Cover body assembly of reaction cavity and wafer processing device

Abstract

The utility model discloses a cover body assembly of a reaction cavity and a wafer processing device, and the cover body assembly comprises a cover body which is used for covering an opening in a sealing manner, and when the cover body covers the opening, the reaction cavity can be configured to be in a vacuum state; an air inlet hole communicated with the reaction cavity is formed in the cover body in a penetrating manner, and is used for enabling air to enter the reaction cavity in a vacuum state; the air flow adjusting assembly is communicated with the air inlet hole and is used for adjusting the air inlet rate of air entering the reaction cavity through the air inlet hole. The situation that parts in the reaction cavity are damaged due to the fact that the airflow rate is too large in the atmosphere breaking process is prevented, and meanwhile the atmosphere breaking operation difficulty is lowered.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor, and more particularly to a cover assembly of a reaction cavity and a wafer processing device. BACKGROUND

[0002] In the process of semiconductor manufacturing, a reaction cavity with negative pressure is used in multiple processes. A wafer is placed in the reaction cavity, and the reaction cavity is adjusted to a negative pressure state. The wafer is processed by a process such as but not limited to chemical vapor deposition. In the process of finding the leakage source of the reaction cavity or locally vacuumizing the reaction cavity, the atmosphere of the reaction cavity with negative pressure needs to be broken to make the pressure of the reaction cavity reach the atmospheric pressure.

[0003] The existing reaction cavity is provided with a flange plate with an air inlet channel on the side wall, and an acrylic vacuum cover plate is arranged on the top. The flange plate is sealed and connected with a concentric positioning ring by a clamp. The current breaking atmosphere mode is to remove the concentric positioning ring from the flange plate, release the atmosphere into the reaction cavity, and then manually remove the vacuum cover plate. However, the existing breaking atmosphere mode is prone to problems such as excessive air flow rate and damage to the components in the reaction cavity. In addition, it is difficult to remove the concentric positioning ring from the flange plate, which makes the breaking atmosphere operation complex. Furthermore, it is impossible to monitor when the pressure in the reaction cavity reaches the atmospheric pressure, and there is a risk of slipping when manually removing the vacuum cover plate. CONTENT OF THE UTILITY MODEL

[0004] In order to solve the above problems, the present application is proposed. According to an aspect of the present application, a cover assembly of a reaction cavity is provided. The reaction cavity is used to accommodate a wafer and has an opening. The cover assembly comprises:

[0005] a cover body used to seal the opening, when the cover body covers the opening, the reaction cavity can be configured to a vacuum state; an air inlet hole is arranged through the cover body and communicates with the reaction cavity, the air inlet hole is used to make air enter the reaction cavity in the vacuum state; and

[0006] an air flow adjusting assembly communicating with the air inlet hole, the air flow adjusting assembly is used to adjust the air inlet rate of the air entering the reaction cavity through the air inlet hole.

[0007] In some embodiments of the present application, the air flow adjusting assembly comprises:

[0008] a switching valve with one air inlet and at least two air outlets;

[0009] at least two air inlet branches communicating with the air inlet hole and arranged in parallel, each air inlet branch corresponds to and communicates with one air outlet of the switching valve, and the flow path lengths of different air inlet branches are different;

[0010] The switching valve is used to control the communication between the air inlet and one of the at least two air outlets, so that the air enters the air inlet hole through one of the at least two air inlet branches.

[0011] In some embodiments of the present application, the switching valve comprises a first air outlet and a second air outlet, and the at least two air inlet branches comprise a first air inlet branch and a second air inlet branch which are both in communication with the air inlet hole and are arranged in parallel;

[0012] The first air outlet is arranged opposite to the air inlet hole, the first air inlet branch extends in a straight line and is connected between the first air outlet and the air inlet hole, and the second air inlet branch has at least one bending part and is connected between the second air outlet and the air inlet hole.

[0013] In some embodiments of the present application, the switching valve comprises:

[0014] The first valve body is provided with the air inlet, the first air outlet and the second air outlet of the switching valve, and has a first valve cavity which is in communication with the air inlet, the first air outlet and the second air outlet of the switching valve, and the air inlet and the first air outlet of the switching valve are arranged opposite to each other;

[0015] The first valve core arranged in the first valve cavity is used to adjust the communication between one of the first air outlet and the second air outlet and the air inlet of the switching valve.

[0016] In some embodiments of the present application, the air flow adjusting assembly comprises a flange plate which is detachably assembled on the cover body away from the reaction cavity and is in communication with the air inlet hole, and the flange plate constitutes all the air outlets of the air inlet branches.

[0017] In some embodiments of the present application, the air flow adjusting assembly further comprises:

[0018] An air inlet port which is exposed outside the reaction cavity to allow the air to enter the air flow adjusting assembly;

[0019] An opening adjusting valve which is connected between the air inlet port and the air inlet of the switching valve, and is used to adjust the opening between the air inlet port and the air inlet of the switching valve.

[0020] In some embodiments of the present application, the opening adjusting valve comprises:

[0021] A second valve body which has a second valve cavity, and an air inlet and an air outlet which are both in communication with the second valve cavity, the air inlet of the second valve body is in communication with the air inlet port, and the air outlet of the second valve body is in communication with the air inlet of the switching valve;

[0022] A second valve core which is threadedly connected in the second valve cavity, and is used to adjust the opening between the air inlet of the second valve body and the air outlet of the second valve body.

[0023] In some embodiments of the present application, the cover assembly further comprises:

[0024] a pressure detecting device arranged on the cover and used for detecting the pressure in the reaction cavity, the pressure detecting device being in communication connection with the switching valve.

[0025] In some embodiments of the present application, the cover assembly further comprises a handle arranged on the cover and away from the reaction cavity.

[0026] According to the second aspect of the present application, a wafer processing device is further provided, which comprises a reaction cavity used for accommodating a wafer and having an opening, and the cover assembly of any one of the reaction cavities.

[0027] According to the cover assembly of the reaction cavity and the wafer processing device provided by the embodiments of the present application, the gas inlet hole in communication with the reaction cavity is arranged through the cover used for sealingly covering the opening of the reaction cavity, and the gas flow adjusting assembly in communication with the gas inlet hole is arranged on the cover, and the gas flow adjusting assembly is used for adjusting the air inlet rate of the air entering the reaction cavity through the gas inlet hole. Thus, the damage of the components in the reaction cavity caused by the too large gas flow rate during the breaking of the atmosphere is prevented, and the operation difficulty of the breaking of the atmosphere is also reduced. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative labor.

[0029] Figure 1 The schematic diagram of the air flow path of the air entering the reaction cavity through the gas flow adjusting assembly is shown in an embodiment of the present application;

[0030] Figure 2 The structural schematic diagram of the cover assembly of the reaction cavity is shown in an embodiment of the present application;

[0031] Figure 3 The sectional structural schematic diagram of the switching valve when the gas inlet hole is in communication with the second gas outlet hole is shown in an embodiment of the present application;

[0032] Figure 4 The sectional structural schematic diagram of the switching valve when the gas inlet hole is in communication with the first gas outlet hole is shown in an embodiment of the present application;

[0033] Figure 5 The structural schematic diagram of the opening adjusting valve is shown in an embodiment of the present application.

[0034] Reference signs:

[0035] 10 cover 11 air inlet hole

[0036] 12 reaction cavity 13 wafer

[0037] 20 switching valve 21 first air outlet

[0038] 22 second air outlet 23 first valve body

[0039] 24 first valve cavity 25 first valve core

[0040] 31 first air inlet branch 32 second air inlet branch

[0041] 33 flange 40 air inlet port

[0042] 50 opening adjusting valve 51 second valve body

[0043] 52 second valve cavity 53 second valve core

[0044] 54 rotating handle 55 sealing ring

[0045] 60 pressure detecting device 70 handle DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present application more obvious, the following will describe the example embodiments according to the present application in detail with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein. Based on the embodiments of the present application described in the present application, all other embodiments obtained by those skilled in the art without creative labor should fall within the protection scope of the present application.

[0047] In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid obscuring the present application, some technical features known in the art are not described.

[0048] It should be understood that the present application can be implemented in different forms, and should not be interpreted as being limited to the embodiments presented herein. On the contrary, these embodiments are provided to make the disclosure thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] For a thorough understanding of the application, a detailed description will be made in the following description with specific structures presented to illustrate the technical solutions proposed by the application. The alternative embodiments of the application are described in detail as follows, however, the application can have other implementation manners in addition to these detailed descriptions.

[0051] To solve at least part of the technical problems in the related art, the application proposes the following embodiments.

[0052] Some embodiments of the application will be described in detail below with reference to the accompanying drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0053] First, the application will introduce the application scenario of the cover assembly of the reaction cavity shown in the examples, the cover assembly of the reaction cavity is applied to the reaction cavity, wherein the reaction cavity is used to accommodate a wafer and has an opening.

[0054] With reference to Figure 1 and Figure 2 , the embodiment of the application provides a cover assembly of a reaction cavity, which mainly comprises:

[0055] a cover 10 used to sealingly cover the opening of the reaction cavity 12, when the cover 10 covers the opening, the reaction cavity 12 can be configured in a vacuum state; an air inlet hole 11 is provided through the cover 10 and communicates with the reaction cavity 12, the air inlet hole 11 is used to make air enter the reaction cavity 12 in the vacuum state; and

[0056] an air flow adjusting assembly communicating with the air inlet hole 11, the air flow adjusting assembly is used to adjust the air inlet rate of the air entering the reaction cavity 12 through the air inlet hole 11.

[0057] In the above scheme, by providing the air inlet hole 11 through the cover 10 used to sealingly cover the opening of the reaction cavity 12 and communicating with the reaction cavity 12, and providing the air flow adjusting assembly communicating with the air inlet hole 11 on the cover 10, the air flow adjusting assembly is used to adjust the air inlet rate of the air entering the reaction cavity 12 through the air inlet hole 11.

[0058] In the semiconductor production preparation, the reaction cavity 12 finds the source of leakage or needs to be partially vacuumized, and the related technology breaks the atmosphere in the following way: the concentric positioning ring is removed from the flange, the atmosphere is released into the reaction cavity, and then the vacuum cover plate is manually removed. But the related technology breaks the atmosphere, which is easy to cause the problem of too large air flow rate and damage the components in the reaction cavity, and it is difficult to remove the concentric positioning ring from the flange, which leads to the complexity of breaking the atmosphere operation. In addition, it is impossible to monitor when the internal pressure of the reaction cavity reaches atmospheric pressure, and there is a risk of slipping when manually removing the vacuum cover plate.

[0059] Compared with the existing breaking atmosphere mode, the embodiment of the application only needs to adjust the air inlet rate of the air entering the reaction cavity 12 through the air inlet hole 11 by the air flow adjusting assembly during the breaking atmosphere operation of the reaction cavity 12. Specifically, when the air inlet rate is large, the air inlet rate can be adjusted to be small, so as to prevent the damage of the components in the reaction cavity 12 caused by the too large air flow rate during the breaking atmosphere process. That is, the size of the gas flow rate can be adjusted to prevent the components in the reaction cavity 12 from being damaged due to the too large gas flow rate, and unnecessary loss is avoided. At the same time, it is not necessary to remove the concentric positioning ring from the flange 33 to perform the complex operation of breaking the atmosphere, and the operation difficulty of breaking the atmosphere is also reduced.

[0060] The above various structures will be described in detail below in combination with the drawings.

[0061] First of all, it should be pointed out that the above-mentioned reaction cavity 12 can be a reaction cavity 12 of a wafer 13 processing device such as but not limited to a chemical vapor deposition device. The top of the reaction cavity 12 has an opening, the cover body 10 matches the opening of the reaction cavity 12, and the cover body 10 is arranged at the opening of the reaction cavity 12 to form a sealed space.

[0062] Referring to Figure 2 , in the cover body assembly of the embodiment of the application, the cover body 10 is arranged in a shape matching the opening of the reaction cavity 12, so that when it is arranged at the opening of the reaction cavity 12, it can seal the opening and isolate the flow between the air in the reaction cavity 12 and the outside air. The cover body 10 can be arranged in any plate structure. For example, the cover body 10 can be a transparent cover plate made of acrylic. The reaction cavity 12 can be configured in a vacuum state in various ways such as a vacuum pump, and when the cover body 10 is arranged at the opening, the reaction cavity 12 is configured in a vacuum state. Subsequently, the wafer 13 in the vacuum environment can be processed in various ways such as but not limited to chemical vapor deposition.

[0063] The air inlet hole 11 in the cover body 10 can be arranged in various ways. Referring to Figure 1 and Figure 2For example, the air inlet hole 11 can be arranged at the center of the cover 10, at the edge of the cover 10, or at other positions of the cover 10. The cross-sectional shape and size of the air inlet hole 11 can be any shape and size. Thus, the outside air can enter the reaction cavity 12 in the vacuum state through the air inlet hole 11 without removing the cover 10 from the opening of the reaction cavity 12.

[0064] When the air flow adjusting assembly is arranged, the air flow adjusting assembly can adopt various arrangement modes capable of adjusting the air inlet rate of the air entering the reaction cavity 12 through the air inlet hole 11. Some modes are exemplarily introduced as follows.

[0065] Exemplarily, referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the air flow adjusting assembly can include:

[0066] a switching valve 20 having one air inlet and at least two air outlets;

[0067] at least two air inlet branches in communication with the air inlet hole 11 and arranged in parallel, each air inlet branch corresponding to and in communication with one air outlet of the switching valve 20, and the flow path lengths of different air inlet branches are different;

[0068] The switching valve 20 is used to control the switching valve 20 to be in communication with one of the at least two air outlets, so that the air enters the air inlet hole 11 through one of the at least two air inlet branches.

[0069] In the embodiment, the at least two air inlet branches are arranged in parallel through the switching valve 20, and the flow path lengths of different air inlet branches are different, so that the air inlet rates of the air entering the air inlet hole 11 from different air inlet branches are different. Specifically, when the air enters the air inlet hole 11 from the air inlet branch with a relatively long flow path length, the flow resistance of the air is relatively large due to the relatively long flow path length, so that the air inlet rate is greatly reduced, and the air enters the reaction cavity 12 at a relatively slow air inlet rate, that is, the air breaking rate is relatively slow at this time. When the air enters the air inlet hole 11 from the air inlet branch with a relatively short flow path length, the flow resistance of the air is relatively small due to the relatively short flow path length, so that the air inlet rate is slightly reduced, and the air enters the reaction cavity 12 at a relatively fast air inlet rate, that is, the air breaking rate is relatively fast at this time. Thus, according to actual needs, one target air inlet branch can be selected from the at least two air inlet branches through the switching mode of the switching valve 20, so that the air enters the air inlet hole 11 from the selected target air inlet branch, and the air inlet rate is adjusted to a suitable rate.

[0070] It should be noted that the number of gas outlets of the switching valve 20 can be any value not less than two, such as two, three, four, five, etc., and the total number of the intake branches is equal to the total number of the gas outlets of the switching valve 20, each intake branch corresponds to one gas outlet of the switching valve 20 and is connected between the corresponding gas outlet and the intake hole 11 of the cover body 10.

[0071] For example, referring to Figures 1 to 4 , the switching valve 20 can include a first gas outlet 21 and a second gas outlet 22, and the at least two intake branches include a first intake branch 31 and a second intake branch 32 which are both in communication with the intake hole 11 and are arranged in parallel. That is, the number of gas outlets on the switching valve 20 is two, which are the first gas outlet 21 and the second gas outlet 22. Correspondingly, the number of parallel arranged intake branches is also two, which are the first intake branch 31 and the second intake branch 32.

[0072] For example, referring to Figures 1 to 4 , the first gas outlet 21 can be arranged opposite to the position of the intake hole 11, and the first intake branch 31 extends in a straight line and is connected between the first gas outlet 21 and the intake hole 11. In this way, the flow path length of the first intake branch 31 arranged in this way is the shortest, so that it can be used as a branch with the fastest intake rate.

[0073] For example, referring to Figures 1 to 4 , the second intake branch 32 has at least one bending portion and is connected between the second gas outlet 22 and the intake hole 11. The second intake branch 32 arranged in this way has at least one bending portion, which not only increases the flow resistance of the air, but also increases the flow path length, so that the flow path length of the second intake branch 32 is greater than that of the first intake branch 31, so that the intake rate of the air entering the intake hole 11 from the second intake branch 32 is less than that of the air entering the intake hole 11 from the first intake branch 31. By making the air flow through the first intake branch 31 and the second intake branch 32 have different intake rates, the function of adjusting the intake rate of the air entering the reaction chamber 12 through the intake hole 11 by the switching valve 20 and the two intake branches is realized, and the difficulty of the air flow adjusting assembly is simplified.

[0074] As for the arrangement of the switching valve 20, it can be arranged in various ways, such as the following examples.

[0075] For example, referring to Figure 1 , Figure 3 and Figure 4 , the switching valve 20 can include:

[0076] The first valve body 23 is provided with the air inlet, the first air outlet 21 and the second air outlet 22 of the switching valve 20. The first valve body 23 has a first valve cavity 24 which is in communication with the air inlet, the first air outlet 21 and the second air outlet 22 of the switching valve 20. The air inlet and the first air outlet 21 of the switching valve 20 are oppositely arranged.

[0077] The first valve core 25 is arranged in the first valve cavity 24. The first valve core 25 is used to adjust the communication between one of the first air outlet 21 and the second air outlet 22 and the air inlet of the switching valve 20.

[0078] In this embodiment, the air inlet and the first air outlet 21 of the switching valve 20 are oppositely arranged, so that the first air outlet 21 is opposite to the air inlet hole 11, and when the air inlet of the switching valve 20 is in communication with the first air outlet 21, the air inlet of the switching valve 20, the first air inlet branch 31 and the air inlet hole 11 in the cover body 10 are sequentially arranged in a straight line, so that the air inlet rate of the air entering the reaction cavity 12 through the first air inlet branch 31 can be further improved.

[0079] For example, referring to Figures 1 to 4 The extending direction of the second air outlet 22 and the extending direction of the air inlet hole 11 in the cover body 10 can be arranged in an inclined or intersecting manner, so that when the air inlet of the switching valve 20 is in communication with the second air outlet 22, the air entering the air inlet of the switching valve 20 must flow through a bent flow path to the position of the second air outlet 22, so as to increase the flow resistance and the flow path length, and further reduce the air inlet rate of the air entering the reaction cavity 12 through the first air inlet branch 31.

[0080] For example, referring to Figures 1 to 4 The extending direction of the second air outlet 22 and the extending direction of the air inlet hole 11 in the cover body 10 can be arranged in an inclined or intersecting manner, so that the second air inlet branch 32 necessarily needs to be provided with a bent part to adapt to the misaligned arrangement between the second air outlet 22 and the air inlet hole 11 in the cover body 10, so as to also increase the flow resistance and the flow path length of the second air inlet branch 32, and further reduce the air inlet rate of the air entering the reaction cavity 12 through the first air inlet branch 31.

[0081] The first valve core 25 can be arranged in various ways which can cooperate with the first valve cavity 24 to achieve the function of adjusting the communication between one of the first air outlet 21 and the second air outlet 22 and the air inlet of the switching valve 20. For example, referring to Figure 1 , Figure 3 and Figure 4 , for example, the first valve core 25 can be a spherical valve, and the shape of the corresponding first valve cavity 24 can be a spherical valve cavity which is suitable for the spherical valve.

[0082] For example, referring to Figure 2 The air flow adjusting assembly can further comprise a flange 33 detachably assembled on the cover 10 on the side away from the reaction cavity 12 and in communication with the air inlet hole 11, and the flange 33 constitutes the air outlet of all the air inlet branches. In this embodiment, the detachable connection between the air flow adjusting assembly and the cover 10 is facilitated by providing the flange 33. When the flange 33 is assembled on the cover 10, the air outlet of all the air inlet branches can be ensured to be in communication with the air inlet hole 11 on the cover 10.

[0083] The detachable connection between the flange 33 and the cover 10 can be achieved in various ways, such as, but not limited to, screw fastening, clamping, etc.

[0084] For example, referring to Figure 1 and Figure 2 The air flow adjusting assembly can further comprise:

[0085] An air inlet port 40 exposed to the outside of the reaction cavity 12 for air to enter the air flow adjusting assembly;

[0086] An opening adjusting valve 50 connected between the air inlet port 40 and the air inlet of the switching valve 20, the opening adjusting valve 50 being used to adjust the opening between the air inlet port 40 and the air inlet of the switching valve 20.

[0087] In this embodiment, the opening between the air inlet port 40 and the air inlet of the switching valve 20 is adjusted by providing the opening adjusting valve 50 between the air inlet port 40 and the air inlet of the switching valve 20, so as to adjust the minimum flow area on the flow path between the air inlet port 40 and the air inlet of the switching valve 20, thereby further adjusting the air inlet rate of the air entering the reaction cavity 12 by adjusting the air inlet amount of the air entering the air inlet of the switching valve 20. That is, in this embodiment, the air inlet rate of the air entering the reaction cavity 12 can be adjusted not only by selecting different air inlet branches, but also by adjusting the opening between the air inlet port 40 and the air inlet of the switching valve 20 through the opening adjusting valve 50, so as to adjust the air inlet rate of the air entering the reaction cavity 12, so that the air flow adjusting assembly supports multiple adjustment modes and is conducive to making the air enter the reaction cavity 12 at the most suitable air inlet rate.

[0088] The opening adjusting valve 50 can be provided in various ways, such as the following exemplary ways.

[0089] For example, referring to Figure 1 , Figure 2 and Figure 5 The opening adjusting valve 50 can comprise:

[0090] A second valve body 51 having a second valve cavity 52, and an air inlet and an air outlet both communicating with the second valve cavity 52, the air inlet of the second valve body 51 communicating with the air inlet port 40, and the air outlet of the second valve body 51 communicating with the air inlet of the switching valve 20; and

[0091] A second valve core 53 threadedly connected in the second valve cavity 52, the second valve core 53 being used to adjust the opening degree between the air inlet of the second valve body 51 and the air outlet of the second valve body 51.

[0092] In the present embodiment, by adopting the second valve body 51 and the second valve core 53 threadedly connected with the second valve body 51 as the opening degree adjusting valve 50, the opening degree can be adjusted by rotating the second valve core 53 to adjust the depth of the part of the second valve core 53 screwed into the second valve cavity 52, so as to adjust the opening degree between the air inlet of the second valve body 51 and the air outlet of the second valve body 51, realizing the gearless adjustment of the opening degree from small to large or from large to small, which is conducive to adjusting the most appropriate opening degree to make the air enter the reaction cavity 12 at the most appropriate air inlet rate.

[0093] For example, referring to Figure 2 and Figure 5 The opening degree adjusting valve 50 can further include a rotating handle 54 penetrating the second valve body 51 and connected with the second valve core 53, and a worker can hold and rotate the rotating handle 54 to drive the second valve core 53 to rotate in the second valve cavity 52, so as to adjust the opening degree between the air inlet of the second valve body 51 and the air outlet of the second valve body 51.

[0094] For example, referring to Figure 5 The opening degree adjusting valve 50 can further include a sealing ring 55 arranged in the second valve cavity 52 and opposite to the end position of the extension direction of the second valve core 53, and when the second valve core 53 rotates to the bottom position, the second valve core 53 can abut on the sealing ring 55, so as to realize the sealing connection between the second valve core 53 and the second valve cavity 52, and thus close the opening degree between the air inlet of the second valve body 51 and the air outlet of the second valve body 51.

[0095] For example, referring to Figure 1 and Figure 2The cover assembly can further comprise a pressure detection device 60 arranged on the cover 10 and configured to detect the pressure in the reaction cavity 12, and the pressure detection device 60 is in communication connection with the switching valve 20. In this embodiment, the pressure detection device 60 is arranged to detect the pressure in the reaction cavity 12, and the pressure detection device 60 is in communication connection with the switching valve 20, so that the control device of the switching valve 20 can select a suitable air inlet branch as the target air inlet branch or adjust the opening degree of the opening degree adjusting valve 50 according to the detection result of the pressure detection device 60, so as to realize the controllable air inlet rate. That is, the air volume of the air inlet can be automatically adjusted, the pressure in the vacuum area of the reaction cavity 12 can be monitored in real time, the sudden breaking of the atmosphere can be prevented, and the components inside the reaction cavity 12 can be prevented from being damaged.

[0096] For example, when the pressure detected by the pressure detection device 60 is greatly different from the atmospheric pressure, the air inlet branch with a longer flow path length can be selected as the target air inlet branch, for example, the second air inlet branch 32 can be selected as the target air inlet branch, so that the air enters the air inlet hole 11 through the second air inlet branch 32, so as to reduce the air inlet rate of the air into the reaction cavity 12.

[0097] When the pressure detected by the pressure detection device 60 is less different from the atmospheric pressure, the air inlet branch with a shorter flow path length can be selected as the target air inlet branch, for example, the first air inlet branch 31 can be selected as the target air inlet branch, so that the air enters the air inlet hole 11 through the first air inlet branch 31, so as to increase the air inlet rate of the air into the reaction cavity 12.

[0098] And the prior art cannot monitor whether the internal pressure of the reaction cavity reaches the atmospheric pressure, so it is not clear when the breaking of the atmosphere is completed and whether the cover can be extracted. In this embodiment, the pressure detection device 60 is arranged to detect the pressure in the reaction cavity 12 in real time, so that the pressure in the reaction cavity 12 can be quickly understood to determine whether the breaking of the atmosphere is completed, so that the pressure in the vacuum area of the reaction cavity 12 can be monitored in real time, the timing of extracting the cover 10 can be accurately controlled, the maintenance time can be maintained, and the production efficiency can be increased.

[0099] As to the arrangement mode of the pressure detection device 60, any device capable of detecting the pressure in the reaction cavity 12 can be adopted. For example, a mercury column pressure detector, a MEMS pressure detector, and the like can be adopted as the pressure detection device 60.

[0100] For example, referring to FIG. 1, Figure 2The cover assembly can further include a handle 70 arranged on the cover 10 away from the reaction cavity 12. In the prior art, the cover of the reaction cavity does not have a handle, but a groove is arranged on the sidewall of the cover. When the pressure inside the reaction cavity is equal to the atmospheric pressure, the operator clamps the groove with his hand to extract the cover. In this way, since the extraction point of the cover is only the groove at the edge, the cover is prone to falling and injuring the operator, thus causing danger. In the embodiment, the handle 70 is arranged, so that the operator can directly hold the handle 70 to take the cover 10 out of the opening of the reaction cavity 12 or place the cover 10 in the opening of the reaction cavity 12, thereby preventing the cover from falling and causing danger. That is, the handle 70 is arranged on the cover 10 to facilitate the placement of the cover 10 and prevent the operator from being injured, thus greatly improving the safety and avoiding unnecessary losses.

[0101] For example, referring to FIG. 1, the cover 10 of the reaction cavity 12 can be provided with a plurality of handles 70. Figure 2 The number of handles 70 can be four, which are distributed around the edge region of the cover 10 to facilitate extraction by the user. For example, the handle 70 can be designed in accordance with human ergonomics to improve the comfort of the operator holding the handle 70.

[0102] For example, referring to FIG. 1, the cover 10 of the reaction cavity 12 can be provided with a plurality of handles 70. Figure 1 and Figure 2 The inlet hole 11 is located in the central region of the cover 10, and the airflow adjusting assembly is correspondingly arranged in the central region of the cover 10.

[0103] In addition, the application also provides a wafer processing device, which includes a reaction cavity for accommodating a wafer and having an opening, and a cover assembly of any one of the above reaction cavities. The inlet hole in communication with the reaction cavity is arranged through the cover for sealingly covering the opening of the reaction cavity, and the airflow adjusting assembly in communication with the inlet hole is arranged on the cover, and the airflow adjusting assembly is used to adjust the inlet rate of air entering the reaction cavity through the inlet hole. Thus, the damage to the components in the reaction cavity caused by excessive airflow rate during the breaking of the atmosphere is prevented, and the operation difficulty of breaking the atmosphere is also reduced.

[0104] The application has been described by the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and illustration, and are not intended to limit the application to the described embodiments. In addition, those skilled in the art can understand that the application is not limited to the above embodiments, and more variations and modifications can be made according to the teachings of the application, which all fall within the scope of the application claimed. The protection scope of the application is defined by the attached claims and their equivalent scope.

Claims

1. A lid assembly for a reaction chamber, the lid assembly comprising: The reaction cavity is used for accommodating a wafer and has an opening, the cover assembly comprises: a cover for sealingly covering the opening, when the cover covers the opening, the reaction cavity can be configured as a vacuum state; the cover is provided with an air inlet hole communicated with the reaction cavity, the air inlet hole is used for making air enter the reaction cavity in the vacuum state; and an air flow adjusting assembly communicated with the air inlet hole, the air flow adjusting assembly is used for adjusting the air inlet rate of air entering the reaction cavity through the air inlet hole.

2. The cover assembly of claim 1, wherein, The air flow adjusting assembly comprises: a switching valve with one air inlet and at least two air outlets; at least two air inlet branches communicated with the air inlet hole and arranged in parallel, each of the air inlet branches corresponds to and communicates with one of the air outlets of the switching valve, and the flow path lengths of different air inlet branches are different; wherein the switching valve is used for controlling the air inlet of the switching valve to communicate with one of the at least two air outlets, so that air enters the air inlet hole through one of the at least two air inlet branches.

3. The cover assembly of claim 2, wherein, The switching valve comprises a first air outlet and a second air outlet, and the at least two air inlet branches comprise a first air inlet branch and a second air inlet branch communicated with the air inlet hole and arranged in parallel; wherein the first air outlet is arranged opposite to the air inlet hole, the first air inlet branch extends in a straight line and is connected between the first air outlet and the air inlet hole, and the second air inlet branch has at least one bending part and is connected between the second air outlet and the air inlet hole.

4. The cover assembly of claim 3, wherein, The switching valve comprises: a first valve body, the air inlet, the first air outlet and the second air outlet of the switching valve are arranged on the first valve body, the first valve body has a first valve cavity communicated with the air inlet, the first air outlet and the second air outlet of the switching valve, and the air inlet of the switching valve is arranged opposite to the first air outlet; a first valve core arranged in the first valve cavity, the first valve core is used for adjusting one of the first air outlet and the second air outlet to communicate with the air inlet of the switching valve.

5. The cover assembly of claim 3, wherein The air flow adjusting assembly comprises: a flange plate detachably assembled on the cover away from the reaction cavity and communicated with the air inlet hole, the flange plate constitutes the air outlets of all the air inlet branches.

6. The cover assembly of any one of claims 2-5, wherein, The air flow adjusting assembly further comprises: an air inlet port exposed outside the reaction cavity to make air enter the air flow adjusting assembly; an opening adjusting valve connected between the air inlet port and the air inlet of the switching valve, the opening adjusting valve is used for adjusting the opening between the air inlet port and the air inlet of the switching valve.

7. The cover assembly of claim 6, wherein The opening adjusting valve comprises: a second valve body, the second valve body has a second valve cavity, and an air inlet and an air outlet communicated with the second valve cavity, the air inlet of the second valve body is communicated with the air inlet port, and the air outlet of the second valve body is communicated with the air inlet of the switching valve; a second valve core arranged in the second valve cavity, the second valve core is used for adjusting one of the air inlet and the air outlet of the second valve body to communicate with the air inlet of the switching valve. a second valve core threaded in the second valve cavity, the second valve core being used to adjust the opening degree between the air inlet of the second valve body and the air outlet of the second valve body.

8. The cover assembly of any one of claims 2-5, wherein, Further comprising: a pressure detecting device arranged on the cover body and used to detect the pressure in the reaction cavity, the pressure detecting device being in communication connection with the switching valve.

9. The cap assembly of any one of claims 1-5, wherein, Further comprising: a handle arranged on the cover body and away from the reaction cavity.

10. A wafer processing apparatus characterized by comprising: Comprising: a reaction cavity used to accommodate a wafer and having an opening; and a cover body assembly of the reaction cavity according to any one of claims 1-9.

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