Light source device and projector

Abstract

The light source device includes: a light source unit (10); a heat dissipation unit (20) having a placement surface (21a) including a placement region (21a1) in which the light source unit is placed; a housing member (30) that covers the light source unit mounted on the mounting region by pressing an edge (311) of the opening (31) toward a peripheral edge region (21a2) of the mounting surface, said peripheral edge region being located around the mounting region; and a wiring board (40) connected to the light source unit and extending from the light source unit to the outside of the mounting surface along the mounting surface. The light source unit is provided with a substrate (11) and a connector (13) that is mounted on the main surface (11a) of the substrate and that is connected to the wiring board. The connectors are disposed at intervals in a direction away from the mounting region by contacting the mounting region with a surface of the substrate facing the opposite side to the main surface of the substrate. The peripheral region is disposed at an interval in a direction away from the placement region by having a step between the peripheral region and the placement region.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light source device and a projector. BACKGROUND

[0002] A light source device is disclosed in Patent Literature 1, which has a light source section in which a light emitting element is mounted on a substrate, and a heat dissipating section that is thermally connected to the light source section. In the light source device of Patent Literature 1, the light source section is placed on a flat placement surface of the heat dissipating section.

[0003] [PTL 1]

[0004] [PTL 2]

[0005] [Patent Literature 1] Japanese Patent Application Publication No. 2020-042147 SUMMARY

[0006] [Problems to be Solved by the Invention]

[0007] However, in such a light source device, it is required to ensure the heat dissipation performance of the light source section, the dust countermeasures for the light source section, and the electrical reliability of the light source device.

[0008] The present utility model is completed in view of the above situation, and aims to provide a light source device and a projector that can ensure the heat dissipation performance of the light source section, the dust countermeasures for the light source section, and the electrical reliability.

[0009] [Means for Solving the Problems]

[0010] The first mode of the present utility model is a light source device, which has: a light source section; a heat dissipating section having a placement surface that includes a placement area in which the light source section is placed; a housing member that covers the light source section placed in the placement area by pressing the edge of an opening toward a peripheral area of the placement surface located around the placement area; and a wiring board connected to the light source section and extending from the light source section along the placement surface to the outside of the placement surface. The light source section has a substrate and a connector mounted on the main surface of the substrate and connected to the wiring board. The connector is arranged at intervals in a direction away from the placement area by being in contact with the placement area through the surface of the substrate on the side opposite to the main surface. The peripheral area is arranged at intervals in a direction away from the placement area by having a step between the placement area.

[0011] The second mode of the present utility model is a projector that has the light source device.

[0012] [Effects of the Invention]

[0013] According to this invention, the heat dissipation performance of the light source section, the dust prevention measures for the light source section, and the electrical reliability of the light source device can be ensured. Attached Figure Description

[0014] Figure 1 This is a perspective view showing the appearance of the projector according to the first embodiment of the present invention.

[0015] Figure 2 This is a perspective view of the light source device according to the first embodiment of the present invention.

[0016] Figure 3 It means Figure 2 A cross-sectional view of the light source device.

[0017] Figure 4 It means in Figure 2 An exploded perspective view of the light source device with the housing components removed from the heat dissipation section.

[0018] Figure 5 It means in Figure 4 An exploded perspective view showing the light source and wiring board removed from the heat dissipation unit.

[0019] Figure 6 yes Figure 3 An enlarged view of region VI in the image.

[0020] Figure 7 yes Figure 4 Enlarged view of the main parts.

[0021] Figure 8 This is a perspective view of the light source device according to the second embodiment of the present invention.

[0022] Figure 9 It means in Figure 8 An exploded perspective view of the light source device with the housing components removed from the heat dissipation section.

[0023] Figure 10 It means in Figure 9 An exploded 3D view showing the wiring board removed from the heat dissipation section.

[0024] Figure 11 This is a top view showing the structure in the light source device of the second embodiment in which the wiring board is connected to multiple light source units. Detailed Implementation

[0025] <First Implementation Method>

[0026] The following is for reference Figures 1-7 The first embodiment of this utility model will be described.

[0027] Figure 1The projector 1 shown in this embodiment is a device that projects image light (image) onto a display surface such as a screen. The projector 1 includes a light source device 3, an image light forming device (not shown), a projection device 5, and a housing 7. The housing 7 houses the light source device 3, the image light forming device, and the projection device 5.

[0028] The image light forming apparatus generates image light based on the light output from the light source device 3 described later. Although not shown, the optical engine includes light modulation elements such as a DMD (Digital Micromirror Device), a liquid crystal panel, and electronic components for controlling the light modulation elements.

[0029] The projection device 5 amplifies the image light output from the image light forming device and projects it onto a display surface such as a screen.

[0030] like Figures 2-4 As shown, the light source device 3 has a light source part 10, a heat dissipation part 20, a housing component 30, and a wiring board 40.

[0031] The light source unit 10 emits light. The light source device 3 of this embodiment has multiple (6 in the example) light source units 10.

[0032] like Figure 6 , Figure 7 As shown, each light source unit 10 includes a substrate 11, a light-emitting element 12 mounted on the main surface 11a of the substrate 11, and a connector 13. The light-emitting element 12 may be, for example, an LED (Light Emitting Diode), but in this embodiment it is a laser diode. The light-emitting element 12 in this embodiment emits laser light in the blue wavelength region. That is, the light source unit 10 in this embodiment is a laser substrate. The number of light-emitting elements 12 included in the light source unit 10 may be two as shown in the example, but is not limited to this.

[0033] Although not shown, a thermistor for measuring the temperature of the light source section 10 is also mounted on the substrate 11. Electrical wiring (not shown) connecting the light-emitting element 12, the thermistor, and the connector 13 is formed on the substrate 11. The connector 13 is connected to the wiring board 40 described later.

[0034] like Figures 3-5 As shown, the heat dissipation unit 20 has a mounting surface 21a that includes a mounting region 21a1 and a peripheral region 21a2. The mounting region 21a1 mounts the light source unit 10 and is formed to be generally flat. The peripheral region 21a2 is a flat surface located around the mounting region 21a1.

[0035] exist Figures 2-7In this diagram, the X-axis direction represents the first direction along the mounting surface 21a, and the Y-axis direction represents the second direction orthogonal to the first direction along the mounting surface 21a. Additionally, the Z-axis direction represents the direction orthogonal to the mounting surface 21a. In the following description, the direction away from the mounting surface 21a along the Z-axis (the positive Z-axis direction) is sometimes referred to as "upward."

[0036] like Figures 3-5 As shown, the peripheral region 21a2 is located above the mounting region 21a1 at intervals. There are steps between the mounting region 21a1 and the peripheral region 21a2.

[0037] like Figure 6 , Figure 7 As shown, a substrate 11 of the light source section 10 is disposed overlapping the mounting region 21a1. In this state, the side of the substrate 11 facing away from the main surface 11a is in contact with the mounting region 21a1. The substrate 11 may be in direct contact with the mounting region 21a1, or it may be in indirect contact with the mounting region 21a1. For example, thermally conductive grease may be placed between the substrate 11 and the mounting region 21a1 to improve heat transfer from the substrate 11 to the heat dissipation section 20.

[0038] With the light source 10 placed in the mounting region 21a1, the light generated in the light-emitting element 12 of the light source 10 is mainly directed away from the mounting surface 21a (positive Z-axis direction). In addition, the connectors 13 of the light source 10 are located above the mounting region 21a1 at intervals equal to the thickness of the substrate 11.

[0039] like Figure 3 , Figure 4 As shown, a plurality of light source units 10 are mounted in a mounting region 21a1 such that a wiring board 40 connected to a connector 13 of each light source unit 10 extends from each light source unit 10 along a first direction without interfering with other light source units 10. Specifically, the plurality of light source units 10 are mounted in the mounting region 21a1 such that no other light source unit 10 is sandwiched between two light source units 10 in the first direction.

[0040] The area of ​​the mounting surface 21a is set to be relatively small to consider the heat dissipation efficiency of the heat dissipation section 20 on the light source section 10. In other words, the ratio of the area occupied by the multiple light source sections 10 to the area of ​​the mounting surface 21a is increased. Therefore, the distance between the light source section 10 placed in the mounting region 21a1 and the edge of the mounting region 21a1 (and the boundary with the peripheral region 21a2) is reduced.

[0041] like Figures 3-5 As shown, the heat dissipation unit 20 of this embodiment has a base portion 21 including a mounting surface 21a, an extended heat dissipation portion 22, and a rear heat dissipation portion 23.

[0042] The base portion 21 is formed in a plate shape with the Z-axis direction as a thickness direction. The base portion 21 is composed of, for example, a material having high electrical conductivity such as copper.

[0043] The extended heat dissipation portion 22 extends from both ends of the base portion 21 in the second direction (Y-axis direction) along the placement surface 21a. Further, the extended heat dissipation portion 22 may, for example, extend from only one end of the base portion 21 in the second direction. The extended heat dissipation portion 22 is configured to dissipate heat by causing air to flow in a direction orthogonal to the placement surface 21a (Z-axis direction) with respect to the extended heat dissipation portion 22.

[0044] Specifically, the extended heat dissipation portion 22 is provided with a heat pipe 221 and a plurality of heat dissipation fins 222 mounted to the heat pipe 221. The heat pipe 221 extends from an end portion of the base portion 21 in the second direction. In the embodiment, the heat pipe 221 extends from both ends of the base portion 21 by penetrating the base portion 21 in the second direction. The heat pipe 221 is arranged with a plurality of heat dissipation fins 222 in the first direction (X-axis direction).

[0045] The plurality of heat dissipation fins 222 of the extended heat dissipation portion 22 are each formed in a plate shape with the extension direction of the heat pipe 221 (Y-axis direction) as a thickness direction. The plurality of heat dissipation fins 222 are arranged at intervals in the second direction on both sides of the base portion 21 in the second direction. The heat pipe 221 is mounted to the plurality of heat dissipation fins 222 in such a manner as to penetrate the heat dissipation fins 222 in the thickness direction thereof.

[0046] In the extended heat dissipation portion 22 thus configured, air can be caused to flow between the plurality of heat dissipation fins 222 in a direction orthogonal to the placement surface 21a (Z-axis direction).

[0047] The back heat dissipation portion 23 has a plurality of heat dissipation fins 231 provided to the back surface 21b of the base portion 21 on a side opposite to the placement surface 21a. The back surface 21b of the base portion 21 is a surface substantially parallel to the placement surface 21a. In the following description, the direction along the back surface 21b corresponds to the first direction (X-axis direction) and the second direction (Y-axis direction), and the direction orthogonal to the back surface 21b corresponds to the Z-axis direction.

[0048] The plurality of heat dissipation fins 231 are each formed in a plate shape with the second direction along the back surface 21b of the base portion 21 as a thickness direction. In addition, each heat dissipation fin 231 extends in the first direction along the back surface 21b of the base portion 21. The plurality of heat dissipation fins 231 are arranged at intervals in the second direction similarly to the heat dissipation fins 222 of the extended heat dissipation portion 22.

[0049] The plurality of heat dissipation fins 231 extend from both ends of the base portion 21 in the first direction. Thereby, on both sides of the base portion 21 in the first direction, air is caused to pass in a direction orthogonal to the back surface 21b (Z-axis direction) between the plurality of heat dissipation fins 231 of the back surface heat dissipation portion 23. Further, the plurality of heat dissipation fins 231 may, for example, extend from only one end of the base portion 21 in the first direction.

[0050] The heat dissipation portion 20 configured as above functions to cool the light source portion 10. Specifically, heat generated in the light source portion 10 placed on the placement region 21al is transferred to the heat pipe 221 and the plurality of heat dissipation fins 222 of the extended heat dissipation portion 22 after being transferred to the base portion 21. And, by causing air to flow in a direction orthogonal to the placement surface 21a (Z-axis direction) between the plurality of heat dissipation fins 222 of the extended heat dissipation portion 22, specifically, by causing air to flow in the positive direction of the Z-axis, the heat transferred from the light source portion 10 to the plurality of heat dissipation fins 222 of the extended heat dissipation portion 22 is dissipated.

[0051] In addition, a part of the heat transferred to the base portion 21 is also transferred to the plurality of heat dissipation fins 231 of the back surface heat dissipation portion 23. And, by causing air to flow in a direction orthogonal to the placement surface 21a (Z-axis direction) between the plurality of heat dissipation fins 231 of the back surface heat dissipation portion 23, specifically, by causing air to flow as indicated by the arrow of Figure 3 , the heat transferred from the light source portion 10 to the plurality of heat dissipation fins 231 of the back surface heat dissipation portion 23 is dissipated.

[0052] As indicated by Figure 3 , Figure 4 , the housing member 30 covers the light source portion 10 placed on the placement region 21al, and prevents dust from adhering to the light source portion 10 (particularly, the light emitting element 12). The housing member 30 has two openings 31, 32 (first opening 31, second opening 32). As indicated by Figure 3 , Figure 6 , the edge 311 of the first opening 31 of the housing member 30 is pressed against the peripheral region 21a2 of the placement surface 21a. In the present embodiment, the edge 311 of the first opening 31 is in contact with the peripheral region 21a2 of the placement surface 21a. An elastic body 33 such as an O-ring is provided at the edge 311 of the first opening 31. By pressing this elastic body 33 against the peripheral region 21a2, the edge 311 of the first opening 31 can be made to closely adhere to the peripheral region 21a2 without a gap.

[0053] As indicated by Figure 2 , Figure 3As shown, the second opening 32 of the housing member 30 is formed to allow light from the light source unit 10 to be emitted outwards from the housing member 30 when the housing member 30 is mounted on the mounting surface 21a of the heat dissipation unit 20. For example, the image light forming apparatus described above can be mounted in the second opening 32 of the housing member 30. In this embodiment, an optical system unit (not shown) of the light source device 3 is mounted in the second opening 32 of the housing member 30. The optical system unit appropriately processes the light (blue light) from the light source unit 10 and emits white light towards the image light forming apparatus.

[0054] The first opening 31 of the housing component 30 is blocked by the heat dissipation part 20, and the second opening 32 of the housing component 30 is blocked by the optical system unit (or image light forming device, etc.), thereby preventing or suppressing dust from entering the inside of the housing component 30.

[0055] The housing member 30 is formed not to extend outward (in the X-axis direction and Y-axis direction) from the edge of the mounting surface 21a. As a result, the housing member 30 can prevent the airflow around the base portion 21 from the back side 21b of the base portion 21 toward the mounting surface 21a (positive Z-axis direction) through the multiple heat dissipation fins 222 and 231 of the extended heat dissipation portion 22 and the back heat dissipation portion 23 from being obstructed by the airflow around the base portion 21.

[0056] like Figure 6 , Figure 7 As shown, the wiring board 40 is connected to the connector 13 of each light source unit 10. That is, the wiring board 40 is provided with respect to each of the multiple light source units 10. The wiring board 40 connected to the light source unit 10 extends from the light source unit 10 along the mounting surface 21a to the outside of the mounting surface 21a. The wiring board 40 electrically connects the light source unit 10 to external devices (such as power supply, control device, etc.).

[0057] The wiring board 40 is formed as an elongated strip and is arranged along the mounting surface 21a in both its length and width directions. The wiring board 40 is a flexible wiring board that can be easily bent in the thickness direction at any midpoint in its length direction.

[0058] like Figure 3 , Figure 4 As shown, each wiring board 40 extends along the mounting surface 21a in the first direction (X-axis direction). In this embodiment, the wiring board 40 extending from the light source portion 10 placed in the mounting region 21a1 on one side of the first direction (positive X-axis direction side) extends from the light source portion 10 toward one side of the first direction. Additionally, the wiring board 40 extending from the light source portion 10 placed in the mounting region 21a1 on the other side of the first direction (negative X-axis direction side) extends from the light source portion 10 toward the other side of the first direction.

[0059] The wiring board 40 configured as described above is disposed so as to overlap a part of the periphery of the peripheral region 21a2 of the placement surface 21a, and is sandwiched between the part of the periphery of the peripheral region 21a2 and the edge 311 of the first opening 31 of the housing member 30 (see FIG. 2, in particular Figure 3 , Figure 6 ). Thus, the edge 311 of the first opening 31 of the housing member 30 is in contact with the remaining part of the periphery of the peripheral region 21a2. Since the thickness of the wiring board 40, which is a flexible wiring board, is small, the step between the peripheral region 21a2 and the wiring board 40 disposed in the peripheral region 21a2 is small. Therefore, in a state where the edge 311 of the first opening 31 of the housing member 30 is pressed toward the peripheral region 21a2, it is possible to suppress or prevent a case where a gap is generated between the peripheral region 21a2 and the housing member 30 due to the wiring board 40.

[0060] In the light source device 3 of the first embodiment and the projector 1 including the light source device 3, it is possible to ensure the heat dissipation performance of the light source section 10, the dust countermeasures of the light source section 10, and the electrical reliability. Hereinafter, these aspects will be described.

[0061] The edge 311 of the first opening 31 of the housing member 30 is pressed toward, and specifically in contact with, the peripheral region 21a2 of the placement surface 21a, and thus it is possible to ensure the dust countermeasures of the light source section 10.

[0062] Furthermore, in the light source device 3 of the present embodiment, the peripheral region 21a2 of the placement surface 21a, which is contacted by the edge 311 of the first opening 31 of the housing member 30, is located above the placement region 21a1 with a gap, similarly to the connector 13 of the light source section 10. Thus, it is possible to ensure the electrical reliability of the light source device 3. Hereinafter, this point will be described.

[0063] In a case where the connector 13 of the light source section 10 is located above the placement region 21a1 with a gap, the wiring board 40 connected to the connector 13 is also located above the placement region 21a1 with a gap in the vicinity of the connector 13 (see FIG. 2, in particular Figure 6 ). In addition, in view of the heat dissipation efficiency of the light source section 10, the light source section 10 placed on the placement region 21a1 is spaced apart from the peripheral region 21a2 by a small distance.

[0064] Thus, for example, in a case where there is no step between the placement region 21a1 and the peripheral region 21a2, the wiring board 40 extending from the light source section 10 is located above the peripheral region 21a2 with a gap. Thus, if the wiring board 40 is sandwiched between the edge 311 of the first opening 31 of the housing member 30 and the peripheral region 21a2, the force acting on the connection portion (the connector 13) of the light source section 10 and the wiring board 40 becomes large. As a result, the electrical reliability of the connection portion is reduced.

[0065] On the other hand, in a case where the peripheral region 21a2 is located above the placement region 21al with a gap, the wiring board 40 extending from the light source section 10 can be arranged on the peripheral region 21a2 in a manner that the gap with the peripheral region 21a2 becomes smaller or disappears. Thereby, even if the wiring board 40 is sandwiched between the edge 311 of the first opening 31 of the housing member 30 and the peripheral region 21a2, the force acting on the connection portion (the connector 13) of the light source section 10 and the wiring board 40 can be reduced or eliminated. Thus, the electrical reliability of the light source device 3 can be ensured.

[0066] The above effect (the effect that the electrical reliability of the light source device 3 can be ensured by locating the peripheral region 21a2 above the placement region 21al with a gap) is effective in a case where the size of the base section 21 in plan view (i.e., the area of the placement surface 21a) is small, and the distance between the light source section 10 placed on the placement surface 21a in plan view and the periphery of the placement surface 21a is small. That is, according to the present embodiment, the area of the placement surface 21a can be suppressed to be small, and the connection of the light source section 10 and the wiring board 40 can be ensured, and the electrical reliability of the light source device 3 can be ensured.

[0067] Further, by being able to reduce the area of the placement surface 21a, even if there is a constraint on the installation space of the light source device 3 in the projector 1, a space for arranging other constituent elements (the heat dissipation fins 222 and 231 of the extended heat dissipation section 22 and the back heat dissipation section 23) of the heat dissipation section 20 can be ensured around the base section 21 (the placement surface 21a). Thereby, by causing air to flow to the heat dissipation fins 222 and 231 arranged around the placement surface 21a, the heat dissipation performance of the light source section 10 can be ensured.

[0068] In addition, in the light source device 3 and the projector 1 of the first embodiment, the heat dissipation section 20 has the extended heat dissipation section 22 that extends from the end of the base section 21 in the second direction (the Y-axis direction) along the placement surface 21a. The extended heat dissipation section 22 dissipates heat by causing air to flow in a direction (the Z-axis direction) orthogonal to the placement surface 21a. In contrast, the wiring board 40 extending from the light source section 10 placed on the placement surface 21a extends in the first direction along the placement surface 21a.

[0069] Thus, even if the wiring board 40 extends to the outside of the placement surface 21a along the placement surface 21a, the wiring board 40 and the extended heat dissipation section 22 can be prevented from overlapping in the direction orthogonal to the placement surface 21a. Thereby, the wiring board 40 can be prevented from obstructing the flow of air in the extended heat dissipation section 22. Thus, the heat dissipation efficiency of the light source section 10 can be improved.

[0070] Furthermore, in the light source device 3 and projector 1 of this embodiment, the heat dissipation unit 20 has a plurality of heat dissipation fins 231 disposed on the back surface 21b of the base unit 21 and extending along a first direction (X-axis direction). These plurality of heat dissipation fins 231 extend from the end of the base unit 21 in the first direction (X-axis direction).

[0071] Therefore, by directing airflow toward the heat dissipation fins 231 extending from the end of the base portion 21 in the first direction, heat transferred from the light source portion 10 to the heat dissipation fins 231 can be efficiently dissipated. Thus, the heat dissipation efficiency of the light source portion 10 can be improved.

[0072] Furthermore, in the light source device 3 and projector 1 of this embodiment, the wiring board 40 is a flexible wiring board. As a result, the wiring board 40 can be freely bent outside the mounting surface 21a (peripheral region 21a2).

[0073] In the first embodiment, the wiring board 40 is not limited to a flexible wiring board, but may also be a rigid wiring board that does not bend or deform.

[0074] <Second Implementation Method>

[0075] Next, refer to Figures 8-11 The second embodiment of this utility model will now be described. In the following description, structures identical to those already described will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0076] like Figures 8-10 As shown, the light source device 3C of the second embodiment is constructed in the same manner as the light source device 3 of the first embodiment, except for the wiring board 40C, and can be applied to the projector 1 of the first embodiment. The light source device 3C of this embodiment has one wiring board 40C. The wiring board 40C is connected to the connector 13 of each of the plurality of light source parts 10. The wiring board 40C is arranged to overlap the peripheral region 21a2 of the mounting surface 21a of the base part 21 in the circumferential direction. Therefore, the wiring board 40C is sandwiched between the peripheral region 21a2 of the base 21 and the edge 311 of the first opening 31 of the housing member 30. The wiring board 40C extends from the peripheral region 21a2 toward one side in the first direction (positive X-axis direction side).

[0077] The wiring board 40C in this embodiment is a rigid wiring board that does not bend in its thickness direction.

[0078] like Figure 10 , Figure 11As shown, the wiring board 40C has a plurality of light source section connectors 41 and one external connector 42. The plurality of light source section connectors 41 are electrically connected to the connectors 13 of the plurality of light source sections 10 arranged in the placement region 21al, respectively. The external connector 42 is electrically connected to the plurality of light source section connectors 41 via connection wiring (not shown) formed in the wiring board 40C. A prescribed device (for example, a power source that supplies electric power to the plurality of light source sections 10, a control device that controls the operation of the plurality of light source sections 10) is connected to the external connector 42.

[0079] As shown in FIG. 6, the external connector 42 is arranged outside the peripheral region 21a2 in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2. Specifically, the external connector 42 is provided at a portion of the wiring board 40C that protrudes from the peripheral region 21a2 to one side in the first direction (the positive direction of the X axis). This external connector 42 is positioned so as not to overlap the heat dissipation fins 231 of the back surface heat dissipation section 23 in the direction orthogonal to the placement surface 21a (the Z axis direction). Figure 8 Figure 9 As shown in FIG. 6, the external connector 42 is arranged outside the peripheral region 21a2 in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2. Specifically, the external connector 42 is provided at a portion of the wiring board 40C that protrudes from the peripheral region 21a2 to one side in the first direction (the positive direction of the X axis). This external connector 42 is positioned so as not to overlap the heat dissipation fins 231 of the back surface heat dissipation section 23 in the direction orthogonal to the placement surface 21a (the Z axis direction).

[0080] In the wiring board 40C of the present embodiment, a through-hole 43 that penetrates in the plate thickness direction of the wiring board 40C is formed. The through-hole 43 is formed at a portion of the wiring board 40C that is positioned outside the peripheral region 21a2. The through-hole 43 penetrates the wiring board 40C in the direction orthogonal to the placement surface 21a (the Z axis direction) in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2.

[0081] As shown in FIG. 6, the external connector 42 is arranged outside the peripheral region 21a2 in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2. Specifically, the external connector 42 is provided at a portion of the wiring board 40C that protrudes from the peripheral region 21a2 to one side in the first direction (the positive direction of the X axis). This external connector 42 is positioned so as not to overlap the heat dissipation fins 231 of the back surface heat dissipation section 23 in the direction orthogonal to the placement surface 21a (the Z axis direction). Figure 10 Figure 11 As shown in FIG. 6, the external connector 42 is arranged outside the peripheral region 21a2 in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2. Specifically, the external connector 42 is provided at a portion of the wiring board 40C that protrudes from the peripheral region 21a2 to one side in the first direction (the positive direction of the X axis). This external connector 42 is positioned so as not to overlap the heat dissipation fins 231 of the back surface heat dissipation section 23 in the direction orthogonal to the placement surface 21a (the Z axis direction).

[0082] As shown in FIG. 6, the external connector 42 is arranged outside the peripheral region 21a2 in a state in which the wiring board 40C is arranged so as to overlap the peripheral region 21a2. Specifically, the external connector 42 is provided at a portion of the wiring board 40C that protrudes from the peripheral region 21a2 to one side in the first direction (the positive direction of the X axis). This external connector 42 is positioned so as not to overlap the heat dissipation fins 231 of the back surface heat dissipation section 23 in the direction orthogonal to the placement surface 21a (the Z axis direction). Figure 8 Figure 9 Figure 10 Figure 11 Figure 8 Figure 9 The light source device 3C according to the second embodiment achieves the same effects as the first embodiment. For example, by pressing the edge 311 of the first opening 31 of the housing member 30 toward the peripheral region 21a2 of the placement surface 21a, it is possible to ensure a dustproof countermeasure for the light source section 10.

[0083] The light source device 3C according to the second embodiment achieves the same effects as the first embodiment. For example, by pressing the edge 311 of the first opening 31 of the housing member 30 toward the peripheral region 21a2 of the placement surface 21a, it is possible to ensure a dustproof countermeasure for the light source section 10.

[0084] ​​​Specifically, the wiring board 40C is sandwiched between the peripheral edge region 21a2 and the edge 311 of the first opening 31 of the housing member 30. Therefore, compared to a case where the wiring board 40C overlaps only a part of the circumference of the peripheral edge region 21a2, even if the wiring board 40C is thick, it is possible to appropriately suppress or prevent a gap from being generated between the peripheral edge region 21a2 and the housing member 30. Therefore, even if the wiring board 40C is thick, it is possible to easily ensure the dust-proof countermeasure of the light source section 10.

[0085] In addition, in the light source device 3C of the second embodiment, the plurality of light source sections 10 are connected to one external connector 42 of the wiring board 40C disposed on the outside of the peripheral edge region 21a2. Thereby, by connecting a prescribed device (for example, a power supply, a control device) to one external connector 42 of the wiring board 40C, it is possible to simply connect the prescribed device to the plurality of light source sections 10.

[0086] In addition, in the light source device 3C of the second embodiment, a through-hole 43 that penetrates in the plate thickness direction of the wiring board 40C is formed in a portion of the wiring board 40C that is located on the outside of the peripheral edge region 21a2. Therefore, it is possible to pass air through the through-hole 43 of the wiring board 40C in the plate thickness direction of the wiring board 40C (that is, in a direction orthogonal to the placement surface 21a). Thereby, even if the portion of the wiring board 40C that is located on the outside of the peripheral edge region 21a2 overlaps the plurality of heat dissipation fins 231 of the back surface heat dissipation section 23 that protrude to the outside of the peripheral edge region 21a2 in the orthogonal direction (Z-axis direction) that is orthogonal to the placement surface 21a, it is possible to suppress the wiring board 40C from impeding the flow of air in these plurality of heat dissipation fins 231. Therefore, it is possible to suppress a decrease in the heat dissipation efficiency of the light source section 10 by the wiring board 40C.

[0087] In addition, in the light source device 3C of the second embodiment, the wiring board 40C is a rigid wiring board and does not bend like a flexible wiring board. Therefore, compared to a case where the wiring board 40C is a flexible wiring board, it is possible to easily perform positioning of the wiring board 40C with respect to the connector 13 of the light source section 10. This effect is particularly effective in a case where the connector 13 of the light source section 10 to which the wiring board 40C is connected is a plurality of connectors.

[0088] In the second embodiment, the external connector 42 can also be provided to a portion of the wiring board 40C that protrudes to the other side (X-axis negative direction side) of the first direction from the peripheral edge region 21a2. In addition, the external connector 42 can also be provided to a portion of the wiring board 40C that protrudes to the second direction (Y-axis direction) from the peripheral edge region 21a2, for example. In this case, it is preferable that the external connector 42 not overlap the heat dissipation fin 222 of the extended heat dissipation section 22 in the direction (Z-axis direction) that is orthogonal to the placement surface 21a.

[0089] In the second embodiment, the through-hole 43 can be formed, for example, also at a portion of the wiring board 40C that extends from the peripheral area 21a2 to the other side (X-axis negative direction side) in the first direction. In addition, the through-hole 43 can be formed, for example, also at a portion of the wiring board 40C that extends from the peripheral area 21a2 to the second direction (Y-axis direction). In this case, the through-hole 43 can be located at a position overlapping the heat dissipation fins 222 of the extended heat dissipation portion 22 in a direction (Z-axis direction) orthogonal to the placement surface 21a. In such a structure, it is possible to suppress a case where the wiring board 40 hinders the flow of air in the heat dissipation fins 222 of these extended heat dissipation portions 22, and it is possible to suppress a decrease in the heat dissipation efficiency of the light source portion 10 based on the wiring board 40C.

[0090] In the second embodiment, the wiring board 40C is not limited to a rigid wiring board, and can be, for example, a flexible wiring board that can be bent and deformed.

[0091] The through-hole 43 in the second embodiment can be applied, for example, also to the wiring board 40 of the first embodiment.

[0092] The embodiments of the present application have been described above, but the present application is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist thereof.

[0093] In the present application, the wiring board 40 extending from the light source portion 10 in the first direction can be bent, for example, on the outside of the placement surface 21a (outside of the housing member 30) so as to extend toward the upper side (Z-axis positive direction) of the placement surface 21a. In this case, the wiring board 40 does not overlap the heat dissipation fins 231 extending from the end portion of the base portion 21 in the first direction, and thus it is possible to prevent the wiring board 40 from hindering the flow of air in the heat dissipation fins 231. Therefore, it is possible to achieve an increase in the heat dissipation efficiency of the light source portion 10.

[0094] [REFERENCE NUMERALS]

[0095] 1 projector

[0096] 3, 3C light source device

[0097] 10 light source portion

[0098] 11 substrate

[0099] 11a main surface

[0100] 12 light emitting element

[0101] 13 connector

[0102] 20 heat dissipation portion

[0103] 21 base portion

[0104] 21a placement surface

[0105] 21a1 placement area

[0106] 21a2 peripheral area

[0107] 21b back surface

[0108] 22 extended heat dissipating portion

[0109] 221 heat pipe

[0110] 222 heat dissipating fin

[0111] 23 back surface heat dissipating portion

[0112] 231 heat dissipating fin

[0113] 30 housing member

[0114] 31 first opening

[0115] 311 edge of first opening 31

[0116] 32 second opening

[0117] 40, 40C wiring board

[0118] 41 light source portion connector

[0119] 42 external connector

[0120] 43 through hole

Claims

1. A light source device characterized by comprising: a light source section; a heat dissipating section having a placement surface including a placement area on which the light source section is placed; a housing member covering the light source section placed on the placement area by pressing an edge of an opening toward a peripheral area of the placement surface located around the placement area; and a wiring board connected to the light source section and extending from the light source section along the placement surface to an outside of the placement surface, the light source section includes a substrate and a connector mounted on a main surface of the substrate and connected to the wiring board, the connector is arranged apart from the placement area in a direction away from the placement area by being in contact with the placement area through a surface of the substrate on a side opposite to the main surface, and the peripheral area is arranged apart from the placement area in a direction away from the placement area by having a step between the placement area and the peripheral area.

2. The light source device according to claim 1, characterized in that the wiring board is arranged overlappingly in an entire periphery of the peripheral area and is sandwiched between the peripheral area and the housing member.

3. The light source device according to claim 2, characterized in that a plurality of the light source sections are placed on the placement area, the wiring board has one external connector electrically connected to the connectors of the plurality of light source sections and arranged outside the peripheral area.

4. The light source device according to claim 1, characterized in that the wiring board is arranged overlappingly in a part of a periphery of the peripheral area and is sandwiched between the part of the periphery of the peripheral area and the housing member, the housing member is in contact with a remaining part of the periphery of the peripheral area.

5. The light source device according to any one of claims 1 to 4, characterized in that a through hole penetrating in a thickness direction of the wiring board is formed in a portion of the wiring board outside the peripheral area.

6. The light source device according to any one of claims 1 to 4, characterized in that the wiring board extends in a first direction along the placement surface, the heat dissipating section has a base section including the placement surface and an extended heat dissipating section extending from an end of the base section in a second direction orthogonal to the first direction along the placement surface, the extended heat dissipating section is configured to dissipate heat by causing air to flow in a direction orthogonal to the placement surface with respect to the extended heat dissipating section.

7. The light source device according to any one of claims 1 to 4, characterized in that the wiring board extends in a first direction along the placement surface, the heat dissipating section has a base section including the placement surface and a plurality of heat dissipating fins provided on a back surface of the base section on a side opposite to the placement surface and extending in the first direction, the plurality of heat dissipating fins extend from an end of the base section in the first direction.

8. The light source device according to any one of claims 1 to 4, characterized in that ​ ​ The wiring board is a rigid wiring board.

9. The light source device according to any one of claims 1 to 4, wherein The wiring board is a flexible wiring board.

10. A projector provided with a light source device, wherein The light source device comprises: a light source section; a heat dissipation section having a placement surface including a placement area on which the light source section is placed; a housing member covering the light source section placed on the placement area by pressing the edge of an opening toward a peripheral area of the placement surface surrounding the placement area; and a wiring board connected to the light source section and extending from the light source section along the placement surface to the outside of the placement surface, the light source section comprises a substrate and a connector mounted on a main surface of the substrate and connected to the wiring board, the connector is in contact with the placement area through a surface of the substrate on the side opposite to the main surface, and is arranged at intervals in a direction away from the placement area, the peripheral area is arranged at intervals in a direction away from the placement area by having a step between the placement area and the peripheral area.

11. The projector according to claim 10, wherein the wiring board is arranged overlapping the entire periphery of the peripheral area and is sandwiched between the peripheral area and the housing member.

12. The projector according to claim 11, wherein a plurality of the light source sections are placed on the placement area, the wiring board has one external connector electrically connected to the connectors of the plurality of light source sections and arranged outside the peripheral area.

13. The projector according to claim 10, wherein the wiring board is arranged overlapping a part of the periphery of the peripheral area and is sandwiched between the part of the periphery of the peripheral area and the housing member, the housing member is in contact with the remaining part of the periphery of the peripheral area.

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