Infrared photon temperature sensing device TO packaging tube shell

Abstract

The utility model relates to the technical field of sensor packaging, in particular to an infrared photon temperature sensor TO packaging tube shell, which comprises a TO base and a tube cap shell, the tube cap shell is fixed on the upper side of the TO base, the upper side of the tube cap shell is provided with a packaging groove, the interior of the packaging groove is fixedly connected with a sealing window sheet, and the sealing window sheet is fixedly connected with the sealing window sheet. A fixing boss is fixedly connected to the middle of the upper surface of the TO base, a positioning groove is formed in the middle of the upper surface of the fixing boss, and multiple sets of positioning elastic pieces are fixedly connected to the side wall of the positioning groove. The semiconductor cooler is positioned and fixed through the positioning groove and the positioning elastic piece, and then the semiconductor cooler is welded and fixed by filling the welding flux, so that the stability of the semiconductor cooler is effectively improved, short circuit caused by overflowing of the welding flux is avoided, and the use safety is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor device packaging technical field, concretely relates to a kind of infrared photon temperature sensor device TO package tube shell. BACKGROUND

[0002] Infrared photon sensor is an advanced infrared temperature measurement technology product, and its basic working principle is that when sensor receives infrared radiation, they are absorbed by photosensitive material and excited charge is converted into electrical signal, and the measurement and detection of object temperature are realized by signal processing and analysis.

[0003] Infrared photon sensor is often packaged in TO metal tube shell, and airtight packaging is carried out, but limited by the size of TO packaging space, and lacking effective positioning module, it is easy to cause inaccurate semiconductor installation position, inaccurate semiconductor cooler alignment installation affecting optical path consistency, semiconductor cooler solder overflow easily causing electrical pin short circuit and other problems.

[0004] Therefore, it is necessary to invent a kind of infrared photon temperature sensor device TO package tube shell to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of infrared photon temperature sensor device TO package tube shell to solve the problems of inaccurate semiconductor installation position, inaccurate semiconductor cooler alignment installation affecting optical path consistency, semiconductor cooler solder overflow easily causing electrical pin short circuit and other problems in the prior art.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of infrared photon temperature sensor device TO package tube shell, including TO base and tube cap shell, the tube cap shell is fixed on the upside of TO base, the upside of the tube cap shell is equipped with packaging groove, the inside of the packaging groove is fixedly connected with sealing window piece, the middle position of the upper surface of the TO base is fixedly connected with fixed boss, the middle of the upper surface of the fixed boss is equipped with positioning groove, the side wall of the positioning groove is fixedly connected with multiple sets of positioning elastic sheet.

[0007] By adopting the above technical scheme, the semiconductor cooler is placed in the positioning groove during installation, the positioning elastic sheet positions the semiconductor cooler at the center of the positioning groove, then the solder is filled in the positioning groove to fix the semiconductor cooler, effectively avoiding solder overflow, improving equipment use safety, and the sealing window piece is clamped in the packaging groove, then the brazing solder is filled in the packaging groove, and the sealing window piece is fixed by brazing, which further improves the stability of the sealing window piece compared with traditional adhesive fixing, making the connection more firm.

[0008] Optionally, a plurality of mounting holes are formed on the surface of the fixing boss, and the lower end of the mounting hole penetrates the TO base.

[0009] Optionally, a device pin is inserted into the mounting hole, and a sealing block is filled between the inner wall of the mounting hole and the device pin.

[0010] By adopting the above technical scheme, the sealing block is made of glass material, the device pin is fixed in the mounting hole by the glass material, and the insulation of the device pin is improved.

[0011] Optionally, an annular sealing groove is formed on the upper surface of the TO base at a position outside the fixing boss.

[0012] Optionally, a sealing extension is fixedly connected to the lower end of the cap shell.

[0013] Optionally, a sealing protrusion is fixedly connected to the lower surface of the sealing extension, and the sealing protrusion is clamped in the sealing groove.

[0014] By adopting the above technical scheme, the cap shell is sleeved outside the fixing boss, the sealing protrusion is clamped in the sealing groove, and the stability and air tightness between the cap shell and the TO base are improved in cooperation with the sealing extension.

[0015] Optionally, a connecting hole is formed at the left and right ends of the TO base.

[0016] Optionally, the overall height of the fixing boss is 2mm, the depth of the positioning groove is 0.8mm, and the length and width of the positioning groove are both 6.1mm.

[0017] In the above technical scheme, the technical effects and advantages of the present application are provided:

[0018] 1. The semiconductor refrigerator is placed in the positioning groove, the positioning spring piece positions the semiconductor refrigerator at the center of the positioning groove, then the solder is filled in the positioning groove to fix the semiconductor refrigerator, effectively avoiding solder overflow, and improving the safety of the equipment in use.

[0019] 2. The brazing solder is filled in the packaging groove, the sealing window piece is fixed by brazing, the stability of the sealing window piece is further improved, and the connection is more firm.

[0020] 3. The cap shell is sleeved outside the fixing boss, the sealing protrusion is clamped in the sealing groove, and the stability and air tightness between the cap shell and the TO base are improved in cooperation with the sealing extension. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The overall structure of the present application is shown in the drawingsFigure 1 (connected state);

[0022] Figure 2 for the overall structure of the utility model Figure 2 (separated state);

[0023] Figure 3 for the TO base structure diagram of the utility model;

[0024] Figure 4 for the pipe cap shell structure diagram of the utility model;

[0025] Figure 5 for the device pin structure diagram of the utility model.

[0026] Legend:

[0027] 1, TO base; 11, fixed boss; 12, positioning groove; 121, positioning spring; 13, mounting hole; 14, sealing block; 15, device pin; 16, sealing groove; 17, connecting hole; 2, pipe cap shell; 21, sealing window piece; 22, sealing extension; 23, sealing convex strip; 24, packaging groove. Specific embodiments

[0028] In order to make the technical personnel of the prior art better understand the technical scheme of the utility model, the utility model will be further described in detail below in conjunction with the drawings.

[0029] The utility model provides a kind of infrared photon temperature sensing device TO package pipe shell as shown in Figures 1 to 3 Including TO base 1 and pipe cap shell 2, pipe cap shell 2 is fixed on the upside of TO base 1, the upside of pipe cap shell 2 is provided with packaging groove 24, sealing window piece 21 is fixedly connected in the inside of packaging groove 24, fixed boss 11 is fixedly connected in the middle position of TO base 1 upper surface, positioning groove 12 is set up in the middle of fixed boss 11 upper surface, multiple positioning springs 121 are fixedly connected in the side wall of positioning groove 12, the overall height of fixed boss 11 is 2mm, the depth of positioning groove 12 is 0.8mm, the length and width of positioning groove 12 are both 6.1mm.

[0030] The fixed boss 11 is a 2mm high cylinder, the positioning groove 12 is a cuboid groove with a length of 6.1mm and a depth of 0.8mm, the semiconductor refrigerator is directly placed in the positioning groove 12 during installation, the positioning spring 121 on the side wall of the positioning groove 12 clamps and fixes the semiconductor refrigerator, the stability of the semiconductor refrigerator is improved, displacement of the semiconductor refrigerator during filling of the solder is avoided, the installation precision of the semiconductor refrigerator is effectively improved, meanwhile, the sealing window piece 21 is clamped in the packaging groove 24 during fixing of the sealing window piece 21, and the brazing solder is filled in the packaging groove 24, the sealing window piece 21 is fixed by brazing, compared with the traditional adhesive fixing, the stability of the sealing window piece 21 is further improved, and the connection is more firm.

[0031] Specifically, during brazing of the sealing window piece 21, the sealing window piece 21 is clamped in the packaging groove 24, the filler metal is placed in the gap between the sealing window piece 21 and the side wall of the packaging groove 24, when the workpiece and the filler metal are heated to slightly higher than the melting point temperature of the filler metal, the filler metal melts (the workpiece does not melt), and is absorbed and filled in the gap between the sealing window piece 21 and the side wall of the packaging groove 24 by capillary action, the liquid filler metal and the workpiece metal diffuse and dissolve each other, and the brazing joint is formed after condensation.

[0032] Referring to Figure 3 and Figure 5 , a plurality of mounting holes 13 are formed in the surface of the fixed boss 11, the lower end of the mounting hole 13 penetrates the TO base 1, the device pin 15 is inserted into the mounting hole 13, and the sealing block 14 is filled between the inner wall of the mounting hole 13 and the device pin 15.

[0033] Meanwhile, under the action of the positioning groove 12, the solder overflow is prevented from contacting the device pin 15, and the safety of the device is improved.

[0034] In addition, during installation of the device pin 15, the device pin 15 is inserted into the inside of the mounting hole 13, and then the glass material is filled in the inside to form the sealing block 14 for sealing, and the device pin 15 and the mounting hole 13 are insulated and fixed.

[0035] Referring to Figure 3 and Figure 4 , the annular sealing groove 16 is formed in the position of the upper surface of the TO base 1 outside the fixed boss 11, the lower end of the cap shell 2 is fixedly connected with the sealing extension 22, the lower surface of the sealing extension 22 is fixedly connected with the sealing convex strip 23, the sealing convex strip 23 is clamped in the sealing groove 16, and the left and right ends of the TO base 1 are both provided with the connecting hole 17.

[0036] The process of fixing the pipe cap shell 2 is supplemented, the lower end of the pipe cap shell 2 is clamped outside the fixing boss 11, meanwhile, the sealing convex strip 23 is clamped inside the sealing groove 16, and the contact area of the lower end of the pipe cap shell 2 and the surface of the TO base 1 is increased through the sealing outer extension 22, so that the stability of the pipe cap shell 2 connection and the air tightness in the pipe cap shell 2 are effectively improved, and the safety of the device is improved.

[0037] The utility model discloses working principle: through the positioning recess 12 and the positioning elastic sheet 121 are positioned and are fixed to semiconductor refrigerator, fill solder again to the semiconductor refrigerator and carry out the welding fixed, effectively improve the stability of semiconductor refrigerator, and avoid solder overflow and cause short circuit, improve use safety.

[0038] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the utility model and are not intended to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model can have various changes and improvements, and these changes and improvements fall within the scope of the claimed utility model.

Claims

1. A TO package for an infrared photonic temperature sensor, comprising a TO base (1) and a cap shell (2), characterized in that: The cap shell (2) is fixed on the upper side of the TO base (1). The upper side of the cap shell (2) is provided with a sealing groove (24). A sealing window (21) is fixedly connected inside the sealing groove (24). A fixing boss (11) is fixedly connected at the middle position of the upper surface of the TO base (1). A positioning groove (12) is provided at the middle of the upper surface of the fixing boss (11). A number of positioning springs (121) are fixedly connected to the side wall of the positioning groove (12).

2. The TO package of an infrared photonic temperature sensor according to claim 1, characterized in that: The surface of the fixed boss (11) has multiple sets of mounting holes (13), and the lower end of the mounting holes (13) passes through the TO base (1).

3. The TO package of an infrared photonic temperature sensor according to claim 2, characterized in that: Device pins (15) are inserted into the inside of the mounting hole (13), and sealing blocks (14) are filled between the inner wall of the mounting hole (13) and the device pins (15).

4. The TO package of an infrared photonic temperature sensor according to claim 1, characterized in that: The upper surface of the TO base (1) is provided with an annular sealing groove (16) located outside the fixed boss (11).

5. The TO package of an infrared photonic temperature sensor according to claim 4, characterized in that: The lower end of the cap shell (2) is fixedly connected to a sealing extension (22).

6. The TO package of an infrared photonic temperature sensor according to claim 5, characterized in that: A sealing protrusion (23) is fixedly connected to the lower surface of the sealing extension (22), and the sealing protrusion (23) is stuck inside the sealing groove (16).

7. The TO package of an infrared photonic temperature sensor according to claim 1, characterized in that: The TO base (1) has connection holes (17) at both ends.

8. The TO package of an infrared photonic temperature sensor according to claim 1, characterized in that: The overall height of the fixed boss (11) is 2mm, the depth of the positioning groove (12) is 0.8mm, and the length and width of the positioning groove (12) are both 6.1mm.

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