Semiconductor processing technology chamber and semiconductor processing equipment
By using compression springs and magnetic couplers to stabilize the rotating disk in semiconductor processing equipment, the problems of sealing and rotational stability were solved, achieving stability and uniformity of chemical vapor deposition under high temperature and high pressure, and simplifying the wafer replacement process.
Patent Information
- Application Number
- CN202423227734.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In existing semiconductor processing equipment, the sealing of the reaction chamber is compromised, leading to frequent damage to the sealing components under high temperature and high pressure, which affects the chemical vapor deposition effect. Furthermore, the rotating disk is prone to shaking during rotation, affecting the uniformity of deposition.
By setting a compression spring and a magnetic coupler on the rotating disk, the magnetic coupler drives the rotating disk to rotate, and the extension plate applies pressure to the disk base to ensure sealing and rotational stability, preventing the wafer from detaching.
It improves the stability and uniformity of the chemical vapor deposition process, prevents wafer detachment, facilitates wafer replacement, and maintains the chamber sealing effect under high pressure.
Smart Images
Figure CN223723214U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a semiconductor processing process chamber and a semiconductor processing equipment. BACKGROUND
[0002] The semiconductor processing equipment is a series of complex equipment for manufacturing semiconductor devices and integrated circuits, and many devices are used in the manufacturing process of the semiconductor, such as a photolithography device, an etching device, a thin film deposition device, and a cleaning device.
[0003] Chemical vapor deposition (CVD) is a chemical process technology for preparing thin film materials, and CVD is a process in which gaseous reactants are chemically reacted under high temperature, plasma or other energy excitation to generate solid deposition.
[0004] However, in practice, it has been noticed that, first, since a high pressure state needs to be maintained in the reaction chamber, the sealing requirement of the reaction chamber is high, and the rotating disc for placing the wafer is generally driven by a motor, and the shaft between the motor and the rotating disc needs to penetrate the reaction chamber, which causes certain damage to the sealing property of the reaction chamber, and the sealing assembly at the connection is prone to damage under the high temperature and high pressure state for a long time, needs to be frequently replaced, and after damage, the phenomenon of air leakage occurs, which affects the chemical vapor deposition effect in the reaction chamber, and second, only the shaft supports part of the rotating disc, and the rotating disc is prone to shaking when rotating, which causes the wafer on the rotating disc to separate from the groove, thereby affecting the uniformity after the deposition reaction. UTILITY MODEL CONTENTS
[0005] The utility model discloses a semiconductor processing process chamber and semiconductor processing equipment, and downward pressure is applied to the disc seat through the extension plate, the upward thrust of the compression spring is matched, the disc seat is more stable when rotating, the magnetic coupler is utilized, the driving motor drives the rotating disc to rotate under the condition that the cavity bottom die is sealed.
[0006] To achieve the above object, the utility model provides the following technical scheme.
[0007] A kind of semiconductor processing process chamber, including reaction mould chamber, the reaction mould chamber has cavity bottom mould, the inside of cavity bottom mould is respectively provided with heating pipe placing groove and conical gas collection cavity, and heating pipe placing groove is located in the outside of conical gas collection cavity, and electric heating pipe is fixedly connected in heating pipe placing groove;
[0008] Annular collection groove is provided in the conical gas collection cavity, and the bottom of the cavity bottom mould is provided with gas outlet holes in annular array, and the end of the gas outlet holes extends to the inside of the annular collection groove.
[0009] As a further technical solution of the utility model, the cavity bottom mould is further fixedly connected with a positioning support, and the positioning support has a central sleeve and a cross support, the positioning support is located above the conical gas collection cavity, and one end of the cross support away from the central sleeve is fixedly connected with the cavity bottom mould.
[0010] As a further technical solution of the utility model, the central sleeve penetrates a rotating disc, the rotating disc includes a shaft rod movably connected with the central sleeve, the end of the shaft rod is fixedly connected with a disc seat located above the positioning support, and the top of the disc seat is provided with wafer grooves in annular array.
[0011] The outer side of the shaft rod is respectively sleeved with a limiting sleeve and a compression spring, one end of the compression spring is in contact with the disc seat, the other end of the compression spring is inserted into the central sleeve, and the limiting sleeve is located below the central sleeve, and one end of the shaft rod away from the disc seat is fixedly connected with a driven magnetic disc.
[0012] As a further technical solution of the utility model, the bottom of the cavity bottom mould is fixedly connected with a magnetic coupler, the magnetic coupler includes a non-magnetic sealing cover, and the top of the non-magnetic sealing cover extends to the inside bottom of the conical gas collection cavity through the cavity bottom mould.
[0013] As a further technical solution of the utility model, both ends of the non-magnetic sealing cover are provided with magnetic chambers, and the bottom of the non-magnetic sealing cover is further provided with a hidden groove, the hidden groove is provided with sealing screws in annular array, and the end of the sealing screw penetrates the non-magnetic sealing cover and is screwed with the cavity bottom mould.
[0014] As a further technical solution of the utility model, the bottom of the non-magnetic sealing cover is fixedly connected with a driving motor, the end of the driving motor is fixedly connected with a driving magnetic disc, and the driving magnetic disc is located in the magnetic chamber below the non-magnetic sealing cover.
[0015] The driven magnetic disc at the end of the shaft rod is located in the magnetic chamber above the non-magnetic sealing cover.
[0016] The top of the driving magnetic disc and the bottom of the driven magnetic disc are respectively embedded with permanent magnets in annular array, and the magnetic poles of adjacent two permanent magnets are reversely arranged.
[0017] A semiconductor processing equipment, including bottom support, reaction mold chamber is fixedly connected on bottom support, corresponding open and close end cover is equipped above reaction mold chamber, the top of open and close end cover is fixedly connected with lifting hydraulic cylinder in rectangular array form;
[0018] The side of the bottom support is fixedly connected with the end support, the outer side of the bottom support is fixedly connected with the bottom shell, the top of the end support is fixedly connected with the top controller, the lifting hydraulic cylinder is located in the top controller, and the end of the lifting hydraulic cylinder penetrates through the top controller and is connected with the open and close end cover.
[0019] As a further technical scheme of the utility model, the open and close end cover includes the lower part of the cooperation mold cover which is fixedly connected with the extension plate in annular array form, and the end of the extension plate away from the cooperation mold cover is movably connected with the limiting roller, and the limiting roller is in contact with the edge of the rotating disc.
[0020] As a further technical scheme of the utility model, the upper part of the cooperation mold cover is fixedly connected with the gas material mixing and spraying assembly, the cooperation mold cover is provided with the through hole corresponding to the gas material mixing and spraying assembly, and the end of the gas material mixing and spraying assembly extends to the lower part of the mold cover through the through hole.
[0021] Compared with the prior art, the utility model has the advantages that:
[0022] 1. After the open and close end cover and the reaction mold chamber are closed, the extension plate in the open and close end cover presses the disc seat, the limiting roller movably connected with the end of the extension plate makes the disc seat more stable when rotating, prevents the disc seat from shaking up and down in a rotating mode, and causes the wafer placed on the disc seat to separate from the inner side of the wafer groove, thereby improving the stability during chemical vapor deposition of the wafer.
[0023] 2. After the reaction mold chamber and the open and close end cover are separated, the compression spring can push the disc seat to move upwards, so that the disc seat is moved out of the reaction mold chamber, the staff can conveniently take and place the wafer in the wafer groove for replacement, and the driven disc is separated from the inner side of the magnetic force chamber during the rising process of the rotating disc, so that the wafer can be replaced without stopping the driving motor.
[0024] 3. The driving motor is driven to rotate the disc seat without affecting the sealing structure inside the cavity bottom mold through the magnetic coupling, and there is no hole at the connection, so that the sealing effect of the cavity bottom mold inside can be ensured when used under high pressure. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 It is a use state structure schematic view of the utility model.
[0026] Figure 2 is the bottom structure schematic view of the utility model Figure 1 .
[0027] Figure 3 is the internal structure schematic view of the reaction mold chamber in the utility model.
[0028] Figure 4 is the bottom structure schematic view of the utility model Figure 3 .
[0029] Figure 5 is the partial enlarged schematic view of the utility model Figure 4 .
[0030] Figure 6 is the split structure schematic view of the reaction mold chamber in the utility model.
[0031] Figure 7 is the bottom structure schematic view of the utility model Figure 6 .
[0032] Figure 8 is the partial enlarged schematic view of the utility model Figure 7 .
[0033] Figure 9 is the top view of the reaction mold chamber in the utility model.
[0034] Figure 10 is the C-C sectional view of the utility model Figure 9 .
[0035] Figure 11 is the three-dimensional structure schematic view of the magnetic coupler in the utility model.
[0036] Figure 12 is the bottom structure schematic view of the utility model Figure 11 .
[0037] In the figure:
[0038] bottom shell-1, end support-2, top controller-3, gas material mixing injection assembly-4, lifting hydraulic cylinder-5, reaction mold chamber-6, cavity bottom mold-61, air outlet hole-62, heating pipe placing groove-63, conical gas collecting cavity-64, annular collecting groove-65, bottom support-7, opening and closing end cover-8, matching mold cover-81, through hole-82, extension plate-83, limit roller-84, rotating disc-9, disc seat-91, wafer groove-92, shaft-93, driven magnetic disc-94, limit sleeve-95, compression spring-96, positioning support-10, driving motor-11, magnetic coupler-12, non-magnetic sealing cover-121, magnetic chamber-122, hidden groove-123, sealing screw-124. DETAILED DESCRIPTION
[0039] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the utility model.
[0040] Please refer to Figures 1-12 The utility model embodiment provides a kind of semiconductor processing technology chamber, including reaction mould room 6, the reaction mould room 6 has cavity bottom die 61, the inside of cavity bottom die 61 is respectively provided with heating tube placing groove 63 and conical gas collection cavity 64, and heating tube placing groove 63 is located in the outside of conical gas collection cavity 64, and heating tube placing groove 63 is fixedly connected with electric heating tube;
[0041] The conical gas collection cavity 64 is provided with an annular collection groove 65, and the bottom of the cavity bottom die 61 is provided with a gas outlet 62 in an annular array, and the end of the gas outlet 62 extends to the inside of the annular collection groove 65.
[0042] In this embodiment, the cavity bottom die 61 is also fixedly connected with a positioning bracket 10, and the positioning bracket 10 has a central sleeve and a cross bracket, the positioning bracket 10 is located above the conical gas collection cavity 64, and the end of the cross bracket away from the central sleeve is fixedly connected with the cavity bottom die 61.
[0043] Specifically, the central sleeve is penetrated by a rotating disc 9, the rotating disc 9 includes a shaft 93 movably connected with the central sleeve, the end of the shaft 93 is fixedly connected with a disc seat 91 located above the positioning bracket 10, and the top of the disc seat 91 is provided with a wafer groove 92 in an annular array.
[0044] The outer side of the shaft 93 is respectively sleeved with a limiting sleeve 95 and a compression spring 96, wherein one end of the compression spring 96 is in contact with the disc seat 91, the other end of the compression spring 96 is inserted into the central sleeve, and the limiting sleeve 95 is located below the central sleeve, and the end of the shaft 93 away from the disc seat 91 is fixedly connected with a driven magnetic disc 94.
[0045] Further, the bottom of the cavity bottom die 61 is fixedly connected with a magnetic coupler 12, the magnetic coupler 12 includes a non-magnetic sealing cover 121, and the top of the non-magnetic sealing cover 121 extends to the inside bottom of the conical gas collection cavity 64 through the cavity bottom die 61.
[0046] Specifically, both ends of the non-magnetic sealing cover 121 are provided with magnetic force chambers 122, and the bottom of the non-magnetic sealing cover 121 is further provided with a hidden groove 123, and the hidden groove 123 is arranged in an annular array with sealing screws 124, and the end of the sealing screw 124 penetrates the non-magnetic sealing cover 121 and is threadedly connected with the cavity bottom die 61.
[0047] Further, the bottom of the non-magnetic sealing cover 121 is fixedly connected with a driving motor 11, the end of the driving motor 11 is fixedly connected with a driving magnetic disc 111, and the driving magnetic disc 111 is located in the magnetic force chamber 122 below the non-magnetic sealing cover 121.
[0048] The end of the shaft 93 is provided with a driven magnetic disc 94 located in the magnetic force chamber 122 above the non-magnetic sealing cover 121.
[0049] The top of the driving magnetic disc 111 and the bottom of the driven magnetic disc 94 are respectively embedded with permanent magnets in an annular array, and the magnetic poles of adjacent two permanent magnets are reversely arranged.
[0050] By adopting the above technical scheme, the wafer is placed in the wafer groove 92 on the disc seat 91, the opening and closing end cover 8 is buckled above the cavity bottom die 61, and then the output shaft of the driving motor 11 drives the driving magnetic disc 111 to rotate, the magnetic pole of the permanent magnet between the driving magnetic disc 111 and the driven magnetic disc 94 is changed, the driven magnetic disc 94 drives the disc seat 91 to rotate through the shaft 93, so that the disc seat 91 rotates more stably, and the chemical substances can be more uniformly deposited on the surface of the wafer.
[0051] A semiconductor processing equipment comprises a bottom support 7, the bottom support 7 is fixedly connected with a reaction mold chamber 6, the top of the reaction mold chamber 6 is provided with a corresponding opening and closing end cover 8, and the top of the opening and closing end cover 8 is fixedly connected with a lifting hydraulic cylinder 5 in a rectangular array.
[0052] The side of the bottom support 7 is fixedly connected with an end support 2, the outer side of the bottom support 7 is fixedly connected with a bottom shell 1, the top of the end support 2 is fixedly connected with a top controller 3, the lifting hydraulic cylinder 5 is located in the top controller 3, and the end of the lifting hydraulic cylinder 5 penetrates the top controller 3 and is connected with the opening and closing end cover 8.
[0053] In the embodiment, the opening and closing end cover 8 comprises a matching mold cover 81 matched with the top of the reaction mold chamber 6, the bottom of the matching mold cover 81 is fixedly connected with an extension plate 83 in an annular array, and the end of the extension plate 83 away from the matching mold cover 81 is movably connected with a limiting roller 84 in contact with the edge of the rotating disc 9.
[0054] Further, the upper part of the cooperating mold cover 81 is fixedly connected with the gas material mixing and spraying assembly 4, the cooperating mold cover 81 is provided with a through hole 82 corresponding to the gas material mixing and spraying assembly 4, and the end of the gas material mixing and spraying assembly 4 extends to the lower part of the mold cover 81 through the through hole 82.
[0055] By adopting the above technical scheme, the cooperating mold cover 81 is pushed downward by the lifting hydraulic cylinder 5 to adhere to the top of the cavity bottom mold 61, at this time, the extension plate 83 at the bottom of the cooperating mold cover 81 exerts downward pressure on the disc seat 91 to compress the compression spring 96, and the limiting roller 84 is in contact with the edge of the disc seat 91, so that the rotation of the disc seat 91 is more stable under the downward pressure, and the disc seat 91 is prevented from shaking during rotation.
[0056] In the embodiment, the outer side of the bottom support 7 is fixedly connected with the bottom shell 1 to shield and protect the inner side of the bottom support 7; the inner side of the bottom support 7 is further fixedly connected with a waste gas recovery tank, and the waste gas recovery tank is connected with the gas outlet hole 62 through a corrosion-resistant pipeline;
[0057] Specifically, the gaseous chemical precursors on the inner side of the cavity bottom mold 61 are guided into the annular collection groove 65 through the conical gas collection chamber 64, and finally introduced into the waste gas recovery tank through the gas outlet hole 62 and the corrosion-resistant pipeline for recovery.
[0058] In the embodiment, the upper part of the cooperating mold cover 81 is fixedly connected with the gas material mixing and spraying assembly 4, the cooperating mold cover 81 is provided with a through hole 82 corresponding to the gas material mixing and spraying assembly 4, and the end of the gas material mixing and spraying assembly 4 extends to the lower part of the mold cover 81;
[0059] Specifically, a plurality of gaseous chemical precursors are mixed by the gas material mixing and spraying assembly 4 and then enter the cavity bottom mold 61, the gaseous chemical precursors change after high temperature and high pressure on the inner side of the cavity bottom mold 61, and a chemical vapor deposition reaction occurs on the wafer placed in the wafer groove 92, so that a thin film is formed on the surface of the wafer.
[0060] The working principle of the utility model is: when using, first place wafer into wafer groove 92 on disc seat 91, then push down cooperation mould cover 81 by lifting hydraulic cylinder 5 in top controller 3, at the same time, press down disc seat 91 by extension plate 83 at the bottom of cooperation mould cover 81, the shaft rod 93 at the bottom of disc seat 91 slides in the center sleeve of positioning support 10, compress spring 96 to the center sleeve, and the driven magnetic disc 94 at the bottom of shaft rod 93 inserts into magnetic force chamber 122 above non-magnetic sealing cover 121, drive motor 11 drives driving magnetic disc 111 to rotate, due to push-pull effect between driving magnetic disc 111 and corresponding permanent magnet in driven magnetic disc 94, driving magnetic disc 111 drives driven magnetic disc 94 to rotate, driven magnetic disc 94 drives disc seat 91 to rotate through shaft rod 93, the electric heating tube in heating tube placing groove 63 makes the inside of cavity bottom mould 61 in high temperature state, and gaseous chemical precursor is sent into cavity bottom mould 61 by gas mixture injection assembly 4, so that the inside of cavity bottom mould 61 forms high pressure state, gaseous chemical precursor transforms under high temperature and high pressure, so that it uniformly deposits on the surface of wafer, forms a thin film on the surface of wafer, and finally the excess gas enters waste recovery tank through pipeline.
[0061] It is apparent for those skilled in the art that the utility model is not limited to the details of the above-mentioned exemplary embodiments, and can be realized in other specific forms without departing from the spirit or essential characteristics of the utility model. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.
[0062] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.
Claims
1. A semiconductor processing chamber, characterized by: The utility model relates to a reaction chamber (6) with a cavity bottom die (61) having a heating tube placement groove (63) and a conical gas collection cavity (64) on the inner side of the cavity bottom die (61), and the heating tube placement groove (63) is located on the outer side of the conical gas collection cavity (64), and the heating tube placement groove (63) is fixedly connected with an electric heating tube. The conical gas collection cavity (64) has an annular collection groove (65), and the bottom of the cavity bottom die (61) has a plurality of annularly arranged gas outlet holes (62) extending to the inner side of the annular collection groove (65). The cavity bottom die (61) is further fixedly connected with a positioning bracket (10) having a central sleeve and a cross bracket, and the positioning bracket (10) is located above the conical gas collection cavity (64), and the end of the cross bracket away from the central sleeve is fixedly connected with the cavity bottom die (61).
2. The semiconductor processing chamber of claim 1, wherein: The central sleeve penetrates the rotating disc (9) including a shaft (93) movably connected with the central sleeve, and the end of the shaft (93) is fixedly connected with a disc seat (91) located above the positioning bracket (10), and the top of the disc seat (91) has a plurality of wafer grooves (92) arranged in an annular array. The outer side of the shaft (93) is sleeved with a limiting sleeve (95) and a compression spring (96), wherein one end of the compression spring (96) is in contact with the disc seat (91), the other end of the compression spring (96) is inserted into the central sleeve, and the limiting sleeve (95) is located below the central sleeve, and the end of the shaft (93) away from the disc seat (91) is fixedly connected with a driven magnetic disc (94).
3. The semiconductor processing chamber of claim 2, wherein: The bottom of the cavity bottom die (61) is fixedly connected with a magnetic coupler (12) including a non-magnetic sealing cover (121), and the top of the non-magnetic sealing cover (121) extends to the inner bottom of the conical gas collection cavity (64) through the cavity bottom die (61).
4. The semiconductor processing chamber of claim 3, wherein: Both ends of the non-magnetic sealing cover (121) are provided with magnetic chambers (122), and the bottom of the non-magnetic sealing cover (121) is further provided with a hidden groove (123) having a plurality of sealing screws (124) arranged in an annular array, and the ends of the sealing screws (124) are screwed with the cavity bottom die (61) through the non-magnetic sealing cover (121).
5. The semiconductor processing chamber of claim 4, wherein: The bottom of the non-magnetic sealing cover (121) is fixedly connected with a driving motor (11), and the end of the driving motor (11) is fixedly connected with a driving magnetic disc (111) located in the magnetic chamber (122) below the non-magnetic sealing cover (121). The driven magnetic disc (94) at the end of the shaft (93) is located in the magnetic chamber (122) above the non-magnetic sealing cover (121). The top of the driving magnetic disc (111) and the bottom of the driven magnetic disc (94) are respectively embedded with permanent magnets arranged in an annular array, and the adjacent two permanent magnets are arranged with opposite magnetic poles.
6. A semiconductor processing apparatus, characterized by: Including bottom support (7), bottom support (7) is fixedly connected with reaction mold chamber (6), the top of reaction mold chamber (6) is equipped with corresponding open and close end cover (8), the top of open and close end cover (8) is fixedly connected with lifting hydraulic cylinder (5) in rectangular array mode; The side of the bottom support (7) is fixedly connected with the end support (2), and the outer side of the bottom support (7) is fixedly connected with the bottom shell (1), the top of the end support (2) is fixedly connected with the top controller (3), the lifting hydraulic cylinder (5) is located in the top controller (3), and the end of the lifting hydraulic cylinder (5) penetrates through the top controller (3) and is connected with the open and close end cover (8).
7. The semiconductor processing apparatus of claim 6, wherein: The open and close end cover (8) includes a cooperating mold cover (81) that fits the top of the reaction mold chamber (6), the lower part of the cooperating mold cover (81) is fixedly connected with an extension plate (83) in a ring array, and the end of the extension plate (83) away from the cooperating mold cover (81) is movably connected with a limiting roller (84), the limiting roller (84) is in contact with the edge of the rotating disc (9).
8. The semiconductor processing apparatus of claim 7, wherein: The top of the cooperating mold cover (81) is fixedly connected with the gas-material mixing injection assembly (4), the cooperating mold cover (81) is provided with a through hole (82) corresponding to the gas-material mixing injection assembly (4), and the end of the gas-material mixing injection assembly (4) extends to the lower part of the mold cover (81) through the through hole (82).