LED lamp bead mounting structure

Abstract

The utility model relates to an LED lamp bead installation structure, which comprises a lamp bead support, a lamp bead chip and packaging glue, the lamp bead support comprises a substrate and a retaining wall, a material placing groove is arranged between the substrate and the retaining wall, and the substrate is provided with a first conducting layer and a second conducting layer which are separated by an insulating parting strip and are respectively arranged on two sides; the lamp bead chip is placed in the material placing groove, the bottom end face of the lamp bead chip is fixed to the substrate through the viscous conducting medium, and the lamp bead chip is electrically connected with the first conducting layer and the second conducting layer. Grooves with notches are formed in the positions, corresponding to the first conducting layer and the second conducting layer, of the top end face of the substrate, the adhesive conducting media are filled in the grooves, and the lamp bead chips are fixed through the adhesive conducting media in the grooves and located on the outer surfaces of the first conducting layer and the second conducting layer. And the surface where the adhesion end of the lamp bead chip is located is flush with the plane where the insulating parting strip and the notch are located. According to the embodiment of the utility model, the mounting stability of the lamp bead chip is good, and the lamp bead chip can be prevented from inclining and deviating.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED lamp pearl installation technical field, especially a kind of LED lamp pearl installation structure. BACKGROUND

[0002] The prior art LED lamp pearl installation structure includes lamp pearl support, lamp pearl chip and encapsulation glue, the lamp pearl support includes base plate and the retaining wall being set around the base plate, the base plate and the retaining wall between being provided with material slot, the base plate has the first conductive layer and the second conductive layer being respectively arranged by the insulating partition strip separation two sides, the lamp pearl chip is placed into the material slot and bottom end face is fixed on the base plate by means of adhesive conductive medium, the lamp pearl chip is electrically connected with the first conductive layer and the second conductive layer respectively.

[0003] However, the inventor found in the specific implementation that the lamp pearl chip of the above-mentioned LED lamp pearl installation structure is prone to tilting and deviation after being placed in the material slot, which in turn leads to poor electrical connection between the lamp pearl chip and the first conductive layer or the second conductive layer, seriously affecting the yield and quality of finished lamp pearls. SUMMARY

[0004] Therefore, it is necessary to provide an LED lamp pearl installation structure with good installation stability of lamp pearl chip, which can effectively prevent the lamp pearl chip from tilting and deviating.

[0005] The technical solution for solving the above technical problem is as follows: an LED lamp pearl installation structure, comprising:

[0006] a lamp pearl support, the lamp pearl support includes a base plate and a retaining wall arranged around the base plate, a material slot is arranged between the base plate and the retaining wall, and the base plate has a first conductive layer and a second conductive layer arranged on both sides respectively by an insulating partition strip;

[0007] a lamp pearl chip, the lamp pearl chip is placed into the material slot and the bottom end face is fixed on the base plate by means of an adhesive conductive medium, and the lamp pearl chip is electrically connected with the first conductive layer and the second conductive layer respectively; and

[0008] an encapsulation glue filled in the material slot and corresponding to the encapsulation of the lamp pearl chip; wherein,

[0009] a groove with a notch is formed in the top end face of the base plate corresponding to the positions of the first conductive layer and the second conductive layer respectively, the adhesive conductive medium is filled in the groove, the lamp pearl chip is fixed and positioned on the outer surface of the first conductive layer and the second conductive layer by the adhesive conductive medium in the groove, and the surface where the adhesive end of the lamp pearl chip is located is flush with the plane where the insulating partition strip and the notch are located.

[0010] In one embodiment, the number of the grooves is at least two, and the lamp bead chip is electrically connected to the corresponding first conductive layer and second conductive layer through the adhesive conductive medium filled in each groove.

[0011] In one embodiment, the groove is formed by etching process or stamping process.

[0012] In one embodiment, the surface of the substrate corresponding to the lamp bead chip is provided with a plurality of positioning protrusions arranged around the peripheral part of the lamp bead chip.

[0013] In one embodiment, the inner side wall surface of the retaining wall is provided with a rough structure for the attachment of the encapsulation glue.

[0014] In one embodiment, the rough structure is formed by machining or laser etching or chemical etching process.

[0015] In one embodiment, the encapsulation glue is fluorescent glue.

[0016] In one embodiment, the adhesive conductive medium is tin paste or silver glue.

[0017] In one embodiment, the cross-sectional shape of the groove is rectangular.

[0018] The LED lamp bead mounting structure has the advantages that: the grooves are formed on the substrate corresponding to the positions of the first conductive layer and the second conductive layer, the adhesive conductive medium is filled in advance, the lamp bead chip is positioned on the outer surface of the first conductive layer and the second conductive layer, the adhesive conductive medium in the corresponding groove adheres and fixes the lamp bead chip, the surface where the adhesive end of the lamp bead chip is located is flush with the plane where the insulating partition and the notch are located, the lamp bead chip can shield the adhesive conductive medium in the groove to ensure the stability of the adhesive conductive medium, the lamp bead chip is effectively supported and the possibility of inclination and deviation of the lamp bead chip is avoided, and the stability of the lamp bead chip installation is good. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of the drawings.

[0020] Figure 1 is a cross-sectional view of an optional embodiment of the LED lamp bead mounting structure of the present application.

[0021] Figure 2 It is a plane schematic view of a top view angle of one optional embodiment of the LED lamp bead mounting structure of the utility model;

[0022] Figure 3 It is a sectional schematic view of another optional embodiment of the LED lamp bead mounting structure of the utility model.

[0023] In the drawings, 1, lamp bead support; 11, base plate; 111, insulating partition; 113, first conductive layer; 115, second conductive layer; 116, groove; 117, positioning protrusion; 13, retaining wall; 15, material placing groove; 3, lamp bead chip; 4, conductive medium; 5, encapsulation glue. DETAILED DESCRIPTION

[0024] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict. The technical scheme of the utility model will be further described below by combining the drawings of the embodiments of the utility model. The utility model is not limited to the following specific embodiments.

[0025] It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the utility model, it should be understood that if the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation on the patent. For ordinary skilled persons in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0026] In one embodiment, as shown in Figure 1 and Figure 2 , an LED lamp bead mounting structure comprises:

[0027] A lamp bead support 1, the lamp bead support 1 comprises a base plate 11 and a retaining wall 13 arranged around the base plate 11, a material placing groove 15 is arranged between the base plate 11 and the retaining wall 13, and the base plate 11 has a first conductive layer 113 and a second conductive layer 115 arranged on both sides respectively separated by an insulating partition 111;

[0028] A lamp bead chip 3, the lamp bead chip 3 is placed into the material placing groove 15 and the bottom end face is fixed on the base plate 11 by means of adhesive conductive medium 4, and the lamp bead chip 3 is electrically connected with the first conductive layer 113 and the second conductive layer 115 respectively; and

[0029] A packaging glue 5 filled in the material slot 15 and corresponding to the packaging of the lamp bead chip 3; wherein,

[0030] The top end surface of the substrate 11 is provided with a notched groove 116 at the position corresponding to the first conductive layer 113 and the second conductive layer 115, the adhesive conductive medium 4 is filled in the notched groove 116, the lamp bead chip 3 is fixed on the outer surface of the first conductive layer 113 and the second conductive layer 115 through the adhesive conductive medium 4 in the notched groove 116, and the surface where the adhesive end of the lamp bead chip 3 is located is flush with the plane where the insulating partition strip 111 and the notch are located.

[0031] Compared with the prior art, the LED lamp bead mounting structure has at least the following advantages: the notched groove 116 is correspondingly provided on the substrate 11 at the position corresponding to the first conductive layer 113 and the second conductive layer 115, the adhesive conductive medium 4 is pre-filled, then the lamp bead chip 3 is positioned on the outer surface of the first conductive layer 113 and the second conductive layer 115, the adhesive conductive medium 4 in the corresponding notched groove 116 adhesively fixes the lamp bead chip 3, at this time, the surface where the adhesive end of the lamp bead chip 3 is located is flush with the plane where the insulating partition strip 111 and the notch are located, then the lamp bead chip can shield the adhesive conductive medium 4 in the notched groove 116 to ensure the stability of the adhesive conductive medium 4, effectively supports the lamp bead chip 3 while avoiding the possibility of inclination and deviation of the lamp bead chip 3, and the stability of the lamp bead chip 3 is good.

[0032] In one embodiment, as shown in Figure 1 and Figure 2 The number of the notched grooves 116 is at least two, and the lamp bead chip 3 is electrically connected with the corresponding first conductive layer 113 and second conductive layer 115 through the adhesive conductive medium 4 filled in each notched groove 116. In specific implementation, the first conductive layer 113 and the second conductive layer 115 are connected with an external power supply, and the lamp bead chip 3 is provided with electrodes (positive electrode and negative electrode) on the surfaces corresponding to the first conductive layer 113 and the second conductive layer 115, and then the positive and negative electrodes on the lamp bead chip 3 are electrically connected with the first conductive layer 113 and the second conductive layer 115 through the adhesive conductive medium 4 in the corresponding notched grooves. In this embodiment, the number of the notched grooves 116 is at least two, each notched groove 116 corresponds to the corresponding electrode on the lamp bead chip 3, of course, the number of the notched grooves 116 can be flexibly set according to the size of the electrode, and four notched grooves 116 can also be provided, and the specific form is not described here.

[0033] In one embodiment, as shown in Figure 1 and Figure 2As shown, the groove 116 is formed by an etching process or a punching process. The groove 116 of the present embodiment is formed by one of the etching process or the punching process, and the flexibility of the process selection for forming the groove 116 is high.

[0034] In one embodiment, as shown in Figure 3 As shown, the surface of the substrate 11 corresponding to the lamp bead chip 3 is provided with a plurality of positioning protrusions 117 arranged around the periphery of the lamp bead chip 3. The present embodiment further prevents the lamp bead chip 3 from tilting and deviating by arranging a plurality of positioning protrusions 117 on the substrate 11, and placing the lamp bead chip 3 in the area surrounded by the plurality of positioning protrusions 117.

[0035] In one embodiment, as shown in Figures 1-3 As shown, the inner side wall surface of the retaining wall 13 is provided with a rough structure (not shown in the figure) for the adhesion of the packaging glue 5. The present embodiment improves the adhesion of the packaging glue 5 by providing the rough structure on the inner groove wall surface of the retaining wall 13, and has good structural stability.

[0036] In one embodiment, the rough structure is formed by a mechanical processing or a laser etching or a chemical etching process. The rough structure of the present embodiment can be formed by one of the mechanical processing, the laser etching or the chemical etching process, and the flexibility of the process selection for forming the rough structure is high.

[0037] In one embodiment, as shown in Figures 1-3 As shown, the packaging glue 5 is a fluorescent glue. The packaging glue 5 of the present embodiment is a fluorescent glue, which can make the lamp bead chip 3 emit brighter and more uniform light. In specific implementation, the fluorescent glue can be selected as a combination of A / B silicone glue and nitride fluorescent powder, or a combination of A / B silicone glue and KSF fluorescent powder, which is convenient to select and can realize the output of different color temperatures and light colors to meet the needs of different application scenarios.

[0038] In one embodiment, as shown in Figures 1-3 As shown, the adhesive conductive medium 4 is tin paste or silver glue. The present embodiment effectively electrically connects the electrode at the bottom of the lamp bead chip 3 to the corresponding conductive layer by using the adhesive conductive medium 4 of tin paste or silver glue.

[0039] In one embodiment, as shown in Figure 1 and Figure 3As shown, the cross-sectional shape of the groove 116 is rectangular. The cross-sectional shape of the groove 116 in this embodiment is rectangular, which facilitates the molding of the structure. Of course, the structure of the groove 116 can also adopt a groove structure such as a U-shaped groove, a trapezoidal groove, etc., and the specifications are not described herein. In a specific implementation, the processing dimensions of the length, width and depth of the rectangular groove 116 are 355±15μm×355±15μm×40μm, thereby meeting the mounting requirements of the conventional lamp bead chip 3.

[0040] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments cannot be exhausted. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model claims.

Claims

1. A LED lamp bead mounting structure, comprising: a lamp bead support, the lamp bead support comprising a base plate and a retaining wall arranged around the base plate, a material placing groove being arranged between the base plate and the retaining wall, the base plate having a first conductive layer and a second conductive layer arranged on two sides respectively separated by an insulating partition; a lamp bead chip, the lamp bead chip being placed in the material placing groove and fixed on the base plate by a conductive adhesive medium at a bottom end surface, the lamp bead chip being electrically connected to the first conductive layer and the second conductive layer respectively; and a packaging glue filled in the material placing groove and corresponding to the lamp bead chip; characterized in that, a groove with a notch is arranged on a top end surface of the base plate corresponding to positions of the first conductive layer and the second conductive layer respectively, the conductive adhesive medium being filled in the groove, the lamp bead chip being fixed by the conductive adhesive medium in the groove and positioned on an outer surface of the first conductive layer and the second conductive layer, and a surface where a sticking end of the lamp bead chip is located being flush with a plane where the insulating partition and the notch are located.

2. The LED lamp bead mounting structure according to claim 1, characterized in that, The number of the groove is at least two, the lamp bead chip being electrically connected to the first conductive layer and the second conductive layer respectively by the conductive adhesive medium filled in each groove.

3. The LED lamp bead mounting structure according to claim 2, characterized in that, The groove is formed by an etching process or a stamping process.

4. The LED lamp bead mounting structure according to claim 1, characterized in that, A plurality of positioning protrusions are arranged around a peripheral portion of the lamp bead chip on a surface of the base plate corresponding to the lamp bead chip.

5. The LED lamp bead mounting structure according to claim 1, wherein, A rough structure for the packaging glue to adhere to is arranged on an inner side wall surface of the retaining wall.

6. The LED lamp bead mounting structure according to claim 5, characterized in that, The rough structure is formed by a mechanical processing or a laser etching or a chemical etching process.

7. The LED lamp bead mounting structure according to claim 1, wherein, The packaging glue is a fluorescent glue.

8. The LED lamp bead mounting structure according to claim 1, wherein, The conductive adhesive medium is a tin paste or a silver glue.

9. The LED lamp bead mounting structure according to claim 1, wherein, A cross-sectional shape of the groove is rectangular.

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