Semiconductor packaging sealing performance detection device

Abstract

The utility model relates to the field of sealing performance detection, in particular to a semiconductor packaging sealing performance detection device, which comprises a base assembly, a cover assembly movably connected to the base assembly, a pressurizing assembly connected to the upper end part of the cover assembly, and a detection assembly connected to the cover assembly. According to the utility model, manual bubble observation is changed into observation of the state of the counterweight assembly to realize judgment of the bubble amount, and when the bubble amount exceeds a predetermined value, the buzzer alarm can buzz to warn a user, so that rapid judgment of tiny bubbles is realized, and the problem that when the existing semiconductor package is in a micro-leakage state, the bubble amount cannot be accurately detected is solved. The problem that the detection and judgment of semiconductor packaging are affected to a certain extent and the detection efficiency of the semiconductor packaging is reduced due to the fact that the tiny bubble phenomenon is difficult to observe through naked eyes is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of sealing detection, especially to a semiconductor package sealing detection device. BACKGROUND

[0002] Semiconductor packaging refers to the process of obtaining independent chips by processing wafers according to product models and functional requirements. The packaging process is as follows: wafers from the previous process of wafers are cut into small dies (Die) after the scribing process, then the cut dies are attached to the corresponding island of the substrate (lead frame) with glue, and then the ultra-fine metal (gold, tin, copper and aluminum) wire or conductive resin is used to connect the bond pad (Bond Pad) of the die to the corresponding lead of the substrate, and the required circuit is formed; then the independent die is packaged and protected with a plastic shell, and the semiconductor often needs to be tested after packaging. The existing semiconductor packaging test is mostly tested by bubble test.

[0003] However, the existing bubble test can determine that the packaging of the tested semiconductor is in a leak state once a bubble phenomenon occurs during testing. The bubble phenomenon is often difficult to observe with the naked eye when the packaging is slightly leaking, which affects the user's judgment of the leak and leads to detection errors. SUMMARY

[0004] To overcome the difficulty of observing the tiny bubble phenomenon with the naked eye when the existing semiconductor packaging is slightly leaking, which affects the detection and judgment of the semiconductor packaging and reduces the detection efficiency of the semiconductor packaging.

[0005] The technical scheme of the utility model is a semiconductor package sealing detection device, which comprises a base assembly, a cover assembly movably connected to the base assembly, a pressurizing assembly connected to the upper end of the cover assembly, and a detection assembly connected to the cover assembly.

[0006] The detection assembly comprises a buzzer connected to the cover assembly, a float ball seat electrically connected to the buzzer, and a counterweight assembly connected to the float ball seat, wherein the counterweight assembly is used to obtain the liquid level data inside the cover assembly.

[0007] As a preferred embodiment, the counterweight assembly comprises a mounting cover plate connected to the float ball seat, a plurality of adjusting grooves formed in the inner wall of the float ball seat, a plurality of adjusting clamping plates movably connected to the adjusting grooves, a counterweight block arranged between adjacent two adjusting clamping plates, and a mounting bracket movably connected to the float ball seat, wherein the mounting bracket is connected to the cover assembly.

[0008] As preferred, the cover assembly comprises a combination frame connected to the mounting frame, a fixed cone cover connected to the combination frame, a fixed handle connected to the fixed cone cover, and a plurality of limiting pieces connected to the outer surface of the fixed cone cover, and the fixed cone cover is provided in a transparent shape.

[0009] As preferred, the pressurizing assembly comprises a pressurizing pipe connected to the fixed cone cover, a pressurizing pump connected to the pressurizing pipe, an air source pipe connected to the pressurizing pump, and a mounting plate connected to the bottom end surface of the pressurizing pump, and the mounting plate is connected to the combination frame.

[0010] As preferred, the base assembly comprises a mounting ring movably connected to the fixed cone cover, a plurality of limiting grooves opened in the mounting ring, a bottom disc assembly connected to the mounting ring, and a water inlet assembly movably connected to the bottom disc assembly, and the limiting grooves correspond to the limiting pieces one by one.

[0011] As preferred, the bottom disc assembly comprises a fixed bottom disc connected to the mounting ring, a plurality of connecting columns connected to the fixed bottom disc, a reset spring connected to the connecting columns, and a support cylinder connected to the reset spring.

[0012] As preferred, the water inlet assembly comprises a connecting seat connected to the fixed bottom disc, a placing ring connected to the connecting seat, a fixed sleeve movably connected to the connecting seat, a plurality of liquid outlet grooves opened in the fixed sleeve, a sealing cover connected to the top end portion of the fixed sleeve, and a limiting ring connected to the fixed sleeve.

[0013] The beneficial effects of the utility model are as follows:

[0014] 1. The utility model discloses an improved bubble observation method, which is used for observing the state of the counterweight assembly instead of artificial observation, and when the bubble quantity exceeds the predetermined value, the buzzer alarm can be used to warn the user, so that the small bubbles can be quickly judged, and the problem that the small bubbles are difficult to observe by naked eyes when the semiconductor package is in a micro-leakage state, which affects the detection and judgment of the semiconductor package and reduces the detection efficiency of the semiconductor package can be solved.

[0015] 2. The adjusting clamp can be moved in different adjusting grooves to adjust the placement space of the counterweight block, so that the weight in the floating ball seat can be adjusted, the weight of the floating ball seat can be adjusted to adapt to different leakage rates, the use applicability of the whole detection device is improved, and the water in the fixed cone cover can be distributed in a conical shape through the transparent fixed cone cover, so that the bubbles can be quickly gathered at the tip of the fixed cone cover after being generated, and the detection efficiency of the whole sealing detection device can be improved to a certain extent. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The first three-dimensional structure schematic view of the sealing detection device is shown.

[0017] Figure 2 The second three-dimensional structure schematic view of the sealing detection device is shown.

[0018] Figure 3 The cover assembly three-dimensional structure schematic view of the sealing detection device is shown.

[0019] Figure 4 The base assembly three-dimensional structure schematic view of the sealing detection device is shown.

[0020] Figure 5 The detection assembly three-dimensional structure schematic view of the sealing detection device is shown.

[0021] The figure mark explanation: 1, base assembly; 2, cover assembly; 3, pressurizing assembly; 4, detection assembly; 101, fixed bottom disc; 102, connecting column; 103, reset spring; 104, support cylinder; 105, connecting seat; 106, placing ring; 107, fixed sleeve; 108, liquid outlet groove; 109, sealing cover; 110, limiting ring; 111, mounting ring; 112, limiting groove; 201, fixed cone cover; 202, limiting sheet; 203, fixed handle; 204, combined frame; 301, mounting plate; 302, pressurizing pump; 303, air source pipe; 304, pressurizing pipe; 401, buzzer alarm; 402, float ball seat; 403, adjusting groove; 404, adjusting clamp plate; 405, counterweight block; 406, mounting frame; 407, mounting cover plate. DETAILED DESCRIPTION

[0022] The utility model is further explained in connection with the drawings and examples.

[0023] A semiconductor package sealing detection device, according to Figures 1-5 As shown, including base assembly 1, cover assembly 2 that is movably connected on base assembly 1, pressurizing assembly 3 that is connected on the end of cover assembly 2, detection assembly 4 that is connected on cover assembly 2;

[0024] Detection assembly 4 includes the buzzer alarm 401 that is connected on cover assembly 2, the float ball seat 402 that is electrically connected on buzzer alarm 401 and the counterweight assembly that is connected on float ball seat 402, and the counterweight assembly is used to obtain the liquid level data in cover assembly 2.

[0025] It should be noted that the amount of bubbles is judged by observing the state of the counterweight assembly, and when the predetermined value is exceeded, the user can be warned by the buzzer 401, thereby realizing the rapid judgment of the micro-bubbles.

[0026] According to Figure 5 As shown in the figure, the counterweight assembly includes a mounting cover plate 407 connected to the float ball seat 402, a plurality of adjusting grooves 403 opened on the inner wall of the float ball seat 402, a plurality of adjusting clamping plates 404 movably connected to the adjusting grooves 403, a counterweight block 405 arranged between adjacent two adjusting clamping plates 404, and a mounting frame 406 movably connected to the float ball seat 402, and the mounting frame 406 is connected with the cover assembly 2.

[0027] It should be noted that by moving the adjusting clamping plate 404 in different adjusting grooves 403, the placement space of the counterweight block 405 is adjusted, so that the weight inside the float ball seat 402 can be adjusted to adapt to different leakage rate requirements by adjusting the weight of the float ball seat 402, thereby improving the use applicability of the entire detection device.

[0028] According to Figure 2 With Figure 3 As shown in the figure, the cover assembly 2 includes a combination frame 204 connected to the mounting frame 406, a fixed cone cover 201 connected to the combination frame 204, a fixed handle 203 connected to the fixed cone cover 201, and a plurality of limiting pieces 202 connected to the outer surface of the fixed cone cover 201, and the fixed cone cover 201 is set to be transparent.

[0029] It should be noted that the water entering the inside of the fixed cone cover 201 can be distributed in a conical shape through the transparent fixed cone cover 201, so that the bubbles can quickly gather at the tip of the fixed cone cover 201 after being generated, thereby improving the detection efficiency of the entire sealing detection device to a certain extent.

[0030] According to Figure 2 With Figure 5 As shown in the figure, the pressurizing assembly 3 includes a pressurizing pipe 304 connected to the fixed cone cover 201, a pressurizing pump 302 connected to the pressurizing pipe 304, a gas source pipe 303 connected to the pressurizing pump 302, and a mounting plate 301 connected to the bottom end face of the pressurizing pump 302, and the mounting plate 301 is connected with the combination frame 204.

[0031] It should be noted that the gas source is installed on the gas source pipe 303, and the inside of the fixed cone cover 201 is pressurized through the pressurizing pipe 304 of the pressurizing pump 302, so as to realize the detection of the semiconductor package placed in the inside of the fixed cone cover 201.

[0032] According to Figure 2 WithFigure 4 As shown in the drawings, the base assembly 1 comprises a mounting ring 111 movably connected to the fixed cone cover 201, a plurality of limiting grooves 112 opened on the mounting ring 111, a bottom plate assembly connected to the mounting ring 111, and a water inlet assembly movably connected to the bottom plate assembly, the limiting grooves 112 and the limiting pieces 202 are set in one-to-one correspondence.

[0033] According to Figure 2 As shown in the drawings, the bottom plate assembly comprises a fixed bottom plate 101 connected to the mounting ring 111, a plurality of connecting columns 102 connected to the fixed bottom plate 101, a reset spring 103 connected to the connecting columns 102, and a support cylinder 104 connected to the reset spring 103.

[0034] It should be noted that the sealing cover 109 is separated from the connecting seat 105 by pressing the fixed bottom plate 101, the water body is guided into the fixed cone cover 201 through the liquid outlet grooves 108 opened on the fixed sleeve 107, and the fixed cone cover 201 that has been filled with enough water body can stop the entry of water body through the reset performance of the reset spring 103, so that the semiconductor package placed in the fixed cone cover 201 can start the detection test.

[0035] According to Figure 2 As shown in the drawings, the water inlet assembly comprises a connecting seat 105 connected to the fixed bottom plate 101, a placing ring 106 connected to the connecting seat 105, a fixed sleeve 107 movably connected to the connecting seat 105, a plurality of liquid outlet grooves 108 opened on the fixed sleeve 107, a sealing cover 109 connected to the top end of the fixed sleeve 107, and a limiting ring 110 connected to the fixed sleeve 107.

[0036] It should be noted that the water body is guided into through the plurality of liquid outlet grooves 108, and the limiting ring 110 provided on the fixed sleeve 107 is used to adjust the descending distance of the fixed bottom plate 101, so that the fixed bottom plate 101 can be prevented from being pressed too much to some extent, thereby improving the service life of the entire detection device.

[0037] The embodiments of the utility model are described in detail above combined with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range of those skilled in the art without departing from the purpose of the utility model.

Claims

1. A semiconductor package sealing performance testing device, characterized in that: The utility model relates to a water level detection device, including base assembly (1), cover assembly (2) of movable connection in base assembly (1), pressurization assembly (3) of connection in cover assembly (2) upper end, detection assembly (4) of connection in cover assembly (2), The detection assembly (4) includes a buzzer (401) connected to the cover assembly (2), a float seat (402) electrically connected to the buzzer (401), and a counterweight assembly connected to the float seat (402), which is used to obtain the liquid level data inside the cover assembly (2).

2. The semiconductor package leak detection apparatus of claim 1, wherein: The counterweight assembly includes a mounting cover plate (407) connected to the float seat (402), a plurality of adjusting grooves (403) formed in the inner wall of the float seat (402), a plurality of adjusting clamping plates (404) movably connected to the adjusting grooves (403), a counterweight block (405) arranged between adjacent two adjusting clamping plates (404), and a mounting bracket (406) movably connected to the float seat (402), wherein the mounting bracket (406) is connected to the cover assembly (2).

3. The apparatus of claim 2, wherein: The cover assembly (2) includes a combination bracket (204) connected to the mounting bracket (406), a fixed cone cover (201) connected to the combination bracket (204), a fixed handle (203) connected to the fixed cone cover (201), and a plurality of limiting pieces (202) connected to the outer surface of the fixed cone cover (201), wherein the fixed cone cover (201) is arranged in a transparent manner.

4. The apparatus according to claim 3, wherein: The pressurization assembly (3) includes a pressurization pipe (304) connected to the fixed cone cover (201), a pressurization pump (302) connected to the pressurization pipe (304), an air source pipe (303) connected to the pressurization pump (302), and a mounting plate (301) connected to the bottom end surface of the pressurization pump (302), wherein the mounting plate (301) is connected to the combination bracket (204).

5. The apparatus of claim 3, wherein: The base assembly (1) includes a mounting ring (111) movably connected to the fixed cone cover (201), a plurality of limiting grooves (112) formed in the mounting ring (111), a bottom disc assembly connected to the mounting ring (111), and a water inlet assembly movably connected to the bottom disc assembly, wherein the limiting grooves (112) correspond one-to-one to the limiting pieces (202).

6. The apparatus of claim 5, wherein: The bottom disc assembly includes a fixed bottom disc (101) connected to the mounting ring (111), a plurality of connecting columns (102) connected to the fixed bottom disc (101), a reset spring (103) connected to the connecting columns (102), and a support cylinder (104) connected to the reset spring (103).

7. The apparatus of claim 6, wherein: The water inlet assembly includes a connecting seat (105) connected to the fixed bottom disc (101), a placement ring (106) connected to the connecting seat (105), a fixed sleeve (107) movably connected to the connecting seat (105), a plurality of liquid outlet grooves (108) formed in the fixed sleeve (107), a sealing cover (109) connected to the top end of the fixed sleeve (107), and a limiting ring (110) connected to the fixed sleeve (107).

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