Circuit board blanking device

Abstract

The utility model relates to the technical field of detection equipment, and provides a circuit board blanking device capable of reducing the damage risk of a circuit board. The circuit board discharging device comprises a rack, a first conveying mechanism and a buffer material laying mechanism, the first conveying mechanism and the buffer material laying mechanism are arranged on the rack, the first conveying mechanism is used for conveying a circuit board to a first station in the first direction, and the buffer material laying mechanism is used for conveying a buffer material to the circuit board located on the first station and cutting the buffer material. A lifting device is arranged on the rack opposite to the first station and used for supporting and driving the circuit board to move close to the rack in the third direction.

Description

TECHNICAL FIELD

[0001] The utility model relates to detection equipment technical field, especially provide a circuit board unloading device. BACKGROUND

[0002] The circuit board needs to be detected for defects, such as LED (light emitting diode) circuit board, so as to eliminate the circuit board with LED damage, welding, assembly and other problems, improve the yield of product. The circuit board that passes through detection equipment and is detected qualified needs to be sequentially conveyed to the lifting device on the first station through the conveying equipment, and the lifting device sequentially drops to make the circuit board stack on the lifting device, so as to be packaged subsequently, after the conveying equipment of the prior art conveys the circuit board to the lifting device, the circuit board is directly contacted between the circuit board stacked on the lifting device, so that the electronic components on the circuit board are easily damaged, and the risk of circuit board damage is increased. SUMMARY

[0003] The utility model aims at the problems existing in the prior art, and provides a circuit board unloading device capable of reducing the risk of circuit board damage.

[0004] In order to realize the above-mentioned purpose, the utility model adopts the technical scheme that:

[0005] A circuit board unloading device, comprising a rack and a first conveying mechanism and a buffer material laying mechanism arranged on the rack, the first conveying mechanism is used for conveying the circuit board to the first station along the first direction, the buffer material laying mechanism is used for conveying the buffer material to the circuit board located at the first station and cutting the buffer material, the opposite rack of the first station is provided with a lifting device that lifts along the third direction, the buffer material laying mechanism comprises a traction roller for traction buffer material and a cutting device for cutting buffer material, the traction roller conveys the buffer material to the circuit board located at the first station through the cutting device.

[0006] Further, it further comprises a second conveying mechanism arranged on the rack, and the second conveying mechanism is used for receiving the circuit board on the lifting device and conveying the circuit board along the second direction.

[0007] Further, the first conveying mechanism located at the first station is provided with a telescopic supporting mechanism for supporting the circuit board, the telescopic supporting mechanism can be telescopic along the second direction, and the telescopic supporting mechanism releases the circuit board when being in the contraction state and the circuit board can move to the lifting device along the third direction.

[0008] Further, the first conveying mechanism comprises first conveying devices and second conveying devices which are arranged in the second direction at intervals, the telescopic supporting mechanism comprises first telescopic devices and second telescopic devices which are arranged on the first conveying devices and the second conveying devices at the first work station respectively, and the first telescopic devices and the second telescopic devices can be telescoped between the first conveying devices and the second conveying devices in the second direction.

[0009] Further, the first telescopic devices and the second telescopic devices each comprise a supporting rod for supporting the circuit board and a driving device for driving the supporting rod to be telescoped between the first conveying devices and the second conveying devices in the second direction.

[0010] Further, the first conveying devices and the second conveying devices are each drivingly connected with a driving member for driving the first conveying devices and the second conveying devices to operate.

[0011] Further, the first conveying mechanism further comprises a second work station which is arranged in the first direction at an interval after the first work station, and a lifting device is arranged on the rack at the second work station.

[0012] Further, the buffer material laying mechanism further comprises a driving shaft for supporting the buffer material, the material storage device comprises a driving shaft and a driving motor, the driving motor is used for driving the driving shaft to rotate, and the traction roller is located between the driving shaft and the cutting device.

[0013] Further, the driving shaft is further provided with a clamping structure for clamping the buffer material, the clamping structure comprises first limiting members and second limiting members which are arranged at intervals in the axial direction of the driving shaft.

[0014] Further, the buffer material laying mechanism further comprises a tensioning rod for tensioning the buffer material, and the tensioning rod is arranged between the traction roller and the driving shaft.

[0015] In summary, due to the adoption of the above technical scheme, the circuit board blanking device has the beneficial effects that the buffer material laying mechanism comprised by the circuit board blanking device can convey the buffer material to the circuit board at the first work station and cut the buffer material, so that the surface of the circuit board which faces away from the lifting device can be covered by the buffer material, and thus when the plurality of circuit boards are stacked on the lifting device, the buffer material can be filled between the circuit boards, direct hard contact between the circuit boards is avoided, and the risk of damage to the circuit boards is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The utility model provides a circuit board blanking device's three-dimensional structure schematic view is provided;

[0017] Figure 2 The utility model provides a circuit board blanking device's front view structure schematic view is provided;

[0018] Figure 3 The utility model provides a circuit board blanking device's left view structure schematic view is provided;

[0019] Figure 4 The utility model provides a circuit board blanking device's plan view structure schematic view is provided;

[0020] Figure 5 It is a three-dimensional structure schematic view of one embodiment of telescopic support mechanism.

[0021] Marked in drawing: rack 1, lifting device 2, second conveying mechanism 3, first conveying device 4, second conveying device 5, first telescopic device 6, second telescopic device 7, driving piece 8, traction roller 9, cutting device 10, driving shaft 11, driving motor 12, tensioning rod 13, driving device 14, support rod 15, belt 16, first limit piece 17, second limit piece 18. Specific embodiments

[0022] In order to make the utility model's purpose, technical scheme and advantage more clear and obvious, the following is combined with the embodiment, and the utility model is further detailedly explained.It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0023] Please refer to Figure 1 The first direction mentioned in the utility model is as shown in X direction, the second direction is as shown in Y direction, and the third direction is as shown in Z direction.

[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 And Figure 4 The utility model provides a circuit board blanking device, is used to the circuit board blanking after detection, and the circuit board can be LED circuit board.

[0025] As a possible embodiment of the circuit board unloading device, it comprises a rack 1, a first conveying mechanism and a buffer material laying mechanism arranged on the rack 1, the rack 1 is used to support the first conveying mechanism and the buffer material laying mechanism, the first conveying mechanism is used to convey the circuit board to a first station along a first direction, and the buffer material laying mechanism is used to convey the buffer material to the circuit board at the first station and cut the buffer material, the first station is opposite to the rack 1 and is provided with a lifting device 2, the lifting device 2 is used to support and drive the circuit board to move along a third direction to the rack 1, and the first direction is perpendicular to the third direction.

[0026] Since the conveying mechanism is generally only in contact with the edge of the circuit board during the conveying of the circuit board, the first conveying mechanism can comprise a first conveying device 4 and a second conveying device 5, the first conveying device 4 and the second conveying device 5 are a conveyor belt or a wheel type conveying device, taking the wheel type conveying device as an example, there are two wheel type conveying devices, the two wheel type conveying devices extend along the first direction and are arranged at intervals along a second direction, the conveying wheels on the two wheel type conveying devices are in contact with the edge of the circuit board, and the wheel type conveying device conveys the first circuit board to the first station when the wheel type conveying device operates, after the first circuit board reaches the first station, the lifting device 2 supports the first circuit board at the first station, the buffer material laying mechanism conveys the buffer material to the first circuit board and cuts the buffer material, so that the buffer material covers the first circuit board, the lifting device 2 is arranged between the two wheel type conveying devices, the lifting device 2 can be a pneumatic cylinder, an oil cylinder or an electric telescopic rod, the lifting device 2 drives the first circuit board to move along the third direction to the rack 1 when the lifting device 2 is lowered, after the lifting device 2 is lowered by a certain distance, the second circuit board is conveyed to the lifting device 2, the first circuit board and the second circuit board are stacked, in other words, the second circuit board is located on the buffer material of the first circuit board, the first circuit board and the second circuit board are separated by the buffer material, after the buffer material laying mechanism conveys the buffer material to the second circuit board and cuts the buffer material, the buffer material covers the second circuit board, and the lifting device 2 continues to be lowered, the third circuit board can be placed on the buffer material of the second circuit board, and so on, the lifting device 2 can support multiple layers of circuit boards, and the buffer material is arranged between every two circuit boards, the buffer material can be a flexible material such as plastic, rubber, sponge, paper or bubble bag, a conveyor belt can also be arranged in the same way, both are driven by friction to convey the circuit board, which will not be described here.

[0027] After the lifting device 2 drives the circuit board close to the rack 1, in order to facilitate the output of the circuit board, a second conveying mechanism 3 can be arranged on the rack 1, the second conveying mechanism 3 is used to receive the circuit board on the lifting device 2 and convey the circuit board in a second direction. The second conveying mechanism 3 drives the circuit board on the lifting device 2 in the second direction to a position away from the lifting device 2, in other words, the second conveying mechanism 3 is used to unload the circuit board on the lifting device 2, and the second conveying mechanism 3 can also be a conveyor belt or a wheel type conveying device. Taking the conveyor belt as an example, there are at least two conveyor belts, the lifting device 2 is arranged between the adjacent two conveyor belts, the lifting device 2 is lowered so that the circuit board on the lifting device 2 is in contact with the conveyor belt, and the conveyor belt drives the circuit board to move in the second direction by friction. The wheel type conveying device can also be arranged in this way, which will not be described here.

[0028] When the buffer material is conveyed onto the circuit board at the first station, the buffer material will rub against the circuit board, and when the multi-layer circuit boards are stacked on the lifting device 2, the friction between the buffer material and the circuit board can cause the stacked circuit boards to tilt or fall. In order to solve this problem, a telescopic supporting mechanism for supporting the circuit board can be arranged on the first conveying mechanism of the first station. Please refer to Figure 5, the telescopic supporting mechanism is in the retracted state to release the circuit board and the circuit board can move in the third direction to the lifting device 2, in other words, the telescopic supporting mechanism is in the extended state to support the circuit board and the circuit board cannot move in the third direction to the lifting device 2, and the telescopic supporting mechanism is located between the circuit board and the lifting device 2. For example, when the first conveying mechanism includes the first conveying device 4 and the second conveying device 5, the telescopic supporting mechanism can include the first telescopic device 6 and the second telescopic device 7, the first telescopic device 6 and the second telescopic device 7 are respectively arranged on the first conveying device 4 and the second conveying device 5, the first conveying device 4 and the second conveying device 5 can be the aforementioned conveyor belt or wheel conveyor, the first telescopic device 6 and the second telescopic device 7 can be the same structure, for example, both can be composed of a supporting rod 15 and a driving device 14, the supporting rod 15 is in sliding fit with the first conveying device 4 and the second conveying device 5, and the driving device 14 drives the supporting rod 15 to telescope in the second direction between the first conveying device 4 and the second conveying device 5, the driving device 14 can be a pneumatic cylinder, an oil cylinder or an electric telescopic rod, when the supporting rod 15 is extended, the circuit board conveyed to the first station is located on the supporting rod 15, in other words, the supporting rod 15 in the extended state can support the circuit board at the first station, and the supporting rod 15 separates the circuit board without the cushioning material from the circuit board with the cushioning material on the lifting device 2, the circuit board without the cushioning material is on the supporting rod 15, and when the cushioning material conveying mechanism conveys the cushioning material to the circuit board without the cushioning material, even if the friction between the cushioning material and the circuit board on the supporting rod 15 causes the circuit board to move, it will not affect the stability of the circuit board with the cushioning material on the lifting device 2, after the cushioning material is laid and cut, the supporting rod 15 is retracted to release the circuit board, so that the circuit board with the laid cushioning material falls in the third direction to the lifting device 2 or the circuit board with the laid cushioning material on the lifting device 2, in other words, the telescopic supporting mechanism is in the retracted state to release the circuit board and the circuit board can move in the third direction to the lifting device 2, and so on, the subsequent circuit board can also be operated in this way.

[0029] Please refer to Figure 5 In order to facilitate the driving of the first conveying device 4 and the second conveying device 5 to operate, a driving member 8 can be arranged between the first conveying device 4 and the second conveying device 5, and the first conveying device 4 and the second conveying device 5 are drivingly connected with the driving member 8. The driving member 8 can be a prism-shaped structure such as a triangular prism, a quadrangular prism or a spline shaft extending in the second direction, and a passive structure matching the outer contour of the driving member 8 is arranged on the first conveying device 4 and the second conveying device 5. The driving member 8 can drive the passive structure to rotate, and the driving member 8 drives the belt 16 to rotate through the passive structure when the driving member 8 rotates.

[0030] In order to distinguish the circuit board types, such as qualified products or unqualified products, size specifications or functions, for example, the first conveying mechanism can be provided with a first station and a second station, and the second station and the first station are sequentially and spaced apart along the first direction on the first conveying mechanism. The buffer material laying mechanism is used for conveying the buffer material to the circuit board on the lifting device at the first station and cutting the buffer material. Taking the qualified products and unqualified products as examples, the first station and the second station are both provided with a lifting device 2. The qualified products can pass through the second station to reach the first station. The qualified products are laid, the buffer material is cut, and the qualified products are stacked on the lifting device 2 at the first station. The unqualified products are stacked on the lifting device 2 at the second station. The qualified products and the unqualified products are distinguished. The buffer material laying mechanism can be separately provided at the second station or shared with the first station according to the needs.

[0031] As a possible implementation, the buffer material laying mechanism can include a traction roller 9 for traction of the buffer material and a cutting device 10 for cutting of the buffer material. The traction roller 9 conveys the buffer material to the circuit board at the first station through the cutting device 10. When the traction roller 9 rotates, a friction force is applied to the buffer material, so that the buffer material moves in the direction close to the circuit board through the cutting device until it is laid on the circuit board. The cutting device 10 cuts the buffer material between the traction roller 9 and the circuit board, so that the buffer material covering the circuit board can move with the circuit board, for example, can descend with the lifting device 2. The cutting device can be a cutting knife, a laser cutting device or a wire cutting machine and the like which can cut the buffer material. In order to facilitate storage of the buffer material, the buffer material laying mechanism can further include a storage device for supporting the buffer material. The storage device can include a driving shaft 11 and a driving motor 12. The traction roller 9 is located between the driving shaft 11 and the cutting device 10. The driving motor 12 is used to drive the driving shaft 11 to rotate. The buffer material can be mounted on the driving shaft 11, so as to achieve the purpose of storing the buffer material. The driving shaft 11 can release the buffer material when it rotates. The driving shaft 11 can be provided with a clamping structure for clamping the buffer material. The clamping structure can include a first limiting piece 17 and a second limiting piece 18. The first limiting piece 17 and the second limiting piece 18 are spaced apart along the axial direction of the driving shaft 11. The buffer material can be clamped between the first limiting piece 17 and the second limiting piece 18, so as to prevent the buffer material from falling off the driving shaft 11. The buffer material mounted on the driving shaft 11 is conveyed to the circuit board by the traction roller 9 and then cut by the cutting device 10. The flexible buffer material is prone to slip or drop between the traction roller 9 and the driving shaft 11. The buffer material laying mechanism can further include a tensioning rod 13 arranged between the traction roller 9 and the driving shaft 11. The tensioning rod 13 is used to tension the buffer material, so that the buffer material between the traction roller 9 and the driving shaft 11 is tensioned, and the risk of slipping or dropping is reduced.

[0032] The above merely describes the preferred embodiments of the present application, and is not intended to limit the present application, and any modification, equivalent replacement, and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board blanking device characterized by comprising: The device comprises a frame (1), a first conveying mechanism and a cushion material laying mechanism arranged on the frame (1), the first conveying mechanism is used to convey a circuit board to a first station in a first direction, the cushion material laying mechanism is used to convey a cushion material to the circuit board at the first station and cut the cushion material, the frame (1) opposite to the first station is provided with a lifting device (2) which can lift in a third direction, the cushion material laying mechanism comprises a traction roller (9) which is used to pull the cushion material and a cutting device (10) which is used to cut the cushion material, the traction roller (9) conveys the cushion material to the circuit board at the first station through the cutting device (10).

2. The circuit board blanking device according to claim 1, characterized by The device further comprises a second conveying mechanism (3) arranged on the frame (1), the second conveying mechanism (3) is used to receive the circuit board on the lifting device (2) and convey the circuit board in a second direction.

3. The circuit board blanking device according to claim 1, wherein The first conveying mechanism at the first station is provided with an extendable supporting mechanism which is used to support the circuit board, the extendable supporting mechanism can extend in the second direction, the extendable supporting mechanism is in a retracted state to release the circuit board and the circuit board can move to the lifting device (2) in the third direction.

4. The circuit board blanking device according to claim 3, wherein The first conveying mechanism comprises a first conveying device (4) and a second conveying device (5) which are arranged in the second direction, the extendable supporting mechanism comprises a first extendable device (6) and a second extendable device (7), the first extendable device (6) and the second extendable device (7) are arranged on the first conveying device (4) and the second conveying device (5) at the first station respectively, the first extendable device (6) and the second extendable device (7) can extend between the first conveying device (4) and the second conveying device (5) in the second direction.

5. The circuit board blanking device according to claim 4, wherein The first extendable device (6) and the second extendable device (7) each comprise a supporting rod (15) which is used to support the circuit board and a driving device (14) which is used to drive the supporting rod (15) to extend between the first conveying device (4) and the second conveying device (5) in the second direction, the supporting rod (15) is in sliding fit with the first conveying device (4) and the second conveying device (5).

6. The circuit board blanking device according to claim 4, wherein The first conveying device (4) and the second conveying device (5) are in driving connection with a driving member (8), the driving member (8) is used to drive the first conveying device (4) and the second conveying device (5) to operate.

7. The circuit board blanking device according to any one of claims 1 to 6, characterized by The device further comprises a second station, the second station and the first station are arranged in sequence in the first direction on the first conveying mechanism, the frame (1) at the second station is provided with a lifting device (2).

8. The circuit board blanking device according to claim 7, wherein The cushion material laying mechanism further comprises a storage device which is used to support the cushion material, the storage device comprises a driving shaft (11) and a driving motor (12), the driving motor (12) is used to drive the driving shaft (11) to rotate, the traction roller (9) is located between the driving shaft (11) and the cutting device (10).

9. The circuit board blanking device of claim 8, wherein The driving shaft (11) is further provided with a clamping structure for clamping the cushioning material, the clamping structure comprising a first limiting piece (17) and a second limiting piece (18), the first limiting piece (17) and the second limiting piece (18) being arranged along the axial direction of the driving shaft (11).

10. The circuit board blanking device of claim 8, wherein The cushioning material laying mechanism further comprises a tensioning rod (13) for tensioning the cushioning material, the tensioning rod (13) being arranged between the traction roller (9) and the driving shaft (11).

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