Display backboard, display panel and display device

Abstract

The embodiment of the utility model provides a display back plate. The display back plate comprises a driving back plate, a substrate, a light resistance material reflecting layer and lamp beads, the substrate is arranged on the driving back plate, the driving back plate comprises a driving circuit, the substrate comprises a conductive wire, the driving circuit on the driving back plate is connected with the conductive wire on the substrate, the photoresist material reflecting layer is located on the substrate, the photoresist material reflecting layer is provided with an opening, and the driving circuit is arranged on the substrate. The lamp beads penetrate through the open holes to be arranged on the substrate and are connected with the electric lead of the substrate. The light resistance material reflecting layer is arranged, so that the uniformity of backlight brightness can be effectively improved, and the light utilization rate is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technical field especially relates to a display backplate, a display panel and a display device. BACKGROUND

[0002] With the development of information society, the demand for display devices has been rapidly growing. In order to meet this demand, display devices represented by liquid crystal display (LCD), plasma display panel (PDP), organic light emitting display (OLED), Mini LED (LED), and Micro LED have developed rapidly. In display devices, Mini LED backlight display refers to a display that uses Mini LED as a light source. The Mini LED display backlight is divided into multiple independently controlled partitions. The partitions can be independently controlled. The Mini LED display can improve local backlight brightness. Therefore, the Mini LED display usually has high contrast ratio, and the peak brightness of local backlight is much higher than that of general LED backlight display, which has good display effect. However, due to the use of a large number of lamp beads in the Mini LED backlight display, the inconsistency between the lamp beads and the non-uniformity of the film coating can seriously reduce the uniformity of the backlight brightness. At this time, the brightness of the picture edge part is naturally lower than that of the picture center, which causes local brightness difference on the display picture, thereby reducing the light utilization rate of the entire display. SUMMARY

[0003] Therefore, to overcome at least some of the defects and deficiencies in the prior art, the utility model embodiment provides a display backplate, a display panel and a display device, which can improve the uniformity of backlight brightness and improve the light utilization rate.

[0004] Specifically, in one aspect, the utility model embodiment provides a display backplate, which comprises a driving backplate, a substrate, a photoresist reflective layer and a lamp bead. The substrate is arranged on the driving backplate. The driving backplate comprises a driving circuit. The substrate comprises a conductive wire. The driving circuit on the driving backplate is connected to the conductive wire on the substrate. The photoresist reflective layer is located on the substrate and is provided with an opening. The lamp bead is arranged on the substrate through the opening and is connected to the conductive wire of the substrate.

[0005] In the embodiment of the utility model, the reflectivity of the photoresist reflective layer is 50% to 95%.

[0006] In the embodiment of the utility model, the film thickness of the photoresist reflective layer is 5-50 microns.

[0007] In the embodiment of the utility model, the aperture diameter is 0.1-1 millimeter.

[0008] In the embodiment of the utility model, the photoresist reflective layer is white photoresist.

[0009] In the embodiment of the utility model, the post-baking process temperature of the photoresist reflective layer is 230-240 degrees Celsius.

[0010] On the other hand, the utility model embodiment provides a kind of display panel, comprising any one of the display backboard described above.

[0011] In the embodiment of the utility model, the display panel further includes light efficiency film, the light efficiency film includes any one or more of upper and lower diffusion sheet, blue light film, quantum dot film, diffusion plate and upper and lower light enhancement sheet.The light efficiency film is combined with the display backboard and located on the side of the display backboard away from the drive backboard.

[0012] Still in another aspect, the utility model embodiment provides a kind of display device, comprising any one of the display panel described above.

[0013] As can be known from above, the above technical features of the utility model can have following one or more beneficial effects: by setting photoresist reflective layer on substrate, wherein photoresist reflective layer is prepared from photoresist, because photoresist has high reflectivity, so that the light emitted by lamp pearl towards other non-light emitting direction is reflected by photoresist reflective layer to reach display area, effectively improves the utilization of light, and improves the brightness uniformity of display backplate.At second, photoresist is completed by high-precision exposure machine to coat and solidify photoresist, there is no obvious alignment problem, and aperture size can be reduced.And photoresist is heated after post-baking process, to form photoresist reflective layer, so photoresist also has the characteristics of high temperature resistance, and is not easy to age for long time lamp pearl irradiation, and has long service life. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed to be used in embodiment description will be simply introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.

[0015] Figure 1 It is a structure schematic view of the display backplate provided by the embodiment.

[0016] Figure 2 For Figure 1 Structure diagram of another embodiment of the display backboard in the embodiment;

[0017] Figure 3 For Figure 1 Structure diagram of the opening structure of the photoresist reflective layer in the embodiment;

[0018] Figure 4 For Figure 1 Process related parameter diagram of the photoresist reflective layer in the embodiment;

[0019] Figure 5 For Figure 1 Reflectivity diagram of different film thicknesses of the photoresist in the embodiment;

[0020] Figure 6 Structure diagram of a display panel provided in the embodiment;

[0021] Figure 7 For Figure 6 Structure diagram of another embodiment of the display panel in the embodiment;

[0022] Figure 8 Structure diagram of a display device provided in the embodiment.

[0023]

Explanation of reference signs

[0024] 1: display backboard; 11: driving backboard; 12: substrate; 13: photoresist reflective layer; 131: opening; 14: lamp bead; 15: support column; 2: display panel; 21: light efficiency film; 3: display device. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments described in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0026] In the present application, reference is made to Figure 1 and Figure 3As shown, the display backboard 1 provided by the embodiment includes a driving backboard 11, a substrate 12, a photoresist reflective layer 13 and a lamp bead 14. The substrate 12 is arranged on the driving backboard 11, the driving backboard 11 includes a driving circuit, the substrate 12 includes a conductive wire, and the driving circuit on the driving backboard 11 is connected with the conductive wire on the substrate 12. The photoresist reflective layer 13 is located on the substrate 12 and is provided with an opening 131. The lamp bead 14 is arranged on the substrate 12 through the opening 131 and is connected with the conductive wire of the substrate 12.

[0027] Exemplarily, the driving backboard 11 is used to provide an electric signal for the lamp bead 14 to control the light-emitting state of the lamp bead 14, which can be a PCB circuit board integrated with a driving circuit. The substrate 12 is used to carry the lamp bead 14 and other basic components and plays a role of physical support and electrical connection, which can be a PCB substrate, a glass substrate and an aluminum substrate. The lamp bead 14 is a Mini LED lamp bead, which is a small-sized light-emitting diode. When an electric signal is input, the Mini LED lamp bead can be driven to emit light to provide a light source. The photoresist reflective layer 13 acts as a reflective layer and is used to reflect light emitted by the lamp bead 14 in other directions to a light-emitting direction. The photoresist reflective layer is made of photoresist material. The photoresist material used in the embodiment is color filter photoresist, which can selectively absorb and transmit light of different wavelengths to realize display of basic colors such as red, green and blue, so as to combine various colors to present high-quality, colorful and accurate images. The photoresist material can be white photoresist or RGB photoresist with different viscosity values, etc. The RGB photoresist refers to photoresist material used to form red, green and blue color pixels, which can absorb and transmit light of different wavelengths to realize display of three basic colors of red, green and blue. When the RGB photoresist is selected as the photoresist reflective layer, the process equipment can be reduced, thereby saving cost and improving production efficiency.

[0028] Specifically, the substrate 12 is arranged on the driving backboard 11. For example, the driving circuit on the driving backboard 11 can be connected with the conductive wire on the substrate 12 through metal pins, a flexible circuit board (FPC) or direct welding, so that the driving circuit can transmit control signals and electric energy to the conductive wire on the substrate 12 to drive the lamp bead 14. The photoresist material is arranged on the substrate 12 by coating and curing. Referring to Figure 4As shown, the preparation process of coating, pre-baking, exposure, development and post-baking is shown, and the photoresist reflective layer 13 is obtained. In some embodiments, a bare copper protective film can also be provided after the formation of the photoresist reflective layer 13, which is tightly attached to the surface of the bare copper by its own adhesion. The bare copper protective film is to form a physical barrier between the bare copper and the external environment, which can prevent oxygen and moisture from contacting the copper surface, thereby preventing the copper surface from being oxidized by chemical reaction. Among them, the coating process is to uniformly coat the photoresist material on the substrate. The pre-baking process is a heating process after coating, which mainly aims to remove the solvent components in the coating layer, solidify the coating layer, and enhance the adhesion between the coating layer and the substrate. Exposure is to irradiate the photoresist material after coating and pre-baking with ultraviolet (UV) or other specific wavelength light to cause photochemical reaction of the photoresist material. Development is to remove the part of the photoresist material after exposure which does not undergo photochemical reaction. Post-baking is another heating treatment of the substrate and photoresist material after development, which further solidifies the photoresist material.

[0029] A plurality of openings 131 are provided on the photoresist reflective layer 13 according to the size of the lamp beads 14. It should be noted that the position and number of the openings 131 are set according to the layout design of the lamp beads 14. Among them, the size of the opening 131 can be set according to whether one opening 131 can accommodate multiple lamp beads or one opening 131 can only accommodate one lamp bead. Referring to Figure 2 As shown, the openings 131 required for the support columns 15 are also reserved according to the design requirements and the size and number of the support columns 15, and the support columns 15 pass through the openings 131 of the support columns 15 and are arranged on the substrate 12. The lamp beads 14 are fixed on the substrate 12 by passing through the openings 131, and can be connected to the conductive circuit on the substrate 12 by welding (such as soldering), adhesive or other methods, to realize the electrical connection between the lamp beads 14 and the substrate 12. Finally, an optical film layer is provided on the lamp beads 14, and the upper substrate 12 is covered. The optical film layer is a kind of thin film material with specific optical properties, which can realize various optical functions by changing the propagation direction, intensity, wavelength and other characteristics of light.

[0030] It is worth mentioning that the support column 15 is mainly used to provide mechanical support, and the display backboard 1 is usually a planar structure. When the driving backboard 11 and other components are assembled together, the support column 15 can prevent the upper structure from excessive sinking or deformation due to its own weight or external pressure, and ensure the mechanical stability of the entire display backboard 1.

[0031] The light-blocking material reflective layer 13 has the characteristic of high reflectivity, and when the lamp bead 14 emits light, part of the light is emitted to the surroundings instead of directly to the display area. The light-blocking material reflective layer 13 can efficiently reflect the light that would otherwise be lost, and redirect it to the display area, thereby increasing the effective light flux used for display and improving the utilization of light. During the preparation of the light-blocking material reflective layer, the light-blocking material is coated and cured by a high-precision exposure machine, so that the relative position between the light-blocking material reflective layer and other reference patterns (such as pre-designed circuit patterns or positioning marks) on the substrate is relatively accurate. When the punching operation is performed, the position of the opening 131 can be more accurately determined, i.e., the size of the opening 131 can be reduced. Moreover, the light-blocking material forms the light-blocking material reflective layer after undergoing a heating process in the post-baking process, so the light-blocking material also has the characteristic of high temperature resistance and is not easily aged by long-term illumination of the lamp bead, thereby having a long service life.

[0032] In the traditional structure, the brightness of the edge part of the picture is lower than that of the center of the picture, partly because the light at the edge position is more easily lost and lacks effective reflection compensation. The light-blocking material reflective layer 13 is arranged around the lamp bead 14, which can sufficiently reflect the light emitted by the lamp bead 14 at the edge position, so that the light at the edge part can also be redirected to the display area, reducing the obvious difference in brightness between the edge and the center, and further improving the brightness uniformity in the display area.

[0033] In the embodiment of the utility model, the reflectivity of the light-blocking material reflective layer 13 is 50%~95%. The reflectivity of the light-blocking material reflective layer 13 is closely related to the film thickness, and the appropriate film thickness corresponding to the light-blocking material reflective layer 13 in this reflectivity range can ensure that the reflection of the light-blocking material reflective layer 13 reaches the ideal state.

[0034] In the embodiment of the utility model, the film thickness of the light-blocking material reflective layer 13 is 5~50 microns. When the light-blocking material reflective layer 13 is in the reflectivity range of 50%~95%, the film thickness of the light-blocking material reflective layer 13 corresponding to the film thickness is 5~50 microns, and the combination of reflectivity and film thickness in this range is better for improving the utilization of light. The reflectivity and the film thickness have a positive trend, i.e., the higher the reflectivity, the thicker the film thickness. The appropriate film thickness can avoid excessive scattering or refraction of light in the light-blocking material reflective layer 13 due to the over-thickness of the light-blocking material reflective layer 13, so that the light cannot propagate to the subsequent optical film layer in the expected direction, thereby affecting the optical performance and display effect of the entire backlight system.

[0035] Secondly, due to the physical properties of the photoresist material has a certain viscosity, for example, photoresist material CBR-6205 (viscosity is 9cP), the photoresist material reflective layer 13 film thickness in 6-50 microns thickness, the reflectivity achieved in the range of 50%-95%. The greater the viscosity, the greater the film thickness during coating process, so the viscosity of the photoresist material needs to be controlled during the coating process to ensure that the film thickness and reflectivity are in the preferred range.

[0036] In the embodiment of the utility model, referring to Figure 3 The aperture of the opening 131 is 0.2-0.3 mm. In the related art, the reflector is a film, and the opening 131 needs to be punched according to the position of the lamp bead 14. The size of the opening 131 is generally much larger than the LED pad (the solder pad of the lamp bead), which is easy to cause abnormal alignment. For example, the LED pad with the model 0509 is 0.23*0.1 mm, and the diameter of the opening 131 of the reflector needs to be 4-5 mm. The aperture of the opening 131 of the reflector is too large compared with the aperture of the opening 131 of the photoresist reflective layer 13. The reduction of the aperture of the opening 131 increases the coverage area of the photoresist reflective layer 13 on the substrate 12, thereby providing more reflection opportunities for light. At the same time, the reduced aperture of the opening 131 can also reduce the loss of light from the opening 131. More light will be reflected under the action of the photoresist reflective layer 13, further improving the reflection ratio of the light, thereby improving the reflection efficiency.

[0037] In the embodiment of the utility model, the photoresist reflective layer 13 is white photoresist. Referring to Figure 5 When the white photoresist is used as the photoresist reflective layer 13, the reflectivity can reach a good range (such as 50%-95% mentioned above), and the film thickness is controlled in a good range (such as 5-50 microns mentioned above). Secondly, the white photoresist can improve the contrast of the Mini LED display and enhance the color accuracy by efficiently reflecting light and optimizing light distribution. The white photoresist has a relatively low procurement cost due to its wide application and relatively mature production technology, thereby saving the material procurement cost.

[0038] In the embodiment of the utility model, referring to Figure 3As shown, the post-baking process temperature of the photoresist material reflective layer 13 is 230-240 degrees Celsius. The post-baking is a heating treatment for the substrate and the photoresist material after development, and the post-baking process temperature refers to the temperature setting for heating the substrate and the photoresist material in the post-baking process. In the related art, white paint is used as a reflective layer to improve brightness uniformity. The white paint is directly printed on the back plate in use, needs to avoid the lamp beads 14, the printing process is complex, and the cost is high. Moreover, the white paint is easily aged and has a short service life due to long-time irradiation of the lamp beads 14. In the manufacturing process of the photoresist material reflective layer 13, the post-baking process with a temperature of 230-240 degrees Celsius and a time of 20-30 minutes is needed. Therefore, the photoresist material reflective layer 13 has the characteristics of high temperature resistance after the post-baking process, is not easily aged by long-time irradiation of the lamp beads 14, and has a long service life.

[0039] On the other hand, referring to Figure 6 As shown, the display panel 2 provided in the embodiment of the utility model comprises the display back plate 1 in any of the preceding embodiments.

[0040] For example, the display panel 2 further comprises a polarizer and a liquid crystal panel (thin film transistor array, liquid crystal layer and color filter). One polarizer is arranged below the liquid crystal layer in the direction close to the display back plate 1, and the other is arranged above the liquid crystal layer. The thin film transistor array is arranged below the liquid crystal layer adjacent to the polarizer. The liquid crystal layer is arranged between the thin film transistor array and the color filter. The color filter is arranged above the liquid crystal layer.

[0041] In the embodiment of the utility model, referring to Figure 7 As shown, the display panel 2 further comprises a light efficiency film 21, and the light efficiency film 21 comprises any one or more of an upper and lower diffusion sheet, a blue light film, a quantum dot film, a diffusion plate and an upper and lower light enhancement sheet. The light efficiency film 21 is combined with the display back plate 1 and located on the side of the display back plate 1 away from the driving back plate 11.

[0042] The display back plate 1 can also be combined with any one of the upper and lower diffusion sheets, the blue light film, the quantum dot film, the diffusion plate and the upper and lower light enhancement sheet to improve the utilization rate of light. The lower diffusion sheet is located on the display back plate 1 and immediately adjacent to the display back plate 1, mainly performs preliminary diffusion of light from the back plate direction. The upper diffusion sheet is generally located behind the liquid crystal layer, further diffuses the light passing through the liquid crystal layer, makes the light more soft and uniform, reduces the non-uniform phenomena such as light spots, and improves the viewing experience. The blue light film is located between the display back plate 1 and the liquid crystal layer close to the lamp beads 14, adjusts the blue light by absorbing or reflecting part of the blue light.

[0043] The quantum dot film is generally placed between the display backboard 1 and the liquid crystal layer, close to one side of the liquid crystal layer, for improving display color performance. The diffusion plate is generally located between the display backboard 1 and the liquid crystal layer, close to the lamp beads 14, uniformly diffuses light emitted by the backlight module, and makes light distribution more uniform in the entire display area, so as to avoid local brightness being too high or uneven brightness.

[0044] In still another aspect, referring to Figure 8 The display device 3 may, for example, be a display screen of a television, a computer, a mobile phone, or the like.

[0045] In addition, it can be understood that the foregoing various embodiments are only exemplary descriptions of the utility model, and under the premise that technical features do not conflict, structures are not contradictory, and the purpose of the utility model is not violated, the technical solutions of various embodiments can be arbitrarily combined and used.

[0046] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A display backplane (1) characterised in that, The display backboard (1) comprises a driving backboard (11), a substrate (12), a photoresist reflective layer (13) and a lamp bead (14); the substrate (12) is arranged on the driving backboard (11), the driving backboard (11) comprises a driving circuit, the substrate (12) comprises a conductive wire, and the driving circuit on the driving backboard (11) is connected with the conductive wire on the substrate (12); the photoresist reflective layer (13) is arranged on the substrate (12) and is provided with an opening (131), the lamp bead (14) is arranged on the substrate (12) through the opening (131) and is connected with the conductive wire of the substrate (12). The reflectivity of the photoresist reflective layer (13) is 50% to 95%.

2. The display backplane (1) according to claim 1, characterized in that The film thickness of the photoresist reflective layer (13) is 5 to 50 microns.

3. The display backplane (1) according to claim 1, characterized in that The aperture of the opening (131) is 0.1 to 1 millimeter.

4. The display backplane (1) according to claim 1, characterized in that The photoresist reflective layer (13) is white photoresist.

5. The display backplane (1) according to claim 1, characterized in that The post-baking process temperature of the photoresist reflective layer (13) is 230 to 240 degrees Celsius.

6. The display backplane (1) according to claim 1, characterized in that The display panel (2) further comprises a light efficiency film (21), the light efficiency film (21) comprises any one or more of an up-down diffusion sheet, a blue light film, a quantum dot film, a diffusion plate and an up-down light enhancement sheet; the light efficiency film (21) is combined with the display backboard (1) and is located on a side of the display backboard (1) away from the driving backboard (11).

7. A display panel (2), characterized by The display panel (2) further comprises a light efficiency film (21), the light efficiency film (21) comprises any one or more of an up-down diffusion sheet, a blue light film, a quantum dot film, a diffusion plate and an up-down light enhancement sheet; the light efficiency film (21) is combined with the display backboard (1) and is located on a side of the display backboard (1) away from the driving backboard (11).

8. The display panel (2) according to claim 7, characterized in that ​ 9. A display device (3), characterized in that ​

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