Demux component high-temperature test platform and device

Abstract

The utility model provides a demux assembly high temperature test platform and device, the demux assembly high temperature test platform comprises a heating seat capable of heating and a support assembly, the surface of the heating seat is provided with a placing position used for placing an awg chip; and the support assembly is used for providing support for the adapter, so that the debux assembly keeps the adapter at a certain height in the test process. According to the scheme, the problems that in the prior art, when an oven is used for creating a high-temperature testing environment, a demux assembly and a PD need to be fed into the oven after being aligned in position, the PD alignment precision is low, and carrying is troublesome are solved; the support assembly can provide support for the adapter of the demux assembly so as to prevent the optical fiber from being damaged when the adapter drives the optical fiber to bend under the action of gravity.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical module testing device technical field especially, it relates to a demux subassembly high temperature test platform and device. BACKGROUND

[0002] Wavelength division multiplexing technology is widely used in high-speed optical module, and multi-channel optical signals are transmitted through an optical fiber, which greatly expands the transmission capacity of a single optical fiber and saves optical fiber resources. The commonly used demux subassembly is made of an awg chip coupled with an FA subassembly, which is commonly used in the optical receiving end of the optical module. A four-channel signal of an optical fiber is divided into four channels by the demux subassembly and enters the module for signal reception and processing.

[0003] The optical module has a specific operating temperature range according to its application scenario. The high-temperature performance of the demux subassembly, including wavelength drift with temperature and waveguide position offset at high temperature, affects the performance of the demux subassembly in the optical module.

[0004] The existing demux subassembly needs to be aligned with the PD in position before being sent into the oven to achieve a high-temperature environment during high-temperature performance testing. The device may shake when being sent into the oven, which affects the alignment accuracy of the PD and makes handling difficult, and the efficiency is low. UTILITY MODEL CONTENT

[0005] Based on the problems existing in the prior art, the utility model aims to solve the technical problems of affecting the alignment accuracy of the PD and handling difficulty when testing the high-temperature performance of the demux subassembly in the prior art.

[0006] The utility model provides a kind of demux subassembly high temperature test platform, and demux subassembly includes sequentially fixed connection awg chip, crystal head, optical fiber and adapter, and it includes:

[0007] Heatable heating seat, the surface of the heating seat is formed with placement site for placing the awg chip;

[0008] Supporting assembly is used to support the adapter to keep the adapter at a certain height during testing.

[0009] According to an embodiment of the utility model, the heating seat includes:

[0010] Heat-conducting seat;

[0011] Heating element is inserted into the heat-conducting seat to heat the heat-conducting seat;

[0012] A support block is fixed to the upper surface of the heat-conducting seat, and the top end of the support block forms the placement site; a negative pressure channel is formed in the heat-conducting seat and the support block, one end of the negative pressure channel is connected to the placement site, and the other end is connected to an external negative pressure generating device.

[0013] According to an embodiment of the present application, a limiting protrusion protruding from the upper surface of the top end of the support block is formed on one side of the top end of the support block, and the limiting protrusion is used for limiting the head of the awg chip in the placement site.

[0014] According to an embodiment of the present application, the demux component high-temperature test platform further comprises two limiting blocks oppositely arranged on the upper surface of the heat-conducting seat and respectively located on both sides of the support block, and the two limiting blocks and the limiting protrusion jointly form the placement site.

[0015] According to an embodiment of the present application, the distance between the two limiting blocks is adjustable.

[0016] According to an embodiment of the present application, the demux component high-temperature test platform further comprises a trachea adapter fixedly connected to the end of the negative pressure channel away from the placement site, and the trachea adapter is used for being connected to an external negative pressure generating device through a pipeline.

[0017] According to an embodiment of the present application, the heating element and the trachea adapter are both arranged at the end of the heat-conducting seat away from the support assembly.

[0018] According to an embodiment of the present application, the demux component high-temperature test platform further comprises a lower heat insulation plate and a side heat insulation plate, the lower heat insulation plate is detachably fixedly arranged at the bottom of the heat-conducting seat, and the side heat insulation plate is detachably fixedly arranged at the end of the heat-conducting seat close to the support assembly.

[0019] According to an embodiment of the present application, the support assembly comprises a fixing seat and a support arm fixedly connected to the fixing seat, and the support arm is formed with a groove for placing the adapter at the end away from the fixing seat.

[0020] The utility model also provides a demux component high-temperature test device which comprises:

[0021] The demux component high-temperature test platform;

[0022] A PD test assembly is used for testing the awg chip in the placement site.

[0023] The demux component high-temperature test platform and device provided by the utility model have the following beneficial effects:

[0024] (1) the heating seat can provide an open high temperature environment for high temperature test of the demux assembly, so that the awg chip of the demux assembly can be directly detected, and the problems of PD alignment accuracy and handling trouble caused by the need of position alignment of the demux assembly and the PD before being sent into the oven when the oven is used to create a high temperature test environment in the prior art are solved.

[0025] (2) the support assembly can provide support for the adapter of the demux assembly, so as to avoid damage to the optical fiber caused by the bending of the optical fiber when the adapter is driven by gravity. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0027] Figure 1 It is a structural schematic diagram of a demux assembly.

[0028] Figure 2 It is a structural schematic diagram of a demux assembly high temperature test platform provided by an embodiment of the utility model.

[0029] Figure 3 It is a schematic diagram of the positional relationship of the heating seat, the limiting block and the air pipe adapter in the embodiment of the utility model.

[0030] Figure 4 It is a structural schematic diagram of a demux assembly high temperature test device provided by an embodiment of the utility model.

[0031] The drawings show that: 100-demux assembly; 101-awg chip; 102-crystal head; 103-optical fiber; 104-adapter; 1-heating seat; 10-placing position; 11-heat conduction seat; 111-negative pressure channel; 12-heating element; 13-supporting block; 130-limiting protrusion; 2-limiting block; 3-air pipe adapter; 4-supporting assembly; 41-fixing seat; 42-supporting arm; 420-groove; 5-lower heat insulation plate; 6-lateral heat insulation plate; 61-first heat insulation plate; 62-second heat insulation plate; 7-temperature sensing element; 200-PD test assembly; 300-moving mechanism; 400-fixing frame; 500-mounting plate; 501-through hole; 502-tightening screw; 600-XYZ three-axis sliding table. DETAILED DESCRIPTION

[0032] The following description of the embodiments is made with reference to the accompanying drawings, which illustrate specific embodiments in which the present application can be practiced.

[0033] The demux assembly high-temperature test platform provided by the present application comprises a heatable heating seat and a support assembly. Figure 1 As shown in FIG. 1, which is a structural schematic diagram of a demux assembly 100, the demux assembly 100 comprises an awg chip 101, a crystal head 102, an optical fiber 103 and an adapter 104 fixedly connected in sequence. Figure 2 As shown in FIG. 2, which is a structural schematic diagram of a demux assembly high-temperature test platform, the demux assembly high-temperature test platform comprises a heatable heating seat 1 and a support assembly 4.

[0034] In the present application, the heating seat 1 can directly heat the awg chip 101 of the demux assembly 100 placed in the placement site 10 to provide an open high-temperature test environment, so that the awg chip 101 in the placement site 10 can be subjected to high-temperature detection by a relevant detection instrument (such as a PD, Power Delivery). Compared with the prior art, which creates a high-temperature test environment by using an oven, the present application does not need to move and transfer relevant devices after positioning the awg chip 101, so there is no problem of PD alignment accuracy and handling, and the detection efficiency is higher. The support assembly 4 can provide support for the adapter 104 of the demux assembly 100 to avoid damage to the optical fiber 103 when the adapter 104 is bent by gravity.

[0035] Please refer to Figure 3 Specifically, the heating seat 1 comprises a heat-conducting seat 11, a heating element 12 and a support block 13. The heating element 12 is inserted into the heat-conducting seat 11 to heat the heat-conducting seat 11. Specifically, the heating element 12 can be an electric heating rod. The support block 13 is fixed to the upper surface of the heat-conducting seat 11, and the top end of the support block 13 forms the placement site 10. In order to achieve negative pressure adsorption positioning of the awg chip 101 placed in the placement site 10, a negative pressure channel 111 is formed in the heat-conducting seat 11 and the support block 13. One end of the negative pressure channel 111 leads to the placement site 10, and the other end communicates with an external negative pressure generating device. In particular, the support block 13 is integrally formed on the upper surface of the heat-conducting seat 11 to improve the heat conduction efficiency between the heat-conducting seat 11 and the support block 13.

[0036] It is easy to understand that the awg chip 101 is positioned in the placement site 10 based on the negative pressure adsorption principle, which can avoid the awg chip 101 from being pulled out of the placement site 10 due to the gravity of the optical fiber 103 and the adapter 104, and has good positioning effect and does not affect the detection of the awg chip 101.

[0037] Further, in order to improve the adsorption and positioning effect of the awg chip 101 at the placement site 10, the negative pressure channel 111 has a waist-shaped hole at one end close to the placement site 10, which is more suitable for the awg chip 101 in strip shape, thereby improving the adsorption and positioning effect of the awg chip 101.

[0038] In the embodiment, the demux component high-temperature test platform further comprises a temperature sensing element 7 for monitoring the temperature of the heat-conducting seat 11. Specifically, the temperature sensing element 7 can be a thermistor. Preferably, the temperature sensing element 7 and the heating element 12 are respectively electrically connected to an external temperature controller. The temperature controller adjusts the on-off of the heating element 12 in real time according to the temperature of the heat-conducting seat 11 measured by the temperature sensing element 7, so that the temperature of the heat-conducting seat 11 can be maintained at a relatively constant temperature value.

[0039] Further, the top end of the support block 13 is formed with a limiting protrusion 130 protruding from the upper surface thereof, which is used for limiting the head of the awg chip 101 in the placement site 10. Preferably, in order to improve the positioning accuracy of the limiting protrusion 130 on the head of the awg chip 101, the working surface (the surface on the side facing the placement site 10) of the limiting protrusion 130 is shaped to match the shape of the head of the awg chip 101.

[0040] Further, the demux component high-temperature test platform further comprises two limiting blocks 2 oppositely arranged on the upper surface of the heat-conducting seat 11 and respectively located on both sides of the support block 13, and the two limiting blocks 2 and the limiting protrusion 130 jointly form the placement site 10.

[0041] It can be understood that the two limiting blocks 2 can limit the awg chip 101 in the placement site 10 from both sides, thereby forming a three-sided limiting structure together with the limiting protrusion 130, which can improve the positioning accuracy of the awg chip 101; during multiple measurements, the position of the awg chip 101 can be repeatedly placed with high repeatability, thereby ensuring the consistency of the placement position of the awg chip 101.

[0042] Preferably, in order to improve the positioning accuracy of the limiting block 2 to the awg chip 101, the working surface (the surface facing the placing position 10 side) of the limiting block 2 is matched with the shape of the outer wall of the awg chip 101.

[0043] More preferably, in order to be compatible with awg chips 101 of various width sizes, the distance between the two limiting blocks 2 is adjustable; specifically, the two limiting blocks 2 are detachably fixed on the upper surface of the heat-conducting seat 11, and as a specific embodiment, the limiting block 2 is adjustably arranged on the upper surface of the heat-conducting seat 11 by screws.

[0044] In this embodiment, in order to facilitate the communication between the negative pressure channel 111 and the external negative pressure generating device, the demux component high-temperature test platform further comprises a gas pipe adapter 3 fixedly connected to the end of the negative pressure channel 111 away from the placing position 10, which is used to communicate with the external negative pressure generating device through a pipeline, and the connection or disconnection with the pipeline is relatively convenient.

[0045] Specifically, the support assembly 4 comprises a fixed seat 41 and a support arm 42 fixedly connected to the fixed seat 41, and the end of the support arm 42 away from the fixed seat 41 forms a groove 420 for placing the adapter 104. It should be noted that the support assembly 4 is provided with the fixed seat 41 and the support arm 42 fixedly connected to the fixed seat 41, which is only a preferred embodiment in this scheme. In other embodiments, the support assembly 4 can also be provided with other structures, such as a support seat spaced apart from the heat-conducting seat 11, and the top of the support seat can provide support for the adapter 104 of the demux component 100.

[0046] Preferably, in order to adapt to demux components 100 of various length sizes, the distance between the support assembly 4 and the heating seat 1 is adjustable, and / or the support arm 42 is a telescopic support arm.

[0047] In this embodiment, the heating element 12 and the gas pipe adapter 3 are arranged at the end of the heat-conducting seat 11 away from the support assembly 4.

[0048] It can be understood that, since the demux component 100 needs to be taken and placed between the support assembly 4 and the placing position 10 of the heat-conducting seat 11 during detection, arranging the heating element 12 and the gas pipe adapter 3 at the end of the heat-conducting seat 11 away from the support assembly 4 can prevent the cables connected to the heating element 12 or the gas pipe adapter 3 from interfering with the taking and placing operation of the demux component 100.

[0049] Further, the demux component high temperature test platform further comprises a lower heat insulation plate 5 and a side heat insulation plate 6, the lower heat insulation plate 5 is detachably fixed at the bottom of the heat conduction seat 11, and the side heat insulation plate 6 is detachably fixed at one end of the heat conduction seat 11 close to the support assembly 4.

[0050] Generally, the heat conduction seat 11 is fixed on a workbench, by fixing the lower heat insulation plate 5 at the bottom of the heat conduction seat 11, the heat transferred from the heat conduction seat 11 to the workbench can be reduced or cut off; by fixing the side heat insulation plate 6 at one end of the heat conduction seat 11 close to the support assembly 4, the scalding accident caused by accidentally touching the heat conduction seat 11 when taking and placing the demux component 100 can be avoided.

[0051] Further, the side heat insulation plate 6 comprises a first heat insulation plate 61 and a second heat insulation plate 62, and the first heat insulation plate 61 and the second heat insulation plate 62 are fixed at one end of the heat conduction seat 11 close to the support assembly 4 in sequence. It can be understood that the first heat insulation plate 61 can reduce or cut off the heat of the heat conduction seat 11 from being transmitted to the second heat insulation plate 62, so that the temperature of the second heat insulation plate 62 can be maintained at room temperature, thereby preventing the occurrence of scalding accidents when taking and placing the demux component 100, and improving the safety performance. Preferably, the first heat insulation plate 61 is a ceramic fiber plate, and the materials of the lower heat insulation plate 5 and the second heat insulation plate 62 are ceramic materials.

[0052] The utility model also provides a kind of demux component high temperature test device, its structure as Figure 4 Shown, including the demux component high temperature test platform and PD test assembly 200, wherein, the PD test assembly 200 is used to test the awg chip 101 in the placement site 10.

[0053] In the embodiment, the demux component high temperature test device further comprises a moving mechanism 300 for moving the PD test assembly 200 towards the placement site 10 to test the awg chip 101 placed in the placement site 10.

[0054] Specifically, the moving mechanism 300 is a lifting driving element for driving the PD test assembly 200 to approach or move away from the placement position 10 in the vertical direction, preferably, the lifting driving element is a linear cylinder, and the linear cylinder is provided with a manual valve (not shown in the figure), and the manual valve is actuated to realize the up-down movement of the PD test assembly 200 driven by the linear cylinder. Further, the demux assembly high-temperature test device further comprises a fixing frame 400 and a mounting plate 500, the lifting driving element is detachably fixed on the fixing frame 400, and the mounting plate 500 is fixedly connected with the output end of the lifting driving element, and the PD test assembly 200 is detachably arranged on the mounting plate 500.

[0055] Preferably, the mounting plate 500 is provided with a through hole 501, and a plurality of clamping screws 502 are arranged on the circumferential side wall of the through hole 501, and the PD test assembly 200 is arranged in the through hole 501 and fixed by the clamping screws 502.

[0056] Further, the mounting plate 500 is an inclined plate, so that the awg chip 101 has better light when being tested.

[0057] Further, the demux assembly high-temperature test device further comprises an XYZ three-axis sliding table 600, and the heating seat 1 is fixedly arranged on the XYZ three-axis sliding table 600, and the XYZ three-axis sliding table 600 can adjust the position of the heating seat 1, so that the awg chip 101 in the placement position 10 is aligned with the PD test assembly 200.

[0058] In order to facilitate the understanding of the scheme, the following will be combined with Figures 1-4 The working principle of the utility model will be described in detail:

[0059] Step 1, adjust the positions of the two limiting blocks 2 on the upper surface of the heat-conducting seat 11, so that the distance between the two limiting blocks 2 matches the width of the awg chip 101 of the demux assembly 100 to be detected.

[0060] Step 2, place the awg chip 101 of the demux assembly 100 to be detected in the placement position 10, and place the adapter 104 of the demux assembly 100 in the groove 420 of the support arm 42, at this time, the demux assembly 100 is placed across the placement position 10 and the groove 420; the external negative pressure generating device draws negative pressure on the negative pressure channel 111 through the air pipe adapter 3, so that the awg chip 101 is adsorbed and positioned in the placement position 10.

[0061] Step 3, the heating element 12 is started to heat the heat-conducting seat 11, the heat-conducting seat 11 can conduct heat to the awg chip 101, and the temperature sensing element 7 monitors the temperature of the heat-conducting seat 11 in real time, when the monitoring value of the temperature sensing element 7 reaches the preset temperature value, the heating element 12 stops heating the heat-conducting seat 11, and the heat-conducting seat 11 is kept at the temperature.

[0062] Step 4, the lifting drive is started to drive the PD test assembly 200 to descend a certain height until the PD test assembly 200 is aligned with the awg chip 101 in the placement position 10, and the awg chip 101 can be tested.

[0063] Step 5, after the test is completed, the lifting drive is controlled to drive the PD test assembly 200 to rise to the initial position, and the demux assembly 100 after the test is removed.

[0064] In summary, the demux assembly high-temperature test platform and device provided by the utility model can provide an open high-temperature environment for high-temperature test of the demux assembly 100, so that the awg chip 101 of the demux assembly 100 can be directly detected, and the problems of PD alignment accuracy and handling inconvenience caused by the need to align the demux assembly and the PD in position and then send them into an oven in the prior art are solved; in addition, the support assembly 4 can provide support for the adapter 104 of the demux assembly 100, so as to avoid damage to the optical fiber 103 caused by bending of the optical fiber 103 due to gravity of the adapter 104.

[0065] It should be noted that although the utility model is disclosed as above with specific embodiments, the above embodiments are not used to limit the utility model, and those skilled in the art can make various changes and decorations without departing from the spirit and scope of the utility model, therefore the protection scope of the utility model is defined by the claim.

Claims

1. A high-temperature testing platform for a demux component, wherein the demux component (100) comprises an AWG chip (101), a crystal head (102), an optical fiber (103), and an adapter (104) connected in sequence, characterized in that, include: A heatable heating base (1) has a placement position (10) formed on its surface for placing the AWG chip (101). A support component (4) is provided to support the adapter (104) so ​​that the demux component (100) holds the adapter (104) at a certain height during testing.

2. The high-temperature testing platform for demux components according to claim 1, characterized in that, The heating base (1) includes: Heat-conducting seat (11); A heating element (12) is inserted into the heat-conducting base (11) to heat the heat-conducting base (11). A support block (13) is fixed to the upper surface of the heat-conducting base (11), and the top of the support block (13) forms the placement position (10). A negative pressure channel (111) is provided in the heat-conducting base (11) and the support block (13). One end of the negative pressure channel (111) leads to the placement position (10), and the other end is connected to an external negative pressure generating device.

3. The high-temperature testing platform for demux components according to claim 2, characterized in that, The support block (13) has a limiting protrusion (130) protruding from its upper surface on one side of its top end. The limiting protrusion (130) is used to limit the head of the AWG chip (101) in the placement position (10).

4. The high-temperature testing platform for demux components according to claim 3, characterized in that, It also includes two limiting blocks (2) that are disposed opposite to each other on the upper surface of the heat-conducting base (11) and located on both sides of the support block (13). The two limiting blocks (2) and the limiting protrusion (130) together form the placement position (10).

5. A high-temperature testing platform for demux components according to claim 4, characterized in that, The distance between the two limiting blocks (2) is adjustable.

6. The high-temperature testing platform for demux components according to claim 2, characterized in that, It also includes a tracheal adapter (3) that is fixedly connected to the end of the negative pressure channel (111) away from the placement position (10), the tracheal adapter (3) being used to communicate with an external negative pressure generating device through a pipeline.

7. A high-temperature testing platform for demux components according to claim 6, characterized in that, The heating element (12) and the air pipe adapter (3) are both located at the end of the heat-conducting base (11) away from the support assembly (4).

8. A high-temperature testing platform for demux components according to claim 2, characterized in that, It also includes a lower heat insulation plate (5) and a side heat insulation plate (6). The lower heat insulation plate (5) is detachably fixed to the bottom of the heat-conducting base (11), and the side heat insulation plate (6) is detachably fixed to one end of the heat-conducting base (11) near the support assembly (4).

9. A high-temperature testing platform for demux components according to claim 1, characterized in that, The support assembly (4) includes a fixed base (41) and a support arm (42) fixedly connected to the fixed base (41). The end of the support arm (42) away from the fixed base (41) has a groove (420) for placing the adapter (104).

10. A high-temperature testing device for demux components, characterized in that, include: The high-temperature testing platform for demux components as described in any one of claims 1 to 9; A PD test component (200) is used to test the AWG chip (101) in the placement position (10).

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