Small wireless power supply magnetic core structure

By introducing ventilation gaps and channels into the wireless power supply core structure, and utilizing a semiconductor cooler and dehumidification plate, the problem of core heating and aging was solved, achieving efficient heat dissipation and moisture prevention, and extending the service life of the core.

CN223728590UActive Publication Date: 2025-12-26TIANCHANG HUIKANG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202520047961.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-09
Publication Date
2025-12-26
Estimated Expiration
2035-01-09

AI Technical Summary

Technical Problem

Existing wireless power supply cores are prone to overheating under high load operation, leading to material aging, shortened service life, and poor reliability of slip ring power transmission and signal transmission.

Method used

A small wireless power supply core structure was designed. By setting an air exchange gap between the inner and outer ring cores and setting an air exchange channel on the side wall of the outer ring core, combined with a semiconductor cooler, heat exchange tube and air exchange dehumidification plate, effective heat dissipation and dehumidification are achieved, and the life of the core is extended.

Benefits of technology

It effectively dissipates heat, prevents the magnetic core material from overheating and aging, extends the service life, prevents the magnetic core from getting damp during cooling, and improves the reliability and service life of the magnetic core.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a small wireless power supply magnetic core structure which comprises an inner ring magnetic core, an outer ring magnetic core and a heat dissipation mechanism, a ventilation gap is arranged between the outer ring magnetic core and the inner ring magnetic core, and a ventilation channel is arranged on the side wall of the outer ring magnetic core. The heat dissipation mechanism comprises a semiconductor cooler, a ventilation dehumidification plate arranged on the side wall of the semiconductor cooler and a heat exchange pipe communicated with a ventilation channel. The rotating shaft hole is used in cooperation with the shaft rod, heat can be discharged through the ventilation gap, and due to the arrangement of the clamping base, the semiconductor cooler can be disassembled and assembled conveniently, and maintenance and overhaul are facilitated; refrigeration is conducted through the semiconductor cooler, cold air enters the ventilation gap through the heat exchange pipe and the ventilation channel, the inner ring magnetic core and the outer ring magnetic core are cooled, overheating aging of magnetic core materials is avoided, the service cycle is prolonged, the ventilation dehumidification plate can absorb moisture in the entering air, and the magnetic core materials are prevented from being affected with damp during cooling.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wireless power supply technical field, concretely is a small -size wireless power supply magnetic core structure. BACKGROUND

[0002] When the instrument and equipment exist rotating part, and the rotor part has circuit, need through the slip ring transmission power and signal.But the slip ring has the fatal defect, the life is difficult to exceed 100 million turns.A common work in 1200rpm's slip ring, just can only continuous use two months, even if using mercury slip ring also cannot fundamentally solve this problem.Based on this, in recent one or two years, along with wireless charging, rotary sensor etc.application need, based on the brushless rotation wireless power supply device of resonance coupling also matures day by day.This new type wireless power supply scheme, does not need any contact, no noise, no wear and tear, can therefore realize more than ten years super long life, and is irrelevant with rotation speed, therefore it will gradually replace the use of slip ring.

[0003] The existing wireless power supply magnetic core will heat up when operating under high load. The main reasons for the heating of the magnetic core include electromagnetic induction and resistance loss. When the current passes through the inductor coil, an alternating magnetic field is generated in the magnetic core, part of the electric energy is converted into magnetic energy and stored in the magnetic core, but a part of the energy is dissipated in the form of heat, causing the magnetic core to heat up. In a high temperature environment, the thermal aging of the magnetic core material is accelerated, reducing the service life of the magnetic core. SUMMARY

[0004] This section aims to outline some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the present application.

[0005] In view of the above and / or problems existing in the use of small wireless power supply magnetic core structure, the present application is proposed.

[0006] Therefore, the purpose of the present application is to provide a small wireless power supply magnetic core structure, which is used by cooperating the shaft hole with the shaft rod, and the heat can be discharged through the air exchange gap. The setting of the clamping seat facilitates the disassembly and maintenance of the semiconductor refrigerator. The semiconductor refrigerator is used for refrigeration, and the cold air enters the air exchange gap through the heat exchange pipe and the air exchange channel to cool the inner ring magnetic core and the outer ring magnetic core. The overheat aging of the magnetic core material is avoided, the service life is prolonged, and the moisture of the magnetic core material is avoided when cooling.

[0007] To solve the above technical problems, according to one aspect of the present application, the present application provides the following technical scheme:

[0008] A small wireless power supply magnetic core structure comprises:

[0009] An inner ring magnetic core;

[0010] An outer ring magnetic core, which is provided with an air exchange gap between the inner ring magnetic core, and a side wall of the outer ring magnetic core is provided with an air exchange channel;

[0011] A heat dissipation mechanism, which comprises a semiconductor refrigerator, an air exchange and dehumidification plate provided on a side wall of the semiconductor refrigerator, and a heat exchange pipe in communication with the air exchange channel.

[0012] As a preferred scheme of the small wireless power supply magnetic core structure, the shaft portion of the inner ring magnetic core is provided with a shaft hole, and the outer ring magnetic core is coaxial with the inner ring magnetic core.

[0013] As a preferred scheme of the small wireless power supply magnetic core structure, the side wall of the outer ring magnetic core is provided with an opening, and the side wall of the outer ring magnetic core is provided with a clamping seat.

[0014] As a preferred scheme of the small wireless power supply magnetic core structure, the clamping seat is made of two "L" type plates, and the side wall of the "L" type plate is provided with a fastening screw.

[0015] As a preferred scheme of the small wireless power supply magnetic core structure, the side wall of the semiconductor refrigerator is provided with an insertion plate, and the insertion plate is clamped into the clamping seat.

[0016] As a preferred scheme of the small wireless power supply magnetic core structure, the insertion plate is a rubber plate, and the edge of the pipe opening of the heat exchange pipe is provided with a sealing ring.

[0017] As a preferred scheme of the small wireless power supply magnetic core structure, the inside of the air exchange and dehumidification plate is provided with a moisture absorbing filler, and the outer periphery of the heat exchange pipe is provided with a heat preservation sleeve.

[0018] Compared with the prior art, the small wireless power supply magnetic core structure has the beneficial effects that: the shaft hole is used in cooperation with the shaft rod, the air exchange gap can discharge heat, the clamping seat is arranged, the semiconductor refrigerator is convenient to disassemble and assemble, and maintenance and repair are convenient, the semiconductor refrigerator is refrigerated, the cold air enters the air exchange gap through the heat exchange pipe and the air exchange channel, the inner ring magnetic core and the outer ring magnetic core are cooled, overheating and aging of the magnetic core material are avoided, the use cycle is prolonged, the air exchange and dehumidification plate can absorb moisture in the entering air, and the magnetic core material is prevented from being dampened during cooling. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the present application will be described in detail below with reference to the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor. Among them:

[0020] Fig. 1 It is a whole first perspective structure schematic diagram of the small wireless power supply magnetic core structure of the present application;

[0021] Fig. 2 It is a whole second perspective structure schematic diagram of the small wireless power supply magnetic core structure of the present application;

[0022] Fig. 3 It is a part structure schematic diagram of the heat dissipation mechanism of the small wireless power supply magnetic core structure of the present application.

[0023] 100, inner ring magnetic core; 101, air exchange gap; 102, shaft hole; 200, outer ring magnetic core; 201, notch; 210, card seat; 220, air exchange channel; 300, heat dissipation mechanism; 310, semiconductor refrigerator; 320, heat exchange pipe; 330, air exchange and dehumidification plate. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purpose, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the drawings.

[0025] Secondly, the present application is described in detail in combination with the schematic diagram. In order to facilitate the description, the sectional view of the device structure will be partially enlarged without the general scale, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual production.

[0026] In order to make the purpose, technical scheme and advantages of the present application more clear, the embodiments of the present application will be described in further detail below with reference to the drawings.

[0027] The present application provides a small wireless power supply magnetic core structure, which is used by cooperating the shaft hole with the shaft rod, the heat can be discharged through the air exchange gap, the card seat is arranged, the semiconductor refrigerator can be disassembled and assembled conveniently, and the maintenance and repair are facilitated. The semiconductor refrigerator is refrigerated, the cold air enters the air exchange gap through the heat exchange pipe and the air exchange channel, the inner ring magnetic core and the outer ring magnetic core are cooled, the overheating and aging of the magnetic core material are avoided, the service life is prolonged, the air moisture entering the air exchange and dehumidification plate is absorbed, and the magnetic core material is prevented from being dampened during cooling.

[0028] Figs. 1-3 The utility model discloses a small -size wireless power supply magnetic core structure one implementation mode's structure schematic diagram is shown, please refer to Figs. 1-3 The utility model discloses a small -size wireless power supply magnetic core structure, and its main part includes inner ring magnetic core 100, outer ring magnetic core 200 and heat abstractor 300.

[0029] Inner ring magnetic core 100 passes through pivot hole 102 cooperation axle stem uses, specifically, in the embodiment, the axle part of the inner ring magnetic core is provided with pivot hole 102, and the outer ring magnetic core 200 is coaxial with the inner ring magnetic core 100.

[0030] The outer ring magnetic core 200 can discharge heat through the ventilation gap 101, and the setting of the clamping seat 210 facilitates the disassembly and assembly of the semiconductor refrigerator 310, facilitates maintenance and overhaul, specifically, the outer ring magnetic core 200 is provided with ventilation gap 101 between the inner ring magnetic core 100, the side wall of the outer ring magnetic core 200 is provided with ventilation channel 220, in the embodiment, the side wall of the outer ring magnetic core 200 is provided with the gap 201, the side wall of the outer ring magnetic core 200 is provided with the clamping seat 210, the clamping seat 210 is made of two "L" type plates, and the side wall of the "L" type plate is provided with a fastening screw.

[0031] The heat abstractor 300 is cooled by the semiconductor refrigerator 310, and the cold air enters the ventilation gap 101 through the heat exchange pipe 320 and the ventilation channel 220, and the inner ring magnetic core 100 and the outer ring magnetic core 200 are cooled, so that the magnetic core material is prevented from overheating and aging, and the service life is prolonged, the ventilation and dehumidification plate 330 can absorb the moisture in the entering air, so that the magnetic core material is prevented from being damp during cooling, and specifically, the heat abstractor 300 includes the semiconductor refrigerator 310, the ventilation and dehumidification plate 330 arranged on the side wall of the semiconductor refrigerator 310 and the heat exchange pipe 320 communicated with the ventilation channel 220, in the embodiment, the side wall of the semiconductor refrigerator 310 is provided with the plug-in board, the plug-in board is clamped into the inside of the clamping seat 210, the plug-in board is a rubber plate, the edge of the pipe opening of the heat exchange pipe 320 is provided with a sealing ring, the inside of the ventilation and dehumidification plate 330 is provided with a moisture absorbing filler, and the outer periphery of the heat exchange pipe 320 is provided with a heat preservation sleeve, wherein the semiconductor refrigerator 310 is an existing technical means with a blowing fan and a semiconductor refrigeration sheet.

[0032] Combined Figs. 1-3The small wireless power supply magnetic core structure of the embodiment is used as follows: the shaft hole 102 is matched with the shaft rod, the heat is discharged through the air exchange gap 101, the clamping seat 210 is arranged, the semiconductor refrigerator 310 is convenient to disassemble and assemble, and maintenance is convenient, the semiconductor refrigerator 310 is used for refrigeration, the cold air enters the air exchange gap 101 through the heat exchange pipe 320 and the air exchange channel 220, the inner ring magnetic core 100 and the outer ring magnetic core 200 are cooled, the magnetic core material is prevented from overheating and aging, the service life is prolonged, and the air exchange and dehumidification plate 330 can absorb the moisture of the entering air, so that the magnetic core material is prevented from being dampened during cooling.

[0033] Although the utility model has been described above with reference to the embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, the features in the embodiments disclosed by the utility model can be combined in any way, and the combinations are not exhaustively described in the specification only for the purpose of saving space and resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A small wireless power supply magnetic core structure, characterized by, The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core.

2. A small wireless power supply magnetic core structure according to claim 1, characterized in that, The application relates to a heat dissipation mechanism for a magnetic core.

3. A small wireless power supply magnetic core structure according to claim 2, characterized in that, The application relates to a heat dissipation mechanism for a magnetic core.

4. A small wireless power supply magnetic core structure according to claim 3, characterized in that, The application relates to a heat dissipation mechanism for a magnetic core.

5. A small wireless power supply magnetic core structure according to claim 4, characterized in that, The application relates to a heat dissipation mechanism for a magnetic core.

6. A small wireless power supply magnetic core structure according to claim 5, wherein The application relates to a heat dissipation mechanism for a magnetic core.

7. A small wireless power supply magnetic core structure according to claim 6, characterized in that, The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application relates to a heat dissipation mechanism for a magnetic core. The application