Rapid cooling electrostatic chuck

Abstract

The utility model particularly relates to a rapid cooling electrostatic chuck, which comprises a base, and a first dielectric layer, an adsorption electrode layer, a second dielectric layer, a heater layer and a third dielectric layer which are sequentially arranged from top to bottom, and the lower surface of the third dielectric layer is arranged on the upper surface of the base; the adsorption electrode layer and the heater layer are respectively provided with an adsorption electrode leading-out end and a heating electrode leading-out end; the periphery of the base is provided with an air blowing guide column and a fixing bolt which extend from bottom to top; the fixing bolt is used for fixing the base with the first dielectric layer, the second dielectric layer and the third dielectric layer; the first dielectric layer, the second dielectric layer and the third dielectric layer are ceramic dielectric layers; the bottom of the base is provided with an air channel and an air inlet hole communicated with the air channel, and the air blowing guide column is communicated with the air channel and provided with an air blowing hole used for blowing air to the base. The electrostatic chuck is convenient to assemble, the electrostatic chuck and the wafer can be rapidly cooled, and the temperature of the wafer can be well controlled.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, concretely relates to a kind of quick cooling electrostatic chuck. BACKGROUND

[0002] Electrostatic chuck is one of the core components in chip and LCD / OLED panel processing equipment, and has been widely used in dry etching, physical vapor deposition, chemical vapor deposition, ion implantation and other processes, and its main function is to fix wafer / glass substrate through electrostatic adsorption force to process it.In the electrostatic chuck, helium gas hole is often set, and the helium gas hole is set to pass helium from the gas hole to the front of the wafer to cool and cool down.However, in the processing of electrostatic chuck, base and ceramic dielectric layer are often welded, which has the risk of affecting product yield during welding and is inconvenient for production and assembly, and the existing electrostatic chuck often has the problem of poor cooling effect, which needs to be further improved. SUMMARY

[0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the utility model is to provide a kind of quick cooling electrostatic chuck, the electrostatic chuck is assembled conveniently, the electrostatic chuck and wafer can be cooled quickly, and the temperature of wafer can be controlled better.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme: a kind of quick cooling electrostatic chuck, including base and first dielectric layer, adsorption electrode layer, second dielectric layer, heater layer and third dielectric layer arranged from top to bottom, the lower surface of the third dielectric layer is arranged on the upper surface of the base;The upper surface of the first dielectric layer is provided with a plurality of spaced distribution bosses;The adsorption electrode layer and the heater layer are respectively provided with adsorption electrode lead-out end and heating electrode lead-out end;

[0005] The outer periphery of the base is provided with a gas blowing guide column and a fixed insertion pin, which extend from bottom to top;The first dielectric layer, the second dielectric layer and the third dielectric layer are all ceramic dielectric layers;The bottom of the base is provided with an air duct and a gas inlet hole communicated with the air duct, and the gas blowing guide column is communicated with the air duct and provided with a gas blowing hole for blowing the base.

[0006] Further, the upper surface of the first dielectric layer is provided with a plurality of spaced distribution bosses;

[0007] Further, the number of the gas blowing guide column and the fixed insertion pin is multiple, the plurality of gas blowing guide columns are arranged in a ring array, and the plurality of fixed insertion pins are arranged in a ring array.

[0008] Further, the blowing guide column comprises a hollow column, a top cover arranged at the upper end of the hollow column and a connecting portion arranged at the lower end of the hollow column, a plurality of blowing holes are arranged on the side wall of the hollow column facing the base, and the hollow column is communicated with the gas passage.

[0009] Further, a gap is arranged between the hollow column and the base; and the blowing guide column extends upward from the lower end of the base to the upper end of the first dielectric layer.

[0010] Further, the gas passage comprises a first channel, a second channel and a plurality of third channels; the first channel is annular and surrounds the gas inlet hole, the second channel and the third channels are linear, the gas inlet hole is communicated with the first channel through the second channel, and the first channel is communicated with the plurality of corresponding blowing guide columns through the plurality of third channels.

[0011] Further, a first fixing lug and a second fixing lug are arranged on the outer periphery of the base, the blowing guide column and the fixing pin are respectively inserted with the first fixing lug and the second fixing lug; a groove is arranged on the outer peripheral edge of the base, and the fixing pin is embedded in the groove and abuts against the inner wall of the groove.

[0012] Further, the first fixing lug and the second fixing lug are arranged at intervals.

[0013] Further, the adsorption electrode layer comprises a first adsorption electrode and a second adsorption electrode, the first adsorption electrode surrounds the outer periphery of the second adsorption electrode, and the first adsorption electrode and the second adsorption electrode are respectively provided with a first adsorption electrode lead-out end and a second adsorption electrode lead-out end.

[0014] Further, the heater layer is provided with a heating coil, the heating coil comprises a coil first end and a coil second end connected with the coil first end, and the heating coil is arranged in a reciprocating backfolding mode from the coil first end to the coil second end.

[0015] Further, the adsorption electrode lead-out end extends downward from the adsorption electrode layer to the lower end of the base, and the heating electrode lead-out end extends downward from the heating electrode to the lower end of the base.

[0016] The quick cooling electrostatic chuck of the utility model has the advantages that: when the quick cooling electrostatic chuck is used, the gas inlet hole, the gas passage, the interior of the blowing guide column and the blowing holes form a helium passage to convey helium, the blowing guide column can convey helium to the electrostatic chuck, so that the electrostatic chuck and the wafer can be rapidly cooled and cooled down; the base and the ceramic dielectric layer are combined by the fixing pin, so that the base and the ceramic dielectric layer are convenient to assemble and disassemble, and the welding risk between the base and the ceramic dielectric layer is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a three-dimensional structure schematic diagram of the quick cooling electrostatic chuck of the utility model.

[0018] Figure 2 is a top view of the quick cooling electrostatic chuck of the utility model.

[0019] Figure 3 is a bottom section view of the quick cooling electrostatic chuck of the utility model.

[0020] Figure 4 is a three-dimensional structure schematic diagram of the blowing guide column of the utility model.

[0021] Figure 5 is another view of the blowing guide column of the utility model.

[0022] Figure 6 is a structure schematic diagram of the adsorption electrode of the utility model.

[0023] Figure 7 is a structure schematic diagram of the heater of the utility model.

[0024] The reference signs are: 11, base; 12, first dielectric layer; 13, blowing guide column; 14, fixed bolt; 15, first fixed lug; 16, second fixed lug; 17, boss; 18, air passage; 19, gas inlet hole; 20, adsorption electrode lead-out end; 21, heating electrode lead-out end; 22, blowing hole; 23, connecting part; 24, top cover; 25, first adsorption electrode; 26, second adsorption electrode; 27, heater; 28, heating coil; 29, first channel; 30, second channel; 31, third channel. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of those skilled in the art, the utility model is further explained below in combination with examples and drawings, and the content mentioned in the implementation manner is not a limitation on the utility model.

[0026] As Figures 1-7 shown, a kind of quick cooling electrostatic chuck, including base 11 and by upper and lower sequentially arranged first dielectric layer 12, adsorption electrode layer, second dielectric layer, heater layer and third dielectric layer, the lower surface of the third dielectric layer is arranged on the upper surface of base 11;The adsorption electrode layer and heater layer are respectively provided with adsorption electrode lead-out end 20 and heating electrode lead-out end 21;The adsorption electrode lead-out end 20 is used to connect with the adsorption power supply outside, and the heating electrode lead-out end 21 is used to connect with the heating power supply outside;

[0027] The outer periphery of the base 11 is provided with a gas blowing guide column 13 and a fixing pin 14, both of which extend from bottom to top, and the fixing pin 14 is used to fix the base 11 with the first dielectric layer 12, the second dielectric layer and the third dielectric layer; the first dielectric layer 12, the second dielectric layer and the third dielectric layer are all ceramic dielectric layers; the bottom of the base 11 is provided with an air channel 18 and a gas inlet hole 19 in communication with the air channel 18, and the gas blowing guide column 13 is in communication with the air channel 18 and is provided with a gas blowing hole 22 for blowing gas to the base 11.

[0028] The helium gas channel is formed by the gas inlet hole 19, the air channel 18, the gas blowing guide column 13 and the gas blowing hole 22, and the gas blowing guide column 13 can be arranged to convey helium gas to the electrostatic chuck, so that the electrostatic chuck and the wafer can be rapidly cooled and cooled; the base 11 and the ceramic dielectric layer are combined by the fixing pin 14, which is convenient to disassemble and reduces the welding risk between the base 11 and the ceramic dielectric layer. The electrostatic chuck is easy to assemble, can realize rapid cooling and cooling of the electrostatic chuck and the wafer, and can better control the temperature of the wafer. The product quality and working stability during processing are improved. In the embodiment, the upper end of the base 11 is recessed downward to form a receiving groove, and the lower surface of the third dielectric layer is arranged on the bottom of the receiving groove.

[0029] Further, the upper surface of the first dielectric layer 12 is provided with a plurality of spaced distribution bosses 17, and the plurality of bosses 17 are uniformly arranged. The boss 17 provides support for the wafer, which is conducive to the entry of helium gas into the gap between the wafer and the ceramic dielectric layer to realize temperature control of the wafer, so that the surface temperature of the wafer is uniform.

[0030] Further, the number of the gas blowing guide column 13 and the fixing pin 14 is multiple, the plurality of gas blowing guide columns 13 are arranged in a ring array, and the plurality of fixing pins 14 are arranged in a ring array.

[0031] Further, the gas blowing guide column 13 includes a hollow column, a top cover 24 arranged at the upper end of the hollow column and a connecting part 23 arranged at the lower end of the hollow column, a plurality of gas blowing holes 22 are arranged on the side wall of the hollow column facing the base 11, the connecting part 23 is provided with a notch, and the hollow column is in communication with the air channel 18 through the notch. The helium gas can enter the hollow column through the gas inlet hole 19, the air channel 18 and the notch of the connecting part 23, and then be blown out through the gas blowing hole 22.

[0032] The utility model discloses a set up several blow -off guide column 13 on the outer periphery of electrostatic chuck, and helium is blown to the electrostatic chuck and wafer surface through blow -off guide column 13, plays the role of quick cooling and temperature reduction, can also control the precision of wafer temperature, and the heat transfer is even when wafer processing, is favorable to keep the stability and quality of wafer, thereby improves production efficiency, can also reduce the power of heater 27 simultaneously, saves energy and production cost. The cross section of the ceramic dielectric layer and base 11 of the embodiment is circular, and in other embodiments, it can also be set as polygonal structure such as square.

[0033] Further, the hollow cylinder and the base 11 are provided with a gap; the blow -off guide column 13 extends from the lower end of the base 11 to the upper end of the first dielectric layer 12.

[0034] Further, the gas passage 18 includes a first channel 29, a second channel 30 and a plurality of third channels 31; the first channel 29 is annular and surrounds the gas inlet hole 19, the second channel 30 and the third channel 31 are both linear, the second channel 30 extends from the inner ring wall of the first channel 29 towards the gas inlet hole 19, the third channel 31 extends outwardly from the outer ring wall of the first channel 29, the gas inlet hole 19 communicates with the first channel 29 through the second channel 30, and the first channel 29 communicates with a plurality of corresponding blow -off guide columns 13 through a plurality of third channels 31. The first channel 29 is arranged in the area close to the edge of the base 11, helium passes through the gas inlet hole 19, the second channel 30, the first channel 29 and the third channel 31 in turn, and enters the hollow cylinder through the lower end of the blow -off guide column 13, and is blown out through the blow -off hole 22.

[0035] The gas inlet hole 19, the gas passage 18, the blow -off guide column 13 and the blow -off hole 22 of the embodiment form a helium gas channel to deliver helium, and the blow -off guide column 13 can deliver helium from the side and top of the electrostatic chuck, so that the electrostatic chuck and the wafer are quickly cooled and cooled.

[0036] Further, the outer periphery of the base 11 is provided with a first fixed lug 15 and a second fixed lug 16, and the blow -off guide column 13 and the fixed pin 14 are respectively inserted with the first fixed lug 15 and the second fixed lug 16; the outer periphery of the base 11 is provided with a groove, and the fixed pin 14 is embedded in the groove and abuts with the inner wall of the groove. The first fixed lug 15 and the second fixed lug 16 are arranged at intervals. Due to the arrangement of the above structure, the blow -off guide column 13 and the fixed pin 14 are installed on the base 11, and the assembly is convenient.

[0037] Further, the first dielectric layer 12, the second dielectric layer, the third dielectric layer, the adsorption electrode layer and the heating electrode layer are integrally formed. The ceramic dielectric layer of the electrostatic chuck is integrally sintered with the adsorption electrode layer and the heating electrode layer at high temperature, and is more convenient to assemble with the base 11. The electrostatic chuck can effectively improve the heating efficiency and reduce the heat loss during use, can optimize the temperature control, and can ensure the quality and stability of wafer processing.

[0038] Further, the adsorption electrode layer comprises a first adsorption electrode 25 and a second adsorption electrode 26, the first adsorption electrode 25 surrounds the outer periphery of the second adsorption electrode, and the first adsorption electrode 25 and the second adsorption electrode 26 are the blank area of the adsorption electrode layer; the first adsorption electrode 25 and the second adsorption electrode 26 are respectively provided with a first adsorption electrode lead-out end and a second adsorption electrode lead-out end. The adsorption electrode layer of the embodiment adopts a double-electrode arrangement, and is provided with two adsorption electrodes, so that the adsorption effect can be effectively improved.

[0039] Further, the heater layer is provided with a heater 27, the heater 27 is provided with a heating coil 28, the heating coil 28 comprises a coil first end and a coil last end connected with the coil first end, the heating coil 28 is reciprocally and back-folded from the coil first end to the coil last end, and the coil first end and the coil last end are both connected with a heating electrode lead-out end 21.

[0040] The above embodiment is a preferred implementation scheme of the utility model, in addition to this, the utility model can be realized in other ways, and any obvious replacement without departing from the utility model concept is within the protection scope of the utility model.

Claims

1. A rapid cooling electrostatic chuck, characterized by: The base and the first dielectric layer, the adsorption electrode layer, the second dielectric layer, the heater layer and the third dielectric layer are sequentially arranged from top to bottom, the lower surface of the third dielectric layer is arranged on the upper surface of the base, and the adsorption electrode layer and the heater layer are respectively provided with adsorption electrode leading ends and heating electrode leading ends. The outer periphery of the base is provided with air blowing guide columns and fixing pins which extend from bottom to top, the first dielectric layer, the second dielectric layer and the third dielectric layer are all ceramic dielectric layers, the bottom of the base is provided with an air channel and a gas inlet hole which is in communication with the air channel, and the air blowing guide columns are in communication with the air channel and are provided with air blowing holes for blowing air to the base.

2. The rapid cooling electrostatic chuck of claim 1, wherein: The upper surface of the first dielectric layer is provided with a plurality of spaced distribution bosses.

3. The rapid cooling electrostatic chuck of claim 1, wherein: The number of the air blowing guide columns and the fixing pins is both multiple, the multiple air blowing guide columns are arranged in a ring array, and the multiple fixing pins are arranged in a ring array.

4. The rapid cooling electrostatic chuck of claim 1, wherein: The air blowing guide column comprises a hollow column, a top cover arranged on the upper end of the hollow column and a connecting part arranged on the lower end of the hollow column, a plurality of air blowing holes are arranged on the side wall of the hollow column which faces the base, and the hollow column is in communication with the air channel.

5. The rapid cooling electrostatic chuck of claim 4, wherein: A gap is arranged between the hollow column and the base, and the air blowing guide column extends upward from the lower end of the base to beyond the upper end of the first dielectric layer.

6. The rapid cooling electrostatic chuck of claim 3, wherein: The air channel comprises a first channel, a second channel and a plurality of third channels, the first channel is annular and surrounds the gas inlet hole, the second channel and the third channel are both linear, the gas inlet hole is in communication with the first channel via the second channel, and the first channel is in communication with the multiple corresponding air blowing guide columns via the multiple third channels.

7. The rapid cooling electrostatic chuck of claim 1, wherein: The outer periphery of the base is provided with a first fixing lug and a second fixing lug, the air blowing guide columns and the fixing pins are respectively inserted into the first fixing lug and the second fixing lug, the outer periphery edge of the base is provided with a groove, and the fixing pins are embedded in the groove and abut against the inner wall of the groove.

8. The rapid cooling electrostatic chuck of claim 1, wherein: The adsorption electrode layer comprises a first adsorption electrode and a second adsorption electrode, the first adsorption electrode surrounds the outer periphery of the second adsorption electrode, and the first adsorption electrode and the second adsorption electrode are respectively provided with first adsorption electrode leading ends and second adsorption electrode leading ends.

9. The rapid cooling electrostatic chuck of claim 1, wherein the heater layer is provided with a heating coil, the heating coil comprises a coil head end and a coil tail end connected with the coil head end, and the heating coil is arranged in a reciprocating backfolding manner.

10. The rapid cooling electrostatic chuck of claim 1, wherein: The adsorption electrode leading ends extend downward from the adsorption electrode layer to the lower end of the base, and the heating electrode leading ends extend downward from the heater electrode to the lower end of the base.

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