COF structure and display device

Abstract

The utility model provides a COF structure and a display device. The COF structure comprises a flexible thin film; the driving integrated circuit chip is arranged on the flexible thin film, and the wires are connected with the driving integrated circuit chip; the wires comprise first direction wires extending towards a first direction from the driving integrated circuit chip; the first direction wires comprise a plurality of first wires and a plurality of second wires; wherein the width of each first wire is larger than that of any second wire. According to the COF structure of the utility model, the first wire with a larger width is arranged in the COF structure, and therefore, the combination of pins with the same function or definition can be realized, the heat dissipation area of the wire can be increased, the heat conduction can be accelerated, and the heat dissipation efficiency of the COF structure can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of display, especially, a COF structure and display device including the COF structure. BACKGROUND

[0002] The main principle of COF (Chip on Film) technology in liquid crystal display (LCD) is to place a driver integrated circuit (Driver IC) chip into a flexible FPC (Flexible Printed Circuit) flat cable, and to fold the flat cable to the lower side of the screen by using the characteristics of the FPC itself. Compared with the traditional COG (Chip On Glass) technology, this technology can release the space occupied by the IC chip, thereby reducing the lower frame width by at least 1.5 mm, making the screen design more lightweight and compact. The use of COF technology can help improve the functionality, high packaging density, and lightweight and compactness of the product, thereby improving the added value of the product. However, during the use of COF, the Drive IC chip will generate heat to different degrees due to different driving pictures and power, and the increase in COF temperature will increase the risk of melting of the television frame, affecting the performance of the product. SUMMARY

[0003] To overcome at least one defect and deficiency in the prior art and improve the heat dissipation efficiency of the COF structure in the LCD, the utility model provides a COF structure and display device.

[0004] Specifically, the COF structure provided by the utility model comprises a flexible film, a drive integrated circuit chip arranged on the flexible film, and a trace connected to the drive integrated circuit chip; the trace comprises a first direction trace extending from the drive integrated circuit chip in a first direction; the first direction trace comprises a plurality of first traces and a plurality of second traces; and the width of each first trace is greater than the width of any second trace.

[0005] In an embodiment of the utility model, the drive integrated circuit chip comprises a plurality of pins arranged at intervals, the plurality of first traces comprises a target trace, the target trace is connected to a first pin of the plurality of pins, extends to a side of a second pin adjacent to the first pin, and is arranged at an interval from the second pin on the side of the second pin facing the first direction.

[0006] In an embodiment of the utility model, the width of each first trace is greater than or equal to the sum of the width of any two adjacent second traces and the interval between the two adjacent second traces.

[0007] In one embodiment of the utility model, the interval between any two adjacent first tracks is greater than the interval between any two adjacent second tracks.

[0008] In one embodiment of the utility model, the width of each first track is greater than or equal to 34μm.

[0009] In one embodiment of the utility model, the COF structure further comprises: a heat dissipation patch, covering one side of the driving integrated circuit chip away from the flexible film and covering part of the tracks.

[0010] In one embodiment of the utility model, the tracks further comprise second direction tracks extending from the driving integrated circuit chip towards a second direction, the first direction being opposite to the second direction; the second direction tracks comprise a plurality of third tracks and a plurality of fourth tracks, wherein the width of each third track is greater than the width of any fourth track.

[0011] The display device provided by the utility model comprises: a display panel, a COF structure connected with the display panel and a horizontal direction circuit board (XB board) connected with the COF structure; the COF structure comprises: a flexible film, a driving integrated circuit chip arranged on the flexible film and tracks connected with the driving integrated circuit chip; the tracks comprise first direction tracks and second direction tracks located on both sides of the driving integrated circuit chip; the first direction tracks are connected with the horizontal direction circuit board, and the second direction tracks are connected with the display panel; wherein the first direction tracks comprise a plurality of first tracks and a plurality of second tracks; the width of each first track is greater than the width of any second track.

[0012] In one embodiment of the utility model, the second direction tracks comprise a plurality of third tracks and a plurality of fourth tracks, wherein the width of each third track is greater than the width of any fourth track.

[0013] The utility model further provides a display device which comprises: a display panel, a COF structure connected with the display panel and a horizontal direction circuit board connected with the COF structure; the COF structure comprises: a flexible film, a driving integrated circuit chip arranged on the flexible film and tracks connected with the driving integrated circuit chip; the tracks comprise first direction tracks and second direction tracks located on both sides of the driving integrated circuit chip; the first direction tracks are connected with the horizontal direction circuit board, and the second direction tracks are connected with the display panel; wherein the second direction tracks comprise a plurality of third tracks and a plurality of fourth tracks; the width of each third track is greater than the width of any fourth track.

[0014] The above at least one technical solution has the following beneficial effects and advantages:

[0015] The embodiment of the utility model discloses the first trace of greater width in the COF structure, can realize the same function or the definition of the pin's merger, increases the trace heat dissipation area, speeds up the heat conduction, improves the heat dissipation efficiency of COF structure. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiment of the present application, the drawings needed in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0017] Figure 1 The utility model provides a COF structure's schematic diagram for embodiment.

[0018] Figure 2 Another scheme schematic diagram of COF structure is provided for the utility model embodiment.

[0019] Figure 3 Still another scheme schematic diagram of COF structure is provided for the utility model embodiment.

[0020] Figure 4 Still another scheme schematic diagram of COF structure is provided for the utility model embodiment.

[0021] Figure 5 The structure schematic diagram of a display device is provided for the utility model embodiment.

[0022] Figure 6 Another scheme structure schematic diagram of display device is provided for the utility model embodiment.

[0023] Figure 7 Still another scheme structure schematic diagram of display device is provided for the utility model embodiment.

[0024] Explanation of the drawings:

[0025] 1-COF structure, 2-display panel, 3-horizontal direction circuit board, 110-driving integrated circuit chip, 111-pin, 112-first pin, 113-second pin, 120-flexible film, 130-trace, 131-first direction trace, 132-second direction trace, 1311-first trace, 1312-second trace, 1313-target trace, 1321-third trace, 1322-fourth trace, 140-heat dissipation sticker. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments described in this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] In this embodiment of the invention, the use of terms such as "first" and "second" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0028] Example 1

[0029] like Figure 1 As shown, this embodiment provides a COF structure 1, including: a flexible thin film 120; a driver integrated circuit chip 110 disposed on the flexible thin film 120; and traces 130 connecting the driver integrated circuit chip 110. The traces 130 include first direction traces 131 extending from the driver integrated circuit chip in a first direction; the first direction traces 131 include multiple first traces 1311 and multiple second traces 1312. The width of each first trace 1311 is greater than the width of any second trace 1312. The first direction traces 131 can be input traces.

[0030] The flexible film 120 can be made of flexible polymer materials such as polyimide (PI) and polyester (PET), but this embodiment is not limited to these.

[0031] Furthermore, such as Figure 2 As shown, the driver integrated circuit chip 110 includes a plurality of pins 111 spaced apart. The plurality of first traces 1311 include a target trace 1313. The target trace 1313 connects to a first pin 112 among the plurality of pins 111 and extends towards a second pin 113 adjacent to the first pin 112, to the side of the second pin 113 facing the first direction, and is spaced apart from the second pin 113. The second pin 113 may be a non-signal pin. The target trace 1313 is not connected to the second pin 113. The target trace 1313 connected to the first pin 112 increases its linewidth by occupying the trace area of ​​the second pin 113.

[0032] Furthermore, in this embodiment, multiple pins with the same function or definition can be merged; correspondingly, the first trace 1311 can be formed by merging multiple traces; it can also be understood that the first trace 1311 can be connected to the merged pins; that is, the first trace 1311 can provide the conditions for merging multiple pins with the same function or definition. Specifically, the driver integrated circuit chip 110 may include multiple signal pins, power supply pins, ground pins, and non-signal pins; pins with the same definition or function among the signal pins are merged into a functional merged pin; pins with equal signal values ​​among the power supply pins are merged into a power supply merged pin; ground pins are merged into a ground merged pin; some of the non-signal pins are merged or reordered according to the above pin adjustment, and may be adjusted, for example, to power supply pins or pin areas through which a large current flows. For example, multiple power supply pins VDD with the same voltage of 12V can be merged into a power supply merged pin, and the traces connected to it can be as follows. Figure 1 The first trace shown is 1311, but a 12V VDD cannot be merged with a 3V VDD. Multiple ground pins VSS can be merged into a single ground merge pin, and the trace connected to it can be the first trace 1311. Non-signal pins (NC / dummy pins) can be adjusted to the appropriate position and merged, and the trace connected to them can be the first trace 1311. Signal pins with the same function, such as multiple reference voltages V... COM They can be combined into a single functional pin, and the connected trace can be the first trace 1311.

[0033] The width of each first trace 1311 is greater than or equal to the sum of the widths of any two adjacent second traces 1312 and the spacing between any two adjacent second traces 1312. Specifically, if the first trace 1311 is considered as a combination of multiple traces, then the width of each first trace 1311 is the product of the width of each combined trace and the number of combined traces, plus the sum of the spacing between the combined traces. The width and required spacing of the combined traces are similar to those of the second traces 1312; for example, the width of the second trace 1312 is generally 11-14 μm, and the spacing between two adjacent second traces 1312 is generally 12-15 μm. Taking two traces combined into one first trace 1311 as an example, the width of the first trace 1311 is approximately 34-43 μm. Therefore, the width of each first trace 1311 is greater than or equal to 34 μm.

[0034] Furthermore, the spacing between any two adjacent first traces 1311 is greater than the spacing between any two adjacent second traces 1312, in order to achieve better heat dissipation.

[0035] like Figure 4As shown, the trace 130 further includes a second-direction trace 132 extending from the driving integrated circuit chip 110 in a second direction opposite to the first direction, and the second-direction trace 132 can be an output trace; the second-direction trace 132 includes a plurality of third traces 1321 and a plurality of fourth traces 1322, wherein a width of each third trace 1321 is greater than a width of any fourth trace 1322.

[0036] Compared with the COF structure in the prior art, the embodiment can realize the reordering and merging of pins (PINs), increase the heat dissipation area of the COF trace, and achieve the effect of cooling the COF by increasing the width of part of the COF trace (i.e., providing the first trace 1311). It is verified by experiments that, under the same experimental conditions, the maximum temperature of the COF structure 1 provided by the embodiment is reduced by about 5°C compared with the COF structure in the prior art. The following is a temperature data table of the COF structure 1 of the embodiment and the COF structure in the prior art under the conditions of the same model, the same screen, the same lighting time, and the same temperature measuring instrument.

[0037] Table 1: Maximum temperature data table of the COF structure 1 of the embodiment and the COF structure in the prior art

[0038]

[0039] In some alternative embodiments, as shown in Figure 3 The COF structure 1 can further include a heat dissipation patch 140 covering one side of the driving integrated circuit chip 110 away from the flexible film 120 and covering part of the trace 130. The heat dissipation patch can be made of metal, graphite, or ceramic.

[0040] The embodiment further provides a display device including the COF structure 1, a display panel 2 connected to the COF structure 1, and a horizontal direction circuit board 3. The first-direction trace 131 of the COF structure 1 is connected to the horizontal direction circuit board 3, and the second-direction trace 132 is connected to the display panel 2. Specifically, the first-direction trace 131 is connected to a line on the horizontal direction circuit board 3, which can be a data line, and the second-direction trace 132 is connected to a circuit on the display panel 2, which can be a gate drive circuit 201 or a source drive circuit. The display panel 2 (Panel) can be a GOA panel.

[0041] As shown in Figure 5As shown, in one embodiment, the first directional trace 131 includes multiple first traces 1311 and multiple second traces 1312; the width of each first trace 1311 is greater than the width of any second trace 1312. The second directional trace 132 does not include the third trace 1321.

[0042] like Figure 6 As shown, in another embodiment, the second-direction routing 132 includes multiple third routings 1321 and multiple fourth routings 1322, wherein the width of each third routing 1321 is greater than the width of any fourth routing 1322. The first-direction routing 131 does not include the first routing 1311.

[0043] like Figure 7 As shown, in another embodiment, the first directional trace 131 includes multiple first traces 1311 and multiple second traces 1312, and the second directional trace 132 includes multiple third traces 1321 and multiple fourth traces 1322; wherein the width of each first trace 1311 is greater than the width of any second trace 1312, and the width of each third trace 1321 is greater than the width of any fourth trace 1322. That is, the traces 130 connecting the COF structure 1 to the horizontal circuit board 3 and the display panel 1 all include relatively wide traces, increasing the heat dissipation area of ​​the COF traces.

[0044] The circuits of the display panel 2 and the horizontal circuit board 3 connected to the COF structure 1 can be appropriately adjusted according to the width of the first trace 1311 or the third trace 1321. For example, the corresponding pins can be merged.

[0045] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A COF structure, characterized by, include: A flexible thin film (120); a driver integrated circuit chip (110) disposed on the flexible thin film (120); and a trace (130) connecting the driver integrated circuit chip (110); the trace (130) includes a first direction trace (131) extending from the driver integrated circuit chip (110) in a first direction; the first direction trace (131) includes a plurality of first traces (1311) and a plurality of second traces (1312); wherein the width of each first trace (1311) is greater than the width of any second trace (1312).

2. The COF structure of claim 1, wherein, The driver integrated circuit chip (110) includes a plurality of pins (111) spaced apart. The plurality of first traces (1311) include a target trace (1313). The target trace (1313) connects to a first pin (112) among the plurality of pins (111) and extends to the side of a second pin (113) adjacent to the first pin (112) to the side of the second pin (113) facing the first direction, and is spaced apart from the second pin (113).

3. The COF structure of claim 1, wherein, The width of each of the first traces (1311) is greater than or equal to the sum of the widths of any two adjacent second traces (1312) and the spacing between the two adjacent second traces (1312).

4. The COF structure of claim 1, wherein, The spacing between any two adjacent first traces (1311) is greater than the spacing between any two adjacent second traces (1312).

5. The COF structure of claim 1, wherein, The width of each of the first traces (1311) is greater than or equal to 34 μm.

6. The COF structure of claim 1, wherein, Also includes: A heat dissipation patch (140) is applied to the side of the driver integrated circuit chip (110) away from the flexible film (120) and covers part of the trace (130).

7. The COF structure of claim 1, wherein, The trace (130) also includes a second direction trace (132) extending from the driver integrated circuit chip (110) in a second direction, the first direction being opposite to the second direction; the second direction trace (132) includes a plurality of third traces (1321) and a plurality of fourth traces (1322), wherein the width of each of the third traces (1321) is greater than the width of any of the fourth traces (1322).

8. A display device, characterized by comprising: include: Display panel (2), COF structure (1) connected to the display panel (2), and horizontal circuit board (3) connected to the COF structure (1); the COF structure (1) includes: flexible film (120); A driving integrated circuit chip (110) is arranged on the flexible film (120), and a wire (130) is connected to the driving integrated circuit chip (110); the wire (130) includes a first direction wire (131) and a second direction wire (132) on both sides of the driving integrated circuit chip (110); the first direction wire (131) is connected to the horizontal direction circuit board (3), and the second direction wire (132) is connected to the display panel (2); wherein the first direction wire (131) includes a plurality of first wires (1311) and a plurality of second wires (1312); the width of each first wire (1311) is greater than the width of any second wire (1312).

9. The display device of claim 8, wherein, The second direction wire (132) includes a plurality of third wires (1321) and a plurality of fourth wires (1322), wherein the width of each third wire (1321) is greater than the width of any fourth wire (1322).

10. A display device, characterized by comprising: Comprise: A display panel (2), a COF structure (1) connected to the display panel (2), and a horizontal direction circuit board (3) connected to the COF structure (1); the COF structure (1) comprises: a flexible film (120); A driving integrated circuit chip (110) is arranged on the flexible film (120), and a wire (130) is connected to the driving integrated circuit chip (110); the wire (130) includes a first direction wire (131) and a second direction wire (132) on both sides of the driving integrated circuit chip (110); the first direction wire (131) is connected to the horizontal direction circuit board (3), and the second direction wire (132) is connected to the display panel (2); wherein the second direction wire (132) includes a plurality of third wires (1321) and a plurality of fourth wires (1322); the width of each third wire (1321) is greater than the width of any fourth wire (1322).

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