Air cooling heat dissipation mechanism of gold stamping die-cutting machine

Abstract

The utility model discloses an air cooling heat dissipation mechanism of a gilding die-cutting machine, which comprises a gilding die-cutting machine body, a cold water tank, an adapter plate, an air cooling mechanism, a first branch pipe, a second branch pipe, a semiconductor refrigeration assembly and an up-down swinging mechanism, the gilding die-cutting machine body is provided with a gilding assembly and a die-cutting tool, the cold water tank is positioned on the rear side of the gilding die-cutting machine body, and the adapter plate is positioned on the back side of the gilding die-cutting machine body. The cold water tank is filled with water flow, the air cooling mechanism penetrates through the cold water tank, the first branch pipe is fixedly connected with the upper end of the air cooling mechanism, a plurality of first air blowing nozzles pointing to the die cutting tool are installed on the first branch pipe, the second branch pipe is rotationally connected with the upper end of the air cooling mechanism, and a plurality of second air blowing nozzles pointing to the gold stamping assembly are installed on the second branch pipe. A plurality of semiconductor refrigeration assemblies inserted into the cold water tank are installed on the side face of the cold water tank, and an up-down swinging mechanism used for driving the second branch pipe to swing up and down is installed on the cold water tank. According to the hot stamping die-cutting machine, cold air is used for assisting heat dissipation of heating components of the hot stamping die-cutting machine, the heat dissipation effect is better, and overheating is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to a gilding die cutting machine technical field especially relates to a gilding die cutting machine's air cooling heat abstractor. BACKGROUND

[0002] The gilding die cutting machine is a kind of common printing equipment, and its main function is to carry out gilding and die cutting processing on paper, plastic, cloth and other materials to realize the decoration and processing of printed matter.

[0003] The gilding part and die cutting part of the gilding die cutting machine will generate a lot of heat when continuously used for a long time, and the existing gilding die cutting machine is naturally cooled by external air, and when high temperature is encountered in summer, the heat dissipation efficiency is greatly reduced, and overheating phenomenon is likely to occur, which needs to be cooled down, and the production is affected, therefore, in view of the above status, it is urgent to develop a kind of air cooling heat abstractor of gilding die cutting machine, which is better in heat dissipation effect and prevents overheating, to overcome the shortcomings in current actual application and meet the current demand. UTILITY MODEL CONTENTS

[0004] The utility model is provided with a kind of air cooling heat abstractor of gilding die cutting machine to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] An air cooling heat abstractor of gilding die cutting machine, including gilding die cutting machine body, cold water tank, adapter plate, air cooling mechanism, first branch pipe, second branch pipe, semiconductor refrigeration assembly and up-down swing mechanism, the gilding die cutting machine body is provided with gilding assembly and die cutting cutter, the cold water tank is located at the back side of gilding die cutting machine body, the cold water tank is filled with water flow, the air cooling mechanism passes through the cold water tank, the first branch pipe is fixedly connected with the upper end of air cooling mechanism, a plurality of first air blow nozzles pointing to die cutting cutter are installed on the first branch pipe, the second branch pipe is rotatably connected with the upper end of air cooling mechanism, a plurality of second air blow nozzles pointing to gilding assembly are installed on the second branch pipe, a plurality of semiconductor refrigeration assemblies inserted into the inside of the cold water tank are installed on the side of the cold water tank, the up-down swing mechanism for driving the second branch pipe to swing up and down is installed on the cold water tank, the up-down swing mechanism includes electric telescopic rod, rack and pinion, the electric telescopic rod is fixed on the side of the cold water tank, the telescopic end of the electric telescopic rod is fixed with the rack, the rack is provided with pinion meshing with it on one side, and the pinion is fixed on the second branch pipe.

[0007] Preferably, the adapter plate is fixed with the cold water tank, and the second branch pipe is rotatably connected with the adapter plate.

[0008] Preferably, the air cooling mechanism comprises a heat exchange pipe, a mounting cylinder, a fan and a shunt pipe, the heat exchange pipe is located in the cold water tank, a mounting cylinder in communication with the heat exchange pipe is fixed to the left end of the heat exchange pipe, the fan is installed in the mounting cylinder, a shunt pipe in communication with the heat exchange pipe is fixed to the upper end of the heat exchange pipe, the first branch pipe is fixedly connected with one end of the shunt pipe, and the end of the second branch pipe is inserted into the shunt pipe and rotationally connected with the shunt pipe.

[0009] Preferably, the semiconductor refrigeration assembly comprises a base plate, heat exchange fins, a semiconductor refrigeration fin and a heat dissipation fin, the base plate is fixed to the side of the cold water tank, a plurality of heat exchange fins inserted into the cold water tank are fixed to the base plate, the cold end of the semiconductor refrigeration fin is fixed to the base plate, and the heat dissipation fin is fixed to the hot end of the semiconductor refrigeration fin.

[0010] Preferably, the heat exchange pipe, the base plate, the heat exchange fin and the heat dissipation fin are all made of copper.

[0011] Preferably, a plug is detachably mounted on the top of the cold water tank through screw threads.

[0012] The gilding die cutting machine has the advantages that: the gilding die cutting machine is used, the base plate and the heat exchange fin are refrigerated by the semiconductor refrigeration fin, the water flow in the cold water tank is refrigerated and cooled by the heat exchange fin, meanwhile, the fan blows air into the heat exchange pipe, the air flow in the heat exchange pipe is refrigerated and cooled by the cold water in the cold water tank, then, the cold air enters the first branch pipe and the second branch pipe through the shunt pipe, the cold air is blown out through the first air blowing nozzle to cool and heat dissipate the die cutting tool, the cold air is blown out through the second air blowing nozzle to cool and heat dissipate the gilding assembly, meanwhile, the electric telescopic rod drives the rack to move up and down, the rack drives the gear to rotate back and forth, the gear drives the second branch pipe and the second air blowing nozzle to rotate back and forth, so that the second air blowing nozzle blows and heat dissipates the gilding assembly more uniformly. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a front structure schematic view of the utility model.

[0014] Figure 2 It is a back structure schematic view of the utility model.

[0015] Figure 3 It is a part structure schematic view of the utility model Figure 1 .

[0016] Figure 4 It is an inside view of the cold water tank in the utility model.

[0017] Figure 5 It is a part structure schematic view of the utility modelFigure 2 .

[0018] Legend:

[0019] 1, gilding die-cutting machine body; 101, gilding assembly; 102, die-cutting tool; 2, cold water tank; 201, plug; 3, adapter plate; 4, air cooling mechanism; 401, heat exchange pipe; 402, mounting cylinder; 403, fan; 404, shunt pipe; 5, first branch pipe; 501, first air blowing nozzle; 6, second branch pipe; 601, second air blowing nozzle; 7, semiconductor refrigeration assembly; 701, base plate; 702, heat exchange sheet; 703, semiconductor refrigeration sheet; 704, heat dissipation fin; 8, up-down swinging mechanism; 801, electric telescopic rod; 802, rack; 803, gear; 9, switch button. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0021] Specific embodiments are given below.

[0022] Reference Figures 1-5 In the embodiments of the present application, an air cooling and heat dissipation mechanism of a gilding die-cutting machine comprises a gilding die-cutting machine body 1, a cold water tank 2, an adapter plate 3, an air cooling mechanism 4, a first branch pipe 5, a second branch pipe 6, a semiconductor refrigeration assembly 7, and an up-down swinging mechanism 8. The gilding die-cutting machine body 1 is provided with a gilding assembly 101 and a die-cutting tool 102. The cold water tank 2 is located at the rear side of the gilding die-cutting machine body 1. The cold water tank 2 is filled with water flow. The air cooling mechanism 4 passes through the cold water tank 2. The first branch pipe 5 is fixedly connected with the upper end of the air cooling mechanism 4. The first branch pipe 5 is provided with a plurality of first air blowing nozzles 501 pointing to the die-cutting tool 102. The second branch pipe 6 is rotatably connected with the upper end of the air cooling mechanism 4. The second branch pipe 6 is provided with a plurality of second air blowing nozzles 601 pointing to the gilding assembly 101. The adapter plate 3 is fixed with the cold water tank 2. The second branch pipe 6 is rotatably connected with the adapter plate 3. A plurality of semiconductor refrigeration assemblies 7 are inserted into the cold water tank 2. The up-down swinging mechanism 8 is installed on the cold water tank 2 for driving the second branch pipe 6 to swing up and down.

[0023] The air cooling mechanism 4 comprises a heat exchange pipe 401, a mounting cylinder 402, a fan 403 and a shunt pipe 404, the heat exchange pipe 401 is located in the cold water tank 2, the left end of the heat exchange pipe 401 is fixed with the mounting cylinder 402 which is communicated with the heat exchange pipe 401, the fan 403 is mounted in the mounting cylinder 402, the upper end of the heat exchange pipe 401 is fixed with the shunt pipe 404 which is communicated with the heat exchange pipe 401, the first branch pipe 5 is fixedly connected with one end of the shunt pipe 404, the end of the second branch pipe 6 is inserted into the shunt pipe 404 and is rotatably connected with the shunt pipe 404, in use, air is blown into the heat exchange pipe 401 by the fan 403, and the air is then delivered into the first branch pipe 5 and the second branch pipe 6.

[0024] The top of the cold water tank 2 is detachably mounted with a plug 201 by screwing, and the cold water tank 2 can be added with water flow by detaching the plug 201.

[0025] The semiconductor refrigeration assembly 7 comprises a base plate 701, heat exchange fins 702, a semiconductor refrigeration fin 703 and a heat dissipation fin 704, the base plate 701 is fixed on the side of the cold water tank 2, a plurality of heat exchange fins 702 are fixed on the base plate 701 and are inserted into the cold water tank 2, the cold end of the semiconductor refrigeration fin 703 is fixed with the base plate 701, and the heat dissipation fin 704 is fixed on the hot end of the semiconductor refrigeration fin 703, in use, the base plate 701 and the heat exchange fins 702 are refrigerated by the semiconductor refrigeration fin 703, and the water flow in the cold water tank 2 is refrigerated and cooled by the heat exchange fins 702.

[0026] The up-down swinging mechanism 8 comprises an electric telescopic rod 801, a rack 802 and a gear 803, the electric telescopic rod 801 is fixed on the side of the cold water tank 2, the telescopic end of the electric telescopic rod 801 is fixed with the rack 802, the rack 802 is provided with the gear 803 which is engaged with the rack 802, and the gear 803 is fixed on the second branch pipe 6, in use, the rack 802 is driven to move up and down by the electric telescopic rod 801, the gear 803 is driven to rotate back and forth by the up-down movement of the rack 802, the second branch pipe 6 and the second air blowing nozzle 601 are driven to rotate back and forth by the gear 803, so that the air blowing and heat dissipation of the second air blowing nozzle 601 to the gold stamping assembly 101 are more uniform.

[0027] The heat exchange pipe 401, the base plate 701, the heat exchange fin 702 and the heat dissipation fin 704 are all made of copper, so that they have good heat conductivity.

[0028] A plurality of switch buttons 9 are mounted on the cold water tank 2.

[0029] Working principle: the air cooling heat dissipation mechanism of the gilding die cutting machine, when in use, the base plate 701 and the heat exchange sheet 702 are cooled by the semiconductor refrigerating sheet 703, the water flow in the cold water tank 2 is cooled by the heat exchange sheet 702, at the same time, the hot air is blown into the heat exchange pipe 401 by the fan 403, the air flow in the heat exchange pipe 401 is cooled by the cold water in the cold water tank 2, then the cold air enters into the first branch pipe 5 and the second branch pipe 6 through the shunt pipe 404, the cold air is blown out by the first blowing nozzle 501 to cool the die cutting cutter 102, the cold air is blown by the second blowing nozzle 601 to cool the gilding assembly 101, at the same time, the rack 802 is driven to move up and down by the electric telescopic rod 801, the gear 803 is driven to rotate back and forth by the rack 802 moving up and down, the second branch pipe 6 and the second blowing nozzle 601 are driven to rotate back and forth by the gear 803, so that the blowing and heat dissipation of the second blowing nozzle 601 to the gilding assembly 101 are more uniform.

[0030] In addition, it should be noted that, in the description of the present application, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection, it can be direct connection, or indirect connection through intermediate medium, it can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A mechanism for air cooling and heat dissipation of a gilding die-cutting machine, characterized in that, The gilding die-cutting machine body (1) is provided with a gilding assembly (101) and a die-cutting tool (102), the cold water tank (2) is located at the rear side of the gilding die-cutting machine body (1), the cold water tank (2) is filled with water flow, the air cooling mechanism (4) passes through the cold water tank (2), the first branch pipe (5) is fixedly connected with the upper end of the air cooling mechanism (4), a plurality of first air blowing nozzles (501) pointing to the die-cutting tool (102) are installed on the first branch pipe (5), the second branch pipe (6) is rotatably connected with the upper end of the air cooling mechanism (4), a plurality of second air blowing nozzles (601) pointing to the gilding assembly (101) are installed on the second branch pipe (6), a plurality of semiconductor refrigeration assemblies (7) are inserted into the cold water tank (2), the upper and lower swing mechanism (8) for driving the second branch pipe (6) to swing up and down is installed on the cold water tank (2), the upper and lower swing mechanism (8) comprises an electric telescopic rod (801), a rack (802) and a gear (803), the electric telescopic rod (801) is fixed to the side of the cold water tank (2), the telescopic end of the electric telescopic rod (801) is fixed with the rack (802), one side of the rack (802) is provided with a gear (803) engaged therewith, and the gear (803) is fixed to the second branch pipe (6).

2. The air-cooled heat radiation mechanism of the gilding die-cutting machine according to claim 1, wherein The adapter plate (3) is fixed with the cold water tank (2), and the second branch pipe (6) is rotatably connected with the adapter plate (3).

3. The air-cooled heat dissipating mechanism of the gilding die-cutting machine according to claim 1, characterized in that, The air cooling mechanism (4) comprises a heat exchange pipe (401), a mounting cylinder (402), a fan (403) and a shunt pipe (404), the heat exchange pipe (401) is located in the cold water tank (2), the left end of the heat exchange pipe (401) is fixedly connected with the mounting cylinder (402) in communication, the fan (403) is installed in the mounting cylinder (402), the upper end of the heat exchange pipe (401) is fixedly connected with the shunt pipe (404) in communication, one end of the shunt pipe (404) is fixedly connected with the first branch pipe (5), and the end of the second branch pipe (6) is inserted into the shunt pipe (404) and rotatably connected therewith.

4. The air-cooled heat radiation mechanism of the gilding die-cutting machine according to claim 3, wherein The semiconductor refrigeration assembly (7) comprises a substrate (701), a heat exchange sheet (702), a semiconductor refrigeration sheet (703) and a heat dissipation fin (704), the substrate (701) is fixed to the side of the cold water tank (2), a plurality of heat exchange sheets (702) inserted into the cold water tank (2) are fixed on the substrate (701), the cold end of the semiconductor refrigeration sheet (703) is fixed with the substrate (701), and the hot end of the semiconductor refrigeration sheet (703) is fixed with the heat dissipation fin (704).

5. The air-cooled heat dissipating mechanism of the gilding die-cutting machine according to claim 4, wherein, The heat exchange pipe (401), the substrate (701), the heat exchange sheet (702) and the heat dissipation fin (704) are all made of copper.

6. The air cooling mechanism of the gilding die-cutting machine according to claim 1, wherein The top of the cold water tank (2) is detachably provided with a plug (201) through threads.

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