Flexible electrode body, conductive piece and power transmission mechanism
By combining the flexible electrode body with the conductive roller, the problem of poor contact between the electrode and the substrate was solved, and the uniformity and quality of the electroplating thickness during the electroplating process were improved, ensuring a high-efficiency electroplating effect. This research solves the technical problems existing in the prior art and demonstrates its effectiveness.
Patent Information
- Application Number
- CN202520028878.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-03
AI Technical Summary
In the existing electroplating process, poor contact between the electrode and the substrate leads to uneven plating thickness, poor appearance consistency, and easy crushing or scratching of the substrate, causing damage.
A flexible electrode body is adopted, including a liner, a conductive adhesive layer, and a conductive microstructure layer, combined with conductive foam. The flexible electrode body is constructed to cooperate with the conductive roller to ensure effective contact between the electrode and the substrate. Uniform electroplating is achieved through the design of the conductive microstructure layer and the conductive adhesive layer.
It achieves uniformity and consistency in electroplating thickness, avoids damage and scratches to the substrate, and improves the electroplating effect.
Smart Images
Figure CN223723254U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of metal electroplating deposition manufacturing, and particularly relates to a flexible electrode body, a conductive member provided with the conductive mechanism, and a power transmission mechanism provided with the conductive member. BACKGROUND
[0002] In the existing electroplating process, the electrode and the substrate cannot be in complete and effective contact, which easily leads to uneven thickness after electroplating, poor appearance consistency, easy breakage of the substrate during electroplating, easy scratching of the substrate, and thus damage to the substrate. In addition, the electrode and the substrate are prone to poor contact. SUMMARY
[0003] The present application provides a flexible electrode body, a conductive member, and a power transmission mechanism, which are particularly suitable for electroplating of thin and brittle substrates and solve the technical problems of poor contact between the existing electrode and the substrate or easy breakage of the substrate.
[0004] To solve at least one of the above technical problems, the technical scheme adopted by the present application is as follows:
[0005] A flexible electrode body, comprising a backing body, a conductive adhesive layer, and a conductive microstructure layer, wherein the conductive adhesive layer and the conductive microstructure layer are arranged on both sides of the backing body, and the conductive microstructure layer penetrates through the backing body.
[0006] Further, a conductive foam is arranged on the side of the conductive adhesive layer away from the backing body.
[0007] Further, a plurality of gap holes are formed on the backing body and penetrated by the conductive microstructure layer, and all the gap holes are uniformly arranged on the backing body.
[0008] Further, the length of the conductive microstructure layer is the same as that of the conductive adhesive layer, and is less than the length of the backing body.
[0009] A conductive member adopts the electrode body as described above, and the electrode body is arranged around a conductive roller, which is configured as a cylindrical rigid structural member.
[0010] Further, the structural member is a solid cylinder or a hollow cylinder.
[0011] Further, a plurality of holes and grooves are formed on the wall surface of the structural member, the holes and grooves are arranged vertically to the wall surface, and the electrode body is arranged on all the holes and grooves.
[0012] Further, a plurality of annular grooves are arranged on the wall surface of the structural member, all the grooves are uniformly spaced, and the electrode body is arranged in the grooves.
[0013] Further, the length of each of the grooves is greater than the length of the non-groove structure, and the depth of each of the grooves is the same.
[0014] A power transmission mechanism provided with the flexible electrode body as described above, which is supplied with power and a substrate by a conductive member adapted to the flexible electrode body.
[0015] The flexible electrode body designed in the present application has a simple structure, and is especially suitable for the electroplating process of a thin and fragile substrate, so that the electrode and the substrate can be effectively and completely contacted, the thickness after electroplating is more uniform and consistent, and thus the damage to the substrate can be avoided, the problem of the substrate being pressed or scratched during electroplating can be prevented, and the electroplating effect is improved. The present application also provides a conductive member provided with the conductive mechanism, and a power transmission mechanism provided with the conductive member. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a structural schematic diagram of one of the flexible electrode bodies in the present application;
[0017] Figure 2 is a structural schematic diagram of another flexible electrode body in the present application;
[0018] Figure 3 is a perspective view of one of the conductive members in the present application;
[0019] Figure 4 is a cross-sectional schematic diagram of one of the conductive members in the present application;
[0020] Figure 5 is a cross-sectional schematic diagram of another conductive member in the present application;
[0021] Figure 6 is a structural schematic diagram of one of the conductive rollers in the present application;
[0022] Figure 7 is a structural schematic diagram of one of the conductive rollers in the present application;
[0023] Figure 8 is a structural schematic diagram of one of the conductive rollers in the present application;
[0024] Figure 9 is a structural schematic diagram of one of the conductive rollers in the present application.
[0025] In the drawings:
[0026] 10, electrode body 11, backing body 12, conductive adhesive layer
[0027] 13, conductive microstructure layer 14, conductive foam 20, conductive roller
[0028] 21, hole groove 22, groove Detailed Implementation
[0029] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.
[0030] This embodiment proposes a flexible electrode body 10, such as Figure 1 As shown, it includes a liner 11, a conductive adhesive layer 12, and a conductive microstructure layer 13, wherein the conductive adhesive layer 12 and the conductive microstructure layer 13 are respectively placed on both sides of the liner 11, and the conductive microstructure layer 13 passes through the liner 11.
[0031] The lining 11 can be made of either a conductive or non-conductive material. It can be a mesh structure made of elastic, chemical-resistant, and heat-resistant materials such as fabric (woven with warp and weft threads to form a mesh), polymer plastics (EVA, resin, PVC, or rubber, etc.), or sponge. The lining 11 has a plurality of gaps through which the conductive microstructure layer 13 passes, and all gaps are evenly distributed on the lining 11. For a lining 11 made of fabric, the woven warp and weft threads themselves can serve as gaps. For a lining 11 made of polymer plastics, the gaps can be prepared using processes including, but not limited to, laser drilling, punching, or injection molding.
[0032] For the conductive adhesive layer 12, the conductive adhesive can be applied to one side of the liner 11 using a printing process, and the liner 11 is laid flat on the vacuum stage. The matrix of the conductive adhesive layer 12 includes, but is not limited to, gelatin-based matrices, adhesives, dispersants, and diluents, which, when mixed with conductive microparticles, form a liquid material with chemical resistance and temperature resistance. Due to the fluidity of the conductive adhesive, it can flow downwards along the gaps when a vacuum is drawn from below the vacuum stage. After the conductive adhesive solidifies in the gaps, the liner 11 with the conductive adhesive layer 12 is dried and cured. This can be done through a lamp irradiation drying process, a UV lamp irradiation drying process, or drying and curing under a hot air atmosphere. This conductive microstructure, formed by the conductive adhesive passing through the gaps in the liner after drying and curing, is a flexible electrode.
[0033] Since the thickness of the first printed conductive adhesive layer 12 is relatively thin after drying and curing, in order to ensure the overall conductivity of the substrate 11, conductive adhesive can be printed a second time on the conductive adhesive layer 12 to form the final conductive adhesive layer 12 structure.
[0034] like Figure 2 As shown, this embodiment is similar to... Figure 1Compared to the embodiments described above, the biggest difference is that a layer of conductive foam 14 is adhered to the side of the conductive adhesive layer 12 away from the liner 11. Preferably, this flexible electrode body 10 with conductive foam 14 is easier to bond with the conductive roller 20 and has better elastic conductivity. When the substrate to be processed is in direct contact with the surface of this flexible electrode body 10, the thin and brittle substrate can be prevented from being damaged, thereby ensuring the integrity and safety of its processing quality.
[0035] Regardless of whether the electrode body 10 contains conductive foam 14, this type of flexible electrode is suitable for electroplating processes on thin and brittle substrates. It allows the flexible electrode body 10 to make effective and complete contact with the substrate, resulting in a more uniform and consistent thickness after electroplating, thereby avoiding damage to the substrate. It can also prevent the substrate from being crushed or scratched during electroplating, thus improving the electroplating effect.
[0036] Furthermore, for the two different electrode bodies 10, the conductive microstructure layer 13 and the conductive adhesive layer 12 are of the same length and are both shorter than the length of the liner 11, in order to facilitate the fabrication of a conductive microstructure layer 13; and the length of the conductive foam 14 is also the same as the length of the conductive adhesive layer 12.
[0037] A conductive component, such as Figure 3 As shown, the electrode body 10 described above is used, and the electrode body 10 is positioned around the conductive roller 20, wherein the conductive roller 20 is constructed as a cylindrical rigid structure. For the flexible electrode body 10 without conductive foam 14, the conductive adhesive layer 12 itself is adhesive and can be directly adhered to the outer wall surface of the conductive roller 20, thereby forming a conductive element with transmission capability, such as... Figure 4 As shown. Of course, for the electrode body 10 with conductive foam 14, as... Figure 5 As shown, it has stronger adhesion and can more effectively adhere to the outer wall surface of the conductive roller 20. For all embodiments described below, it is adapted to... Figure 4 The structure of the electrode body 10 and as shown in the figure Figure 5 The structure of electrode body 10 in the middle.
[0038] In this embodiment, for rigid structural components such as the conductive roller 20, it can be as follows: Figure 6 The solid cylindrical structure shown can also be... Figure 7 The hollow cylindrical structures shown can all serve as the main body structure of the conductive roller 20 and cooperate with the electrode body 10.
[0039] like Figure 8As shown, whether it is a solid cylindrical structure or a hollow cylindrical structure, a plurality of small-diameter holes 21 can be formed on the wall of the structure. All holes 21 are perpendicular to the wall, and the depth of the holes 21 can be through the wall thickness of the hollow cylinder, or can be provided as a blind hole on the wall of the cylinder. This not only reduces the overall weight of the conductive roller 20, but also increases the friction and conductivity of the contact area between the conductive roller 20 and the electrode body 10. The electrode body 10 is covered by all the holes. The diameter of the hole 21 is not limited here, and can be determined based on actual conditions. When the electrode body 10 is engaged with the conductive roller 20, the length of the electrode body 10 needs to cover all the holes 21.
[0040] As shown in Figure 9 A plurality of annular grooves 22 are provided on the wall of the structure, and all the grooves 22 are uniformly spaced in the length direction of the conductive roller 20. The provision of the grooves 22 not only allows the electrode body 10 to be completely clamped therein, but also reduces the overall weight of the conductive roller 20 and improves the reliability and safety of the overall conductive member formed after the conductive roller 20 is engaged with the electrode body 10. The electrode body 10 must be placed in the groove 22 and adapted to the length of the groove 22; at the same time, the depth of the groove 22 should not be too high, and it should be less than the thickness of the electrode body 10 to improve the integrity and reliability of the surface contact between the electrode body 10 and the workpiece, i.e. the substrate. In this embodiment, the length of the groove 22 is greater than the length of the non-groove structure, and the depth of all the grooves perpendicular to the wall of the structure is the same.
[0041] A power transmission mechanism is provided with a flexible electrode body as described above, which is conveyed by a conductive member 10 adapted to the flexible electrode body to transmit power and convey the substrate.
[0042] The flexible electrode body designed in the present application has a simple structure, and is particularly suitable for electroplating processes on thin and brittle substrates. It can effectively and completely contact the electrode with the substrate, making the thickness of the electroplated substrate more uniform and consistent, thereby avoiding damage to the substrate and preventing the substrate from being crushed or scratched during electroplating, and improving the electroplating effect. The present application also provides a conductive member with the conductive mechanism, and a power transmission mechanism provided with the conductive member.
[0043] The embodiments of the present application have been described in detail above, and the above description is only a preferred embodiment of the present application and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application should still be included in the scope of the patent coverage of the present application.
Claims
1. A flexible electrode body, characterized by, At least comprising a backing, a conductive adhesive layer and a conductive microstructure layer, wherein the conductive adhesive layer and the conductive microstructure layer are disposed on both sides of the backing, and the conductive microstructure layer penetrates through the backing.
2. The flexible electrode body of claim 1, wherein Further comprising a conductive foam disposed on the side of the conductive adhesive layer away from the backing.
3. The flexible electrode body of claim 1 or 2, wherein The backing is configured with a plurality of gap holes penetrated by the conductive microstructure layer, and all the gap holes are uniformly arranged on the backing.
4. The flexible electrode body of claim 3, wherein, The conductive microstructure layer and the conductive adhesive layer have the same length, which is less than the length of the backing.
5. An electrically conductive member characterized by comprising: The electrode body as claimed in any one of claims 1-4 is disposed around a conductive roller configured as a cylindrical rigid structural member.
6. An electrically conductive member according to claim 5, wherein The structural member is a solid cylinder or a hollow cylinder.
7. An electrically conductive member according to claim 6, wherein A plurality of hole grooves are configured on the wall surface of the structural member; the hole grooves are all disposed perpendicular to the wall surface, and the electrode body is disposed on all the hole grooves.
8. The electrically conductive member of claim 6, wherein A plurality of annular grooves are disposed on the wall surface of the structural member, and all the grooves are uniformly spaced; and the electrode body is disposed in the grooves.
9. An electrically conductive member according to claim 8, wherein The length of the grooves is greater than the length of the non-groove structure, and the depth of all the grooves perpendicular to the wall surface of the structural member is the same.
10. A power transmission mechanism characterized by comprising: The flexible electrode body as claimed in any one of claims 1-4 is provided with a conductive member adapted to the flexible electrode body for transmitting power supply and transmitting substrate.