Cleaning and overturning equipment

Abstract

The utility model relates to the technical field of wafer processing, and relates to a cleaning and overturning device. According to the utility model, the wafer product is conveyed to the positioning jig by the belt line, and after the wafer product is positioned by the jig frame, the rotating mechanism drives the positioning jig and the wafer product on the positioning jig to rotate, so that the spraying cleaning angle of the wafer product can be changed, the cleaning surface can be enlarged, and the cleaning efficiency can be improved; impurities in a small-area irregular area can be rapidly cleaned, the jig frame is arranged on the avoiding open groove in a penetrating mode so that the jig frame can synchronously clean the surface of a wafer product online, and the cleaning efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field relates to a cleaning turnover equipment. BACKGROUND

[0002] Wafer cleaning is a crucial step in the semiconductor manufacturing process, used to remove contaminants and impurities on the surface of the wafer. The quality of wafer cleaning directly affects the performance and yield of semiconductor devices. The current wafer cleaning equipment generally positions the upper and lower surfaces of the wafer for cleaning. Limited by the space of the wafer cleaning equipment, the cleaning effect of the wafer edge is limited, and the impurities in the small area irregular area cannot be cleaned completely. After cleaning, there are still particles and other contaminants on the wafer edge, affecting the cleaning effect. SUMMARY

[0003] The technical problem to be solved by the utility model is to provide a cleaning turnover equipment that can change the spray cleaning angle of wafer products, increase the cleaning surface, improve the cleaning efficiency, and clean the surface of wafer products online.

[0004] To solve the above technical problems, the utility model adopts the technical scheme of:

[0005] A cleaning turnover equipment, comprising:

[0006] A conveying track comprising a conveying frame, the conveying frame having a belt line on both sides, the belt line being used to convey wafer products;

[0007] A positioning jig is arranged on the conveying frame, the positioning jig comprising a jig frame, the jig frame being provided with a positioning station for positioning wafer products;

[0008] A rotating mechanism is drivingly connected to the positioning jig, the rotating mechanism being used to rotate the positioning jig;

[0009] The conveying frame is provided with a clearance slot matched with the jig frame, and the jig frame is arranged in the clearance slot.

[0010] In one embodiment of the utility model, the jig frame is provided with a plurality of support plates for supporting wafer products, and the jig frame is provided with a positioning block and a limiting block on both sides, which are used to position the two sides of the wafer products.

[0011] In one embodiment of the utility model, the limiting block is provided with a slot, the slot is provided with a clamping block, a guide rod is arranged through the slot, the guide rod is connected with the clamping block, a spring is arranged on the guide rod, one end of the spring is abutted with the clamping block, and the other end is abutted with the slot, and a pressing block is arranged on the extending end of the clamping block.

[0012] In one embodiment of the utility model, the pressing block and the limiting block are provided with positioning inclined surfaces, and the positioning inclined surfaces are oppositely arranged with the wafer product.

[0013] In one embodiment of the utility model, the rotating mechanism comprises two rotating frames, the two rotating frames are arranged on the two sides of the conveying track respectively, a rotating shaft is arranged on the positioning jig, the rotating shaft is arranged on the bearing seat of the rotating frame, the rotating shaft is drivingly connected with the rotating motor, and the rotating motor drives the positioning jig connected with the rotating shaft to rotate.

[0014] In one embodiment of the utility model, the belt line comprises rotating wheels, the rotating wheels are arranged on the conveying frame, the adjacent rotating wheels are connected through conveying belts, and the rotating wheels are drivingly connected with the conveying motor.

[0015] In one embodiment of the utility model, the positioning jig is provided with a pressing assembly, the pressing assembly comprises a pressing frame, a guide rod is arranged on the pressing frame, a guide sleeve is arranged on the jig frame, the guide rod is connected with a pressing block by being arranged through the guide sleeve, and the conveying frame is provided with a supporting block matched with the pressing block.

[0016] In one embodiment of the utility model, the conveying frame is provided with a material lifting frame, the material lifting frame is provided with a material lifting plate, and the material lifting plate is oppositely arranged with the pressing frame.

[0017] In one embodiment of the utility model, the material lifting frame is provided with a mounting seat, the mounting seat is provided with a pressing spring, and a free end of the pressing spring is connected with the pressing frame.

[0018] In one embodiment of the utility model, the pressing block is provided with a pressing inclined surface, and the pressing inclined surface is provided with an anti-skid pattern.

[0019] The utility model discloses beneficial effects:

[0020] The utility model discloses a belt line is transmitted to the wafer product on the positioning fixture, and the fixture frame is positioned to the wafer product, and the rotating mechanism drives the positioning fixture and the wafer product on it to rotate, can change the spray cleaning angle of wafer product, can increase the cleaning surface, improves the cleaning efficiency, can clean the impurity in the small area irregular area fast, and the fixture frame is arranged on the avoidance slot, so that it can be cleaned to the surface of wafer product in line, greatly improves the cleaning efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0021] Fig. 1 It is a cleaning turnover equipment schematic view of the utility model.

[0022] Fig. 2 It is a positioning fixture schematic view of the utility model.

[0023] Fig. 3 It is a conveying track schematic view of the utility model.

[0024] Mark number explanation: 1, conveying frame;11, belt line;12, rotating wheel;13, conveying belt;14, conveying motor;2, positioning fixture;21, fixture frame;22, support plate;23, positioning block;24, limiting block;25, clamping block;26, guide rod;27, abutting block;28, positioning inclined plane;3, avoidance slot;4, pressing assembly;41, pressing frame;42, guide rod;43, pressing block;44, ejector frame;45, ejector plate;46, pressing spring;5, rotating shaft;51, rotating frame;6, supporting block;7, wafer product. DETAILED DESCRIPTION

[0025] The utility model makes further explanation in combination with the drawings and specific embodiment to make the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model.

[0026] Referring to Figs. 1-3 The cleaning turnover equipment shown in the figure, comprising:

[0027] Conveying track, including conveying frame 1, the conveying frame 1 both sides are provided with belt line 11, and the belt line 11 is used to transmit wafer product 7;

[0028] Positioning fixture 2, set up in conveying frame 1, the positioning fixture 2 includes fixture frame 21, and the fixture frame 21 is provided with the positioning station for positioning wafer product 7;

[0029] Rotating mechanism, with the drive connection of positioning fixture 2, the rotating mechanism is used to drive positioning fixture 2 rotates;

[0030] The conveying frame 1 is provided with an avoiding slot 3 matched with the jig frame 21, and the jig frame 21 is arranged on the avoiding slot 3.

[0031] The belt line 11 of the utility model transmits the wafer product 7 to the positioning jig 2, the jig frame 21 positions the wafer product 7, and the rotating mechanism drives the positioning jig 2 and the wafer product 7 thereon to rotate, which can change the spray cleaning angle of the wafer product 7, can increase the cleaning surface, improve the cleaning efficiency, can quickly clean the impurities in the small area irregular area, the jig frame 21 is arranged on the avoiding slot 3, so that the surface of the wafer product 7 can be cleaned synchronously, and the cleaning efficiency is greatly improved.

[0032] In one embodiment of the utility model, the jig frame 21 is provided with a plurality of support plates 22 for supporting the wafer product 7, and the jig frame 21 is provided with a positioning block 23 and a limiting block 24 on both sides, respectively, the two sides of the wafer product 7 are positioned by the positioning block 23 and the limiting block 24, and the jig frame 21 can conveniently spray the upper and lower surfaces of the wafer product 7, improving the spray efficiency.

[0033] In one embodiment of the utility model, the limiting block 24 is provided with a slot, the slot is provided with a clamping block 25, a guide rod 26 is arranged on the slot, the guide rod 26 is connected with the clamping block 25, a spring is arranged on the guide rod 26, one end of the spring is abutted with the clamping block 25, the other end is abutted with the slot, and a pressing block 27 is arranged on the protruding end of the clamping block 25.

[0034] Specifically, the jig frame 21 is separated from the avoiding slot 3, the wafer product 7 is blanked between the positioning block 23 and the limiting block 24, the two sides of the wafer product 7 are positioned by the positioning block 23 and the limiting block 24, the side edge of the wafer product 7 compresses the spring so that the pressing block 27 on the clamping block 25 is tightly pressed on the side surface of the wafer product 7, the wafer product 7 can be quickly positioned, and the positioning accuracy is improved.

[0035] In one embodiment of the utility model, the pressing block 27 and the limiting block 24 are both provided with a positioning inclined surface 28, and the positioning inclined surface 28 is arranged opposite to the wafer product 7.

[0036] Specifically, the positioning inclined surface 28 can guide the wafer product 7 during blanking, ensure that the wafer product 7 is accurately blanked on the support plate 22 of the jig frame 21, and improve the positioning accuracy.

[0037] In an embodiment of the utility model, the rotating mechanism includes two rotating frames 51, two rotating frames 51 are arranged on the two sides of the conveying track respectively, the locating fixture 2 is provided with a rotating shaft 5, the rotating shaft 5 is rotatably arranged on the bearing seat of rotating frame 51, the rotating shaft 5 is drivenly connected with the rotating motor, the rotating motor drives the rotating of the locating fixture 2 connected with the rotating shaft 5.

[0038] Specifically, during the cleaning process, the rotating motor drives the rotating of the locating fixture 2 connected with the rotating shaft 5, which can greatly increase the spraying area, is suitable for cleaning of wafer products 7 of various specifications, greatly improves the cleaning efficiency, and has a wide range of applications.

[0039] In an embodiment of the utility model, the belt line 11 includes rotating wheels 12, the rotating wheels 12 are arranged on the conveying frame 1, adjacent rotating wheels 12 are connected through conveying belts 13, the rotating wheels 12 are drivenly connected with the conveying motor 14, the wafer products 7 are placed on the conveying belts 13, the conveying motor 14 drives the rotating of the rotating wheels 12 to drive the conveying of the conveying belts 13 to the wafer products 7, and the conveying efficiency is high.

[0040] In an embodiment of the utility model, the locating fixture 2 is provided with a pressing assembly 4, the pressing assembly 4 includes a pressing frame 41, the pressing frame 41 is provided with a guide rod 42, the jig frame 21 is provided with a guide sleeve, the guide rod 42 penetrates through the guide sleeve and is connected with a pressing block 43, and the conveying frame 1 is provided with a supporting block 6 matched with the pressing block 43. The conveying frame 1 moves downward, the guide rod 42 moves downward along the guide sleeve under the driving of the pressing spring 46, the pressing block 43 is pressed on the jig frame 21 when the jig frame 21 is separated from the avoiding slot 3, so that the other two sides of the wafer product 7 are pressed and positioned.

[0041] In an embodiment of the utility model, the conveying frame 1 is provided with a material lifting frame 44, the material lifting frame 44 is provided with a material lifting plate 45, and the material lifting plate 45 is arranged opposite to the pressing frame 41.

[0042] Specifically, after the cleaning is completed, the conveying frame 1 moves upward under the driving of the reciprocating lifting equipment, the jig frame 21 penetrates through the avoiding slot 3, the material lifting plate 45 is arranged opposite to the pressing frame 41, the pressing frame 41 is lifted, the pressing block 43 abuts against the supporting block 6, the wafer product 7 falls on the conveying belt 13, the pressing block 43 can be separated from the wafer product 7 by upwardly pushing the pressing frame 41, and the wafer product 7 can be normally conveyed.

[0043] In an embodiment of the utility model, the top material frame 44 is provided with a mounting seat, the mounting seat is provided with a material pressing spring 46, the free end of material pressing spring 46 is connected with the pressing frame 41, the conveying frame 1 moves downward, under the drive of material pressing spring 46, the pressing block 43 is always pressed against the wafer product 7, the positioning effect is guaranteed, and the setting of material pressing spring 46 can always provide pressing force during the rotation of jig frame 21, the positioning accuracy of the rotating posture is guaranteed.

[0044] In an embodiment of the utility model, the pressing block 43 is provided with a pressing inclined surface, the pressing inclined surface is provided with anti-skid lines, the pressing inclined surface can press and position the side of wafer product 7, the anti-skid lines can guarantee that wafer product 7 does not displace during the cleaning and rotation, and the positioning effect is guaranteed.

[0045] Use process

[0046] The wafer product 7 is placed on the conveying belt 13, the conveying motor 14 drives the rotating wheel 12 to rotate to drive the conveying belt 13 to transmit the wafer product 7, the transmission is stopped when the wafer product 7 is transmitted to the front of the positioning jig 2, the conveying frame 1 is drivingly connected with the cylinder, oil cylinder and other reciprocating lifting equipment, the reciprocating lifting equipment drives the conveying frame 1 to move downward to the positioning jig 2, the opposite jig frame 21 moves upward through the avoiding slot 3, the jig frame 21 is separated from the avoiding slot 3, the wafer product 7 is discharged between the positioning block 23 and the limiting block 24, the positioning block 23 and the limiting block 24 position the two sides of the wafer product 7, the side of the wafer product 7 compresses the spring, the abutting block 27 on the clamping block 25 is pressed against the side of the wafer product 7, the conveying frame 1 moves downward, under the drive of the material pressing spring 46, the guide rod 42 moves downward along the guide sleeve, when the jig frame 21 is separated from the avoiding slot 3, the pressing block 43 is pressed on the jig frame 21, so that the other two sides of the wafer product 7 are pressed and positioned, during the cleaning process, the rotating motor drives the positioning jig 2 connected with the rotating shaft 5 to rotate, so that the wafer product 7 can be cleaned better, after cleaning, the conveying frame 1 moves upward under the drive of the reciprocating lifting equipment, the jig frame 21 is arranged on the avoiding slot 3, the pressing plate 45 is arranged opposite to the pressing frame 41, the pressing frame 41 is lifted to make the pressing block 43 abut against the supporting block 6, the wafer product 7 is discharged on the conveying belt 13, the conveying motor 14 drives the rotating wheel 12 to rotate to drive the conveying belt 13 to transmit the wafer product 7 cleaned.

[0047] The above-described embodiments are only preferred embodiments for fully illustrating the present application, and the protection scope of the present application is not limited thereto. Any equivalent substitutions or transformations made by the skilled in the art based on the present application are within the protection scope of the present application. The protection scope of the present application is subject to the claims.

Claims

1. A cleaning turn around apparatus characterized by, The utility model relates to a wafer conveying device, including: A conveying track including a conveying frame, both sides of the conveying frame are provided with belt lines for conveying wafer products; A positioning jig provided on the conveying frame, the positioning jig including a jig frame, the jig frame is provided with a positioning station for positioning wafer products; A rotating mechanism drivingly connected with the positioning jig, the rotating mechanism is used to drive the positioning jig to rotate; Wherein, the conveying frame is provided with a matched avoiding slot with the jig frame, the jig frame is arranged on the avoiding slot.

2. The cleaning inversion apparatus of claim 1, wherein, The jig frame is provided with a plurality of support plates for supporting wafer products, and the jig frame is provided with a positioning block and a limiting block on both sides, respectively, for positioning both sides of the wafer products.

3. The cleaning inversion apparatus of claim 2, wherein, The limiting block is provided with a slot, the slot is provided with a clamping block, the slot is provided with a guide rod, the guide rod is connected with the clamping block, the guide rod is provided with a spring, one end of the spring is abutted with the clamping block, and the other end is abutted with the slot, the extending end of the clamping block is provided with an abutting block.

4. The cleaning inversion apparatus of claim 3, wherein, The abutting block and the limiting block are both provided with a positioning inclined surface, and the positioning inclined surface is arranged opposite to the wafer product.

5. The cleaning inversion apparatus of claim 1, wherein, The rotating mechanism includes two rotating frames, the two rotating frames are arranged on both sides of the conveying track, respectively, the positioning jig is provided with a rotating shaft, the rotating shaft is arranged on a bearing seat of the rotating frame, the rotating shaft is drivingly connected with a rotating motor, and the rotating motor drives the positioning jig connected with the rotating shaft to rotate.

6. The cleaning inversion apparatus of claim 1, wherein, The belt line includes a rotating wheel, the rotating wheel is arranged on the conveying frame, adjacent rotating wheels are connected through conveying belts, and the rotating wheel is drivingly connected with a conveying motor.

7. The cleaning inversion apparatus of claim 1, wherein, The positioning jig is provided with a pressing assembly, the pressing assembly includes a pressing frame, the pressing frame is provided with a guide rod, the jig frame is provided with a guide sleeve, the guide rod is arranged through the guide sleeve and connected with a pressing block, and the conveying frame is provided with a matched supporting block with the pressing block.

8. The cleaning inversion apparatus of claim 7, wherein, The conveying frame is provided with a material lifting frame, the material lifting frame is provided with a material lifting plate, and the material lifting plate is arranged opposite to the pressing frame.

9. The cleaning inversion apparatus of claim 8, wherein, The material lifting frame is provided with a mounting seat, the mounting seat is provided with a pressing spring, and a free end of the pressing spring is connected with the pressing frame.

10. The cleaning inversion apparatus of claim 7, wherein, The pressing block is provided with a pressing inclined surface, and the pressing inclined surface is provided with an anti-skid pattern.

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