Wafer automatic leveling device with double-platform structure

Abstract

The utility model provides an automatic wafer leveling device with a double-platform structure, which comprises a bearing assembling mechanism and a bearing leveling mechanism, and is characterized in that the bearing leveling mechanism comprises a bearing bracket assembly, a wafer positioning assembly, an elastic switching assembly, a top pressure adjusting assembly and a wafer lifting assembly; the bearing support assembly and the wafer positioning assembly of the wafer automatic leveling mechanism are installed through the movable connection structures, the positions of the bearing support assembly and the wafer positioning assembly can be independently adjusted in the respective ranges, the universality and flexibility of the device are improved, the jacking adjusting assembly achieves automatic leveling operation of the bearing support assembly through cooperation of the jacking motor and the jacking cam, and the wafer automatic leveling mechanism is simple in structure and convenient to use. According to the leveling mechanism, the wafer is ensured to be always kept in a horizontal state in the detection process, the levelness of the wafer detection platform can be effectively adjusted in real time, so that more accurate and accurate wafer measurement values are obtained, the processing quality of an integrated circuit is improved, meanwhile, the leveling mechanism is provided with a pair of bearing leveling mechanisms which can operate simultaneously, and the wafer detection speed can be improved.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to an automatic wafer leveling device with a dual-platform structure. Background Technology

[0002] Patent document CN220367901U discloses a wafer leveling device, which employs a fixed support mechanism consisting of a fixed column and a fixed tension spring. The top of the fixed column abuts against a mating wing via steel balls, and the bottom abuts against a support base via steel balls, allowing the positioning base to be finely adjusted in position by deflection on the support base. A movable support mechanism consists of a movable skid, a movable column, and a movable tension spring. The movable skid can be deflected on the support base via a lever pin. The top of the movable column abuts against a mating wing via steel balls, and the bottom abuts against the outer end of the movable skid via steel balls. A worm gear end pin driven by a transmission worm is also provided, with its top end abutting against the inner end of the movable skid. Its rotation causes the movable skid to deflect, thereby leveling the positioning base and positioning suction cup. With the assistance of a corresponding position sensor, the leveling process can be closed-loop controlled, which is beneficial for improving the accuracy of wafer inspection and processing, and enhancing the performance of the finished integrated circuit. However, this leveling device can only level a single wafer, resulting in low leveling efficiency. Therefore, it is necessary to optimize its structure to overcome the above-mentioned defects. Utility Model Content

[0003] The purpose of this invention is to provide an automatic wafer leveling device with a dual-platform structure to improve detection accuracy and product quality.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] An automatic wafer leveling device with a dual-platform structure includes:

[0006] A support assembly mechanism is installed in a wafer inspection device and has an assembly space inside.

[0007] The bearing and leveling mechanism is provided in pairs, with each bearing and leveling mechanism installed in the support assembly mechanism. Each of these mechanisms has a wafer bearing space inside, and the wafer is supported and leveled by the bearing and leveling mechanism.

[0008] The load-bearing leveling mechanism includes:

[0009] A load-bearing support assembly, which is provided in pairs, with each load-bearing support assembly being installed in the support assembly mechanism via a movable connection structure, and its position can be adjusted in the support assembly mechanism;

[0010] A wafer positioning assembly is provided in pairs. Each wafer positioning assembly is installed in the support assembly through a movable connection structure. It can adjust its position together with the support assembly and can also adjust its position independently in the support assembly. It has a wafer positioning space inside, and the wafer is adjusted by the wafer positioning assembly.

[0011] The elastic transition assembly is provided in pairs, with each elastic transition assembly installed between the load-bearing support assembly and the support assembly mechanism. It can deform when the load-bearing support assembly is adjusted, and the elastic transition assembly positions the load-bearing support assembly.

[0012] The top pressure adjustment assembly is provided in pairs. Each top pressure adjustment assembly is installed in the support assembly mechanism and cooperates with the bearing support assembly. The top pressure adjustment assembly adjusts the position of the bearing support assembly in the support assembly mechanism.

[0013] A wafer lifting assembly is provided, which consists of a pair. Each wafer lifting assembly is installed in the support assembly mechanism and cooperates with the wafer positioning assembly. The wafer lifting assembly drives the wafer positioning assembly to rise or fall in the support assembly, so that the wafer positioning assembly engages or disengages from the support assembly.

[0014] Specifically, the support assembly mechanism includes:

[0015] The support plate is installed in the wafer inspection equipment via connectors. It has a pair of bearing recesses on its top and a pair of leveling recesses on its bottom. The bearing recesses and leveling recesses are positioned to correspond to each other and are adapted to the shape of the bearing and leveling mechanism. The support plate has a clearance opening in the middle, through which the bearing recesses and leveling recesses are connected. A set of assembly notches are provided on the edge of the bearing recesses. Each assembly notch is recessed radially outward from the bearing recess. They are arranged sequentially along the circumference of the bearing recesses and are connected to the leveling recesses in the axial direction.

[0016] The assembly boss is provided in two sets, with each set of assembly bosses formed on the top of the support plate and corresponding to the position of the assembly notch.

[0017] Each load-bearing support component includes:

[0018] The bearing base plate is adapted to the shape of the bearing recess and is placed inside the bearing recess. Its position can be adjusted in the bearing recess. The edge of the bearing base plate is provided with a set of mounting flanges. Each mounting flange protrudes radially outward from the bearing base plate and extends into the mounting notch.

[0019] Wafer positioning components include:

[0020] The positioning suction cup is installed on the top of the support base plate. The support base plate uses a vacuum adsorption structure to adsorb and position the positioning suction cup. The position of the positioning suction cup is adjusted by the support base plate. The positioning suction cup has a wafer positioning space. The positioning suction cup adsorbs and positions the wafer and carries the wafer to adjust its position.

[0021] The flexible adapter includes:

[0022] The adapter spring is provided in a set. Each adapter spring is installed on the mounting boss and is engaged with the mounting flange through the adapter structure. It can deform when the position of the bearing base plate is adjusted, and the adapter spring positions the bearing base plate.

[0023] The top pressure adjustment assembly includes:

[0024] The top pressure motor is provided in a set. Each top pressure motor is installed in a leveling recess and arranged sequentially along the circumference of the leveling recess. The number of top pressure motors is less than the number of assembly flanges. Each top pressure motor has a top pressure cam installed on its power output shaft.

[0025] A set of transmission pads is provided, each of which is installed in a leveling recess via a hinge structure. The transmission pads can deflect within the leveling recess. The position of the transmission pads corresponds to that of the assembly flange, and the number of transmission pads is less than that of the assembly flange. The top of the transmission pads abuts against the assembly flange, and the bottom of the transmission pads abuts against the top pressing cam. When the top pressing cam rotates, it drives the assembly flange and the bearing base plate to move through the transmission pads, thereby performing a leveling operation on the bearing base plate.

[0026] The wafer lifting assembly includes:

[0027] The lifting end head is located in the clearance opening. Its top is connected to the bottom of the positioning suction cup through a vacuum adsorption structure, which can adsorb and position the positioning suction cup.

[0028] The lifting motor is installed in the leveling recess. Its power output shaft is connected to the bottom of the lifting end head through a cam transmission structure. The lifting motor drives the lifting end head to adjust its position axially in the clearance passage.

[0029] The lifting guide rails are provided in pairs. Each lifting guide rail is installed on the inner wall of the clearance opening and extends along the axial direction of the clearance opening. They are engaged with the lifting end head through a slider and the lifting guide rails guide the position adjustment process of the lifting end head.

[0030] The advantages of this utility model are:

[0031] The automatic wafer leveling mechanism's support assembly and wafer positioning assembly are both installed via a movable connection structure and can be independently adjusted within their respective ranges. This allows the device to adapt to wafers of different sizes and shapes, improving its versatility and flexibility. The top pressure adjustment assembly, through the cooperation of a top pressure motor and a top pressure cam, achieves automatic leveling of the support assembly, ensuring that the wafer remains level throughout the inspection process. It effectively adjusts the levelness of the wafer inspection platform in real time, meaning that the inspection platform is adjusted before each wafer inspection to ensure the accuracy of the basic inspection platform. This results in more accurate and precise wafer measurement values, thereby improving the quality of integrated circuit processing. Furthermore, the leveling mechanism has a pair of support leveling mechanisms that can operate simultaneously, which helps to increase wafer inspection speed and shorten the time required for wafer production. Attached Figure Description

[0032] Figure 1 This is a front view of the automatic wafer leveling device with a dual-platform structure proposed in this utility model.

[0033] Figure 2 This is a schematic diagram of the back structure of the automatic wafer leveling device;

[0034] Figure 3 This is a flowchart of the leveling operation of the leveling device;

[0035] Figure 4 This is the circuit diagram of the top pressure motor and the motion control card. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The mechanisms of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0037] like Figures 1-4As shown, the automatic wafer leveling device with a dual-platform structure proposed in this utility model includes a support assembly mechanism and a load-bearing leveling mechanism. The support assembly mechanism is installed in the wafer inspection equipment and has an assembly space inside. There is a pair of load-bearing leveling mechanisms, each of which is installed in the support assembly mechanism and has a wafer carrying space inside. The load-bearing leveling mechanism carries and levels the wafer.

[0038] The load-bearing leveling mechanism includes a load-bearing support assembly, a wafer positioning assembly, a flexible adapter assembly, a top pressure adjustment assembly, and a wafer lifting assembly. A pair of load-bearing support assemblies are provided, each mounted in the support assembly mechanism via a movable connection structure, allowing for position adjustment within the support assembly mechanism. A pair of wafer positioning assemblies are also provided, each mounted in the load-bearing support assembly via a movable connection structure, allowing for position adjustment along with the load-bearing support assembly and independently within the load-bearing support assembly. Each wafer positioning assembly has a wafer positioning space within it, where the wafer positioning assembly drives the wafer to adjust its position. A pair of flexible adapter assemblies are also provided, each... Installed between the load-bearing support assembly and the support assembly mechanism, it can deform when the load-bearing support assembly is adjusted. The elastic transition assembly positions the load-bearing support assembly. There is a pair of top pressure adjustment assemblies, each of which is installed in the support assembly mechanism and cooperates with the load-bearing support assembly. The top pressure adjustment assemblies adjust the position of the load-bearing support assembly in the support assembly mechanism. There is a pair of wafer lifting assemblies, each of which is installed in the support assembly mechanism and cooperates with the wafer positioning assembly. The wafer lifting assembly drives the wafer positioning assembly to rise or fall in the load-bearing support assembly, so that the wafer positioning assembly engages or disengages from the load-bearing support assembly.

[0039] In this embodiment, the support assembly mechanism includes a support base plate 110 and an assembly boss 120. The support base plate is installed in the wafer inspection equipment through a connector. A pair of bearing recesses 111 are provided on its top and a pair of leveling recesses 112 are provided on its bottom. The bearing recesses and leveling recesses are positioned correspondingly and are adapted to the shape of the bearing and leveling mechanism. A clearance opening is provided in the middle of the support base plate. The bearing recesses and leveling recesses are connected through the clearance opening. A set of assembly notches are provided on the edge of the bearing recesses. Each assembly notch is recessed radially outward from the bearing recess. They are arranged sequentially along the circumference of the bearing recess and are connected to the leveling recess in the axial direction. Two sets of assembly bosses are provided. Each set of assembly bosses is formed on the top of the support base plate and corresponds to the position of the assembly notch.

[0040] Each load-bearing support assembly includes a load-bearing base plate 200, which is adapted to the shape of the load-bearing recess and is placed inside the load-bearing recess. Its position can be adjusted within the load-bearing recess. A set of mounting flanges 210 are provided on the edge of the load-bearing base plate. Each mounting flange protrudes radially outward from the load-bearing base plate and extends into the mounting notch.

[0041] The wafer positioning assembly includes a positioning suction cup 300, which is mounted on the top of a support base plate. The support base plate uses a vacuum adsorption structure to adsorb and position the positioning suction cup. The position of the positioning suction cup is adjusted by the support base plate. The positioning suction cup has a wafer positioning space. The positioning suction cup adsorbs and positions the wafer and carries the wafer to adjust its position.

[0042] The flexible transition assembly includes a transition spring 400. A set of transition springs is provided, and each transition spring is installed on the mounting boss and engaged with the mounting flange through the transition structure. It can deform when the position of the bearing base plate is adjusted, and the transition springs position the bearing base plate.

[0043] The top pressure adjustment assembly includes a top pressure motor 510 and a transmission pad 520. There is one set of top pressure motors, each of which is installed in the leveling recess and arranged sequentially along the circumference of the leveling recess. The number of top pressure motors is less than the number of assembly flanges. Each top pressure motor has a top pressure cam 511 installed on its power output shaft. There is one set of transmission pads, each of which is installed in the leveling recess through a hinge structure and can deflect in the leveling recess. The transmission pads correspond to the positions of the assembly flanges and are fewer in number than the number of assembly flanges. The top of the transmission pads abuts against the assembly flanges and the bottom of the transmission pads abuts against the top pressure cams. When the top pressure cams rotate, they drive the assembly flanges and the supporting base plate to move through the transmission pads, thereby performing a leveling operation on the supporting base plate.

[0044] The wafer lifting assembly includes a lifting head 610, a lifting motor 620, and a lifting guide rail 630. The lifting head is located in the clearance opening, and its top is engaged with the bottom of the positioning suction cup through a vacuum adsorption structure, which can adsorb and position the positioning suction cup. The lifting motor is installed in the leveling recess, and its power output shaft is engaged with the bottom of the lifting head through a cam transmission structure. The lifting motor drives the lifting head to adjust its position axially in the clearance opening. There is a pair of lifting guide rails, each of which is installed on the inner wall of the clearance opening and extends axially along the clearance opening. Each of the lifting guide rails is engaged with the lifting head through a slider, and the lifting guide rails guide the position adjustment process of the lifting head.

[0045] The automatic wafer leveling method proposed in this utility model uses the aforementioned automatic wafer leveling device for operation, and includes:

[0046] The robotic arm delivers the wafer to the carrying and leveling mechanism. The wafer lifting mechanism then rises, removes the wafer from the robotic arm, and places it onto the positioning suction cup, which holds the wafer in place.

[0047] The positioning suction cup is moved by the XY motion platform to the bottom of the height detection sensor, and the height detection sensor detects the height monitoring point on the positioning suction cup to obtain its height data. There are three height monitoring points, which are arranged sequentially along the circumference of the positioning suction cup.

[0048] By comparing the height data of each height monitoring point with the reference height, the required lifting distance of each height monitoring point is calculated, and the operation of the top pressure motor is controlled to adjust the height of the corresponding monitoring point.

[0049] The height monitoring point on the positioning suction cup is detected again by the height detection sensor and compared with the reference height to determine whether the adjustment is in place. If the adjustment is not in place, the adjustment and detection are performed again. After the adjustment is in place, the wafer inspection process begins.

[0050] In this embodiment, the height monitoring point is located at the center of the outermost protruding ring of the positioning suction cup, and is located on the line connecting the center of the adapter spring and the center of the positioning suction cup.

[0051] In this embodiment, when the difference between the height data of each height monitoring point and the reference height is less than 0.3 μm, it is determined that the adjustment is in place; when the difference is greater than 0.3 μm, it is determined that the adjustment is not in place.

[0052] The operation flow of the above leveling process is as follows: Figure 3 As shown in the diagram. To achieve this leveling process, each top-pressure motor needs to be connected to the motion control card via a control circuit. The motion control card then controls its operation. The circuit diagram is shown in the diagram below. Figure 4 As shown.

[0053] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. An automatic wafer leveling device with a dual-platform structure, comprising: A support assembly mechanism is installed in a wafer inspection device and has an assembly space inside. The bearing and leveling mechanism is provided in pairs, with each bearing and leveling mechanism installed in the support assembly mechanism. Each of these mechanisms has a wafer bearing space inside, and the wafer is supported and leveled by the bearing and leveling mechanism. The feature is that the load-bearing leveling mechanism includes: A load-bearing support assembly, which is provided in pairs, with each load-bearing support assembly being installed in the support assembly mechanism via a movable connection structure, and its position can be adjusted in the support assembly mechanism; A wafer positioning assembly is provided in pairs. Each wafer positioning assembly is installed in the support assembly through a movable connection structure. It can adjust its position together with the support assembly and can also adjust its position independently in the support assembly. It has a wafer positioning space inside, and the wafer is adjusted by the wafer positioning assembly. The elastic transition assembly is provided in pairs, with each elastic transition assembly installed between the load-bearing support assembly and the support assembly mechanism. It can deform when the load-bearing support assembly is adjusted, and the elastic transition assembly positions the load-bearing support assembly. The top pressure adjustment assembly is provided in pairs. Each top pressure adjustment assembly is installed in the support assembly mechanism and cooperates with the bearing support assembly. The top pressure adjustment assembly adjusts the position of the bearing support assembly in the support assembly mechanism. A wafer lifting assembly is provided, which consists of a pair. Each wafer lifting assembly is installed in the support assembly mechanism and cooperates with the wafer positioning assembly. The wafer lifting assembly drives the wafer positioning assembly to rise or fall in the support assembly, so that the wafer positioning assembly engages or disengages from the support assembly.

2. The wafer automatic leveling device with a dual-platform structure according to claim 1, characterized in that, The support assembly mechanism includes: The support plate is installed in the wafer inspection equipment via connectors. It has a pair of bearing recesses on its top and a pair of leveling recesses on its bottom. The bearing recesses and leveling recesses are positioned to correspond to each other and are adapted to the shape of the bearing and leveling mechanism. The support plate has a clearance opening in the middle, through which the bearing recesses and leveling recesses are connected. A set of assembly notches are provided on the edge of the bearing recesses. Each assembly notch is recessed radially outward from the bearing recess. They are arranged sequentially along the circumference of the bearing recesses and are connected to the leveling recesses in the axial direction. The assembly boss is provided in two sets, with each set of assembly bosses formed on the top of the support plate and corresponding to the position of the assembly notch.

3. The wafer automatic leveling device with a dual-platform structure according to claim 2, characterized in that, Each load-bearing support component includes: The bearing base plate is adapted to the shape of the bearing recess and is placed inside the bearing recess. Its position can be adjusted in the bearing recess. The edge of the bearing base plate is provided with a set of mounting flanges. Each mounting flange protrudes radially outward from the bearing base plate and extends into the mounting notch.

4. The automatic wafer leveling device with a dual-platform structure according to claim 3, characterized in that, Wafer positioning components include: The positioning suction cup is installed on the top of the support base plate. The support base plate uses a vacuum adsorption structure to adsorb and position the positioning suction cup. The position of the positioning suction cup is adjusted by the support base plate. The positioning suction cup has a wafer positioning space. The positioning suction cup adsorbs and positions the wafer and carries the wafer to adjust its position.

5. The automatic wafer leveling device with a dual-platform structure according to claim 3, characterized in that, The flexible adapter includes: The adapter spring is provided in a set. Each adapter spring is installed on the mounting boss and is engaged with the mounting flange through the adapter structure. It can deform when the position of the bearing base plate is adjusted, and the adapter spring positions the bearing base plate.

6. The automatic wafer leveling device with a dual-platform structure according to claim 5, characterized in that, The top pressure adjustment assembly includes: The top pressure motor is provided in a set. Each top pressure motor is installed in a leveling recess and arranged sequentially along the circumference of the leveling recess. The number of top pressure motors is less than the number of assembly flanges. Each top pressure motor has a top pressure cam installed on its power output shaft. A set of transmission pads is provided, each of which is installed in a leveling recess via a hinge structure. The transmission pads can deflect within the leveling recess. The position of the transmission pads corresponds to that of the assembly flange, and the number of transmission pads is less than that of the assembly flange. The top of the transmission pads abuts against the assembly flange, and the bottom of the transmission pads abuts against the top pressing cam. When the top pressing cam rotates, it drives the assembly flange and the bearing base plate to move through the transmission pads, thereby performing a leveling operation on the bearing base plate.

7. The automatic wafer leveling device with a dual-platform structure according to claim 4, characterized in that, The wafer lifting assembly includes: The lifting end is located in the clearance opening. Its top is connected to the bottom of the positioning suction cup through a vacuum adsorption structure, which can adsorb and position the positioning suction cup. The lifting motor is installed in the leveling recess. Its power output shaft is connected to the bottom of the lifting end head through a cam transmission structure. The lifting motor drives the lifting end head to adjust its position axially in the clearance passage. The lifting guide rails are provided in pairs. Each lifting guide rail is installed on the inner wall of the clearance opening and extends along the axial direction of the clearance opening. They are engaged with the lifting end head through a slider and the lifting guide rails guide the position adjustment process of the lifting end head.

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