plate 12 presses the front end of the film on the cutting table 2, and the pressing plate 12 is retracted after pressing the film, the moving assembly 4 drives the frame 3 to move as a whole, thereby driving the pressing roller 6 to move, the pressing roller 6 presses the film on the cutting table 2, and the infrared sensor 22 is installed on the outer side of the front end of the cutting table 2, when the fixed block 23 moves to the position of the infrared sensor 22, the cylinder 13 drives the pressing plate 12, the lifting cylinder 18 and the pressure regulating cylinder 20 to control the pressing roller 6 to press the film downward.
[0026] In specific use, the wafer is placed on the cutting table 2, the film is pulled out from the film roll and placed above the limiting roller 7 and below the pressing roller 6 through the guide rollers 5, the rotating motor 9 is started, the rotating motor 9 drives the connecting shaft 10 and the connecting plate 11 to rotate, thereby driving the limiting roller 7 to rotate along the periphery of the pressing roller 6, the film is pressed between the limiting roller 7 and the pressing roller 6, the driving motor 17 drives the threaded rod 14 to rotate, the threaded rod 14 drives the frame 3 to move on the limiting groove 16, thereby driving the pressing plate 12 and the pressing roller 6 to move as a whole, the film is pulled out to the cutting table 2, when moving to the position of the infrared sensor, the fixed block 23 blocks the infrared sensor, the control system controls the cylinder 13 to drive the pressing plate 12 to move downward, the film is pressed on the cutting table 2, and the lifting cylinder 18 presses the film after being retracted, the moving assembly 4 is reversely moved again to drive the pressing roller 6 to press the film on the wafer, thereby realizing automatic film pasting of the wafer.
[0027] The above describes the present application and its embodiments, which are not limited, and the embodiments shown in the drawings are only one of the embodiments of the present application, and the actual structure is not limited thereto. In general, if a person skilled in the art is inspired, without departing from the creative purpose of the present application, without creative design, similar structure and embodiments of the technical scheme are not included in the protection scope of the present application.
Claims
1. A wafer thinning lamination device, characterized in that: Includes a base (1), a cutting table (2) is provided inside the base (1), a U-shaped frame (3) is movably provided inside the base (1), the cutting table (2) is located inside the frame (3), a guide roller (5) is provided on the rear side of the frame (3), and a pressure roller (6) is provided on the front side of the frame (3). The bottom of the frame (3) is provided with a moving component (4), and a limiting roller (7) is also provided on the frame (3) next to the pressure roller (6). The film is pressed between the pressure roller (6) and the limiting roller (7) and is sent to the cutting table (2) by the moving component (4).
2. The wafer thinning lamination apparatus according to claim 1, characterized in that: A clamping assembly (8) is provided between the limiting roller (7) and the frame (3); the clamping assembly (8) includes a rotary motor (9), a connecting shaft (10) and a connecting plate (11). The rotary motor (9) is fixed on the outer side of the frame (3). The output end of the rotary motor (9) is fixedly connected to the connecting shaft (10). One end of the connecting shaft (10) is fixed to the connecting plate (11). The limiting roller (7) is fixed at the bottom of the connecting plate (11). The limiting roller (7) and the pressure roller (6) rotate coaxially, and the limiting roller (7) is located outside the pressure roller (6).
3. The wafer thinning film application device according to claim 2, characterized in that: A pressure plate (12) is provided on the frame (3) in front of the pressure roller (6). A fixing block (23) is fixed on the inner side of the frame (3). A cylinder (13) is fixed on the fixing block (23). The top of the cylinder (13) is fixedly connected to the bottom of the pressure plate (12).
4. The wafer thinning film application device according to claim 3, characterized in that: The moving component (4) includes a threaded rod (14), a limiting rod (15), a limiting groove (16), and a drive motor (17). The limiting groove (16) is located in the base (1) and on both sides of the cutting table (2). The bottom of the frame (3) is slidably mounted on the limiting groove (16). The threaded rod (14) is rotatably mounted in the limiting groove (16) and threadedly connected to the frame (3). The drive motor (17) is fixedly connected to one end of the threaded rod (14) on the outer side of the base (1). The limiting rod (15) is located in the limiting groove (16) on the side away from the threaded rod (14) and passes through the frame (3) and is fixed on the inner side of the limiting groove (16).
5. The wafer thinning film application device according to claim 4, characterized in that: A lifting cylinder (18) is fixed at the top of the frame (3) above the pressure roller (6). A horizontal top plate (19) is fixedly connected to the movable end of the bottom of the lifting cylinder (18). Pressure regulating cylinders (20) are fixed on both sides of the top plate (19). A side plate (21) is fixedly connected to the movable end of the bottom of the pressure regulating cylinder (20). The pressure roller (6) is fixed on the outer surface of the side plate (21).
6. The wafer thinning film application apparatus according to claim 5, characterized in that: An infrared sensor (22) is installed on the outer surface of the front end of the cutting table (2).