Integrated circuit chip burning device with voltage monitoring mechanism

By introducing a voltage monitoring mechanism into the integrated circuit chip programming device, dual voltage monitoring is achieved, solving the problems of chip performance damage and high defect rate caused by voltage instability, and improving product quality and production efficiency.

CN223727898UActive Publication Date: 2025-12-26WUXI XINYUAN MICRO TECHNOLOGY CO LTD

Patent Information

Application Number
CN202423191777.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-12-26
Estimated Expiration
2034-12-24

AI Technical Summary

Technical Problem

Existing integrated circuit chip programming devices lack voltage monitoring mechanisms, making it impossible to monitor voltage changes in real time. This leads to chip performance degradation or programming failures, resulting in increased product defect rates.

Method used

The integrated circuit chip programming device incorporates a programmer station, voltage monitoring point, voltage sensor, first voltage monitor, second voltage monitor, and power point probe to achieve dual voltage monitoring, ensuring that each chip is programmed under the same voltage conditions.

Benefits of technology

It improves product consistency and quality, reduces defect rates, increases production efficiency and automation, and reduces the need for manual intervention.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223727898U_ABST
    Figure CN223727898U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of integrated circuit chips, in particular to an integrated circuit chip burning device with a voltage monitoring mechanism, which comprises a burning machine body, a main body for burning an integrated circuit chip, and a display controller for checking the burning condition of the integrated circuit chip. According to the utility model, a burner station is arranged; a voltage monitoring point; a voltage sensor; a first voltage monitor; when an integrated circuit chip is placed at the burner station for burning, a voltage monitoring point in the burner station transmits the voltage condition of the integrated circuit chip to the voltage sensor through the first external connection wire, and then the voltage condition is transmitted to the first voltage monitor through the voltage sensor. And after the integrated circuit chips are burnt and before the materials are taken, the portal frame drives the second voltage monitor and the power supply point measuring head to reach the position above the integrated circuit chips in the burner station so as to carry out one-to-one point measurement on the integrated circuit chips.
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Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit chip field, concretely relates to integrated circuit chip burning device with voltage monitoring mechanism. BACKGROUND

[0002] Integrated circuit chip is the silicon slice containing multiple electronic components and circuits, and these components are connected through microfabrication process to constitute a complete circuit system, realize specific function, integrated circuit chip burning device, usually called chip burner or programmer, is a kind of device for writing program or data into integrated circuit chip, and the working principle of chip burning device involves using specific programming language to write program code, and then using burning tool to write these codes into chip.

[0003] Through the retrieval, the IC chip burning device of the announcement number CN215576578U is specifically disclosed, and relates to chip processing technical field, including base and burner, the upper side of the base is fixedly connected with the fixed frame, the upper side of the fixed frame is fixedly connected with a plurality of first air cylinders, the output end of a plurality of first air cylinders is extended to the inside of fixed frame, the upper side of the burner is fixedly connected with the output end of each first air cylinder, the inside of the base is provided with equipment bin, the inside of the equipment bin is installed with adsorption fixer, the side surface close to adsorption fixer in the base is installed with suspension frame, the inside of the suspension frame is hung with chip rack, the chip rack in the utility model is provided with the chip groove of round table shape, so that the chip can be conveniently preliminarily limited, and it is simple to take, and simultaneously, the chip rack can be hung on the suspension frame through connecting rod, so that the chip can be conveniently fixed with the device.

[0004] The existing integrated circuit chip burning device lacks voltage monitoring mechanism during use, which means that voltage change cannot be monitored in real time, so that voltage anomaly cannot be found in time, which will lead to integrated circuit chip burning failure or chip performance damage, and the integrated circuit chip burning device in the above comparative case also lacks voltage monitoring mechanism, so that voltage cannot be monitored in real time for a long time, and some potential voltage problems are ignored during burning process, which will be exposed in subsequent test or use, and will lead to product failure rate increase.

[0005] Therefore, it is necessary to invent an integrated circuit chip burning device with voltage monitoring mechanism to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model discloses a purpose provides a kind of integrated circuit chip burning device with voltage monitoring mechanism, and the integrated circuit chip burning device is equipped with voltage monitoring mechanism by burner station, voltage monitoring point, voltage sensor, first voltage monitor, second voltage monitor and power point probe head, so accurate control voltage in burning process can be carried out, ensure that each chip is burned under the condition of same voltage, to improve the consistency and quality of product, and double voltage monitoring, help to reduce the defective rate caused by voltage problem, improve production efficiency and product qualification rate, so that voltage monitoring mechanism and burner station are closely combined under long-term use, realize automatic monitoring, without manual intervention, to improve the degree of automation of production process and the effect of efficiency, to solve the integrated circuit chip burning device in prior art in use process, because in the burning process, the stability of voltage is crucial to the performance and reliability of integrated circuit chip, lack of voltage monitoring mechanism means that voltage change cannot be monitored in real time, so voltage anomaly cannot be discovered in time, this can lead to integrated circuit chip burning failure or chip performance damage, and the integrated circuit chip burning device in the above comparative case also lacks voltage monitoring mechanism, so that voltage cannot be monitored in real time under long-term use, and some potential voltage problems are also ignored in the burning process, these problems are exposed in subsequent test or use, and can lead to the problem of increasing product defective rate.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: an integrated circuit chip burning device with a voltage monitoring mechanism, comprising a burning machine body, a main body for integrated circuit chip burning;

[0008] A display controller is arranged in front of the burning machine body for viewing the integrated circuit chip burning condition, and a burning table is fixedly installed above the burning machine body, a burning rack is fixedly installed above the burning table, a burner station is arranged in the burning rack, a voltage monitoring point is fixedly installed in the burner station, a first external wire is fixedly connected to the outside of the voltage monitoring point, a voltage sensor is fixedly installed at the other end of the first external wire, a second external wire is fixedly installed outside the voltage sensor, and a first voltage monitor is fixedly connected to the other end of the second external wire.

[0009] A portal frame is arranged outside the burning machine body for secondary voltage monitoring of the integrated circuit chip, and a second electric sliding rail is arranged outside the portal frame, a second electric sliding sleeve is movably connected to the outside of the second electric sliding rail, a second telescopic air cylinder is fixedly installed outside the second electric sliding sleeve, a second voltage monitor is fixedly installed at the bottom end of the second telescopic air cylinder, and a power point probe head is fixedly installed at the bottom of the second voltage monitor.

[0010] Preferably, the external part of the burning machine body is fixedly installed with a feeding table, and the upper part of the feeding table is provided with a feeding electric slide rail.

[0011] Preferably, the external part of the feeding electric slide rail is movably connected with a feeding electric slide sleeve, and the upper part of the feeding electric slide sleeve is fixedly installed with a dust collection circuit chip box.

[0012] Preferably, the back part of the burning machine body is provided with a material taking and placing back plate, the external part of the material taking and placing back plate is provided with a first electric slide rail, the external part of the first electric slide rail is movably connected with a first electric slide sleeve, and the external part of the first electric slide sleeve is fixedly installed with a horizontal rack plate.

[0013] Preferably, the upper part of the horizontal rack plate is fixedly installed with a first telescopic air cylinder, the bottom end of the first telescopic air cylinder is fixedly installed with a pneumatic material taking and placing head, the bottom part of the pneumatic material taking and placing head is fixedly installed with a pneumatic suction cup, and the upper part of the horizontal rack plate is fixedly installed with a vacuum air pump.

[0014] Preferably, the second voltage monitor is movably connected with the gantry, and the second telescopic air cylinder is vertically distributed with the second voltage monitor.

[0015] In the above technical scheme, the technical effects and advantages of the present application are provided.

[0016] The burning device is provided with a burner station, a voltage monitoring point, a voltage sensor, a first voltage monitor, a second voltage monitor and a power point measuring head. When the integrated circuit chip is placed in the burner station for burning, the voltage monitoring point in the burner station transmits the voltage condition of the integrated circuit chip to the voltage sensor through the first external wire, and then transmits the voltage condition to the first voltage monitor. Then, before taking the material after the integrated circuit chip is burned, the second voltage monitor and the power point measuring head are driven by the gantry to come to the upper part of the integrated circuit chip in the burner station to measure the integrated circuit chip, so as to complete the voltage monitoring work twice. The integrated circuit chip burning device has a voltage monitoring mechanism, which can accurately control the voltage in the burning process, ensure that each chip is burned under the same voltage condition, improve the consistency and quality of the product, and reduce the defective rate caused by the voltage problem, improve the production efficiency and product qualification rate. The voltage monitoring mechanism and the burner station are closely combined for long-term use, automatic monitoring is realized, manual intervention is not needed, and the automation degree and efficiency of the production process are improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only represent some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the feeding table structure of the utility model;

[0020] Figure 3 It is a schematic diagram of the burning frame structure of the utility model;

[0021] Figure 4 It is a schematic diagram of the material taking and placing backboard structure of the utility model;

[0022] Figure 5 It is a schematic diagram of the gantry structure of the utility model.

[0023] Explanation of reference signs:

[0024] 1, burning machine body; 2, display controller; 3, feeding table; 4, feeding electric slide rail; 5, feeding electric sliding sleeve; 6, dust collection circuit chip box; 7, burning table; 8, burning frame; 9, burner station; 10, voltage monitoring point; 11, first external line; 12, voltage sensor; 13, second external line; 14, first voltage monitor; 15, material taking and placing backboard; 16, first electric slide rail; 17, first electric sliding sleeve; 18, cross frame plate; 19, first telescopic air cylinder; 20, pneumatic material taking and placing head; 21, pneumatic suction cup; 22, vacuum air pump; 23, gantry; 24, second electric slide rail; 25, second electric sliding sleeve; 26, second telescopic air cylinder; 27, second voltage monitor; 28, power point measuring head. DETAILED DESCRIPTION

[0025] In order to make those skilled in the art better understand the technical solutions of the utility model, the utility model will be further described in detail in combination with the drawings.

[0026] The utility model provides a kind of integrated circuit chip burning device with voltage monitoring mechanism as shown in Figures 1-5 It includes burning machine body 1, the main body for integrated circuit chip burning;

[0027] The display controller 2 is arranged in front of the burning machine body 1, and is used for checking the burning situation of the integrated circuit chip. The burning machine body 1 is fixedly installed with a burning table 7. The burning table 7 is fixedly installed with a burning frame 8. The burning frame 8 is internally provided with a burner station 9. The burner station 9 is fixedly installed with a voltage monitoring point 10. The voltage monitoring point 10 is fixedly connected with a first external wire 11. The other end of the first external wire 11 is fixedly installed with a voltage sensor 12. The voltage sensor 12 is externally fixedly installed with a second external wire 13. The other end of the second external wire 13 is fixedly connected with a first voltage monitor 14.

[0028] The gantry 23 is arranged outside the burning machine body 1, and is used for secondary voltage monitoring of the integrated circuit chip. The gantry 23 is externally provided with a second electric sliding rail 24. The second electric sliding rail 24 is movably connected with a second electric sliding sleeve 25. The second electric sliding sleeve 25 is fixedly installed with a second telescopic air cylinder 26. The bottom end of the second telescopic air cylinder 26 is fixedly installed with a second voltage monitor 27. The bottom of the second voltage monitor 27 is fixedly installed with a power point probe 28. After the integrated circuit chip is burned, the second voltage monitor 27 and the power point probe 28 are driven by the gantry 23 to come to the top of the integrated circuit chip in the burner station 9, and then the integrated circuit chip is measured, so that the voltage monitoring work is completed twice.

[0029] As shown in Figure 1 , Figure 2 and Figure 3 , the burning machine body 1 is externally fixedly installed with a feeding table 3. The feeding table 3 is externally provided with a feeding electric sliding rail 4. The feeding table 3 is used for assisting the burning machine body 1 to feed, so as to speed up the entire integrated circuit chip burning process. The feeding electric sliding rail 4 is movably connected with a feeding electric sliding sleeve 5. The feeding electric sliding sleeve 5 is fixedly installed with a dust collection integrated circuit chip box 6. The dust collection integrated circuit chip box 6 can store the integrated circuit chips to be burned and the integrated circuit chips after being burned.

[0030] As shown in Figure 1 , Figure 4 and Figure 5As shown, the back of the burner body 1 is provided with a material taking and placing back plate 15, the outside of the material taking and placing back plate 15 is provided with a first electric sliding rail 16, the outside of the first electric sliding rail 16 is movably connected with a first electric sliding sleeve 17, the outside of the first electric sliding sleeve 17 is fixedly installed with a horizontal rack plate 18, the first electric sliding rail 16 and the first electric sliding sleeve 17 are used to drive the pneumatic suction cup 21 to move left and right so as to complete the integrated circuit chip taking and placing operation, the top of the horizontal rack plate 18 is fixedly installed with a first telescopic air cylinder 19, the bottom end of the first telescopic air cylinder 19 is fixedly installed with a pneumatic material taking and placing head 20, the bottom of the pneumatic material taking and placing head 20 is fixedly installed with the pneumatic suction cup 21, the top of the horizontal rack plate 18 is fixedly installed with a vacuum air pump 22, the pneumatic suction cup 21 is given a certain suction force through the vacuum air pump 22, so as to conveniently pneumatically suck the integrated circuit chip, complete the integrated circuit chip taking and placing operation, the second voltage monitor 27 is movably connected with a gantry 23, the second telescopic air cylinder 26 and the second voltage monitor 27 are vertically distributed, the structure of the gantry 23 is simple and easy to operate, and the maintenance personnel can conveniently maintain in time when a fault occurs.

[0031] The utility model discloses a kind of integrated circuit chip burning devices with voltage monitoring mechanism, including display controller 2, burner body 1, voltage sensor 12, first voltage monitor 14, first external line 11, voltage monitoring point 10, first electric sliding rail 16, first electric sliding sleeve 17, horizontal rack plate 18, first telescopic cylinder 19, vacuum air pump 22, pneumatic pick-and-place head 20, second voltage monitor 27, power point probe 28, second electric sliding rail 24, second electric sliding sleeve 25, gantry 23, pick-and-place backboard 15, pick-and-place electric sliding rail 4, pick-and-place electric sliding sleeve 5, loading table 3, dust collection circuit chip box 6 and burning table 7, its working principle is as follows: first, connect external power supply, place appropriate amount of integrated circuit chip in dust collection circuit chip box 6 of loading table 3, then open the switch of pick-and-place electric sliding rail 4, let pick-and-place electric sliding rail 4 and pick-and-place electric sliding sleeve 5 drive dust collection circuit chip box 6 to move to the left side of burning table 7, then open the switch of first electric sliding rail 16 on pick-and-place backboard 15, first electric sliding rail 16 and first electric sliding sleeve 17 drive horizontal rack plate 18 to move to the left side, when pneumatic pick-and-place head 20 moves above dust collection circuit chip box 6, then open the switch of first telescopic cylinder 19, lower pneumatic pick-and-place head 20, open the switch of vacuum air pump 22, let vacuum air pump 22 give pneumatic suction cup 21 certain suction, to facilitate pneumatic suction integrated circuit chip, complete integrated circuit chip pick-and-place operation, in this way, after suction integrated circuit chip, according to the above operation, place integrated circuit chip in burner station 9 of burning rack 8, can start integrated circuit chip burning work, when circuit chip is placed in burner station 9 and is burned, voltage monitoring point 10 inside burner station 9 will transmit integrated circuit chip voltage condition to voltage sensor 12 by first external line 11, then by voltage sensor 12 transmission to first voltage monitor 14, then before pick-and-place after integrated circuit chip burning is completed, by second electric sliding rail 24 and second electric sliding sleeve 25 on gantry 23 drive second voltage monitor 27 and power point probe 28 to come to the above integrated circuit chip in burner station 9 and carry out a point measurement to integrated circuit chip, to complete two times voltage monitoring work, then voltage monitoring data will be displayed on display controller 2 of burner body 1, in this way, to facilitate external operator to watch, and in this way, also let the integrated circuit chip burning device have voltage monitoring mechanism, can accurately control voltage in burning process, ensure that each chip is burned under the condition of same voltage, to improve product consistency and quality, simultaneously double voltage monitoring, help to reduce the defective rate caused by voltage problem, improve production efficiency and product qualification rate, finally, after completing integrated circuit chip burning device installation and use etc.

[0032] The above only describes certain exemplary embodiments of the utility model in a manner of illustration, without doubt, for ordinary skilled person in the art, under the condition that deviating from the spirit and scope of the utility model, the described embodiments can be modified in various different ways. Therefore, the above drawing and description are illustrative in nature, and should not be understood as limiting the scope of protection claimed by the utility model.

Claims

1. An integrated circuit chip burning apparatus having a voltage monitoring mechanism, characterized by comprising: The utility model relates to a kind of integrated circuit chip burning machine, including Burner body (1) for integrated circuit chip burning main body; Display controller (2) is arranged at the front of including burner body (1), for viewing integrated circuit chip burning situation, and burner body (1) is fixedly installed with burning table (7) above, the burning table (7) is fixedly installed with burning frame (8) above, the inside of the burning frame (8) is provided with burner station (9), the inside of the burner station (9) is fixedly installed with voltage monitoring point (10), the outside of the voltage monitoring point (10) is fixedly connected with first external line (11), the other end of the first external line (11) is fixedly installed with voltage sensor (12), the outside of the voltage sensor (12) is fixedly installed with second external line (13), the other end of the second external line (13) is fixedly connected with first voltage monitor (14); Portal frame (23) is arranged at the outside of burner body (1), for integrated circuit chip secondary voltage monitoring, and portal frame (23) is provided with second electric slide rail (24) outside, the second electric slide rail (24) is movably connected with second electric sliding sleeve (25) outside, the second electric sliding sleeve (25) is fixedly installed with second telescopic cylinder (26) outside, the bottom of the second telescopic cylinder (26) is fixedly installed with second voltage monitor (27), the bottom of the second voltage monitor (27) is fixedly installed with power point probe (28).

2. The integrated circuit chip burning apparatus having a voltage monitoring mechanism according to claim 1, characterized by: The outside of the burner body (1) is fixedly installed with feeding table (3), and the upper side of the feeding table (3) is provided with feeding electric slide rail (4).

3. The integrated circuit chip burning apparatus having a voltage monitoring mechanism according to claim 2, wherein: The outside of the feeding electric slide rail (4) is movably connected with feeding electric sliding sleeve (5), and the upper side of the feeding electric sliding sleeve (5) is fixedly installed with dust collection integrated circuit chip box (6).

4. The integrated circuit chip burning apparatus having a voltage monitoring mechanism according to claim 1, wherein: The back of the burner body (1) is provided with pick-and-place back plate (15), and the outside of the pick-and-place back plate (15) is provided with first electric slide rail (16), and the outside of the first electric slide rail (16) is movably connected with first electric sliding sleeve (17), and the outside of the first electric sliding sleeve (17) is fixedly installed with cross frame plate (18).

5. The integrated circuit chip burning apparatus having a voltage monitoring mechanism according to claim 4, wherein: The bottom of the first telescopic cylinder (19) is fixedly installed with pneumatic pick-and-place head (20), and the bottom of the pneumatic pick-and-place head (20) is fixedly installed with pneumatic suction cup (21), and the upper side of the cross frame plate (18) is fixedly installed with vacuum air pump (22).

6. The integrated circuit chip burning apparatus having a voltage monitoring mechanism according to claim 1, wherein: The second voltage monitor (27) is movably connected with the portal frame (23), and the second telescopic cylinder (26) and the second voltage monitor (27) are vertically distributed.

Citation Information

Patent Citations

  • IC chip burning device

    CN215576578U

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