Chip packaging structure and electronic equipment

Abstract

The utility model provides a chip packaging structure and electronic equipment. The chip packaging structure comprises a lead frame, a chip and a packaging body, the packaging body is used for packaging the lead frame and the chip; the lead frame comprises a base island which is used for bearing a chip; a plurality of power supply pins, a plurality of high-voltage pins, a plurality of low-voltage pins and a plurality of ground end pins, each power supply pin is only adjacent to the same kind of pins or the high-voltage pins, and each low-voltage pin is only adjacent to the same kind of pins or the ground end pins; wherein the chip is electrically connected with the plurality of power supply pins, the plurality of high-voltage pins, the plurality of low-voltage pins and the plurality of ground end pins respectively. According to the utility model, each power supply pin is only adjacent to a similar pin or a high-voltage pin, and each low-voltage pin is only adjacent to the similar pin or a ground end pin, so that the chip and the MCU connected with the chip cannot be damaged when the adjacent pins are short-circuited.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of chip packaging especially relates to a chip packaging structure and electronic equipment. BACKGROUND

[0002] Electronic chip often will cause short circuit of adjacent pin because of electrostatic discharge, internal structure problem, electromagnetic interference or material medium migration.

[0003] However, the chip of prior art is easy to cause damage to the chip itself or external chip when short circuit occurs in adjacent packaging pin.

[0004] Therefore, it has become a technical problem to be solved in the industry to provide a chip packaging structure that will not be damaged by short circuit of adjacent pins. SUMMARY

[0005] The utility model embodiment provides a kind of chip packaging structure and electronic equipment, to solve the problem that the chip of prior art is easy to cause damage to the chip itself or external chip when short circuit occurs in adjacent packaging pin.

[0006] To solve the above technical problems, the technical scheme of the utility model provides a kind of chip packaging structure, comprising: lead frame, chip and encapsulation body;

[0007] The encapsulation body is used to encapsulate the lead frame and the chip;

[0008] The lead frame includes: base island, the base island is used to support the chip;A plurality of power pins, a plurality of high-voltage pins, a plurality of low-voltage pins and a plurality of ground pins, each power pin is adjacent to the same type of pin or the high-voltage pin, each low-voltage pin is adjacent to the same type of pin or the ground pin;Wherein, the chip is electrically connected with the plurality of power pins, the plurality of high-voltage pins, the plurality of low-voltage pins and the plurality of ground pins respectively.

[0009] Optionally, the chip is specifically an electromagnetic valve driving chip, and the electromagnetic valve driving chip is integrated with a plurality of valve driving modules, low-voltage power supply modules, communication modules, watchdog modules, driving control modules, current detection modules and charge pumps.

[0010] Optionally, the plurality of power pins includes: a plurality of valve driving power pins and charge pump power supply pins;

[0011] Each valve driving power pin is connected to the power supply end of the corresponding valve driving module;

[0012] The charge pump power supply pin is connected to the power supply end of the charge pump.

[0013] Optionally, the plurality of high-voltage pins comprise: a plurality of valve drive output pins, a plurality of first current detection input pins, a plurality of second current detection input pins, a plurality of current detection output pins, and a charge pump output pin.

[0014] Each of the valve drive output pins is connected to an output end of a corresponding valve drive module.

[0015] Each of the first current detection input pins, each of the second current detection input pins, and each of the current detection output pins is respectively connected to a first input end, a second input end, and an output end of a corresponding current detection module.

[0016] The charge pump output pin is connected to an output end of the charge pump.

[0017] Optionally, the plurality of low-voltage pins comprise: a plurality of communication pins, a reset pin, a low-voltage power supply pin, an enable pin, and a plurality of direct connection control pins.

[0018] The plurality of communication pins are connected to the communication module.

[0019] The low-voltage power supply pin is connected to the low-voltage power supply module.

[0020] The reset pin is connected to an output end of the watchdog module.

[0021] The enable pin is connected to the drive control module.

[0022] The plurality of direct connection control pins are each connected to a direct connection control end of a corresponding valve drive module.

[0023] Optionally, the low-voltage power supply pin and the plurality of direct connection control pins are further connected to an MCU.

[0024] Optionally, the chip packaging structure further comprises: a diode, a positive electrode of the diode being connected to the low-voltage power supply pin, and a negative electrode of the diode being connected to the current detection output pin.

[0025] Optionally, the plurality of ground end pins comprise: a plurality of valve drive ground end pins, each of the plurality of valve drive ground end pins being connected to a ground end of a corresponding valve drive module.

[0026] Optionally, the ground end pins are arranged between the high-voltage pins and the low-voltage pins, and the high-voltage pins are arranged between the power supply pins and the ground end pins.

[0027] The technical scheme of the utility model further provides an electronic device comprising the chip packaging structure.

[0028] Compared with the prior art, the technical scheme provided by the utility model has the following beneficial effects:

[0029] The chip packaging structure provided in the technical scheme of the utility model, through setting up each power pin only with similar pin or high voltage pin adjacent, and each low voltage pin only with similar pin or ground pin adjacent, thereby ensure that adjacent pin short circuit, will not damage the chip itself and the connected MCU.

[0030] Further, by setting the diode, when the current detection output pin short circuit, prevent the current back to the low voltage power pin, thereby protecting the low voltage power pin connected to the MCU. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 The chip packaging structure provided in the technical scheme of the utility model, through setting up each power pin only with similar pin or high voltage pin adjacent, and each low voltage pin only with similar pin or ground pin adjacent, thereby ensure that adjacent pin short circuit, will not damage the chip itself and the connected MCU. Figure One

[0032] Figure 2 The chip packaging structure provided in the technical scheme of the utility model, through setting up each power pin only with similar pin or high voltage pin adjacent, and each low voltage pin only with similar pin or ground pin adjacent, thereby ensure that adjacent pin short circuit, will not damage the chip itself and the connected MCU. Figure Two DETAILED DESCRIPTION

[0033] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the scope of protection of the utility model. The terms "first", "second", "third", "fourth" and the like (if exist) in the specification and claims of the utility model and the above drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to the clearly listed steps or units, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0034] As described in the background, the chip in the prior art is easy to damage the chip itself or the external chip when the adjacent packaging pin short circuit.

[0035] Therefore, the embodiments of the utility model provide a new chip packaging structure to prevent the chip itself or the external chip from being damaged when the adjacent pin short circuit. ​​

[0036] wherein, Figure 1 is a structural diagram of a chip packaging structure provided by an embodiment of the present application Figure One .

[0037] Please refer to Figure 1 , the chip packaging structure provided by an embodiment of the present application comprises:

[0038] a lead frame, a chip 30 and a packaging body 10;

[0039] The packaging body 10 is used for packaging the lead frame and the chip 30;

[0040] The lead frame comprises a base island 21, the base island 21 is used for bearing the chip 30; a plurality of power pins 221, a plurality of high-voltage pins 222, a plurality of low-voltage pins 223 and a plurality of ground pins 224, each of the power pins 221 is adjacent to a pin of the same type or the high-voltage pin 222, and each of the low-voltage pins 223 is adjacent to a pin of the same type or the ground pin 224;

[0041] The chip 30 is electrically connected with the plurality of power pins 221, the plurality of high-voltage pins 222, the plurality of low-voltage pins 223 and the plurality of ground pins 224 respectively.

[0042] It should be noted that the number of the power pins 221, the high-voltage pins 222, the low-voltage pins 223 and the ground pins 224 depends on the internal circuit structure of the chip 30, which is not limited here.

[0043] When the power pin 221 and the adjacent ground pin 224 of the chip 30 are short-circuited, the current flowing through the chip 30 will greatly increase, thereby causing the chip 30 to be burned out.

[0044] When the power pin 221 and the adjacent low-voltage pin 223 of the chip 30 are short-circuited, the external chip 30 such as MCU connected with the low-voltage pin 223 and the internal circuit of the chip 30 connected with the low-voltage pin 223 will be damaged.

[0045] When the high-voltage pin 222 and the adjacent low-voltage pin 223 of the chip 30 are short-circuited, the external chip 30 such as MCU connected with the low-voltage pin 223 and the internal circuit of the chip 30 connected with the low-voltage pin 223 cannot work normally, and even be damaged.

[0046] Based on the above existing pin problems, the chip 30 packaging structure provided by the embodiment is arranged such that each power pin 221 is adjacent to only the same type of pin or the high-voltage pin 222, and each low-voltage pin 223 is adjacent to only the same type of pin or the ground pin 224, so that when short circuit occurs between adjacent packaging pins, damage to the chip 30 itself and the external chip 30 is avoided.

[0047] In order to make the above-mentioned purposes, characteristics and beneficial effects of the utility model more obvious and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0048] The following takes the chip as an electromagnetic valve driving chip as an example to describe the pin layout of the chip packaging structure provided by the embodiment.

[0049] Among them, Figure 2 is the structural diagram of the chip packaging structure provided by the embodiment of the utility model Figure Two .

[0050] Please refer to Figure 2 , the electromagnetic valve driving chip integrates 4 high-low side valve drive modules, a low-voltage power supply module, a communication module, a watchdog module, a driving control module, 2 current detection modules, and a charge pump.

[0051] Each high-low side valve drive module is used for high-side driving or low-side driving of the corresponding electromagnetic valve, and each high-low side valve drive module is provided with a power supply end, an output end, and a ground end.

[0052] Therefore, the plurality of power pins include 4 valve drive power pins VS_SOL to correspond to the 4 valve drive modules respectively, and each valve drive power pin VS_SOL is connected to the power supply end of the corresponding high-low side valve drive module. The plurality of high-voltage pins include valve drive output pins LOAD_SOL, and each valve drive output pin LOAD_SOL is connected to the output end of the corresponding high-low side valve drive module. The plurality of ground pins include 4 valve drive ground pins GND_SOL, and each valve drive ground pin GND_SOL is connected to the ground end of the corresponding high-low side valve drive module. Since the power pins and the ground pins cannot be adjacent, the adjacent two sides of the valve drive ground pin GND_SOL are arranged as the valve drive output pin LOAD_SOL, and the two ends of the valve drive power pin VS_SOL are arranged as the valve drive output pin LOAD_SOL or the valve drive power pin VS_SOL.

[0053] It should be noted that if the valve drive module is only a low-side drive module, the corresponding valve drive power supply pin VS SOL does not need to be set, and only the corresponding valve drive output pin LOAD SOL and valve drive ground pin GND SOL need to be set. If the valve drive module is only a high-side drive module, the corresponding valve drive ground pin GND SOL does not need to be set, and only the corresponding valve drive output pin LOAD SOL and valve drive power supply pin VS SOL need to be set. Therefore, the embodiment is only an example, and the actual valve drive module can be different according to different needs, which is not limited here.

[0054] The low-voltage power supply module is specifically a 3.3V low-voltage internal converter for powering the current detection module and the external MCU. Therefore, the low-voltage supply pin VDD is included in the plurality of low-voltage pins to connect the low-voltage power supply module, the external MCU and the current detection module.

[0055] The communication module is specifically an SPI communication module for communicating with the external MCU. Therefore, the selection pin CSN, the clock pin CLK, the serial input pin SDI, the serial output pin SDO and the fault detection pin FAULTn are included in the plurality of low-voltage pins to connect the SPI communication module.

[0056] The watchdog module is used to detect the working state of the external MCU and restart the MCU when the MCU has a fault. Therefore, the reset pin RESn is included in the plurality of low-voltage pins to connect the watchdog module and the external MCU.

[0057] The drive control module is used to control the on-off of the power tube in the high-low side valve drive module. Therefore, the enable pin EN is included in the plurality of low-voltage pins to connect the drive control module, thereby controlling the enable and disable of the high-low side valve drive module.

[0058] Each of the current detection modules is used to detect the current flowing through the electromagnetic valve, and each current detection module is provided with a first input end, a second input end and an output end. Therefore, the plurality of high-voltage pins includes two first current detection input pins CSA INP, two second current detection input pins CSA INN and two current detection output pins CSA OUT. Each first current detection input pin CSA INP is connected to the first input end of the corresponding current detection module, each second current detection input pin CSA INN is connected to the second input end of the corresponding current detection module, and each second current detection output pin CSA OUT is connected to the output end of the corresponding current detection module.

[0059] It should be noted that one current detection module can detect the current of multiple electromagnetic valves, so the current detection module and the valve drive module do not need to be one-to-one corresponding.

[0060] Since the current detection module is powered by the low-voltage power supply module, when the current detection output pin CSA_OUT and the adjacent pin are short-circuited, the high voltage on the current detection output pin CSA_OUT will be transmitted to the external MCU through the low-voltage power supply pin VDD, thereby damaging the external MCU. Therefore, a diode is arranged between the current detection output pin CSA_OUT and the low-voltage power supply pin VDD to prevent the external MCU from being damaged due to short circuit of the current detection output pin CSA_OUT.

[0061] The charge pump is used to boost the input power voltage and output to the corresponding high-low side valve drive module, and the charge pump is provided with an input end and an output end. Therefore, the plurality of high-voltage pins includes a charge pump output pin CP to connect the output end of the charge pump, and the plurality of power supply pins includes a charge pump power supply pin VBAT to transmit the power voltage to the input end of the charge pump.

[0062] Of course, the packaging of the chip other than the electromagnetic valve driving chip is also applicable to the technical solution of the present application, and is not limited here.

[0063] In summary, the chip packaging structure provided by the embodiments of the present application ensures that when the adjacent pins are short-circuited, the chip itself and the connected MCU will not be damaged, by arranging each power supply pin adjacent to the same type of pin or the high-voltage pin, and each low-voltage pin adjacent to the same type of pin or the ground pin.

[0064] Further, by arranging the diode, when the current detection output pin is short-circuited, the current is prevented from being backfed to the low-voltage power supply pin, thereby protecting the MCU connected to the low-voltage power supply pin.

[0065] The embodiments of the present application also provide an electronic device comprising the chip packaging structure.

[0066] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip packaging structure, characterized in that, The packaging structure includes: a lead frame, a chip, and a package body; The package is used to encapsulate the lead frame and the chip; The lead frame includes: a base island for supporting the chip; a plurality of power supply pins, a plurality of high-voltage pins, a plurality of low-voltage pins, and a plurality of ground pins, wherein each power supply pin is adjacent only to a pin of the same type or the high-voltage pin, and each low-voltage pin is adjacent only to a pin of the same type or the ground pin; wherein the chip is electrically connected to the plurality of power supply pins, the plurality of high-voltage pins, the plurality of low-voltage pins, and the plurality of ground pins respectively.

2. The chip packaging structure according to claim 1, characterized in that, The chip is specifically a solenoid valve driver chip, which integrates several valve drive modules, low-voltage power supply modules, communication modules, watchdog modules, drive control modules, current detection modules, and charge pumps.

3. The chip packaging structure according to claim 2, characterized in that, The plurality of power supply pins include: a plurality of valve drive power supply pins and charge pump power supply pins; Each of the valve drive power pins is connected to the power supply terminal of the corresponding valve drive module; The charge pump power supply pin is connected to the power supply terminal of the charge pump.

4. The chip packaging structure according to claim 3, characterized in that, The plurality of high-voltage pins include: a plurality of valve drive output pins, a plurality of first current detection input pins, a plurality of second current detection input pins, a plurality of current detection output pins, and charge pump output pins; Each valve drive output pin is connected to the output terminal of the corresponding valve drive module; Each of the first current detection input pins, each of the second current detection input pins, and each of the current detection output pins are respectively connected to the first input terminal, the second input terminal, and the output terminal of the corresponding current detection module. The charge pump output pin is connected to the output terminal of the charge pump.

5. The chip packaging structure according to claim 4, characterized in that, The plurality of low-voltage pins include: a plurality of communication pins, a reset pin, a low-voltage power supply pin, an enable pin, and a plurality of direct-connection control pins; Several communication pins are connected to the communication module; The low-voltage power supply pin is connected to the low-voltage power supply module; The reset pin is connected to the output of the watchdog module; The enable pin is connected to the drive control module; Each of the aforementioned direct-connect control pins is connected to the direct-connect control terminal of the corresponding valve drive module.

6. The chip packaging structure according to claim 5, characterized in that, The low-voltage power supply pin and the several direct-connect control pins are also connected to the MCU.

7. The chip packaging structure according to claim 6, characterized in that, The chip package structure also includes a diode, the positive terminal of which is connected to the low-voltage power supply pin, and the negative terminal of which is connected to the current detection output pin.

8. The chip packaging structure according to claim 5, characterized in that, The plurality of ground pins include: a plurality of valve drive ground pins, wherein each of the plurality of valve drive ground pins is connected to the ground of the corresponding valve drive module.

9. The chip packaging structure according to any one of claims 1 to 8, characterized in that, A ground pin is provided between the high-voltage pin and the low-voltage pin; a high-voltage pin is provided between the power pin and the ground pin.

10. An electronic device, characterized in that, Includes the chip packaging structure described in any one of claims 1 to 9.

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