Cutting equipment for semiconductor chip production and processing

By designing an adjustment mechanism and fixture for the cutting equipment, the problem of frequent position and angle adjustments during semiconductor wafer cutting was solved, achieving convenient adjustment and efficient cutting.

CN223719849UActive Publication Date: 2025-12-26SHANGHAI SHENGJI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520214353.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2025-12-26
Estimated Expiration
2035-02-11

AI Technical Summary

Technical Problem

Existing cutting equipment requires frequent adjustments to fix and disassemble the semiconductor wafers to change the cutting position and angle, which makes operation cumbersome and reduces processing efficiency.

Method used

A cutting device including an adjustment mechanism and an adjustment fixture was designed. The semiconductor chip can be conveniently adjusted through moving and rotating components, and the cutting operation is performed in combination with a hydraulic cylinder and a cutting blade.

Benefits of technology

It enables convenient adjustment of the cutting position and angle of semiconductor chips, reduces repeated fixing and disassembly steps, improves cutting efficiency, and is applicable to semiconductor chips of different sizes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides cutting equipment for producing and processing a semiconductor chip, which relates to the field of cutting equipment and comprises a processing base and a semiconductor chip body, the semiconductor chip body is positioned at the top of the processing base, and a cutting mechanism is arranged at the top of the processing base. The adjusting mechanism is located at the top of the machining base; the adjusting clamp is located at the top of the adjusting mechanism; by arranging the adjusting mechanism, the cutting position and the cutting angle of the semiconductor chip can be conveniently adjusted and changed according to processing requirements, so that the semiconductor chip does not need to be repeatedly fixed, disassembled and adjusted, and the purposes of being simple and convenient to operate, saving time and labor and effectively improving the cutting processing efficiency are achieved; and by arranging the adjusting clamp, the semiconductor chips with different sizes can be conveniently clamped and fixed according to use requirements, so that the semiconductor chip cutting device is suitable for different use requirements, and the purpose of conveniently and normally cutting and processing the semiconductor chips with different sizes is achieved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to cutting equipment field especially relates to a cutting equipment for semiconductor chip production and processing. BACKGROUND

[0002] Semiconductor chip refers to the etching, wiring, making of semiconductor device that can realize certain function on semiconductor sheet material, not only silicon chip, common also includes gallium arsenide (gallium arsenide is toxic, so some inferior circuit board do not be curious to decompose it), germanium etc. semiconductor material, and semiconductor chip in the production and processing process, often need to cut and process semiconductor sheet material, therefore, need to use cutting equipment to cut and process semiconductor sheet material;

[0003] And the related cutting equipment when using, usually is fixed in the cutting table surface of the semiconductor sheet material to be processed, then through the cutting blade that is used to cut semiconductor sheet material falls, thereby cutting semiconductor sheet material into the shape and size required, further realizes the effect of cutting and processing semiconductor sheet material;

[0004] However, when using the above-mentioned mode, since the cutting mechanism used to cut semiconductor sheet material often needs to be fixedly installed, and the cutting requirement of semiconductor sheet material is often different, which leads to according to the different cutting requirements, often need to repeat the fixing and dismounting of semiconductor sheet material when cutting and processing semiconductor sheet material, so as to adjust the position and angle of semiconductor sheet material, so as to facilitate the adjustment of cutting point and cutting angle, which is troublesome and time-consuming, and also reduces the cutting efficiency.

[0005] Therefore, it is necessary to provide a cutting equipment for semiconductor chip production and processing to solve the above technical problems. CONTENT OF THE UTILITY MODEL

[0006] In order to solve the above-mentioned technical problem that needs to repeat the fixing and dismounting of semiconductor sheet material to adjust the position and angle of semiconductor sheet material, so as to facilitate the adjustment of cutting point and cutting angle, which is troublesome and time-consuming, and also reduces the cutting efficiency, the utility model provides a cutting equipment for semiconductor chip production and processing.

[0007] The utility model provides a kind of cutting equipment for semiconductor chip production and processing, comprising: processing base and semiconductor chip body, wherein the semiconductor chip body is located at the top of processing base, the top of processing base is provided with cutting mechanism for cutting processing;Adjusting mechanism, it is located at the top of processing base, to be used for moving and rotating adjustment to semiconductor chip body;Adjusting clamp, it is located at the top of adjusting mechanism, to be used for the clamping fixation of semiconductor chip body of different size size;The adjusting mechanism includes support plate, moving assembly and rotating component, the bottom of support plate is installed on the top of processing base by two moving assemblies, and the rotating component is installed on the top center of support plate.

[0008] Preferably, the moving assembly includes a support frame, a threaded rod, a first motor and a moving block, the bottom of the support frame is fixedly connected to the top of the processing base, the threaded rod is rotatably connected to the ends of the support frame, the first motor is fixedly connected to one end of the support frame, and one end of the threaded rod is fixedly connected to the output end of the first motor by rotating through one end of the support frame, a threaded hole is formed in the middle of the moving block, the moving block is rotatably connected to the sidewall of the threaded rod through the threaded hole, and the top of the moving block is fixedly connected to the bottom of the support plate.

[0009] Preferably, the rotating component includes a second motor, a first transmission gear, a support shaft and a second transmission gear, the bottom of the second motor is fixedly connected to the top of the support plate, the first transmission gear is fixedly connected to the output end of the second motor, the bottom of the support shaft is rotatably connected to the top center of the support plate, the second transmission gear is fixedly connected to the sidewall of the support shaft, and the sidewall of the second transmission gear is engaged with the sidewall of the first transmission gear.

[0010] Preferably, the adjusting clamp includes a clamping base plate and a plurality of fixed clamping plates, the bottom center of the clamping base plate is fixedly connected to the top of the support shaft, and the bottoms of the plurality of fixed clamping plates are symmetrically installed on the top of the clamping base plate through a plurality of size adjusting assemblies.

[0011] Preferably, the size adjusting assembly includes an adjusting sliding groove, an adjusting sliding rod, a sliding block and a spring, the adjusting sliding groove is formed in the top of the clamping base plate, the ends of the adjusting sliding rod are fixedly connected to the ends of the adjusting sliding groove, the bottom of the fixed clamping plate is slidingly connected to the sidewall of the adjusting sliding rod through the sliding block, and the ends of the spring are fixedly connected to one end of the adjusting sliding groove and one end of the sliding block, respectively.

[0012] Preferably, the cutting mechanism includes a support column, a hydraulic cylinder and a cutting knife, the bottom of the support column is fixedly connected to the top of the processing base, the sidewall of the hydraulic cylinder is fixedly connected to the top of the support column, and the top of the cutting knife is fixedly connected to the output end of the hydraulic cylinder.

[0013] Compared with the related art, the cutting equipment for semiconductor chip production and processing has the following beneficial effects:

[0014] By setting the adjusting mechanism, the cutting position and angle of the semiconductor chip can be conveniently adjusted according to the processing needs, so that the semiconductor chip does not need to be repeatedly fixed and disassembled and adjusted, thereby achieving the purposes of simple and convenient operation, time and labor saving, and effectively improving the cutting processing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 The structure schematic view provided by the utility model;

[0016] Fig. 2 The partial structure side view of the adjusting mechanism provided by the utility model;

[0017] Fig. 3 The structure sectional view of the adjusting clamp provided by the utility model;

[0018] Fig. 4 The structure schematic view of the cutting mechanism provided by the utility model.

[0019] Marked number in the drawing: 1, processing base; 2, semiconductor chip body; 3, cutting mechanism; 301, support column; 302, hydraulic cylinder; 303, cutting knife; 4, adjusting clamp; 401, clamping bottom plate; 402, fixed clamping plate; 5, size adjusting assembly; 501, adjusting sliding groove; 502, adjusting sliding rod; 503, sliding block; 504, spring; 6, adjusting mechanism; 601, support plate; 7, moving assembly; 701, support frame; 702, threaded rod; 703, first motor; 704, moving block; 8, rotating assembly; 801, second motor; 802, first transmission gear; 803, support rotating shaft; 804, second transmission gear. DETAILED DESCRIPTION

[0020] The utility model will be further described below in combination with the drawings and embodiments.

[0021] Please refer to Figs. 1 to 4The utility model provides a kind of cutting equipment for semiconductor chip production processing, including: processing base 1 and semiconductor chip body 2, wherein semiconductor chip body 2 is located on the top of processing base 1, the top of processing base 1 is provided with cutting mechanism 3 for cutting processing;Adjusting mechanism 6 is located on the top of processing base 1 for moving and rotating adjustment to semiconductor chip body 2;Adjusting clamp 4 is located on the top of adjusting mechanism 6 for clamping and fixing semiconductor chip body 2 of different size;

[0022] Adjusting mechanism 6 includes support plate 601, moving assembly 7 and rotating assembly 8, the bottom of support plate 601 is installed on the top of processing base 1 by two moving assemblies 7, and rotating assembly 8 is installed on the top center of support plate 601;

[0023] Moving assembly 7 includes support frame 701, threaded rod 702, first motor 703 and moving block 704, the bottom of support frame 701 is fixedly connected to the top of processing base 1, both ends of threaded rod 702 are rotatably connected to both ends of support frame 701, first motor 703 is fixedly connected to one end of support frame 701, and one end of threaded rod 702 is fixedly connected to the output end of first motor 703 by rotating through one end of support frame 701, and threaded hole is formed in the middle of moving block 704, moving block 704 is rotatably connected to the side wall of threaded rod 702 by threaded hole, and the top of moving block 704 is fixedly connected to the bottom of support plate 601;

[0024] Rotating assembly 8 includes second motor 801, first transmission gear 802, support shaft 803 and second transmission gear 804, the bottom of second motor 801 is fixedly connected to the top of support plate 601, first transmission gear 802 is fixedly connected to the output end of second motor 801, the bottom of support shaft 803 is rotatably connected to the top center of support plate 601, second transmission gear 804 is fixedly connected to the side wall of support shaft 803, and the side wall of second transmission gear 804 is engaged with the side wall of first transmission gear 802;

[0025] Cutting mechanism 3 includes support column 301, hydraulic cylinder 302 and cutting knife 303, the bottom of support column 301 is fixedly connected to the top of processing base 1, the side wall of hydraulic cylinder 302 is fixedly connected to the top of support column 301, and the top of cutting knife 303 is fixedly connected with the output end of hydraulic cylinder 302.

[0026] In the specific implementation process, first, the semiconductor chip body 2 to be processed is fixed on the processing base 1 through the adjusting clamp 4, then the threaded rod 702 connected thereto is driven to rotate on the support frame 701 by the first motor 703 controlled by the same control system, the moving block 704 connected through the threaded hole is slidably connected on the threaded rod 702 under the limitation of the support frame 701, the support plate 601 connected thereto is driven to follow the movement by the sliding movement of the moving block 704 on the threaded rod 702, the fixed semiconductor chip body 2 is driven to follow the movement on the processing base 1 by the movement of the support plate 601, and the first transmission gear 802 connected thereto is driven to rotate by the second motor 801, the second transmission gear 804 engaged therewith is driven to follow the rotation by the rotation of the first transmission gear 802, the support shaft 803 connected therewith is driven to rotate on the top center of the support plate 601 by the rotation of the second transmission gear 804, and the fixed semiconductor chip body 2 is driven to rotate for adjusting the cutting angle by the rotation of the support shaft 803. Thus, the cutting position and the cutting angle of the semiconductor chip body 2 can be conveniently adjusted according to the processing needs, without the need to repeatedly fix and disassemble the semiconductor chip body 2 for adjustment, which is simple and convenient, time-saving and labor-saving, and effectively improves the cutting processing efficiency.

[0027] Furthermore, after adjusting the cutting position and the cutting angle, the hydraulic cylinder 302 fixed by the support column 301 is started to provide a driving force, so that the cutting knife 303 connected therewith is driven to move downward, and the semiconductor chip body 2 below is cut and processed by the downward movement of the cutting knife 303.

[0028] Further, the adjusting clamp 4 comprises a clamping bottom plate 401 and a plurality of fixed clamping plates 402, the bottom center of the clamping bottom plate 401 is fixedly connected to the top of the support shaft 803, and the bottoms of the plurality of fixed clamping plates 402 are symmetrically installed on the top of the clamping bottom plate 401 through a plurality of size adjusting assemblies 5.

[0029] The size adjusting assembly 5 comprises an adjusting sliding groove 501, an adjusting sliding rod 502, a sliding block 503 and a spring 504, the adjusting sliding groove 501 is opened on the top of the clamping bottom plate 401, the two ends of the adjusting sliding rod 502 are fixedly connected to the two ends of the adjusting sliding groove 501, the bottom of the fixed clamping plate 402 is slidably connected to the side wall of the adjusting sliding rod 502 through the sliding block 503, and the two ends of the spring 504 are fixedly connected to one end of the adjusting sliding groove 501 and one end of the sliding block 503, respectively.

[0030] It is to be noted that: according to the size of the semiconductor chip body 2 to be processed, the adjusting slide rod 502 is arranged to support the sliding block 503 to slide and move in the adjusting sliding groove 501 opened at the top of the clamping bottom plate 401, the sliding block 503 slides and moves to drive the fixed clamping plate 402 connected thereto to move and open under the force of the clamping bottom plate 401, at this time, the semiconductor chip body 2 to be processed is placed on the clamping bottom plate 401, and the spring 504 is arranged to provide a counterforce to make the sliding block 503 reset and rebound in the adjusting sliding groove 501, the sliding block 503 resets and rebounds to drive the fixed clamping plate 402 arranged to move and close under the force of the rebound, the fixed clamping plate 402 moves and closes to clamp and fix the semiconductor chip body 2, so that the semiconductor chip body 2 of different sizes can be conveniently clamped and fixed according to the use requirement, thereby being suitable for different use requirements, and the effect of normal cutting processing of the semiconductor chip body 2 of different sizes is facilitated.

[0031] The working principle of the cutting equipment for semiconductor chip production and processing is as follows:

[0032] In use, first, according to the size of the semiconductor chip body 2 to be processed, by adjusting the slide rod 502 to support the sliding block 503 to slide in the adjusting sliding groove 501 opened at the top of the clamping bottom plate 401, by sliding the sliding block 503 to drive the fixed clamping plate 402 connected thereto to follow the force to move and open at the top of the clamping bottom plate 401, at this time, the semiconductor chip body 2 to be processed is placed on the clamping bottom plate 401, and the spring 504 provides a counterforce to make the sliding block 503 reset and rebound in the adjusting sliding groove 501, by the sliding block 503 reset and rebound to drive the fixed clamping plate 402 to rebound and close, by the rebound and closing of the fixed clamping plate 402 to clamp and fix the semiconductor chip body 2, so as to effectively and conveniently clamp and fix the semiconductor chip body 2 of different sizes according to the use needs, so as to be suitable for different use needs, and facilitate normal cutting processing of semiconductor chip bodies 2 of different sizes, secondly, after the semiconductor chip body 2 to be processed is fixed on the processing base 1, the first motor 703 controlled by the same control system is started to provide a driving force to drive the threaded rod 702 connected thereto to rotate on the support frame 701, by rotating the threaded rod 702 to make the moving block 704 connected through the threaded hole to slide on the threaded rod 702 under the limit of the support frame 701, by sliding the moving block 704 on the threaded rod 702 to drive the support plate 601 connected thereto to follow the force to move, by moving the support plate 601 to drive the fixed semiconductor chip body 2 to follow the force to move and adjust the cutting position on the processing base 1, and the second motor 801 is started to provide a driving force to drive the first transmission gear 802 connected thereto to rotate, by rotating the first transmission gear 802 to drive the second transmission gear 804 engaged therewith to follow the force to rotate, by rotating the second transmission gear 804 to drive the support shaft 803 connected thereto to rotate on the top center of the support plate 601, by rotating the support shaft 803 to drive the fixed semiconductor chip body 2 to rotate and adjust the cutting angle, so as to effectively and conveniently adjust and change the cutting position and cutting angle of the semiconductor chip body 2 according to the processing needs, without the need to repeatedly fix and disassemble the semiconductor chip body 2 for adjustment, simple operation, time and labor saving, effectively improving the cutting processing efficiency, finally, the hydraulic cylinder 302 supported by the support column 301 is started to provide a driving force, thereby driving the cutting knife 303 connected thereto to move downward, by moving the cutting knife 303 downward to cut and process the semiconductor chip body 2 below.

[0033] The above merely illustrates the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made by using the content of the present application specification and drawings, are also included in the patent protection scope of the present application.

Claims

1. A cutting device for semiconductor chip manufacturing and processing, characterized in that, Include: Processing base (1) and semiconductor chip body (2), wherein the semiconductor chip body (2) is located on the top of the processing base (1), and the top of the processing base (1) is provided with a cutting mechanism (3) for cutting processing; Adjusting mechanism (6) is located on the top of the processing base (1) for moving and rotating adjustment of the semiconductor chip body (2); Adjusting clamp (4) is located on the top of the adjusting mechanism (6) for clamping and fixing semiconductor chip body (2) of different size; The adjusting mechanism (6) comprises a support plate (601), a moving assembly (7) and a rotating assembly (8), the bottom of the support plate (601) is installed on the top of the processing base (1) through two moving assemblies (7), and the rotating assembly (8) is installed on the top center of the support plate (601).

2. The cutting apparatus for semiconductor chip production according to claim 1, wherein The moving assembly (7) comprises a support frame (701), a threaded rod (702), a first motor (703) and a moving block (704), the bottom of the support frame (701) is fixedly connected to the top of the processing base (1), both ends of the threaded rod (702) are rotatably connected to both ends of the support frame (701), the first motor (703) is fixedly connected to one end of the support frame (701), one end of the threaded rod (702) is fixedly connected to the output end of the first motor (703) by rotating through one end of the support frame (701), and a threaded hole is formed in the middle of the moving block (704), the moving block (704) is rotatably connected with the side wall of the threaded rod (702) through the threaded hole, and the top of the moving block (704) is fixedly connected to the bottom of the support plate (601).

3. The cutting apparatus for semiconductor chip production according to claim 1, wherein The rotating assembly (8) comprises a second motor (801), a first transmission gear (802), a support shaft (803) and a second transmission gear (804), the bottom of the second motor (801) is fixedly connected to the top of the support plate (601), the first transmission gear (802) is fixedly connected to the output end of the second motor (801), the bottom of the support shaft (803) is rotatably connected to the top center of the support plate (601), and the second transmission gear (804) is fixedly connected to the side wall of the support shaft (803), and the side wall of the second transmission gear (804) is engaged with the side wall of the first transmission gear (802).

4. The cutting apparatus for semiconductor chip production according to claim 3, wherein The adjusting clamp (4) comprises a clamping bottom plate (401) and a plurality of fixed clamping plates (402), the bottom center of the clamping bottom plate (401) is fixedly connected to the top of the support shaft (803), and the bottoms of the plurality of fixed clamping plates (402) are symmetrically installed on the top of the clamping bottom plate (401) through a plurality of size adjusting assemblies (5).

5. The apparatus according to claim 4, wherein The size adjusting assembly (5) comprises an adjusting sliding groove (501), an adjusting sliding rod (502), a sliding block (503) and a spring (504), the adjusting sliding groove (501) is arranged on the top of the clamping bottom plate (401), the two ends of the adjusting sliding rod (502) are fixedly connected to the two ends of the adjusting sliding groove (501), the bottom of the fixed clamping plate (402) is slidably connected to the side wall of the adjusting sliding rod (502) through the sliding block (503), and the two ends of the spring (504) are fixedly connected to one end of the adjusting sliding groove (501) and one end of the sliding block (503) respectively.

6. The cutting apparatus for semiconductor chip production according to claim 1, wherein The cutting mechanism (3) comprises a supporting column (301), a hydraulic cylinder (302) and a cutting knife (303), the bottom of the supporting column (301) is fixedly connected to the top of the machining base (1), the side wall of the hydraulic cylinder (302) is fixedly connected to the top of the supporting column (301), and the top of the cutting knife (303) is fixedly connected to the output end of the hydraulic cylinder (302).