Semiconductor packaging detection device

Abstract

The utility model discloses a semiconductor packaging detection device, and relates to the technical field of semiconductor packaging, the semiconductor packaging detection device comprises a detection machine, the side surface of the detection machine is fixedly connected with a mounting rack, the top of the mounting rack is rotatably connected with a transmission machine through a rotating shaft, and the top of the detection machine is fixedly connected with a detection bench located below the right side of the transmission machine. According to the semiconductor detection machine, the illuminating lamp and the transparent plate are respectively arranged at the top of the detection table, so that light rays can be kept clear in the semiconductor detection process, and the situations of missing detection and the like in the detection process can be avoided, and the upper guide rail and the inner guide rail are respectively arranged at the top of the detection machine; a driving wheel is arranged on an output shaft of a driver installed on the inner side of the upper guide rail, and the driving wheel is in meshed connection with the inner side of a half gear on the top of the detection machine and can drive a moving column in the middle of a linkage rod and a detection camera to do annular motion, and multi-angle detection can be conducted on semiconductors.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially relates to a semiconductor packaging detection device. BACKGROUND

[0002] Semiconductor packaging refers to the process of obtaining independent chips by processing wafers according to product models and functional requirements, and the packaging process is as follows: wafers from the previous process of wafers are cut into small dies (Die) through the scribing process, then the cut dies are attached to the corresponding island of the substrate (lead frame) by glue, and then the ultra-fine metal (gold, tin, copper and aluminum) wire or conductive resin is used to connect the bond pad (Bond Pad) of the die to the corresponding lead of the substrate, and the required circuit is formed.

[0003] In the existing process of semiconductor chip packaging, chip breakage is easily caused due to mechanical micro-failure and other reasons, so unified detection needs to be performed on the packaged semiconductor chips before the chips are boxed, and the common detection method in modern times mostly needs manual one-by-one detection, so the detection efficiency is low, the production progress is seriously hindered, and the labor cost is also increased. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a semiconductor packaging detection device to solve the problem that in the existing process of semiconductor chip packaging, chip breakage is easily caused due to mechanical micro-failure and other reasons, so unified detection needs to be performed on the packaged semiconductor chips before the chips are boxed, the common detection method in modern times mostly needs manual one-by-one detection, so the detection efficiency is low, the production progress is seriously hindered, and the labor cost is also increased.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor packaging detection device, including detection machine, the side surface fixed connection of detection machine has installation support, the top of installation support is rotatably connected with conveyer through pivot, and the top of detection machine is fixedly connected with detection table below the right side of conveyer, the inboard of detection table is fixedly connected with illuminating lamp, the top right side of detection machine is equipped with upper rail, the inboard of upper rail is equipped with driver, the output shaft of driver is fixedly connected with linkage rod, the bottom end of linkage rod is fixedly connected with drive wheel, and the outer side of linkage rod is movably connected with moving column, the outer side of moving column is fixedly connected with detection camera, the bottom of detection machine is fixedly connected with support frame, and the bottom of support frame is fixedly connected with truss.

[0006] As a preferred technical scheme of the utility model, the side surface of the detection machine is fixedly connected with a speed reducer, and the output shaft of the speed reducer is fixedly connected with a driving rod located inside the conveyer.

[0007] As a preferred technical scheme of the utility model, the top of the detection table is fixedly connected with a transparent plate above the illuminating lamp; a transmission machine is installed on the top of the detection machine through a mounting frame and a speed reducer, and the top of the detection machine is provided with the detection table located at the right side of the transmission machine, and the top of the detection table is provided with the illuminating lamp and the transparent plate respectively, so that the light can be kept clear during the detection of the semiconductor, and the situation of missing detection during the detection process can be avoided.

[0008] As a preferred technical scheme of the utility model, the top right side of the detection machine is provided with a half gear on the inner side, and the inner side of the half gear is in meshing connection with the driving wheel.

[0009] As a preferred technical scheme of the utility model, the inner side of the detection machine is provided with an inner guide rail, and the side surface of the moving column is in sliding connection with the inner guide rail.

[0010] As a preferred technical scheme of the utility model, the bottom of the truss is threadedly connected with a connecting screw rod, and the side surface of the truss is fixedly connected with the reinforcing rod located at the bottom of the detection machine.

[0011] As a preferred technical scheme of the utility model, the top of the detection machine is fixedly connected with the alarm lamp, and the alarm lamp is in electric connection with the detection camera; the top of the detection machine is provided with the upper guide rail and the inner guide rail respectively, the driving wheel is installed on the output shaft of the driver on the inner side of the upper guide rail, the driving wheel is in meshing connection with the inner side of the half gear on the top of the detection machine, can drive the moving column in the middle of the linkage rod and the detection camera to make circular motion, can detect the semiconductor from multiple angles, avoid the detection loophole, and the alarm lamp fixedly connected with the top of the detection machine is in electric connection with the detection camera, so that the unqualified semiconductor can be timely rejected.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1、The top of the detection machine is installed with the transmission machine through the mounting frame and the speed reducer, and the top of the detection machine is provided with the detection table located at the right side of the transmission machine, and the top of the detection table is provided with the illuminating lamp and the transparent plate respectively, so that the light can be kept clear during the detection of the semiconductor, and the situation of missing detection during the detection process can be avoided.

[0014] 2、The top of the detection machine is provided with the upper guide rail and the inner guide rail respectively, the driving wheel is installed on the output shaft of the driver on the inner side of the upper guide rail, the driving wheel is in meshing connection with the inner side of the half gear on the top of the detection machine, can drive the moving column in the middle of the linkage rod and the detection camera to make circular motion, can detect the semiconductor from multiple angles, avoid the detection loophole, and the alarm lamp fixedly connected with the top of the detection machine is in electric connection with the detection camera, so that the unqualified semiconductor can be timely rejected. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the structure main view of the utility model;

[0016] Figure 2 It is the structure local main view of the utility model;

[0017] Figure 3 It is the structure driving wheel and half gear combination view of the utility model;

[0018] Figure 4 It is the structure linkage rod side view of the utility model.

[0019] In the figure: 1, detection machine;2, mounting bracket;3, transmission machine;4, speed reducer;5, detection table;6, illuminating lamp;7, transparent plate;8, alarm lamp;9, upper guide rail;10, driver;11, inner guide rail;12, support frame;13, truss;14, connecting screw;15, reinforcing rod;16, moving column;17, linkage rod;18, driving wheel;19, detection camera;20, half gear. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] Please refer to Figures 1-4 The utility model provides a kind of semiconductor package detection device, including detection machine 1, the side surface of detection machine 1 is fixedly connected with mounting bracket 2, the top of mounting bracket 2 is rotatably connected with transmission machine 3 by pivot, and the top of detection machine 1 is fixedly connected with detection table 5 located in the right lower side of transmission machine 3, the inner side of detection table 5 is fixedly connected with illuminating lamp 6, the right side top of detection machine 1 is equipped with upper guide rail 9, the inner side of upper guide rail 9 is equipped with driver 10, the output shaft of driver 10 is fixedly connected with linkage rod 17, the bottom end of linkage rod 17 is fixedly connected with driving wheel 18, and the outer side of linkage rod 17 is movably connected with moving column 16, the outer side of moving column 16 is fixedly connected with detection camera 19, the bottom of detection machine 1 is fixedly connected with support frame 12, and the bottom of support frame 12 is fixedly connected with truss 13.

[0022] The side of the detection machine 1 is fixedly connected with a speed reducer 4, the output shaft of the speed reducer 4 is fixedly connected with a driving rod located in the inner side of the conveying machine 3, the top of the detection table 5 is fixedly connected with a transparent plate 7 located above the illuminating lamp 6; the conveying machine 3 is installed on the top of the detection machine 1 through the mounting frame 2 and the speed reducer 4, and the detection table 5 is located on the right side of the conveying machine 3 on the top of the detection machine 1, and the illuminating lamp 6 and the transparent plate 7 are respectively arranged on the top of the detection table 5, so that the light is clear during the detection of the semiconductor, and the situation of missing detection during the detection process is avoided, the inner side of the top right side of the detection machine 1 is provided with a half gear 20, and the inner side of the half gear 20 is meshedly connected with the driving wheel 18.

[0023] The inner side of the detection machine 1 is provided with an inner guide rail 11, the side of the moving column 16 is slidably connected with the inner side of the inner guide rail 11, the bottom of the truss 13 is threadedly connected with a connecting screw rod 14, the side of the truss 13 is fixedly connected with a reinforcing rod 15 located at the bottom of the detection machine 1, the top of the detection machine 1 is fixedly connected with an alarm lamp 8, and the alarm lamp 8 is electrically connected with the detection camera 19; the top of the detection machine 1 is respectively provided with the upper guide rail 9 and the inner guide rail 11, the driving wheel 18 is arranged on the output shaft of the driving device 10 installed in the inner side of the upper guide rail 9, the driving wheel 18 is meshedly connected with the inner side of the half gear 20 on the top of the detection machine 1, the moving column 16 in the middle of the linkage rod 17 and the detection camera 19 can be driven to make circular motion, the semiconductor can be detected at multiple angles, the detection loophole is avoided, and the alarm lamp 8 fixedly connected with the top of the detection machine 1 is electrically connected with the detection camera 19, so that the unqualified semiconductor can be timely rejected.

[0024] Specifically, first, the conveying machine 3 is installed on the top of the detection machine 1 through the mounting frame 2 and the speed reducer 4, and the detection table 5 is located on the right side of the conveying machine 3 on the top of the detection machine 1, and the illuminating lamp 6 and the transparent plate 7 are respectively arranged on the top of the detection table 5, so that the light is clear during the detection of the semiconductor, and the situation of missing detection during the detection process is avoided, the top of the detection machine 1 is respectively provided with the upper guide rail 9 and the inner guide rail 11, the driving wheel 18 is arranged on the output shaft of the driving device 10 installed in the inner side of the upper guide rail 9, the driving wheel 18 is meshedly connected with the inner side of the half gear 20 on the top of the detection machine 1, the moving column 16 in the middle of the linkage rod 17 and the detection camera 19 can be driven to make circular motion, the semiconductor can be detected at multiple angles, the detection loophole is avoided, and the alarm lamp 8 fixedly connected with the top of the detection machine 1 is electrically connected with the detection camera 19, so that the unqualified semiconductor can be timely rejected.

[0025] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor package inspection apparatus comprising an inspection machine (1), characterized in that: The side of detection machine (1) is fixedly connected with mounting rack (2), the top of mounting rack (2) is rotatably connected with transmission machine (3) through rotating shaft, and the top of detection machine (1) is fixedly connected with detection table (5) below the right side of transmission machine (3), the inner side of detection table (5) is fixedly connected with illuminating lamp (6), the top right side of detection machine (1) is provided with upper guide rail (9), the inner side of upper guide rail (9) is provided with driver (10), the output shaft of driver (10) is fixedly connected with linkage rod (17), the bottom end of linkage rod (17) is fixedly connected with driving wheel (18), and the outer side of linkage rod (17) is movably connected with moving column (16), the outer side of moving column (16) is fixedly connected with detection camera (19), the bottom of detection machine (1) is fixedly connected with support frame (12), and the bottom of support frame (12) is fixedly connected with truss (13).

2. The semiconductor package inspection apparatus of claim 1, wherein: The side of detection machine (1) is fixedly connected with speed reducer (4), and the output shaft of speed reducer (4) is fixedly connected with driving rod inside transmission machine (3).

3. The semiconductor package inspection apparatus of claim 1, wherein: The top of detection table (5) is fixedly connected with transparent plate (7) above illuminating lamp (6).

4. The semiconductor package inspection apparatus of claim 1, wherein: The inner side of the top right side of detection machine (1) is provided with half gear (20), and the inner side of half gear (20) is meshedly connected with driving wheel (18).

5. The semiconductor package inspection apparatus of claim 1, wherein: The inner side of detection machine (1) is provided with inner guide rail (11), and the side of moving column (16) is slidably connected with the inner side of inner guide rail (11).

6. The semiconductor package inspection apparatus of claim 1, wherein: The bottom of truss (13) is threadedly connected with connecting screw rod (14), and the side of truss (13) is fixedly connected with reinforcing rod (15) at the bottom of detection machine (1).

7. The semiconductor package inspection apparatus of claim 1, wherein: The top of detection machine (1) is fixedly connected with alarm lamp (8), and alarm lamp (8) is electrically connected with detection camera (19).

Images