Force control mechanism for semiconductor packaging

Abstract

The utility model relates to the technical field of semiconductor packaging equipment, in particular to a force control mechanism for semiconductor packaging, which comprises a fixed seat, a power component, a pressure component and a flexible hinge component. The power assembly comprises a ball guide rail assembly and a large voice coil motor, the ball guide rail assembly is arranged on the fixing base, a Z-direction mover plate is arranged on the ball guide rail assembly in a sliding mode, a stator fixing plate of the large voice coil motor is connected to the upper end of the fixing base, and a mover fixing plate of the large voice coil motor is fixedly arranged on the Z-direction mover plate; the pressure assembly comprises a small voice coil motor and a lower pressing plate, the upper end of the small voice coil motor is arranged at the right upper end of the Z-direction mover plate, and the lower pressing plate is arranged at the lower end of the small voice coil motor; the flexible hinge assembly comprises a plate spring connecting base and a plate spring fixing base, the right end of the plate spring connecting base is connected to the lower portion of the middle of the small voice coil motor, the plate spring fixing base is fixed to the Z-direction mover plate, and a plate spring pressing block, an upper plate spring and a lower plate spring are fixed to the upper end of the plate spring connecting base and the upper end of the plate spring fixing base through fastening screws.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging equipment relates to a force control mechanism for semiconductor packaging. BACKGROUND

[0002] The development of semiconductor equipment presents a market scale that continues to expand, especially in recent years, driven by the rapid development of terminal applications such as smart phones, consumer electronics, data centers, and the vigorous development of artificial intelligence computing, the semiconductor equipment industry has entered a period of overall rise. However, as demand increases, the speed and accuracy requirements of the equipment are also gradually increasing, and the cost control of the chip is also increasingly high. Higher speed (UPH) can increase the output of the equipment, and higher accuracy can improve the pass rate of the chip, and these two requirements are the core factors of reducing the cost of the chip.

[0003] Traditional packaging equipment generally has one or two bonding heads, which causes a bottleneck in the improvement of the UPH of the equipment. In order to improve the UPH, it can only develop in the direction of more bonding heads. The force control mechanism is a key mechanism for chip bonding in the packaging equipment, and the accuracy of the force control mechanism determines the success or failure of chip bonding. Since bonding requires the application of bonding force, the bonding head must have the function of force control, and in order to improve the UPH of the equipment, the weight of the bonding head must also be strictly controlled, and lighter mass can provide faster speed. In the existing technology, one bonding head is generally equipped with one force control mechanism, which increases the weight of the bonding head. Even if there are multiple bonding heads, the speed cannot be fast, and in order to achieve faster speed, the bonding head needs to be lightened.

[0004] There is also an external force control mechanism for one-to-many bonding heads in the existing technology, but the pressure control guide of this mechanism uses a ball guide, a cross roller guide, or a linear bushing structure. Although it can also achieve the requirement of high UPH, as long as it is a mechanical guide, there will be the influence of friction, and the change of friction is random, which cannot be completely eliminated or compensated, but if there is a higher accuracy and stability requirement, the current mechanism cannot meet the requirement well. UTILITY MODEL CONTENTS

[0005] The utility model discloses a force control mechanism for semiconductor packaging to solve the prior art problems.

[0006] The utility model discloses a force control mechanism for semiconductor packaging to solve the prior art problems.

[0007] The power assembly comprises a ball guide rail assembly and a large voice coil motor, the ball guide rail assembly is arranged on the fixed seat, a Z-direction moving plate is arranged on the ball guide rail assembly, a stator fixing plate of the large voice coil motor is connected to the upper end of the fixed seat, and a mover fixing plate of the large voice coil motor is fixedly arranged on the Z-direction moving plate;

[0008] The pressure assembly comprises a small voice coil motor and a lower pressing plate, the upper end of the small voice coil motor is arranged at the upper right end of the Z-direction moving plate, and the lower pressing plate is arranged at the lower end of the small voice coil motor.

[0009] The flexible hinge assembly comprises a leaf spring connecting seat and a leaf spring fixing seat, the right end of the leaf spring connecting seat is connected below the middle part of the small voice coil motor, the leaf spring fixing seat is fixed on the Z-direction moving plate, the upper end of the leaf spring connecting seat and the upper end of the leaf spring fixing seat are sequentially fixed with a leaf spring pressing block and an upper leaf spring downward through fastening screws, and the lower end of the leaf spring connecting seat and the lower end of the leaf spring fixing seat are sequentially fixed with another set of leaf spring pressing blocks and lower leaf springs upward through fastening screws.

[0010] The large voice coil motor stator of the large voice coil motor is arranged on the stator fixing plate, the large voice coil motor mover of the large voice coil motor is arranged on the mover fixing plate, the small voice coil motor mover of the small voice coil motor is arranged at the upper right end of the Z-direction moving plate, the small voice coil motor stator of the small voice coil motor is arranged at the upper right end of the leaf spring connecting seat, and the stator fixing plate is further connected with a fixing piece reinforcing rib, and the fixing piece reinforcing rib is connected to the fixed seat.

[0011] Further improvement, the large voice coil motor is provided with a monitoring mechanism one, the monitoring mechanism one comprises a large Z reading head support, a large Z reading head, a large Z grating ruler support and a large Z grating ruler, the large Z reading head support is arranged on the stator fixing plate, the large Z reading head is arranged on the large Z reading head support, the large Z grating ruler support is arranged on the Z-direction moving plate, and the large Z grating ruler is arranged on the large Z grating ruler support; the small voice coil motor is provided with a monitoring mechanism two, the monitoring mechanism two comprises a small Z grating ruler support, a small Z grating ruler, a small Z reading head support and a small Z reading head, the small Z grating ruler support is arranged on the leaf spring connecting seat, the small Z grating ruler is arranged on the small Z grating ruler support, the small Z reading head support is arranged on the leaf spring fixing seat, and the small Z reading head is arranged on the small Z reading head support.

[0012] Further improvement, the lower end surface of the fixed seat is further provided with a spring supporting seat, a balance spring is arranged between the mover fixing plate and the spring supporting seat, and a buffer block is arranged on the fixed seat.

[0013] Further improvement, the ball guide rail assembly includes ball guide rail one and ball guide rail two, the Z direction mover plate is arranged on the slider of ball guide rail one and ball guide rail two, the Z direction mover plate cooperates with large voice coil motor and mover fixed plate, and constitutes Z direction operation module;The side surface of the Z direction mover plate is provided with guide rail pre-tightening plate, and the guide rail pre-tightening plate is provided with the top screw opposite ball guide rail two.

[0014] Further improvement, the safety sensor is arranged on the fixed seat, and the light shielding piece is mounted on the Z direction mover plate, and before starting operation, the safety sensor is in the state triggered by the light shielding piece.

[0015] Further improvement, the Z direction mover plate is provided with a heat dissipation assembly, the heat dissipation assembly includes a fan bracket, a fan mounting seat and a fan, the fan bracket is arranged on the Z direction mover plate, the fan mounting seat is arranged on the fan bracket, and the fan is arranged on the fan mounting seat, and the fan is opposite the small voice coil motor.

[0016] Further improvement, the lower end of the plate spring fixed seat is provided with a limiting support, the lower end of the lower pressing plate is provided with a spring upper pull rod, the upper end of the limiting support is provided with a spring lower pull rod, the inside of the lower pressing plate is provided with a pre-tightening spring, the pre-tightening spring is hung on the spring upper pull rod and the spring lower pull rod respectively, the lower pressing plate is provided with a limiting column on the inside of the pre-tightening spring, the upper end of the ball head top screw is provided against the limiting column, and the right side of the limiting support is provided with a locking top screw for fixing the ball head top screw.

[0017] Further improvement, the plate spring connecting seat and the plate spring fixed seat are limited by concave-convex sub-ports.

[0018] Compared with the prior art, the semiconductor packaging force control mechanism has the beneficial effects that:

[0019] The force control mechanism adopts an external installation mode, can separate the force control mechanism and the bonding head, reduces the weight of the bonding head, helps to improve the running speed of the bonding head, and using the external force control mechanism, a plurality of bonding heads can be controlled, is not affected by the number of bonding heads, helps to improve the UPH of the equipment, and reduces the cost of the equipment;The pressure direction of the force control mechanism is mainly realized by the flexible hinge, can realize complete zero friction, and a large and a small two groups of voice coil motors are used to realize fast movement and pressure control respectively, the response speed is fast, the pressure control precision is high, and the demand of high speed and high precision can be met. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the overall appearance of the utility model;

[0021] Figure 2 It is the left side view of the utility model.

[0022] Figure 3 is a right side view of the utility model;

[0023] Figure 4 is a flexible hinge structure diagram in the utility model;

[0024] Figure 5 is a partial view in the utility model;

[0025] Figure 6 the utility model pressure calibration schematic diagram;

[0026] Figure 7 the utility model specific application schematic diagram;

[0027] In the drawing, 1-fixed seat;2-large voice coil motor;201-large voice coil motor stator;202-large voice coil motor dynamic;3-fixed part reinforcing rib;4-stator fixed plate;5-pressing plate;6-limit support;7-dynamic fixed plate;8-balance spring;9-spring support seat;10-safety sensor;11-light barrier;12-guide rail pre-tightening plate;13-cushion block;14-Z direction dynamic plate;15-roller ball guide rail one;16-roller ball guide rail two;17-large Z reading head support;18-large Z grating ruler;19-large Z grating ruler support;20-large Z reading head;21-small voice coil motor;2101-small voice coil motor dynamic;2102-small voice coil motor stator;22-small Z grating ruler support;23-small Z grating ruler;24-small Z reading head;25-small Z reading head support;26-fan;27-fan mounting seat;28-fan support;29-leaf spring connecting seat;30-leaf spring fixed seat;31-upper leaf spring;32-lower leaf spring;33-leaf spring pressing block;34-pre-tightening spring;35-spring upper pull rod;36-spring lower pull rod;37-locking top screw;38-ball head top screw;39-limit column;40-bonding head;4001-bonding head 1;4002-bonding head 2;4003-bonding head 3;4004-bonding head 4;4005-bonding head 5;4006-bonding head 6;41-pressure sensor. DETAILED DESCRIPTION

[0028] In the description of the utility model, it needs to be explained that the orientation or position relation indicated by the terms 'center', 'upper', 'lower', 'left', 'right','vertical', 'horizontal', 'inner', 'outer' and the like is based on the orientation or position relation shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as the restriction on the utility model.

[0029] In the description of the utility model, need explanation, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected. For ordinary skilled in the art, can understand the concrete meaning of the above terms in the utility model with specific circumstances.

[0030] The following will be described in conjunction with the embodiments and the accompanying Figure 1 ~Appendix Figure 7 The technical scheme of the utility model is further described.

[0031] Embodiment 1: a force control mechanism for semiconductor packaging, comprising: fixed seat 1, power assembly, pressure assembly and flexible hinge assembly;The power assembly includes ball guide rail assembly and large voice coil motor 2, the ball guide rail assembly is arranged on the fixed seat 1, the ball guide rail assembly is slidably provided with Z direction moving plate 14, the stator fixed plate 4 of the large voice coil motor 2 is connected to the upper end of the fixed seat 1, the moving plate 14 of Z direction is fixedly arranged on the stator fixed plate 7 of the large voice coil motor 2;The pressure assembly includes small voice coil motor 21 and lower pressing plate 5, the upper end of the small voice coil motor 21 is arranged at the right upper end of the Z direction moving plate 14, the lower pressing plate 5 is arranged at the lower end of the small voice coil motor 21, that is, fixedly arranged at the right end lower end of the leaf spring connecting seat 29;The flexible hinge assembly includes leaf spring connecting seat 29 and leaf spring fixed seat 30, the right end of the leaf spring connecting seat 29 is connected to the lower middle part of the small voice coil motor 21, the leaf spring fixed seat 30 is fixed on the Z direction moving plate 14, the upper end of the leaf spring connecting seat 29 and the upper end of the leaf spring fixed seat 30 are sequentially fixed with leaf spring pressing block 33 and upper leaf spring 31 downwards by fastening screw, the lower end of the leaf spring connecting seat 29 and the lower end of the leaf spring fixed seat 30 are sequentially fixed with another set of leaf spring pressing block 33 and lower leaf spring 32 upwards by fastening screw.

[0032] As Figure 1 , Figure 2 , Figure 3 And Figure 4As shown, the large voice coil motor mover 202 is mounted on the mover fixing plate 7, and the large voice coil motor 2 provides a power source for Z direction movement to drive the Z direction mover plate 14, the small voice coil motor 21 and the lower pressing plate 5 to move in the ball guide rail assembly for position control; the small voice coil motor 21 realizes pressure control; the lower pressing plate 5 as the pressure output execution end of the force control mechanism can apply the output force of the force control mechanism to the force receiving end. When the force control mechanism is actually working, the bonding head 40 adsorbs the chip, quickly rotates or moves linearly to the lower side of the lower pressing plate 5, and the force control mechanism applies force to the bonding head 40 through the lower pressing plate 5 to package the chip; the upper plate spring 31 and the lower plate spring 32 can limit the X and Y direction freedom of the flexible hinge, but have no limitation on the Z direction freedom, so the flexible hinge can have a small range of displacement in the Z direction. The elastic deformation of the upper plate spring 31 and the lower plate spring 32 is used for guiding, so there is no friction factor, which is different from the conventional guiding mechanism (roller guide, linear guide) relying on the friction guiding of the rolling ball / rolling ball, reduces the influence of friction, and can better improve the force control precision. Instead of directly using fastening screws for fixation, the upper plate spring 31 and the lower plate spring 32 are fixed by the plate spring pressing block 33, which can increase the contact area of the locking force, thereby improving the stability of the plate spring fixation, and prolonging the service life of the flexible hinge.

[0033] The design adopts two sets of driving mechanisms of the large voice coil motor 2 and the small voice coil motor 21, the large voice coil motor 2 provides running power, and the small voice coil motor 21 provides force control pressure, each performs its own function, can work in parallel, makes the mechanism run faster and adjust more sensitively, avoids the problems of serial control, slow time and low efficiency of force-position conversion of a set of driving mechanism; the force control mechanism adopts the small voice coil motor 21 design, the small voice coil motor 21 provides upward or downward output force according to the direction of the input current, the upward force can be used to balance the gravity of the mechanism, can reduce the requirements for the strength and precision of the lower connecting lower pressing plate and other mechanical structures, and reduces the error caused by gravity; the downward force of the voice coil motor can be used to control the contact force between the execution component and the processed part or the product to be tested, through accurate control of the current, the size of the downward force can be adjusted in real time, to ensure the stability and accuracy of the contact force; at the same time, the electrical signal can be quickly changed, the adjustment response speed is faster, and variable force control can be realized during operation; the guiding function is realized by the elastic deformation of the plate spring, which has no friction, simple mechanism and high control precision; compared with the conventional guiding mechanism, the flexible hinge does not need to be maintained, lubricated and has high stability.

[0034] The force control mechanism can realize one-to-many bonding heads, is not limited by the number of bonding heads, simplifies the force control mechanism of the bonding head, has lighter quality, faster running speed, and can better improve the UPH capacity of the whole equipment.

[0035] The large voice coil motor stator 201 of the large voice coil motor 2 is arranged on the stator fixing plate 4, and the large voice coil motor rotor 202 of the large voice coil motor 2 is arranged on the rotor fixing plate 7; the small voice coil motor rotor 2101 of the small voice coil motor 21 is arranged on the upper right end of the Z-direction rotor plate 14, and the small voice coil motor stator 2102 of the small voice coil motor 21 is arranged on the upper right end of the leaf spring connecting seat 29; the lower pressing plate 5 is arranged on the lower end of the right end of the leaf spring connecting seat 29; and the stator fixing plate 4 is further connected with the fixing piece reinforcing rib 3, and the fixing piece reinforcing rib 3 is connected with the fixing seat 1.

[0036] As shown in Figure 1 and Figure 3 The large voice coil motor rotor 202 is arranged on the rotor fixing plate 7, and the large voice coil motor 2 provides a power source for Z-direction movement, which can ensure high-speed movement of the force control mechanism; the small voice coil motor 21 is an output force mechanism of the force control mechanism, and when energized, a certain amount of heat is generated; the small voice coil motor rotor 2101 and the small voice coil motor stator 2102 are arranged in reverse, and the heat source is placed away from the pressure output execution end, which can effectively reduce the temperature change of the lower pressing plate 5, thereby reducing the thermal deformation of the lower pressing plate 5; additionally, ceramic, asbestos or other heat insulation materials can be arranged between the upper and lower ends of the small voice coil motor 21 and the connected parts, which can also reduce the thermal deformation; and the fixing piece reinforcing rib 3 can increase the rigidity and stability of the stator fixing plate 4.

[0037] As a further preferred embodiment, the large voice coil motor 2 is provided with a monitoring mechanism I, which includes a large Z reading head support 17, a large Z reading head 20, a large Z grating ruler support 19 and a large Z grating ruler 18; the large Z reading head support 17 is arranged on the stator fixing plate 4, the large Z reading head 20 is arranged on the large Z reading head support 17, the large Z grating ruler support 19 is arranged on the Z-direction rotor plate 14, and the large Z grating ruler 18 is arranged on the large Z grating ruler support 19; the small voice coil motor 21 is provided with a monitoring mechanism II, which includes a small Z grating ruler support 22, a small Z grating ruler 23, a small Z reading head support 25 and a small Z reading head 24; the small Z grating ruler support 22 is arranged on the leaf spring connecting seat 29, the small Z grating ruler 23 is arranged on the small Z grating ruler support 22, the small Z reading head support 25 is arranged on the leaf spring fixing seat 30, and the small Z reading head 24 is arranged on the small Z reading head support 25.

[0038] As shown in Figure 3 The large Z reading head 20 does not move with the up-down movement of the force control mechanism, and the large Z grating ruler 18 and the large Z grating ruler support 19 move with the up-down movement of the force control mechanism; through the relative movement of the large Z grating ruler 18 and the large Z reading head 20, the running distance of the force control mechanism can be accurately fed back;

[0039] When the lower pressing plate 5 at the lower end of the small voice coil motor 21 contacts a hard object and cannot run downward, it will push the lower pressing plate 5 upward, at which time the small Z reading head 24 will have a signal change. From the start of the signal change of the large Z reading head 20 to the signal change of the small Z reading head 24, the distance of this section of travel represents the height detection value of the force control mechanism. The design of the small Z grating ruler 23 and the small Z reading head 24 not only can be used as a height detection function, but also can be used as an alarm device for monitoring abnormal Z height during bonding, such as chip stacking, foreign matter on the chip, and bonding head 40 jamming. After the first height detection is completed, the force control mechanism will move in the Z direction according to the height detection value. When the chip is stacked, there is foreign matter on the chip, or the bonding head 40 is jammed, the large voice coil motor 2 will still run the displacement of the height detection value, but because the height of the object contacted by the lower pressing plate 5 below has changed, the feedback signal of the small Z reading head 24 will also deviate from the normal feedback signal, thus giving a different alarm output. According to the actual situation, the feedback signal value of the small Z reading head 24 will be set to a certain range to determine whether it is a true abnormal situation.

[0040] As a further preferred embodiment, the lower end surface of the fixed seat 1 is further provided with a spring support seat 9, and a balance spring 8 is arranged between the mover fixing plate 7 and the spring support seat 9. A buffer block 13 is arranged on the fixed seat 1.

[0041] As shown in Figure 1 , the balance spring 8 is used to balance the Z-direction movement mass of the force control mechanism. When the large voice coil motor 2 is not powered, the Z-direction movement part of the force control mechanism can be pushed to a high position to avoid collision between the force control mechanism and other mechanisms, ensuring safety. The lower pressing plate 5 serves as the pressure output execution end of the force control mechanism, and can apply the output force of the force control mechanism to the force receiving end. The buffer block 13 serves as a buffer when the balance spring 8 pushes the mechanism upward, so as to prevent the large voice coil motor stator 201 and the large voice coil motor mover 202 from colliding and causing damage to the large voice coil motor 2.

[0042] As a further preferred embodiment, the ball guide rail assembly includes a ball guide rail one 15 and a ball guide rail two 16, and the Z-direction mover plate 14 is arranged on the sliders of the ball guide rail one 15 and the ball guide rail two 16. The Z-direction mover plate 14 cooperates with the large voice coil motor 2 and the mover fixing plate 7 to form a Z-direction running module. The side surface of the Z-direction mover plate 14 is provided with a guide rail pre-tightening plate 12, and the guide rail pre-tightening plate 12 is provided with a top screw facing the ball guide rail two 16.

[0043] As shown in Figure 2 , the parallelism of the running of the two guide rails is ensured by measuring with a micrometer. The ball guide rail two 16 is pre-tightened by the top screw, which improves the rigidity of the guide rail installation and thus improves the stability of the entire mechanism.

[0044] As a further preferred embodiment, the fixed seat 1 is provided with a safety sensor 10, and the Z-direction moving plate 14 is provided with a light blocking piece 11. Before starting operation, the safety sensor 10 is in a state triggered by the light blocking piece 11.

[0045] As shown in Figure 2 Since the main function of the force control mechanism is to provide pressure by pressing down, the pressed mechanism must be operated to the specified position before the force control mechanism can be operated downward, otherwise the risk of collision will occur. Therefore, in order to ensure the safety of the mechanism, the pressed mechanism needs to be operated to the specified position before starting operation, so that the safety sensor 10 is in a state triggered by the light blocking piece 11. The safety sensor 10 and the light blocking piece 11 play a guaranteeing role in this way

[0046] As a further preferred embodiment, the Z-direction moving plate 14 is provided with a heat dissipation assembly, which includes a fan bracket 28, a fan mounting seat 27 and a fan 26. The fan bracket 28 is arranged on the Z-direction moving plate 14, the fan mounting seat 27 is arranged on the fan bracket 28, and the fan 26 is arranged on the fan mounting seat 27. The fan 26 is arranged opposite to the small voice coil motor 21.

[0047] As shown in Figure 3 The small voice coil motor generates heat when it works. Since the thermal deformation caused by heat will affect the force control accuracy, the fan 26 in the heat dissipation module blows air to the small voice coil motor to accelerate the air flow around the heat source, thereby dissipating heat, reducing thermal deformation of the force control mechanism, and improving the accuracy of pressure control.

[0048] As a further preferred embodiment, the lower end of the plate spring fixed seat 30 is provided with a limiting bracket 6, the lower end of the pressing plate 5 is provided with a spring upper pull rod 35, the upper end of the limiting bracket 6 is provided with a spring lower pull rod 36, the inside of the pressing plate 5 is provided with a pre-tightening spring 34, the pre-tightening spring 34 is respectively hung on the spring upper pull rod 35 and the spring lower pull rod 36, the pressing plate 5 is provided with a limiting column 39 inside the pre-tightening spring 34, the upper end of the ball head top wire 38 is arranged against the limiting column 39, and the right side of the limiting bracket 6 is provided with a locking top wire 37 for fixing the ball head top wire 38.

[0049] As shown in Figure 5As shown, the setting of the limiting support 6 can be used to determine the height position of the lower pressing plate 5 and ensure that the flexible hinge is in a balanced state when not working, reducing the stress deformation inside the flexible hinge; the pre-tightening spring 34 can provide an initial pre-pressure to the force control mechanism; by adjusting the ball head top screw 38 up and down, the height of the lower pressing plate 5 is adjusted, so that the leaf spring is in a horizontal and stress-free state when not working, which can effectively ensure the elastic life of the leaf spring; after the height adjustment of the ball head top screw 38 is completed, the locking top screw 37 is used to lock on the side to ensure that the state of the ball head top screw 38 does not change.

[0050] As a further preferred embodiment, the leaf spring connecting seat 29 and the leaf spring fixing seat 30 are limited by concave-convex sub-port settings. As shown in Figure 4 As shown, the convex of the leaf spring fixing seat 30 is matched and set in the groove of the leaf spring connecting seat 29, which avoids abnormality during assembly or debugging, causing excessive shape deformation of the leaf spring and damage.

[0051] As shown in Figures 1 to 7 As shown, the force control mechanism corrects the pressure method and principle:

[0052] The lower pressing plate 5 is placed with a bonding head 40, and below the bonding head is a pressure sensor 41.

[0053] Benefit S1: Initial positioning and height detection: the force control mechanism goes down to make the lower pressing plate 5 push the bonding head 40 to move downward, and after the bonding head 40 contacts the pressure sensor 41 (the pressure sensor 41 is fixedly installed and does not change in height), the large-sound coil motor 2 continues to drive the mechanism to go down;

[0054] S2: Record the height detection value: since the pressure sensor 41 does not move, the lower pressing plate 5 will be pushed upward, the small Z reading head 24 signal changes, and the system records the running displacement of the large-sound coil motor 2 at this time as the height detection value;

[0055] S3: Pressure correction preparation: according to the recorded height detection value, the position of the force control mechanism is adjusted to ensure that the bonding head 40 can accurately press on the pressure sensor 41;

[0056] S4: Real-time pressure feedback and adjustment: the lower plate 5 continues to press the bonding head 40, which is pressed on the pressure sensor 41, the pressure sensor 41 feeds back the pressure value in real time, and the small voice coil motor 21 adjusts the output force by adjusting the current value according to the pressure value fed back by the pressure sensor 41, so as to achieve the required accurate pressure value; (the output pressure of the force control mechanism is mainly composed of the output force of the small voice coil motor 21, the gravity of the mechanism, the elastic force of the flexible hinge and the pre-tightening spring 34, and the friction of the mechanism, wherein the output force of the voice coil motor 21 and the gravity of the mechanism are constant forces, and given parameters will not change, the elastic force of the flexible hinge and the pre-tightening spring 34 is affected by displacement change, and the influence is controlled by controlling thermal deformation, and the design adopts a flexible leaf spring, and the friction is zero, so that the force control precision can be effectively improved).

[0057] S5: complete pressure correction: when the pressure value fed back by the pressure sensor 41 reaches the set value, the small voice coil motor 21 maintains the current current value, stabilizes the pressure, and completes the pressure correction process.

[0058] The above describes the preferred embodiments of the present application. It should be understood that those skilled in the art can make many modifications and changes without creative labor according to the concept of the present application. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment on the basis of the prior art according to the concept of the present application shall be within the protection scope defined by the claims.

Claims

1. A force control mechanism for a semiconductor package, characterized by, The utility model relates to a kind of flexible hinge assembly, including fixed seat, power component, pressure component and flexible hinge assembly; The power component includes ball guide rail assembly and large voice coil motor, the ball guide rail assembly is arranged on the fixed seat, Z direction mover plate is slidably arranged on the ball guide rail assembly, the stator fixed plate of the large voice coil motor is connected to the upper end of the fixed seat, the mover fixed plate of the large voice coil motor is fixedly arranged on the Z direction mover plate; The pressure component includes small voice coil motor and lower pressing plate, the upper end of the small voice coil motor is arranged at the right upper end of the Z direction mover plate, and the lower pressing plate is arranged at the lower end of the small voice coil motor; The flexible hinge assembly includes leaf spring connecting seat and leaf spring fixed seat, the right end of the leaf spring connecting seat is connected below the middle of the small voice coil motor, the leaf spring fixed seat is fixed on the Z direction mover plate, the upper end of the leaf spring connecting seat and the upper end of the leaf spring fixed seat are sequentially fixed with leaf spring pressing block and upper leaf spring by fastening screw downwards, the lower end of the leaf spring connecting seat and the lower end of the leaf spring fixed seat are sequentially fixed with another set of leaf spring pressing block and lower leaf spring by fastening screw upwards; The large voice coil motor stator of the large voice coil motor is arranged on the stator fixed plate, and the large voice coil motor mover is arranged on the mover fixed plate;The small voice coil motor mover of the small voice coil motor is arranged at the right upper end of the Z direction mover plate, and the small voice coil motor stator is arranged at the right upper end of the leaf spring connecting seat;The stator fixed plate is also connected with a fixed part reinforcing rib, and the fixed part reinforcing rib is connected to the fixed seat. The large voice coil motor is provided with monitoring mechanism one, and the monitoring mechanism one includes large Z reading head support, large Z reading head, large Z grating ruler support and large Z grating ruler, the large Z reading head support is arranged on the stator fixed plate, the large Z reading head is arranged on the large Z reading head support, the large Z grating ruler support is arranged on the Z direction mover plate, and the large Z grating ruler is arranged on the large Z grating ruler support;The small voice coil motor is provided with monitoring mechanism two, and the monitoring mechanism two includes small Z grating ruler support, small Z grating ruler, small Z reading head support and small Z reading head, the small Z grating ruler support is arranged on the leaf spring connecting seat, the small Z grating ruler is arranged on the small Z grating ruler support, the small Z reading head support is arranged on the leaf spring fixed seat, and the small Z reading head is arranged on the small Z reading head support.

2. The force control mechanism for a semiconductor package according to claim 1, wherein The lower end surface of the fixed seat is also provided with spring support seat, the balance spring is arranged between the mover fixed plate and the spring support seat, and the buffer block is arranged on the fixed seat.

3. The force control mechanism for semiconductor package according to claim 1, wherein The ball guide rail assembly includes ball guide rail one and ball guide rail two, the Z direction mover plate is arranged on the slider of the ball guide rail one and the ball guide rail two, the Z direction mover plate cooperates with the large voice coil motor and the mover fixed plate, and constitutes Z direction operation module;The side surface of the Z direction mover plate is provided with guide rail pre-tightening plate, and the top wire opposite to the ball guide rail two is arranged on the guide rail pre-tightening plate.

4. The force control mechanism for semiconductor package according to claim 1, wherein The safety sensor is arranged on the fixed seat, and the light barrier is mounted on the Z direction mover plate, and before starting operation, the safety sensor is in the state triggered by the light barrier.

5. The force control mechanism for a semiconductor package according to claim 1, wherein ​ 6. The force control mechanism for a semiconductor package according to claim 1, wherein The Z-direction moving plate is provided with a heat dissipation assembly, the heat dissipation assembly comprises a fan support, a fan mounting seat and a fan, the fan support is arranged on the Z-direction moving plate, the fan mounting seat is arranged on the fan support, and the fan is arranged on the fan mounting seat.

7. The force control mechanism for semiconductor package according to claim 1, wherein The lower end of the plate spring fixing seat is provided with a limiting support, the lower end of the pressing plate is provided with a spring upper pull rod, the upper end of the limiting support is provided with a spring lower pull rod, the inside of the pressing plate is provided with a pre-tightening spring, the pre-tightening spring is respectively hung on the spring upper pull rod and the spring lower pull rod, the pressing plate is provided with a limiting column on the inside of the pre-tightening spring, the upper end of the limiting support is provided with a ball head top screw, the upper end of the ball head top screw abuts against the limiting column, and the right side of the limiting support is provided with a locking top screw for fixing the ball head top screw.

8. The force control mechanism for semiconductor package according to claim 1, wherein The plate spring connecting seat and the plate spring fixing seat are limitedly arranged through concave-convex sub-ports.

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