Wafer box conversion base
By designing a wafer cassette transfer base, and utilizing a support ramp and limiting strip structure, the wafer is placed at an angle, while buffer blocks and baffles limit the movement. This solves the problem of wafers being easily damaged during transfer, and achieves stable wafer transfer and protection.
Patent Information
- Application Number
- CN202423132193.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-18
AI Technical Summary
In the existing technology, during the wafer transfer process, the wafer cassette conversion base of the Open Cassette is prone to swinging in a horizontal position, which can damage adjacent wafers when the suction pen is used for adsorption, resulting in losses.
Design a wafer cassette conversion base, which adopts a support slope and limiting strip structure to place the wafer at an angle. The buffer block and baffle limit the wafer to prevent it from sliding and colliding. The buffer block is made of polyurethane and the limiting strip and screw are made of polytetrafluoroethylene to fix the wafer and avoid damage.
It effectively prevents wafer damage during transfer, is easy to operate, and is suitable for large-scale applications.
Smart Images
Figure CN223712724U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor production, and particularly relates to a wafer box conversion base. BACKGROUND
[0002] Open cassette (open wafer box) and PFA cassette are widely used in the process of transporting and cleaning between silicon wafer manufacturing processes, and have excellent temperature resistance and acid and alkali resistance, as well as good mechanical properties, dimensional stability and anti-static advantages. Figure 1 It is a typical open cassette, which comprises a first bottom surface 21, a second bottom surface 22 and a side surface between the first bottom surface 21 and the second bottom surface 22, and the side surface comprises an upper side, a front side 24, a lower side and a rear side 26 in sequence; wherein the upper side is completely open for the wafer to enter and exit, and the lower side is also in an open state except that two support strips 25 are arranged thereon, and corresponding slots are arranged on the front side, the rear side and the support strips for the wafer to be inserted. When the open cassette is in a horizontal state, the lower side support strip 25 is at the bottom, and when the open cassette is in a vertical state, the first bottom surface 21 is at the bottom, and three support points are arranged on the outer side of the first bottom surface 21 for supporting the open wafer box to stand stably. Manual transfer between open cassette and PFA cassette is required between part of the process procedures, and when the transfer is performed, the open cassette is in a horizontal state (as shown in FIG. 1), and the wafer is transferred by a wafer suction pen adsorbing the center position of the silicon wafer, but the silicon wafer is easy to swing in the open cassette in the horizontal state, so that the wafer suction pen adsorbs the wafer and easily collides with the adjacent wafer to cause damage and become scrap, which is a problem to be solved in a wafer factory. Figure 1 OBJECT OF THE INVENTION TECHNICAL SOLUTION
[0003] The utility model discloses a wafer box conversion base, which is used for supporting an open wafer box, and the open wafer box comprises a first bottom surface, a second bottom surface and a side surface.
[0004] The utility model discloses a wafer box conversion base, which is used for supporting an open wafer box, and the open wafer box comprises a first bottom surface, a second bottom surface and a side surface.
[0005] The wafer box conversion base comprises a support inclined surface for supporting the wafer box in an inclined manner, so that the wafer is placed in an inclined manner.
[0006] The upper surface of the support inclined surface is provided with two limiting strips extending in the inclined direction and a buffer block between the two limiting strips; the two limiting strips are used for limiting the support strip;
[0007] A baffle is arranged at the lower end of the two limiting strips and the buffer block, and is used for limiting the first bottom surface;
[0008] The hardness of the buffer block is less than that of the wafer box.
[0009] Preferably, a support point is arranged outside the first bottom surface, and is used for supporting the wafer box to stand upright.
[0010] An opening is arranged on the baffle, and is used for accommodating the support point, so that the first bottom surface is tightly attached to the baffle.
[0011] Preferably, the buffer block is made of polyurethane material.
[0012] Preferably, the bottom of the support inclined surface is provided with two parallel right-angled triangle vertical plates and a rectangular vertical plate arranged at the right-angled end of the triangle vertical plate, and is used for supporting the support inclined surface.
[0013] Preferably, a parallel right-angled triangle vertical plate is further arranged between the two parallel right-angled triangle vertical plates.
[0014] Preferably, the inclination angle α of the support inclined surface is 5°-10°.
[0015] Preferably, the limiting strips, the buffer block and the support inclined surface are fixed by counterbore screws.
[0016] Preferably, the support inclined surface, the baffle and the limiting strips are made of polytetrafluoroethylene material.
[0017] Preferably, the counterbore screws are made of polytetrafluoroethylene material.
[0018] Preferably, the right-angled triangle vertical plates, the rectangular vertical plate and the support inclined surface are fixed by hot melt glue.
[0019] The conversion base provided in the application can effectively prevent the wafer from being damaged during wafer transfer, and has simple structure and convenient operation, and is suitable for large-scale application. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a typical open cassette schematic diagram in the prior art;
[0021] Figure 2This is a three-dimensional structural diagram of the conversion base provided in this application;
[0022] Figure 3 This is a schematic diagram of the bottom structure of the conversion base provided in this application;
[0023] Figure 4 This is a top view of the conversion base provided in this application;
[0024] Figure 5 for Figure 4 A cross-sectional view in the XX direction;
[0025] Figure 6 This is a reference state diagram for the application of the conversion base;
[0026] Figure 7 for Figure 6 A cross-sectional view in the YY direction;
[0027] Explanation of reference numerals in the attached figures:
[0028] 21-First bottom surface; 22-Second bottom surface; 24-Front side; 25-Supporting strip; 26-Rear side; 3-Wafer; 4-Baffle; 5-Supporting slope; 6-Limiting strip; 7-Buffer block; 8-Counterhead screw; 9-Right-angled triangular vertical plate; 10-Rectangular vertical plate; 11-Opening. Detailed Implementation
[0029] A preferred embodiment of this application provides a wafer cassette conversion base, such as Figures 2 to 5 As shown, it includes a support ramp 5 for tilting the wafer cassette, thereby tilting the wafer.
[0030] The upper surface of the supporting inclined surface 5 is provided with two limiting strips 6 extending in the inclined direction (e.g. Figure 2 As shown, the supporting slope 5 is higher on the left and lower on the right, with limiting strips 6 arranged along the left-right direction of the supporting slope, and a buffer block 7 located between the two limiting strips 6; the two limiting strips are used to limit the supporting strips 25 on the lower side of the wafer cassette. Preferably, the distance between the two limiting strips 6 is slightly larger than the width of the lower side of the wafer cassette (the width of the distribution of the two supporting strips 25), so that it can just accommodate the two supporting strips and limit them.
[0031] A baffle 4 is provided at the lower end of the two limiting bars 6 and the buffer block 7 to limit the first bottom surface 21 of the wafer cassette; the hardness of the buffer block is less than that of the wafer cassette.
[0032] When the wafer box is used, the lower side of the wafer box is placed on the support slope 5. Since the support slope is in an inclined state, the wafer box is also placed in an inclined state on the support slope 5, and the two limiting strips limit the two support strips on the lower side of the wafer box, preventing the wafer box from moving up and down, and the baffle limits the first bottom surface of the wafer box, preventing the wafer box from sliding downward.
[0033] When the wafer box contains wafers inside and the wafers need to be transferred outward by using a suction pen 2, as shown in FIG. 4, the wafers 3 are also placed in an inclined state, and the surface of the wafer with a lower height (the right surface of the wafer) is in contact with the right side wall of the slot, which limits the wafer, so that the wafer is not easy to shake, and has good stability, and the spacing between the wafers is maximum, which can prevent the adjacent wafers from being scratched when the wafers are transferred by using the suction pen. Figures 6 to 7
[0034] When the wafers are placed inside the wafer box, since the two support strips are open and there is no block between the buffer block and the wafer, the wafer first contacts the buffer block (the height of the buffer block is about 1 mm higher than the distance between the bottom of the wafer and the support slope) when the wafer is placed into the wafer box, and then contacts the slot on the support strip, thereby playing a buffering role, avoiding the impact between the chamfer of the wafer and the slot when the wafer is placed, and causing edge collapse.
[0035] Therefore, the conversion base provided by the present application can effectively prevent the wafers from being damaged during wafer transfer, and the conversion base has a simple structure, is easy to operate, and is suitable for large-scale application.
[0036] Preferably, the baffle 4 is provided with an opening 11 for accommodating the support point of the wafer box, so that the first bottom surface 21 of the wafer box is closely attached to the baffle 4.
[0037] Preferably, the buffer block is made of polyurethane material. The hardness of the polyurethane material is less than that of the wafer box, and the wafer will not be damaged when in contact with the wafer, thereby having a good buffering effect.
[0038] Preferably, the bottom of the support slope is provided with two parallel right-angled triangular vertical plates 9 and a rectangular vertical plate 10 located at the right-angled end of the triangular vertical plate 9, which are used to support the support slope and make it in an inclined state. Further, the right-angled triangular vertical plate and the rectangular vertical plate are connected and fixed with the support slope by using hot melt glue.
[0039] Further preferably, a parallel right-angled triangular vertical plate is further arranged between the two parallel right-angled triangular vertical plates, which is used to further support the slope.
[0040] Preferably, the inclination angle α of the support slope 5 is 5°-10°, which can make the wafer in contact with the right slot, ensure the maximum spacing between the wafers, and prevent the wafer box from being excessively inclined and causing tilting.
[0041] Preferably, the limiting strip 6, the buffer block 7 and the supporting slope 5 are fixed by the countersunk screw 8, preventing the screw from protruding and scratching the wafer.
[0042] Preferably, the supporting slope, the baffle, the limiting strip and the countersunk screw are made of polytetrafluoroethylene material, which has moderate hardness, certain strength and does not cause excessive damage to the wafer.
[0043] Although the preferred embodiments of the present application have been described, those skilled in the art who once know the basic creative concept can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application. Obviously, those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and changes of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and changes.
Claims
1. A wafer cassette conversion base for supporting an open wafer cassette, the open wafer cassette comprising a first bottom surface, a second bottom surface, and side surfaces; the side surfaces comprising an upper side, a front side, a lower side, and a back side in sequence; wherein the upper side is completely open for wafer access; the lower side is also open except for two support bars, wherein the support bars are provided with slots for supporting wafers; characterized in that, The conversion base comprises a support slope for supporting a wafer box in an inclined manner, so that the wafer is placed in an inclined manner. The upper surface of the support slope is provided with two limiting strips extending along the inclined direction and a buffer block between the two limiting strips; the two limiting strips are used for limiting the support strip. A baffle is arranged at the lower end of the two limiting strips and the buffer block, and is used for limiting the first bottom surface. The hardness of the buffer block is less than that of the wafer box.
2. The wafer box conversion base according to claim 1, wherein A support point is arranged outside the first bottom surface, and is used for supporting the wafer box to stand upright. An opening is arranged on the baffle, and is used for accommodating the support point, so that the first bottom surface is tightly attached to the baffle.
3. The wafer box conversion base according to claim 1, wherein The buffer block is made of polyurethane.
4. The wafer box conversion base according to claim 1, wherein The bottom of the support slope is provided with two parallel right-angled triangular vertical plates and a rectangular vertical plate arranged at the right-angled end of the triangular vertical plates, and is used for supporting the support slope.
5. The wafer box conversion base according to claim 1, wherein A parallel right-angled triangular vertical plate is further arranged between the two parallel right-angled triangular vertical plates.
6. The wafer box conversion base according to claim 1, wherein The inclination angle α of the support slope is 5°-10°.
7. The wafer box conversion base according to claim 1, wherein The limiting strips, the buffer block and the support slope are fixed by using a counter-sunk screw.
8. The wafer box conversion base according to claim 1, wherein The support slope, the baffle and the limiting strips are made of polytetrafluoroethylene.
9. The wafer box conversion base according to claim 7, wherein The counter-sunk screw is made of polytetrafluoroethylene.
10. The wafer box conversion base according to claim 4, wherein The right-angled triangular vertical plates, the rectangular vertical plate and the support slope are fixed by using hot melt glue.