Wafer adsorption head

Abstract

The utility model relates to the technical field of wafer processing, and provides a wafer adsorption head, which comprises a housing assembly, an optical part and a joint assembly, the opening, the mounting hole and the cover opening are communicated with the containing cavity, the opening and the cover opening are oppositely arranged in the optical axis direction of the optical part, and the mounting hole is formed in the peripheral wall of the shell cover assembly; the optical part is detachably arranged in the accommodating cavity; an air suction channel is arranged in the optical part, the first end of the air suction channel is formed at the first end of the optical part, and the second end of the air suction channel is formed on the side face of the optical part. The connector assembly comprises a first connector and a second connector which are communicated with each other, the first connector is bonded to the second end of the air suction channel, and the second connector is detachably connected with the first connector and bonded in the mounting hole. The wafer adsorption head provided by the utility model can reduce the surface shape change of an optical part as much as possible in the assembly process, thereby facilitating the accurate positioning of the wafer by the wafer adsorption head, and achieving the accurate displacement control of the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially relates to a wafer adsorption head. BACKGROUND

[0002] In the wafer processing, usually adopt adsorption head control wafer between different stations and load. In practical application, it is found that the existing adsorption head simple structure, unreasonable design, often in the assembly process optical parts face shape appears change, lead to adsorption head difficult to accurately position wafer, thereby cannot accurately control wafer displacement. UTILITY MODEL CONTENTS

[0003] The utility model provides a kind of wafer adsorption head to at least solve or improve the problem that existing adsorption head cannot accurately control wafer displacement.

[0004] The utility model provides a kind of wafer adsorption head, it include: shell cover subassembly, optical parts and joint subassembly;

[0005] The shell cover subassembly has accommodating cavity and the opening being connected with the accommodating cavity, mounting hole and cover mouth, the opening is oppositely arranged along the optical axis direction of the optical parts with the cover mouth, the mounting hole is located in the peripheral wall of the shell cover subassembly;

[0006] The optical parts are detachably arranged in the accommodating cavity, the first end of the optical parts is oppositely arranged with the opening, and the second end of the optical parts is oppositely arranged with the cover mouth;Suction passage is arranged in the optical parts, and the first end of the suction passage is formed in the first end of the optical parts, and the second end of the suction passage is formed in the side surface of the optical parts;

[0007] The joint subassembly includes the first joint and the second joint being connected, the first joint is bonded in the second end of the suction passage, and the second joint is detachably connected with the first joint and bonded in the mounting hole.

[0008] According to the wafer adsorption head provided by the utility model, the first joint includes the first bonding section and the screw sleeve section being connected, the first bonding section is inserted in the second end of the suction passage and is bonded with the inner wall of the suction passage;

[0009] The second joint includes the screw head section and the second bonding section being connected, the screw head section is inserted in the screw sleeve section and is threadedly connected with the screw sleeve section, and the second bonding section is inserted in the mounting hole and is bonded with the inner wall of the mounting hole.

[0010] According to the wafer adsorption head provided by the utility model, the inner wall of the screw sleeve section and the peripheral wall of the screw head section are further connected by adhesive.

[0011] According to the wafer adsorption head provided by the utility model, the shell cover assembly comprises a cover body and a lock ring; the opening is arranged at the cover top end of the cover body, the cover mouth is arranged at the cover mouth end of the cover body, and the mounting hole is arranged at the side wall of the cover body; and the lock ring is detachably arranged at the cover mouth end.

[0012] The first end of the optical part abuts against the cover top end, and the second end of the optical part abuts against the lock ring.

[0013] According to the wafer adsorption head provided by the utility model, the optical part comprises a first cylinder segment and a second cylinder segment, the first cylinder segment and the second cylinder segment are coaxially connected, and the diameter of the first cylinder segment is smaller than the diameter of the second cylinder segment.

[0014] The first cylinder segment is embedded in the opening, one end of the second cylinder segment facing the first cylinder segment abuts against the cover top end, and the other end of the second cylinder segment away from the first cylinder segment is arranged opposite to the cover mouth and abuts against the lock ring.

[0015] The first end of the air suction channel is formed at one end of the first cylinder segment away from the second cylinder segment, and the second end of the air suction channel is formed at the peripheral wall of the second cylinder segment.

[0016] According to the wafer adsorption head provided by the utility model, the air suction channel comprises a first air suction segment and a second air suction segment in communication;

[0017] The first air suction segment is located in the first cylinder segment and the second cylinder segment and is arranged in the axial direction of the first cylinder segment or the second cylinder segment; and the second air suction segment is located in the second cylinder segment and is arranged in the radial direction of the second cylinder segment.

[0018] According to the wafer adsorption head provided by the utility model, the lock ring is threadedly connected with the cover mouth end, an operation part is arranged on the lock ring, and the operation part is used for receiving external force to drive the lock ring to rotate relative to the cover mouth end.

[0019] According to the wafer adsorption head provided by the utility model, a cover is further arranged, the cover is detachably arranged at the cover mouth end of the cover body, the lock ring is limited between the optical part and the cover, the cover is provided with a light passing port, and the light passing port is arranged opposite to the cover mouth.

[0020] Alternatively, a flexible contact layer is arranged on the inner wall of the cover body, and the flexible contact layer is in contact with the side surface of the optical part.

[0021] The utility model provides a wafer adsorption head further includes positioning pin, the peripheral wall of shell cover subassembly is equipped with positioning hole, the side of optical part is equipped with positioning slot, the first end of positioning pin is bonded in positioning slot, the second end of positioning pin is bonded in positioning hole.

[0022] The utility model provides a wafer adsorption head further includes dust cover, dust cover detachably cover in shell cover subassembly on to with the opening of cover.

[0023] The utility model provides a wafer adsorption head, in the assembly process, can first adopt the glue and bond first joint in the second end of suction passage, then optical part is assembled in the containing cavity of shell cover subassembly, ensure that the second end of suction passage and the mounting hole on shell cover subassembly are opposite arrangement, then, one end of second joint is connected with first joint, the other end of second joint is bonded in mounting hole with glue, this design ensures the air tightness between optical part and first joint, first joint has certain activity margin relative to optical part, and when installing second joint, the acting force on second joint will not directly act on optical part, greatly reduces the influence on the surface shape of optical part due to the installation of second joint, thereby can reduce the surface shape change of optical part as far as possible in the assembly process, the wafer adsorption head is positioned accurately to the wafer, realizes the accurate displacement control to the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will be a simple introduction to the drawings needed to be used in the embodiment or prior art description, obviously, the following description in the drawings is some embodiments of the utility model, for those skilled in the art, without creative labor, other drawings can also be obtained according to these drawings.

[0025] Figure 1 It is one of the structure schematic view of the wafer adsorption head provided by the utility model.

[0026] Figure 2 It is the sectional structure schematic view of the utility model provided Figure 1 .

[0027] Figure 3 It is the sectional structure schematic view of the joint subassembly provided by the utility model.

[0028] Figure 4 It is the second structure schematic view of the wafer adsorption head provided by the utility model.

[0029] Figure 5 It is the structure schematic view of the lock ring provided by the utility model.

[0030] Figure 6 This is a schematic diagram of the structure of the optical component provided by this utility model.

[0031] Figure 7 This utility model provides Figure 6 A cross-sectional structural diagram.

[0032] Figure 8 This is a cross-sectional structural diagram of the cover provided by this utility model.

[0033] Figure label:

[0034] 1. Shell assembly; 11. Shell body; 1101. Flexible contact layer; 12. Locking ring; 1201. Operating part; 101. Opening; 102. Mounting hole; 103. Shell opening; 104. Positioning hole; 105. Receiving cavity;

[0035] 2. Optical components; 21. Air intake channel; 22. Positioning groove; 211. First air intake section; 212. Second air intake section; 201. First cylindrical section; 202. Second cylindrical section;

[0036] 3. Connector assembly; 31. First connector; 311. First adhesive section; 312. Screw sleeve section; 32. Second connector; 321. Screw head section; 322. Second adhesive section;

[0037] 4. Cap; 5. Positioning pin; 6. Dust cover. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0039] The following is combined Figures 1-8 The wafer adsorption head provided by the utility model embodiment will be described in detail through specific embodiments and application scenarios.

[0040] In some embodiments, such as Figure 1 , Figure 2 and Figure 8 As shown, this embodiment of the present invention provides a wafer adsorption head, including: a housing assembly 1, an optical component 2, and a connector assembly 3;

[0041] The shell cover assembly 1 has a containing cavity 105, an opening 101 and a cover opening 103 which are in communication with the containing cavity 105, and a mounting hole 102 which is arranged on the peripheral wall of the shell cover assembly 1;

[0042] The optical component 2 is arranged in the containing cavity 105 in a detachable manner, the first end of the optical component 2 is arranged opposite to the opening 101, and the second end of the optical component 2 is arranged opposite to the cover opening 103; the optical component 2 is internally provided with an air suction channel 21, the first end of the air suction channel 21 is formed on the first end of the optical component 2, and the second end of the air suction channel 21 is formed on the side surface of the optical component 2;

[0043] The joint assembly 3 comprises a first joint 31 and a second joint 32 which are in communication, the first joint 31 is bonded to the second end of the air suction channel 21, the second joint 32 is detachably connected with the first joint 31 and is bonded in the mounting hole 102.

[0044] It can be understood that the optical component 2 can be a quartz component, a sapphire component or a transparent component made of other optical materials with good light transmittance. Alternatively, the optical component 2 is a single quartz component to simplify the processing flow of the optical component 2; of course, the optical component 2 can also adopt an optical cementing component composed of two different quartz components, and the two quartz components of the optical cementing component can be cemented together in an optical cementing manner.

[0045] Exemplarily, the optical component 2 can be arranged in a columnar body, the containing cavity 105 of the shell cover assembly 1 is a columnar cavity, and the shape of the containing cavity 105 is adapted to the outer shape of the optical component 2 to ensure that the optical component 2 is tightly assembled in the containing cavity 105, for example, the diameter of the optical component 2 is 0.03-0.05mm smaller than the inner diameter of the containing cavity 105.

[0046] At the same time, the end surface corresponding to the second end of the optical component 2 is an incident surface, and the end surface corresponding to the first end of the optical component 2 is an exit surface, the 633nm waveband laser interferometer is used for detection, and the transmission integrated surface shape PV of the incident surface and the exit surface is less than λ / 20, and the parallel difference is less than or equal to 20".

[0047] In actual application, the wafer adsorption head is arranged on the execution end of the mechanical arm, the first end of the air suction channel 21 is arranged as an adsorption port, and the second end of the air suction channel 21 is arranged in communication with the negative pressure device through the joint assembly 3; when the wafer is picked up, the position of the wafer adsorption head can be positioned by using the light beam which is vertically incident to the incident surface of the optical component 2, so as to ensure that the adsorption port can reach the coordinate position corresponding to the wafer to be picked up, and then the negative pressure device is started, and the wafer can be sucked by using the negative pressure effect at the adsorption port.

[0048] In the assembling process, the first joint 31 can be first bonded to the second end of the air suction channel 21 by using glue, then the optical component 2 is assembled into the accommodating cavity 105 of the shell assembly 1, the second end of the air suction channel 21 and the mounting hole 102 on the shell assembly 1 are arranged oppositely, then one end of the second joint 32 is connected with the first joint 31, and the other end of the second joint 32 is bonded in the mounting hole 102 by using glue, the design ensures the air tightness between the optical component 2 and the first joint 31, the first joint 31 has a certain movement allowance relative to the optical component 2, and the force on the second joint 32 does not directly act on the optical component 2 when the second joint 32 is installed, so that the influence of the installation of the second joint 32 on the surface shape of the optical component 2 is greatly reduced, the surface shape change of the optical component 2 in the assembling process is reduced as much as possible, the wafer suction head is convenient for accurately positioning the wafer, and accurate displacement control of the wafer is realized.

[0049] In some embodiments, as shown in Figure 2 and Figure 3 The first joint 31 comprises a first bonding section 311 and a screw sleeve section 312 which are connected in communication, the first bonding section 311 is inserted into the second end of the air suction channel 21 and is bonded with the inner wall of the air suction channel 21; the second joint 32 comprises a screw head section 321 and a second bonding section 322 which are connected in communication, the screw head section 321 is inserted into the screw sleeve section 312 and is threadedly connected with the screw sleeve section 312, and the second bonding section 322 is inserted into the mounting hole 102 and is bonded with the inner wall of the mounting hole 102.

[0050] Specifically, for the first joint 31, a first through hole is formed in the first joint 31 and penetrates the first bonding section 311 and the screw sleeve section 312, the diameter of the first bonding section 311 is smaller than that of the screw sleeve section 312, the circumferential wall of the first bonding section 311 can be bonded with the inner wall of the air suction channel 21 by using epoxy resin glue, and the inner wall of the screw sleeve section 312 is provided with internal threads.

[0051] For the second joint 32, a second through hole is formed in the second joint 32 and penetrates the screw head section 321 and the second bonding section 322, the diameter of the screw head section 321 is smaller than that of the second bonding section 322, the circumferential wall of the screw head section 321 is provided with external threads, the screw head section 321 and the screw sleeve section 312 are threadedly connected through the internal threads and the external threads, the inner wall of the screw sleeve section 312 and the circumferential wall of the screw head section 321 are further connected by adhesive (for example, epoxy resin glue), and the circumferential wall of the second bonding section 322 and the inner wall of the mounting hole 102 can also be bonded by using epoxy resin glue.

[0052] When the first joint 31 and the second joint 32 are assembled into one, the suction passage 21, the first through hole corresponding to the first joint 31 and the second through hole corresponding to the second joint 32 are sequentially communicated, so that the air tightness between the optical component 2 and the first joint 31 and between the first joint 31 and the second joint 32 can be ensured.

[0053] In some embodiments, as shown in Figure 2 and Figure 4 The shell assembly 1 includes a shell body 11 and a locking ring 12. An opening 101 is arranged at a top end of the shell body 11, a shell opening 103 is arranged at an opening end of the shell body 11, and a mounting hole 102 is arranged at a side wall of the shell body 11. The locking ring 12 is detachably arranged at the opening end. The first end of the optical component 2 abuts against the top end, and the second end of the optical component 2 abuts against the locking ring 12.

[0054] It can be understood that the locking ring 12 can be arranged at the opening end of the shell body 11 by means of bonding or threaded connection. By arranging the shell assembly 1 as the shell body 11 and the locking ring 12, the optical component 2 can be locked to the shell body 11 by the locking ring 12, and the locking of the locking ring 12 to the optical component 2 only acts on the peripheral region of the optical component 2 and does not affect the surface shape of the middle region of the optical component 2.

[0055] For example, when the optical component 2 is a columnar body, the diameter of the optical component 2 can be 115 mm, the diameter of the effective incident region of the incident surface of the optical component 2 can be 100 mm, and the radial width of the locking ring 12 relative to the optical axis of the optical component 2 is 2-6 mm.

[0056] In some embodiments, as shown in Figure 2 and Figure 6 To ensure that the optical component 2 is stably and reliably installed in the shell body 11, the optical component 2 includes a first columnar segment 201 and a second columnar segment 202. The first columnar segment 201 and the second columnar segment 202 are coaxially connected, and the diameter of the first columnar segment 201 is smaller than the diameter of the second columnar segment 202. The first columnar segment 201 is embedded in the opening 101, one end of the second columnar segment 202 facing the first columnar segment 201 abuts against the top end, and the other end of the second columnar segment 202 away from the first columnar segment 201 is arranged opposite to the shell opening 103 and abuts against the locking ring 12.

[0057] The first end of the suction passage 21 is formed at the end of the first columnar segment 201 away from the second columnar segment 202, and the second end of the suction passage 21 is formed at the peripheral wall of the second columnar segment 202.

[0058] In some embodiments, as shown in Figure 2 and Figure 7As shown, the suction passage 21 comprises a first suction section 211 and a second suction section 212 which are connected in series; the first suction section 211 is located in the first cylinder section 201 and the second cylinder section 202 and is arranged to extend along the axial direction of the first cylinder section 201 or the second cylinder section 202; the second suction section 212 is located in the second cylinder section 202 and is arranged to extend along the radial direction of the second cylinder section 202.

[0059] As shown, one end of the first suction section 211 away from the second suction section 212 is configured as a suction port for adsorbing the wafer, and the other end of the second suction section 212 away from the first suction section 211 is connected with the joint assembly 3.

[0060] As shown, Figure 4 and Figure 5 As shown, the locking ring 12 is threadedly connected with the cover end, and the locking ring 12 is provided with an operation portion 1201 for receiving external force to drive the locking ring 12 to rotate relative to the cover end.

[0061] As an example, the inner side surface of the cover 103 is provided with an internal thread, and the peripheral wall of the locking ring 12 is provided with an external thread, and the cover 103 and the locking ring 12 are threadedly connected through the cooperation of the internal thread and the external thread.

[0062] In some examples, the operation portion 1201 can be a first groove for embedding the fingers of an operator, and the operator can apply a tangential force to the locking ring 12 through the first groove to control the rotation of the locking ring 12 relative to the cover end, so as to install the locking ring 12 on the cover end, lock the optical component 2, or remove the locking ring 12 from the cover end.

[0063] In some examples, the operation portion 1201 can also be a second groove for embedding the end of a screwdriver or other operation tool, and the operator can apply a tangential force to the locking ring 12 through the operation tool at the second groove to control the rotation of the locking ring 12 relative to the cover end, so as to install the locking ring 12 on the cover end or remove the locking ring 12 from the cover end.

[0064] As shown, Figure 1 and Figure 4 As shown, the wafer adsorption head further comprises a cover 4 which is detachably arranged at the cover end of the cover body 11, and the locking ring 12 is limited between the optical component 2 and the cover 4; the cover 4 is provided with a light passage, and the light passage and the cover 103 are oppositely arranged.

[0065] As can be understood, the cover end of the cover body 11 is provided with a plurality of first fixing holes, the cover 4 is provided with a plurality of second fixing holes, the plurality of first fixing holes and the plurality of second fixing holes are oppositely arranged one by one, and the cover 4 and the cover end of the cover body 11 are detachably connected through locking members arranged in the first fixing holes and the second fixing holes.

[0066] The plurality of second fixing holes on the cover 4 are arranged around the light passage on the cover 4.

[0067] In some embodiments, as shown in Figure 2 The inner wall of the cover 11 is provided with a flexible contact layer 1101, and the flexible contact layer 1101 is in contact with the side surface of the optical component 2.

[0068] It can be understood that the flexible contact layer 1101 is arranged along the circumferential direction of the optical component 2 and is clamped between the cover 11 and the optical component 2. The flexible contact layer 1101 is used to prevent the optical component 2 from directly contacting the inner wall of the cover 11. This design uses the flexible contact layer 1101 to protect the optical component 2, so that the optical component 2 does not rigidly contact the cover 11 under the action of external force, thereby avoiding damage to the optical component 2 or changes in the surface shape of the optical component 2 due to the action of external force.

[0069] The flexible contact layer 1101 can be an elastic rubber ring, which can be configured to be bonded to the inner wall of the cover 11.

[0070] In some embodiments, as shown in Figure 2 The circumferential wall of the shell assembly 1 is provided with a positioning hole 104, and the side surface of the optical component 2 is provided with a positioning groove 22. The first end of the positioning pin 5 is bonded in the positioning groove 22, and the second end of the positioning pin 5 is bonded in the positioning hole 104.

[0071] It can be understood that the positioning hole 104 is arranged on the circumferential wall of the cover 11, and the positioning pin 5 is used to connect the cover 11 and the optical component 2. The positioning pin 5 is used to position the optical component 2 based on the positioning reference provided by the positioning hole 104 of the cover 11, so as to prevent the optical component 2 from rotating relative to the cover 11.

[0072] Exemplarily, the positioning pin 5 is arranged along the radial direction of the optical component 2, and the projection of the positioning groove 22 is located within the area defined by the projection of the locking ring 12. This design can minimize the impact of the positioning of the positioning pin 5 on the surface shape of the optical component 2.

[0073] Exemplarily, the first end of the positioning pin 5 and the positioning groove 22 are bonded by epoxy resin, and the second end of the positioning pin 5 and the inner wall of the positioning hole 104 are bonded by epoxy resin. This design not only ensures the reliability of the bonding of the positioning pin 5, but also ensures that the positioning pin 5 has a certain activity margin relative to the optical component 2, thereby reducing the impact of the positioning of the positioning pin 5 on the surface shape of the optical component 2.

[0074] In some embodiments, as shown in Figure 1 and Figure 2As shown, the wafer adsorption head further comprises a dust cover 6, which is detachably covered on the shell cover assembly 1 to cover the opening 101.

[0075] It can be understood that the dust cover 6 is covered on the cover top end of the cover body 11 to cover the opening 101 and prevent dust from affecting the first end of the optical component 2.

[0076] In order to facilitate the installation of the dust cover 6, the inner wall at the cover opening 103 of the dust cover 6 can be provided with internal threads, and the peripheral wall of the cover body 11 can be provided with external threads, so that the dust cover 6 and the cover body 11 are detachably connected through the cooperation of the internal threads and the external threads.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer chucking head, characterized by, The application relates to a shell cover assembly, an optical component and a joint assembly. The shell cover assembly has a containing cavity, an opening communicating with the containing cavity, a mounting hole and a cover opening, the opening and the cover opening are oppositely arranged along the optical axis direction of the optical component, and the mounting hole is arranged on the peripheral wall of the shell cover assembly. The optical component is detachably arranged in the containing cavity, the first end of the optical component is oppositely arranged with the opening, and the second end of the optical component is oppositely arranged with the cover opening; an air suction channel is arranged in the optical component, the first end of the air suction channel is formed in the first end of the optical component, and the second end of the air suction channel is formed in the side surface of the optical component. The joint assembly comprises a first joint and a second joint which are connected in communication, the first joint is bonded to the second end of the air suction channel, the second joint is detachably connected with the first joint, and is bonded in the mounting hole. The first joint comprises a first bonding section and a screw sleeve section which are connected in communication, the first bonding section is inserted into the second end of the air suction channel and is bonded with the inner wall of the air suction channel; 2. The wafer chucking head according to claim 1, wherein The second joint comprises a screw head section and a second bonding section which are connected in communication, the screw head section is inserted into the screw sleeve section and is threadedly connected with the screw sleeve section, and the second bonding section is inserted into the mounting hole and is bonded with the inner wall of the mounting hole. The inner wall of the screw sleeve section and the peripheral wall of the screw head section are further connected through adhesive.

3. The wafer chucking head according to claim 2, wherein The shell cover assembly comprises a cover body and a locking ring; the opening is arranged on the cover top end of the cover body, the cover opening is arranged on the cover opening end of the cover body, the mounting hole is arranged on the side wall of the cover body, and the locking ring is detachably arranged on the cover opening end; 4. The wafer chucking head according to claim 1, wherein The first end of the optical component abuts against the cover top end, and the second end of the optical component abuts against the locking ring. The optical component comprises a first column section and a second column section which are coaxially connected, and the diameter of the first column section is smaller than that of the second column section; 5. The wafer chucking head according to claim 4, wherein The first column section is embedded in the opening, one end of the second column section which faces the first column section abuts against the cover top end, and the other end of the second column section which is away from the first column section is oppositely arranged with the cover opening and abuts against the locking ring; The first end of the air suction channel is formed on one end of the first column section which is away from the second column section, and the second end of the air suction channel is formed on the peripheral wall of the second column section. The air suction channel comprises a first air suction section and a second air suction section which are connected in communication; 6. The wafer chucking head according to claim 5, wherein The first air suction section is arranged in the first column section and the second column section and extends along the axial direction of the first column section or the second column section; and the second air suction section is arranged in the second column section and extends along the radial direction of the second column section. The locking ring is threadedly connected with the cover opening end, an operation part is arranged on the locking ring, and the operation part is used for receiving external force to drive the locking ring to rotate relative to the cover opening end.

7. The wafer chucking head according to claim 4, wherein A cover is further arranged, the cover is detachably arranged on the cover opening end of the cover body, the locking ring is limited between the optical component and the cover, the cover is provided with a light passing opening, and the light passing opening is oppositely arranged with the cover opening.

8. The wafer chucking head according to any one of claims 4 to 7, wherein ​ Alternatively, the inner wall of the cover body is provided with a flexible contact layer, and the flexible contact layer is in contact with the side surface of the optical component.

9. The wafer chucking head according to any one of claims 1 to 7, wherein Further comprising a positioning pin; the peripheral wall of the shell cover assembly is provided with a positioning hole, the side surface of the optical component is provided with a positioning groove, the first end of the positioning pin is bonded in the positioning groove, and the second end of the positioning pin is bonded in the positioning hole.

10. The wafer chucking head according to any one of claims 1 to 7, wherein Further comprising: A dust cover is detachably covered on the shell cover assembly to cover the opening.

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