Frame material box for semiconductor packaging

Abstract

The utility model provides a frame material box for semiconductor packaging, and belongs to the technical field of semiconductor packaging. The frame material box for semiconductor packaging comprises a main material plate and an adjusting connecting mechanism, an auxiliary material plate is installed on the right side of the main material plate, material frames are installed on the inner side of the main material plate and the inner side of the auxiliary material plate, and adjusting frames are fixedly connected to the top and the bottom of the right side of the main material plate; the top and the bottom of the left side of the auxiliary material plate are fixedly connected with adjusting plates located in the adjusting frame, by arranging the adjusting and connecting mechanism, the main material plate and the auxiliary material plate can be adjusted and connected, so that a user can adjust the distance between the main material plate and the auxiliary material plate according to the placement requirement of the size of an external semiconductor packaging frame, and the use experience of the user is improved. The material frame can support frames of multiple models and sizes, the situation that the material frame is difficult to adjust according to the placing requirement of the frames when the material frame is used is avoided, and therefore the using flexibility and adaptability of the auxiliary material plate, the main material plate and the material frame are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically, relates to a frame material box for semiconductor packaging. BACKGROUND

[0002] The frame material box for semiconductor packaging is a packaging container specially used for storing and transporting semiconductor frames, and is usually used to protect semiconductor frames during the semiconductor packaging process and ensure that the semiconductor frames are not damaged during transportation and storage. The frame material box is generally made of high-strength and lightweight materials, and common materials include plastic, such as polypropylene and polycarbonate, which have good impact resistance and chemical resistance, and metal, such as aluminum alloy, which is usually used for applications requiring higher strength and protection. The frame material box for semiconductor packaging mainly consists of a box body and support bars. Since different semiconductor packaging frames have different sizes, it is necessary to adjust the frame material box.

[0003] In related technologies, during the use of the frame material box for semiconductor packaging, the semiconductor packaging frame is usually placed between the support bars by moving the semiconductor packaging frame, and the semiconductor packaging frame is supported and protected by the support bars, thereby being used.

[0004] However, during the use of the frame material box for semiconductor packaging, the frame material box is generally integrated, and the internal placement range space is fixed, which makes it difficult for the frame material box to support and protect only a single type and size of semiconductor packaging frame, thereby reducing the flexibility and adaptability of the frame material box. SUMMARY

[0005] To make up for the above shortcomings, the utility model provides a frame material box for semiconductor packaging that overcomes the above technical problems or at least partially solves the above problems.

[0006] The utility model is implemented as follows:

[0007] The utility model provides a frame material box for semiconductor packaging, which comprises a main material plate, a vice material plate is installed on the right side of the main material plate, a material rack is installed on the inner side of the main material plate and the vice material plate;

[0008] An adjusting connecting mechanism is provided, which comprises:

[0009] An adjusting frame is fixedly connected to the top and bottom of the right side of the main material plate, and an adjusting plate is fixedly connected to the top and bottom of the left side of the vice material plate and located inside the adjusting frame.

[0010] A connecting groove is formed in the inner wall of the adjusting frame, and a connecting block is fixedly connected to the two sides of the adjusting plate and located inside the connecting groove.

[0011] The connecting positioning mechanism is arranged on the right side of the top of the adjusting frame.

[0012] In a preferred scheme, the connecting positioning mechanism comprises a screw groove, a screw post, a positioning groove and a positioning disc, the screw groove is arranged on the right side of the top of the adjusting frame, the screw post is threadedly connected in the screw groove, the positioning groove is arranged on the bottom of the screw groove, and the positioning disc is fixedly connected on the bottom of the screw post.

[0013] In a preferred scheme, the bottom of the material rack is provided with a stabilizing groove on the left side of the adjusting plate, and the stabilizing groove is movably connected with a stabilizing seat.

[0014] In a preferred scheme, the right side of the main material plate is provided with a lifting groove, the lifting groove is movably connected with a lifting post, and the right side of the lifting post is fixedly connected with the left side of the stabilizing seat.

[0015] In a preferred scheme, the top of the inner wall of the lifting groove is provided with a screw hole, and the top of the lifting post is rotatably connected with a screw rod which is threadedly connected with the screw hole.

[0016] In a preferred scheme, the top of the lifting post is provided with a rotating groove, and the bottom of the screw rod is fixedly connected with a rotating seat which is arranged in the rotating groove.

[0017] In a preferred scheme, the bottom of the left side of the main material plate is provided with a splicing groove, and the bottom of the right side of the auxiliary material plate is fixedly connected with a splicing seat.

[0018] In a preferred scheme, the bottom of the inner wall of the main material plate is provided with an insertion cavity which is in communication with the splicing groove, and the insertion cavity is movably connected with an insertion frame which is arranged in the splicing groove.

[0019] The frame material box for semiconductor packaging has the following beneficial effects.

[0020] 1. The adjusting connecting mechanism can be used for adjusting and connecting the main material plate and the auxiliary material plate, so that the distance between the main material plate and the auxiliary material plate can be adjusted according to the placement requirements of the frame size of the semiconductor packaging, the material rack can support frames of multiple sizes, and the material rack can be adjusted according to the placement requirements of the frame, thereby improving the use flexibility and adaptability of the auxiliary material plate, the main material plate and the material rack.

[0021] 2. The connecting positioning mechanism can be used for adjusting, connecting, applying force and positioning between the adjusting plate and the adjusting frame, so that the adjusting plate and the adjusting frame can be positioned and stabilized after adjustment, and the adjusting plate can be positioned and stabilized during use, thereby improving the convenience of the connection and positioning of the adjusting plate and the adjusting frame.

[0022] 3. By setting up stabilizing slots and stabilizing seats, the semiconductor packaging frame located at the top of the rack can be clamped and stabilized, avoiding the difficulty in placing the frame stably during use, thus improving the placement stability of the rack. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is an overall perspective view provided by an embodiment of the present utility model;

[0025] Figure 2 A schematic diagram of the three-dimensional cross-sectional structure of the main material plate provided for an embodiment of this utility model;

[0026] Figure 3 A partial three-dimensional cross-sectional structural diagram of the adjustment frame provided for an embodiment of this utility model;

[0027] Figure 4 A three-dimensional cross-sectional structural diagram of the plug-in splicing base provided for an embodiment of this utility model;

[0028] In the diagram: 1. Main material plate; 2. Secondary material plate; 3. Material rack; 4. Adjustment rack; 5. Adjustment plate; 6. Connecting groove; 7. Connecting block; 8. Screw groove; 9. Screw stud; 10. Positioning groove; 11. Positioning plate; 12. Stabilizing groove; 13. Stabilizing seat; 14. Lifting groove; 15. Lifting column; 16. Screw hole; 17. Screw; 18. Rotary groove; 19. Rotary seat; 20. Splicing groove; 21. Splicing seat; 22. Insertion cavity; 23. Insertion frame. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0030] Reference Figures 1-4The utility model provides a technical scheme: a frame material box for semiconductor packaging, including main material board 1 and adjustment connecting mechanism, the right side of main material board 1 is installed with auxiliary material board 2, and the inside of main material board 1 and auxiliary material board 2 is all installed with material rack 3, can carry out adjustment connecting work between main material board 1 and auxiliary material board 2 to the distance between main material board 1 and auxiliary material board 2 is adjusted according to the placement demand of the size of the frame for semiconductor packaging of outside, so that material rack 3 can support multiple model sizes frame, avoid the situation that material rack 3 appears difficult to adjust according to the frame placement demand when using, therefore, the use flexibility and adaptability of auxiliary material board 2 and main material board 1 and material rack 3 are improved.

[0031] With reference to Figures 1-4 In a preferred embodiment, the adjustment connecting mechanism includes an adjustment frame 4, the adjustment frame 4 is fixedly connected to the top and bottom of the right side of the main material board 1, the top and bottom of the left side of the auxiliary material board 2 are fixedly connected with the adjustment plate 5 inside the adjustment frame 4, the connecting groove 6 is opened on both sides of the inner wall of the adjustment frame 4, the connecting block 7 is fixedly connected to both sides of the adjustment plate 5 inside the connecting groove 6, the connecting and positioning mechanism is arranged on the right side of the top of the adjustment frame 4, according to the applied model size of the frame for semiconductor packaging of outside, the auxiliary material board 2 is hand-held to drive the adjustment plate 5 to move to the right side, the placement distance space between the material racks 3 is adjusted and operated, at this time, the connecting block 7 moves in the connecting groove 6 following the adjustment plate 5, the connecting work between the adjustment plate 5 and the adjustment frame 4 is carried out, the adjustment connecting effect between the main material board 1 and the auxiliary material board 2 by the adjustment plate 5 and the adjustment frame 4 is ensured, and then the frame of outside is placed on the top of the material rack 3, the connecting and positioning mechanism includes a screw groove 8, a stud 9, a positioning groove 10 and a positioning disc 11, the screw groove 8 is opened on the right side of the top of the adjustment frame 4, the stud 9 is threadedly connected inside the screw groove 8, the positioning groove 10 is opened at the bottom of the screw groove 8, and the positioning disc 11 is fixedly connected to the bottom of the stud 9, the adjustment connecting and force positioning work between the adjustment plate 5 and the adjustment frame 4 can be carried out, the positioning and stabilizing work between the adjusted main material board 1 and the auxiliary material board 2 by the adjustment plate 5 and the adjustment frame 4 is carried out, the situation that the adjustment plate 5 is difficult to position and stabilize when being used is avoided, and therefore the convenience of the adjustment plate 5 and the adjustment frame 4 connection positioning is improved.

[0032] With reference to Figure 2In a preferred embodiment, the bottom of the material rack 3 is provided with a stabilizing groove 12 on the left side of the adjusting plate 5, the inside of the stabilizing groove 12 is movably connected with a stabilizing seat 13, the semiconductor package frame on the top of the material rack 3 can be tightly stabilized, avoiding the difficulty in placing the frame when the material rack 3 is used, thus improving the placing stability of the material rack 3. The right side of the main material plate 1 is provided with a lifting groove 14, the inside of the lifting groove 14 is movably connected with a lifting column 15, the right side of the lifting column 15 is fixedly connected with the left side of the stabilizing seat 13, the lifting connection between the plurality of stabilizing seats 13 can be realized, avoiding the difficulty in synchronous lifting when the stabilizing seat 13 is used, thus improving the use convenience of the stabilizing seat 13.

[0033] Referring to Figure 2 In a preferred embodiment, the top of the inner wall of the lifting groove 14 is provided with a threaded hole 16, the top of the lifting column 15 is rotatably connected with a screw rod 17 which is threadedly connected with the threaded hole 16, the stabilizing seat 13 can be applied with downward stabilizing force by the lifting column 15, avoiding the difficulty in stabilizing the frame inside the material rack 3 when the stabilizing seat 13 is used, thus improving the stabilizing effect of the stabilizing seat 13. The top of the lifting column 15 is provided with a rotating groove 18, the bottom of the screw rod 17 is fixedly connected with a rotating seat 19 which is located inside the rotating groove 18, the rotating connection between the screw rod 17 and the lifting column 15 can be realized, avoiding the difficulty in applying threaded lifting force to the lifting column 15 when the screw rod 17 is used, thus improving the connecting effect of the screw rod 17 and the lifting column 15.

[0034] Referring to Figures 2-4 In a preferred embodiment, the bottom of the left side of the main material plate 1 is provided with a splicing groove 20, the bottom of the right side of the auxiliary material plate 2 is fixedly connected with a splicing seat 21, the space and medium for splicing between the main material plate 1 and the auxiliary material plate 2 can be provided for the user, avoiding the difficulty in splicing when the main material plate 1 and the auxiliary material plate 2 are used, thus improving the splicing convenience of the main material plate 1 and the auxiliary material plate 2. The bottom of the inside of the main material plate 1 is provided with an insertion cavity 22 which is in communication with the splicing groove 20, the inside of the insertion cavity 22 is movably connected with an insertion frame 23 which is located inside the splicing groove 20, the splicing and positioning between the splicing groove 20 and the splicing seat 21 can be realized, avoiding the difficulty in splicing and positioning when the splicing seat 21 is used, thus improving the splicing and positioning convenience of the splicing seat 21 and the splicing groove 20.

[0035] Specifically, the working process or working principle of the frame magazine for semiconductor packaging is as follows: in use, first, according to the actual model size of the semiconductor packaging frame to be placed outside, the sub-material plate 2 is held to drive the rack 3 to move to the right, so that the placement space range between the racks 3 meets the frame placement requirement; at this time, the adjusting plate 5 follows the sub-material plate 2 to drive the connecting block 7 to move in the connecting groove 6, and the adjusting connection work between the main material plate 1 and the sub-material plate 2 is performed; when the adjustment of the placement space range between the racks 3 is completed, the stud 9 is held to rotate and cooperate with the screw hole 16 to exert a downward pushing force on the positioning disc 11, so that the bottom of the positioning disc 11 is in contact and tightly abuts against the top of the adjusting plate 5, and the adjusting plate 5 cooperates with the adjusting frame 4 to perform the adjustment and positioning work between the main material plate 1 and the sub-material plate 2; then, the external frame is moved and placed between the racks 3, and the frame placement and support operation is performed; when the frame placement is completed, the screw rod 17 is held to rotate and cooperate with the screw hole 16 to drive the rotating seat 19 to rotate in the rotating groove 18, so that the screw rod 17 exerts a downward pushing force on the lifting column 15, and the bottom of the stabilizing seat 13 is in contact and tightly abuts against the frame placed between the racks 3, and the clamping and stabilizing work between the frame and the racks 3 is performed, so that the frame is placed stably on the top of the racks 3, and the main material plate 1 cooperates with the sub-material plate 2 and the racks 3 to perform the placement and stable protection work on the external semiconductor packaging frame; when a plurality of main material plates 1 and sub-material plates 2 are needed, one sub-material plate 2 is held to drive the splicing seat 21 to enter the splicing groove 20 of another main material plate 1, and then the splicing seat 21 is held and inserted downward into the insertion groove on the top of the splicing seat 21, so that the splicing and positioning work between the two different main material plates 1 and sub-material plates 2 is performed, so that the user can move multiple main material plates 1 and sub-material plates 2 synchronously to transfer the placed and protected frame.

Claims

1. A frame magazine for semiconductor packaging, comprising a main magazine plate (1), a sub magazine plate (2) mounted on the right side of the main magazine plate (1), a magazine rack (3) mounted on the inner side of the main magazine plate (1) and the sub magazine plate (2), characterized in that ； The adjusting connecting mechanism comprises: An adjusting frame (4) is fixedly connected to the top and bottom of the right side of the main plate (1) and the top and bottom of the left side of the auxiliary plate (2), and an adjusting plate (5) is fixedly connected to the inside of the adjusting frame (4); A connecting groove (6) is formed in the inner wall of the adjusting frame (4), and a connecting block (7) is fixedly connected to the two sides of the adjusting plate (5) and located in the connecting groove (6); A connecting positioning mechanism is arranged on the right side of the top of the adjusting frame (4).

2. The frame magazine for semiconductor package according to claim 1, wherein The connecting positioning mechanism comprises a screw groove (8), a screw post (9), a positioning groove (10) and a positioning disc (11), the screw groove (8) is formed in the right side of the top of the adjusting frame (4), the screw post (9) is threadedly connected to the inside of the screw groove (8), the positioning groove (10) is formed in the bottom of the screw groove (8), and the positioning disc (11) is fixedly connected to the bottom of the screw post (9).

3. The frame magazine for semiconductor package according to claim 1, wherein A stable groove (12) is formed in the left side of the adjusting plate (5) and located in the bottom of the adjusting frame (3), and a stable seat (13) is movably connected to the inside of the stable groove (12).

4. The frame magazine for semiconductor package according to claim 3, wherein A lifting groove (14) is formed in the right side of the main plate (1), a lifting post (15) is movably connected to the inside of the lifting groove (14), and the right side of the lifting post (15) is fixedly connected to the left side of the stable seat (13).

5. The frame magazine for semiconductor package according to claim 4, wherein A screw hole (16) is formed in the top of the inner wall of the lifting groove (14), and a screw rod (17) is rotatably connected to the top of the lifting post (15) and threadedly connected to the screw hole (16).

6. The frame magazine for semiconductor package according to claim 5, wherein A rotating groove (18) is formed in the top of the lifting post (15), and a rotating seat (19) is fixedly connected to the bottom of the screw rod (17) and located in the rotating groove (18).

7. The frame magazine for semiconductor package according to claim 1, wherein A splicing groove (20) is formed in the bottom of the left side of the main plate (1), and a splicing seat (21) is fixedly connected to the bottom of the right side of the auxiliary plate (2).

8. The frame magazine for semiconductor package according to claim 7, wherein A plug cavity (22) is formed in the bottom of the inside of the main plate (1) and communicates with the splicing groove (20), and a plug frame (23) is movably connected to the inside of the plug cavity (22) and located in the splicing groove (20).

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