Electroplating electrode assembly, electroplating mechanism and electroplating machine
By using rotating components and tension electrodes in the electroplating apparatus, the problems of poor conductivity between the electrode and the workpiece and time-consuming cleaning and maintenance are solved, achieving high-efficiency conductivity and uniform electroplating thickness, and reducing cleaning and maintenance costs.
Patent Information
- Application Number
- CN202520028838.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-03
AI Technical Summary
In existing electroplating equipment, poor conductivity between the electrode and the object to be plated, as well as the time-consuming and labor-intensive cleaning and maintenance, result in uneven electroplating quality and difficulty in cleaning the electrode.
It employs a rotating assembly and a tension electrode. The tension electrode is mounted on the rotating mechanism and contacts the object to be plated through a flexible conductor, achieving high-efficiency conductivity during the electroplating process. The electrode is isolated from the object to be plated by a film material, reducing the need for electrode cleaning and maintenance.
It improves the conductivity and uniformity of electroplating thickness during the electroplating process, and reduces the time and cost of electrode cleaning and maintenance.
Smart Images
Figure CN223723267U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to metal deposition manufacturing technical field especially is related to a kind of electroplating electrode assembly, electroplating mechanism and electroplating machine. BACKGROUND
[0002] The basic design principle of electroplating technology is to place an anode into an electroplating solution in a space configured with electroplating solution, and to form a closed loop circuit by connecting the plated object with the cathode, so as to deposit metal ions on the plated object.
[0003] The current electroplating device generally places the anode and the electroplating solution in the electroplating tank, and the cathode is placed outside the electroplating tank. In the process of continuous electroplating, the plated object brings out the electroplating solution and continuously deposits and adheres to the cathode, causing the metal salts in the electroplating solution to continuously precipitate and adhere to the electrode, resulting in scratches on the surface of the plated object, punctures in the plated object, and other quality problems.
[0004] Although the existing electroplating machine design has considered setting water-blocking / absorbing rollers or adding air-jet components before the cathode and after the electroplating tank, it only delays the cathode from being contaminated by the electroplating solution. Therefore, manual cleaning of the cathode with water, disassembly of the cathode for deep cleaning and maintenance, and time and labor consumption are still required before and after actual production of the electroplating machine.
[0005] Therefore, there is an urgent need for an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine to solve the above technical problems. SUMMARY
[0006] The utility model aims to provide an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine to solve the technical problems of poor contact between the electrode and the plated object and time and labor consumption for cleaning and maintenance of the electrode in the prior art. The preferred technical solutions in the many technical solutions provided by the utility model can produce the technical effects described below.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions:
[0008] The utility model provides an electroplating electrode assembly, which comprises:
[0009] The rotating assembly comprises a first rotating mechanism and a second rotating mechanism, and the first rotating mechanism and the second rotating mechanism are arranged in parallel and rotate in the same direction.
[0010] The tension electrode is installed on the first rotating mechanism and the second rotating mechanism at both ends, and the tension electrode can contact the plated object during the operation of the plated object. The rotation direction of the first rotating mechanism and the second rotating mechanism is perpendicular to the running direction of the plated object.
[0011] Preferably, the rotating assembly and the tension electrode each comprise two groups, and are arranged symmetrically in upper and lower positions, the object to be plated runs between the two groups of tension electrodes, and the upper and lower sides of the object to be plated are in contact with the two groups of tension electrodes respectively.
[0012] Preferably, a film material with apertures is further included, and the film material is wrapped on the surface of the tension electrode.
[0013] Preferably, the tension electrode comprises a continuous structure or a non-continuous structure with apertures.
[0014] Preferably, the tension electrode comprises a flexible conductor with a thickness of 10 um to 3000 um.
[0015] Preferably, the gap between the two groups of tension electrodes is set to be 50% to 500% of the thickness of the object to be plated.
[0016] Preferably, the rotating assembly further comprises a conductive roller, and each of the conductive rollers is provided with a first rotating part and a second rotating part, the first rotating part can drive the first rotating mechanism to rotate, and the second rotating part can drive the second rotating mechanism to rotate.
[0017] A plating mechanism, comprising a plating liquid tank for accommodating plating liquid and the above-mentioned plating electrode assembly, the plating electrode assembly is installed in the plating liquid tank, and the tension electrode is in contact with the plating liquid.
[0018] Preferably, a conveying assembly is further included for conveying the object to be plated, and the conveying assembly comprises a conveying roller and a roller structure arranged on the conveying roller.
[0019] A plating machine, comprising a plating machine tank and the above-mentioned plating mechanism, and the plating mechanism is installed in the plating machine tank.
[0020] The plating electrode assembly, the plating mechanism and the plating machine provided by the utility model, the plating electrode assembly comprises a rotating assembly and a tension electrode, the rotating assembly comprises a first rotating mechanism and a second rotating mechanism, the first rotating mechanism and the second rotating mechanism are arranged at intervals and rotate in the same direction, and the two ends of the tension electrode are respectively installed on the first rotating mechanism and the second rotating mechanism, in use, the first rotating mechanism and the second rotating mechanism rotate in a fixed direction and a fixed amount, the rotating direction is perpendicular to the running direction of the object to be plated, and the tension electrode can contact the object to be plated during the running of the object to be plated. By adopting the flexible tension electrode and installing it in the plating equipment in the form of a roll, the tension electrode can have higher conduction efficiency and be more suitable for electric field distribution during the plating process, which can meet the plating requirements and replace the daily cleaning process, greatly reduce the cleaning and maintenance cost of the electrode, improve the conduction efficiency, and the plating thickness uniformity is better.BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0022] Figure 1 is a structural schematic diagram of an embodiment of the electroplating electrode assembly of the present application Figure 1 ;
[0023] Figure 2 is a structural schematic diagram of an embodiment of the electroplating electrode assembly of the present application Figure 2 ;
[0024] Figure 3 is a left view structural schematic diagram of an embodiment of the electroplating electrode assembly of the present application
[0025] Figure 4 is a structural schematic diagram of a continuum tension electrode in the electroplating electrode assembly of the present application
[0026] Figure 5 is a structural schematic diagram of a non-continuum tension electrode in the electroplating electrode assembly of the present application
[0027] Figure 6 is a structural schematic diagram of an embodiment of the electroplating mechanism of the present application
[0028] In the figure: 1, rotating assembly; 11, first rotating mechanism; 12, second rotating mechanism; 13, conductive roller; 131, first rotating part; 132, second rotating part; 2, tension electrode; 3, object to be plated; 4, wire; 5, electroplating liquid tank body; 6, conveying assembly; 61, roller roller; 62, roller structure; 7, electroplating machine tank body; 71, liquid conveying part; 72, gas conveying part. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the present application more clear, the technical scheme of the present application will be described in detail below. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.
[0030] Figure 1 is a structural schematic diagram of the present embodiment Figure 1 ,Figure 2 is a structural schematic of the embodiment Figure 2 As shown in Figure 1 and Figure 2 The embodiment provides an electroplating electrode assembly, which comprises a rotating assembly 1 and a tension electrode 2.
[0031] The rotating assembly 1 comprises a first rotating mechanism 11 and a second rotating mechanism 12, the first rotating mechanism 11 is arranged apart from the second rotating mechanism 12 and rotates in the same direction, and in the embodiment, the first rotating mechanism 11 and the second rotating mechanism 12 are both columnar conductive rotating shafts.
[0032] The two ends of the tension electrode 2 are respectively mounted on the first rotating mechanism 11 and the second rotating mechanism 12. The tension electrode 2 can contact the object to be plated 3 during the running of the object to be plated 3. Figure 1 The arrow direction is the running direction of the object to be plated 3, and the rotating directions of the first rotating mechanism 11 and the second rotating mechanism 12 are perpendicular to the running direction of the object to be plated 3.
[0033] In use, the first rotating mechanism 11 and the second rotating mechanism 12 are used to orient and quantitatively rotate the tension electrode 2, and the spacing between the first rotating mechanism 11 and the second rotating mechanism 12 is set to be 50% to 250% of the width perpendicular to the running direction of the object to be plated 3 with the center of the object to be plated 3 as the reference.
[0034] The tension electrode 2 in the embodiment comprises a flexible conductor, including but not limited to conductive cloth, conductive rubber, conductive foam and the like, which are single layer or composite layer and have the properties of electrical conductivity and flexible winding. Moreover, the tension electrode 2 needs to meet the requirements of not reacting with the electroplating liquid and resisting the temperature range of 5°C to 80°C.
[0035] In some embodiments, the tension electrode 2 can also be made of metal foil materials, including but not limited to single metal or composite alloy materials such as gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium and graphite, which do not react with the electroplating liquid and resist the temperature range of 5°C to 80°C.
[0036] Specifically, the width of the tension electrode 2 in the embodiment is set to be 5% to 50% along the length of the object to be plated, and the thickness of the tension electrode 2 is in the range of 10um to 3000um.
[0037] As an optional implementation, Figure 3 is a left view structural schematic of the embodiment, as shown in Figure 3 In the embodiment, the rotating assembly 1 and the tension electrode 2 are both provided in two groups and are symmetrically arranged in an upper and lower manner, the object to be plated 3 runs between the two groups of tension electrodes 2, and the upper and lower sides of the object to be plated 3 respectively contact the two groups of tension electrodes 2.
[0038] It can be understood that, in use, single or double-sided electroplating process can be performed according to the requirements of the object 3 to be plated.
[0039] If double-sided electroplating process is adopted, the upper and lower two groups of tension electrodes 2 need to be supplied with positive (anode) and negative (cathode) electricity respectively.
[0040] If single-sided electroplating process is adopted, only the tension electrode 2 on the side to be electroplated needs to be supplied with electricity.
[0041] Preferably, the gap between the upper and lower two groups of tension electrodes 2 in the embodiment is 50% to 500% of the thickness of the object 3 to be plated, so as to achieve better electroplating effect.
[0042] As an optional embodiment, the tension electrode 2 in the embodiment includes but is not limited to direct contact with the object 3 to be plated. For this purpose, the electroplating electrode assembly of the embodiment further comprises a film material with apertures, which is wrapped on the surface of the tension electrode 2.
[0043] In this way, under the premise of meeting the use of electroplating, the tension electrode 2 can not be in direct contact with the object 3 to be plated, and by wrapping a film material with apertures on the outside of the tension electrode 2, the contact and attachment of gas to the object 3 to be plated can be prevented.
[0044] As an optional embodiment, Figure 4 is a structural schematic diagram of the continuous body tension electrode in the embodiment, Figure 5 is a structural schematic diagram of the non-continuous body tension electrode in the embodiment, as Figure 4 and Figure 5 As shown in the figures, in order to enable the electroplating solution to pass through better, the tension electrode in the embodiment includes a continuous body structure or a non-continuous body structure with apertures.
[0045] As an optional embodiment, the rotating assembly 1 further comprises a conductive roller 13, each conductive roller 13 is provided with a first rotating part 131 and a second rotating part 132, the first rotating part 131 can drive the first rotating mechanism 11 to rotate, and the second rotating part 132 can drive the second rotating mechanism 12 to rotate. Specifically, in the embodiment, the first rotating part 131 and the second rotating part 132 adopt a structure that can conduct electricity and can drive the first rotating mechanism 11 and the second rotating mechanism 12 to rotate, such as a roller shaft, etc., which is not specifically limited here.
[0046] Optionally, in order to further improve the stability of the overall device in use, in the embodiment, the conductive roller 13 is provided in two groups, and the two groups of conductive rollers 13 are arranged perpendicularly to the first rotating mechanism 11 and the second rotating mechanism 12, and are respectively arranged on the two sides of the tension electrode 2.
[0047] The conductive roller 13, the first rotating component 131, the second rotating component 132, the first rotating mechanism 11 and the second rotating mechanism 12 in the embodiment are made of conductive metal, including but not limited to gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium and graphite, or a single metal or a composite alloy material, which can conduct electricity and support.
[0048] The conductive roller 13 can be connected to the power supply of the electroplating equipment through the wire 4, and can conduct electricity and rotate mechanically after being connected to the power supply. The conductive roller 13, the first rotating component 131, the second rotating component 132, the first rotating mechanism 11 and the second rotating mechanism 12 in the embodiment do not react with the electroplating liquid and can withstand a temperature range of 5-80°C.
[0049] The embodiment also provides an electroplating mechanism, Figure 6 is a structural schematic diagram of the embodiment, as Figure 6 shown, the embodiment includes an electroplating liquid tank 5 for containing the electroplating liquid and the electroplating electrode assembly. The electroplating electrode assembly is installed in the electroplating liquid tank 5, and the tension electrode 2 is in contact with the electroplating liquid.
[0050] It can be understood that the tension electrode 2 in the embodiment can be arranged in the electroplating liquid tank or not, as long as it meets the use requirements of electroplating.
[0051] The electroplating liquid tank 5 in the embodiment can be made of a material that does not react with the electroplating liquid and can withstand a temperature range of 5-80°C, such as PVS, PVDF, stainless steel and the like.
[0052] As an optional implementation, the embodiment also includes a conveying assembly 6 for conveying the object to be plated 3.
[0053] In the embodiment, the conveying assembly 6 includes a roller roller 61 and a roller structure 62 arranged on the roller roller 61. The width of the roller structure 62 in contact with the object to be plated 3 is 5%-150% of the widest width perpendicular to the direction of travel with the center of the object to be plated 3 as the reference, so as to have the best support and transmission function for the object to be plated 3.
[0054] The roller roller 61 is made of a non-conductor material, such as EVA, PVA, PVC, PVDF and PP, which does not react with the electroplating liquid and can withstand a temperature range of 5-80°C.
[0055] The material of the roller structure 62 can be a conductive metal or a non-conductor, such as gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium, and graphite, or a composite alloy material; or a conductive rubber, a conductive foam, or the like, which has a single layer or a composite structure with conductive and flexible deformation; and the non-conductor material includes, but is not limited to, EVA, PVA, PVC, PVDF, and PP, and the like, high polymer plastic materials.
[0056] Preferably, the roller structure in the embodiment is made of conductive foam or PP material.
[0057] The plating mechanism includes the conveying assembly 6 including the roller roller 61 and the roller structure 62 arranged on the roller roller 61, the roller structure 62 is in contact with the plated object 3, and the roller structure 62 can avoid excessive pressure on the plated object, so that the tension electrode 2 fully contacts the surface of the plated object 3, reduces the damage rate of the thin plated object 3, and greatly improves the plating capacity and the uniformity of the plating thickness.
[0058] The embodiment also provides a plating machine, which includes the plating machine tank body 7 and the plating mechanism.
[0059] The plating machine tank body 7 in the embodiment can be made of a material that does not react with the plating liquid and can resist a temperature range of 5-80°C, such as PVS, PVDF, stainless steel, and the like.
[0060] The plating machine tank body 7 in the embodiment is provided with a liquid conveying component 71 and a gas conveying component 72 to facilitate the smooth progress of the plating process.
[0061] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. An electroplating electrode assembly, characterized by, The application relates to an electroplating electrode assembly. The rotating assembly comprises a first rotating mechanism and a second rotating mechanism, and the first rotating mechanism is arranged in parallel with the second rotating mechanism. The tension electrode is installed on the first rotating mechanism and the second rotating mechanism, and the tension electrode can contact the object to be plated during the operation of the object to be plated.
2. The electroplating electrode assembly of claim 1, wherein: The rotating assembly and the tension electrode are symmetrically arranged in two groups, and the object to be plated is arranged between the two groups of the tension electrode.
3. The electroplating electrode assembly of claim 1 or 2, wherein: The film material is provided with apertures, and the film material is wrapped on the surface of the tension electrode.
4. The electroplating electrode assembly of claim 1 or 2, wherein: The tension electrode comprises a continuous structure or a non-continuous structure provided with apertures.
5. The electroplating electrode assembly of claim 1 or 2, wherein: The tension electrode comprises a flexible conductor with a thickness of 10-3000 um.
6. The electroplating electrode assembly of claim 2, wherein: The gap between the two groups of the tension electrode is 50%-500% of the thickness of the object to be plated.
7. The electroplating electrode assembly of claim 1 or 2, wherein: The rotating assembly further comprises a conductive roller, and the conductive roller is provided with a first rotating part and a second rotating part.
8. An electroplating mechanism characterized by, The application relates to an electroplating electrode assembly.
9. The electroplating mechanism of claim 8, wherein: The application relates to an electroplating electrode assembly.
10. An electroplating machine characterized by: The application relates to an electroplating electrode assembly.