Deoxidizing tray for gallium arsenide wafer

Abstract

The utility model discloses a deoxidizing tray for a gallium arsenide wafer, and particularly relates to the technical field of wafers, the deoxidizing tray comprises a base for deoxidizing the gallium arsenide wafer, the middle part of the top surface of the base is provided with a placing groove for placing the gallium arsenide wafer, and the outer surface of the base is fixedly provided with a guide ring. And a plurality of movable rods are slidably connected to the outer surface of the guide ring. According to the deoxidizing tray for the gallium arsenide wafer, in actual work, the multiple movable rods are moved according to the diameter size of the gallium arsenide wafer so that the positions of the multiple limiting plates can be adjusted, the movable rods are fixed by inserting the first threaded fasteners into the fixing holes and the adjusting holes which are overlapped, and the movable rods are fixed through the first threaded fasteners. The gallium arsenide wafer is placed in the placing groove, the cover plate and the base are connected through the second threaded fastener, and the pressing plate in the cover plate can prevent the gallium arsenide wafer from falling off from the placing groove, so that the gallium arsenide wafers with different diameter sizes can be conveniently installed, and the application range is expanded.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer technical field especially relates to a gallium arsenide wafer is with oxygen removing tray. BACKGROUND

[0002] High-quality single crystal semiconductor thin film or heterojunction is epitaxially grown on semiconductor single crystal wafer, and it is the core technical link of most semiconductor optoelectronic device research and development, gallium arsenide wafer is often used as a semiconductor wafer with higher lattice matching degree, and is used as the epitaxial growth substrate of semiconductor optoelectronic device, when the gallium arsenide wafer is deoxidized, the gallium arsenide wafer is placed in the tray.

[0003] Through the retrieval, for example, the utility model discloses a gallium arsenide wafer is with oxygen removing tray, including base and positioning assembly, the base is set up and is used for installing gallium arsenide wafer installation hole through the base, the side wall on installation hole is equipped with the limiting protrusion, positioning assembly can be fixedly connected with base, the utility model places gallium arsenide wafer in installation hole, and it is fixed through positioning assembly, but the diameter size of gallium arsenide wafer often has multiple, and the diameter size of installation hole of the utility model is relatively fixed, and then it is inconvenient to install gallium arsenide wafer of different diameter sizes, and the scope of application is smaller, therefore, in order to solve above-mentioned defects, the gallium arsenide wafer is with oxygen removing tray UTILITY MODEL CONTENTS

[0004] The utility model discloses a gallium arsenide wafer is with oxygen removing tray, can effectively solve the problem that the oxygen removing tray of prior art is inconvenient to install gallium arsenide wafer of different diameter sizes.

[0005] In order to achieve the above-mentioned purpose, the technical scheme that the utility model adopts is:

[0006] A kind of gallium arsenide wafer is with oxygen removing tray, including the base for gallium arsenide wafer deoxidization, the top surface of the base is set up and placed slot in middle part, to place gallium arsenide wafer, the outer surface of the base is fixedly installed with guide ring, the outer surface of the guide ring is slidably connected with multiple movable rods, and the movable rod is extended to the inside of placed slot one end, the inside of placed slot is slidably connected with multiple limit plates, and multiple limit plates and multiple movable rods one-to-one correspondence, the movable rod is fixedly connected with limit plate one end extended to the inside of placed slot;

[0007] The top surface of the movable rod is set up and is equipped with multiple adjusting holes, the outer top surface of the guide ring is set up and is equipped with multiple fixed holes, and multiple fixed holes and multiple movable rods one-to-one correspondence, the top surface of the fixed hole is equipped with first threaded fastener, the top surface of the base is equipped with cover plate.

[0008] Preferably, the outer top surface of the cover plate is provided with a plurality of connecting holes, and the outer top surface of the connecting hole is provided with a second threaded fastener, the top surface of the base is provided with a plurality of mounting holes, and the plurality of mounting holes correspond to the plurality of connecting holes one by one.

[0009] Preferably, the inside of the cover plate is provided with a plurality of movable grooves, and the movable groove is slidably connected with a pressing plate, one side of the inside of the movable groove is threadedly connected with a threaded rod, and one part of the threaded rod is located in the inside of the movable groove, and the other part of the threaded rod is located outside the movable groove, and one end of the threaded rod located in the inside of the movable groove is rotatably connected with the pressing plate.

[0010] Preferably, the middle part of the outer bottom surface of the base is provided with a fastening groove, and the inner top surface of the fastening groove is provided with a plurality of heat dissipation holes, the outer bottom surface of the base is fixedly installed with a mounting ring, and the outer surface of the mounting ring is threadedly connected with a sealing cover.

[0011] Preferably, the middle part of the inner top surface of the sealing cover is fixedly installed with a filling block.

[0012] Preferably, one end of the threaded rod located outside the movable groove is fixedly installed with a handle.

[0013] Compared with the prior art, the utility model has the advantages of the following:

[0014] The utility model discloses a gallium arsenide wafer oxygen removal tray, through setting up the base, in actual work, according to the diameter size of gallium arsenide wafer, the position of a plurality of limit boards is adjusted by moving a plurality of movable rods, and the movable rod after moving is fixed by inserting the first threaded fastener into the fixed hole and the adjusting hole after superposition, then the gallium arsenide wafer is placed in the placing groove, the cover plate and the base are connected through the second threaded fastener, and the pressing plate in the cover plate can prevent the gallium arsenide wafer from falling off from the placing groove, so that the gallium arsenide wafer of different diameter sizes is convenient to install, and the application range is expanded. ACCURATE DRAWING

[0015] Figure 1 It is the whole structure schematic diagram of the utility model;

[0016] Figure 2 It is the placing groove structure schematic diagram of the utility model;

[0017] Figure 3 It is the cover plate cross section structure schematic diagram of the utility model;

[0018] Figure 4 It is the fastening groove structure schematic diagram of the utility model;

[0019] Figure 5 It is the sealing cover structure schematic diagram of the utility model.

[0020] In the figure: 1, base; 2, guide ring; 3, cover plate; 101, placing groove; 102, movable rod; 103, limiting plate; 104, adjusting hole; 105, first threaded fastener; 106, fixing hole; 301, connecting hole; 302, second threaded fastener; 303, mounting hole; 3021, movable groove; 3022, pressing plate; 3023, threaded rod; 3024, handle; 1011, mounting ring; 1012, fastening groove; 1013, heat dissipation hole; 1014, sealing cover; 1015, filling block. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0022] The utility model discloses a gallium arsenide wafer is with oxygen -removing tray, as shown in Figures 1-5 The utility model discloses a gallium arsenide wafer is with oxygen -removing tray, as shown in

[0023] The outer surface of base 1 is fixedly installed with guide ring 2, the outer surface of guide ring 2 is slidably connected with a plurality of movable rods 102, one end of movable rod 102 extends to the inside of placing groove 101, a plurality of limiting plates 103 are slidably connected in the inside of placing groove 101, and a plurality of limiting plates 103 correspond to a plurality of movable rods 102 one by one, and the end of movable rod 102 extending to the inside of placing groove 101 is fixedly connected with limiting plate 103, when movable rod 102 moves, limiting plate 103 can be driven to move, and then the position of limiting plate 103 can be adjusted by moving movable rod 102.

[0024] The cross section shape of limiting plate 103 is arc-shaped, so that the circular gallium arsenide wafer can be better fitted, and a plurality of gallium arsenide wafers with different diameters can be stably placed in placing groove 101 by adjusting the position of a plurality of limiting plates 103.

[0025] The top surface of movable rod 102 is provided with a plurality of adjusting holes 104, the outer top surface of guide ring 2 is provided with a plurality of fixing holes 106, and a plurality of fixing holes 106 correspond to a plurality of movable rods 102 one by one, the top surface of fixing hole 106 is provided with first threaded fastener 105, when movable rod 102 moves, adjusting hole 104 and fixing hole 106 coincide, then first threaded fastener 105 is inserted into the inside of coincided adjusting hole 104 and fixing hole 106, movable rod 102 after moving can be fixed, and the top surface of base 1 is provided with cover plate 3.

[0026] The outer top surface of the cover plate 3 is provided with a plurality of connecting holes 301, and the outer top surface of the connecting hole 301 is provided with a second threaded fastener 302. The top surface of the base 1 is provided with a plurality of mounting holes 303, and the plurality of mounting holes 303 correspond to the plurality of connecting holes 301 one by one. Place the cover plate 3 on the top surface of the base 1, so that the plurality of mounting holes 303 coincide with the plurality of connecting holes 301. Then insert the second threaded fastener 302 into the coincided connecting hole 301 and mounting hole 303 in sequence. Thus, the base 1 and the cover plate 3 can be assembled.

[0027] The inside of the cover plate 3 is provided with a plurality of movable grooves 3021, and the inside of the movable groove 3021 is slidably connected with a pressing plate 3022. The pressing plate 3022 can move in the inside of the movable groove 3021. One side of the inside of the movable groove 3021 is threadedly connected with a threaded rod 3023. Part of the threaded rod 3023 is located inside the movable groove 3021, and the other part of the threaded rod 3023 is located outside the movable groove 3021. One end of the threaded rod 3023 located inside the movable groove 3021 is rotationally connected with the pressing plate 3022. Rotating the threaded rod 3023 can push the pressing plate 3022 to move. After the cover plate 3 and the base 1 are assembled, the pressing plate 3022 can prevent the gallium arsenide wafer placed in the placing groove 101 from falling off.

[0028] By rotating the threaded rod 3023, the pressing plate 3022 moves, which can prevent gallium arsenide wafers of different diameters from falling off from the placing groove 101. One end of the threaded rod 3023 located outside the movable groove 3021 is fixedly installed with a handle 3024.

[0029] The middle part of the outer bottom surface of the base 1 is provided with a fastening groove 1012, and the inner top surface of the fastening groove 1012 is provided with a plurality of heat dissipation holes 1013. The heat dissipation holes 1013 communicate with the placing groove 101, which can dissipate heat after the gallium arsenide wafer is heated. The outer bottom surface of the base 1 is fixedly installed with a mounting ring 1011, and the outer surface of the mounting ring 1011 is threadedly connected with a sealing cover 1014.

[0030] The middle part of the inner top surface of the sealing cover 1014 is fixedly installed with a filling block 1015. Rotating the sealing cover 1014 can disassemble the sealing cover 1014 and the mounting ring 1011. After the sealing cover 1014 and the mounting ring 1011 are assembled, the filling block 1015 is inserted into the fastening groove 1012 to block the plurality of heat dissipation holes 1013.

[0031] The utility model discloses a working principle is: according to the diameter size of gallium arsenide wafer, the position of multiple limiting plates 103 is adjusted to multiple movable rods 102 are removed, and through the first threaded fastener 105 is inserted into the fixed hole 106 and the adjusting hole 104 after coinciding, with the movable rod 102 after moving is fixed, then gallium arsenide wafer is placed in the placing groove 101, make gallium arsenide wafer be located between multiple limiting plates 103, then the cover plate 3 is placed on the top surface of base 1, make multiple mounting holes 303 and multiple connecting holes 301 coincide, then the second threaded fastener 302 is inserted into the connecting hole 301 and the mounting hole 303 after coinciding in proper order, the base 1 is assembled with the cover plate 3, and the pressing plate 3022 in the cover plate 3 can avoid gallium arsenide wafer from falling off in the placing groove 101.

[0032] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above. The skilled person in the art should understand that the utility model is not limited by the above examples, and the above examples and the description in the specification are only to illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model can have various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A deoxidizing tray for a gallium arsenide wafer, comprising a base (1) for deoxidizing a gallium arsenide wafer, characterized in that: The top surface of the base (1) is provided with a placing groove (101) in the middle to place a gallium arsenide wafer, and the outer surface of the base (1) is fixedly provided with a guide ring (2), the outer surface of the guide ring (2) is slidably connected with a plurality of movable rods (102), one end of the movable rod (102) extends into the placing groove (101), and the inside of the placing groove (101) is slidably connected with a plurality of limiting plates (103), and the plurality of limiting plates (103) correspond to the plurality of movable rods (102) one by one, and the end of the movable rod (102) extending into the placing groove (101) is fixedly connected with the limiting plate (103). The top surface of the movable rod (102) is provided with a plurality of adjusting holes (104), the outer top surface of the guide ring (2) is provided with a plurality of fixed holes (106), and the plurality of fixed holes (106) correspond to the plurality of movable rods (102) one by one, the top surface of the fixed hole (106) is provided with a first threaded fastener (105), and the top surface of the base (1) is provided with a cover plate (3).

2. The oxygen scavenging tray for a GaAs wafer according to claim 1, wherein: The outer top surface of the cover plate (3) is provided with a plurality of connecting holes (301), and the outer top surface of the connecting hole (301) is provided with a second threaded fastener (302), and the top surface of the base (1) is provided with a plurality of mounting holes (303), and the plurality of mounting holes (303) correspond to the plurality of connecting holes (301) one by one.

3. The oxygen scavenging tray for a GaAs wafer according to claim 1, wherein: The inside of the cover plate (3) is provided with a plurality of movable grooves (3021), and the inside of the movable groove (3021) is slidably connected with a pressing plate (3022), one side of the inside of the movable groove (3021) is threadedly connected with a threaded rod (3023), and a part of the threaded rod (3023) is located in the inside of the movable groove (3021), another part of the threaded rod (3023) is located outside the movable groove (3021), and one end of the threaded rod (3023) located in the inside of the movable groove (3021) is rotatably connected with the pressing plate (3022).

4. The oxygen scavenger tray for a GaAs wafer according to claim 1, wherein: The outer bottom surface of the base (1) is provided with a fastening groove (1012) in the middle, and the inner top surface of the fastening groove (1012) is provided with a plurality of heat dissipation holes (1013), the outer bottom surface of the base (1) is fixedly provided with a mounting ring (1011), and the outer surface of the mounting ring (1011) is threadedly connected with a sealing cover (1014).

5. The oxygen scavenging tray for a GaAs wafer according to claim 4, characterized by: The inner top surface of the sealing cover (1014) is fixedly provided with a filling block (1015).

6. The oxygen scavenging tray for a GaAs wafer as claimed in claim 3, wherein: One end of the threaded rod (3023) located outside the movable groove (3021) is fixedly provided with a handle (3024).

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