Vacuum adsorption fixing platform structure

Abstract

The utility model relates to the field of chip patch manufacturing equipment, and discloses a vacuum adsorption fixing platform structure which comprises a vacuum connecting platform and a product adsorption platform arranged at the upper end of the vacuum connecting platform, the vacuum connecting platform is provided with a plurality of groups of vacuum connecting channels, the product adsorption platform is provided with a plurality of groups of product adsorption holes, and the vacuum connecting channels are communicated with the product adsorption holes. The vacuum connecting channels are in one-to-one correspondence with the product adsorption holes; the throttling partition plate is arranged between the vacuum connecting platform and the product adsorption platform, throttling holes corresponding to the product adsorption holes in a one-to-one mode are formed in the throttling partition plate, the throttling partition plate is additionally arranged between the vacuum connecting platform and the product adsorption platform, under the condition that products are not fully filled, prostheses do not need to be used for covering the adsorption holes, and therefore the product adsorption efficiency is improved. The stable adsorption effect can be achieved, and subsequent use is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip patch manufacturing equipment technical field, concretely is a kind of vacuum adsorption fixed platform structure. BACKGROUND

[0002] In chip patch manufacturing equipment, vacuum adsorption technology is widely used in fixing and positioning various small electronic components, such as chips, wafers and other precision components, in this process, the design of adsorption platform directly affects the adsorption effect, work efficiency and production quality.

[0003] Through patent retrieval, it is found that the Chinese patent with publication number CN118380369A discloses a substrate material vacuum adsorption fixing device, which comprises a base, a vacuum adsorption fixing platform is arranged on the base, a hard adsorption flat plate is arranged on the surface of the vacuum adsorption fixing platform, a set of transmission structure for transmitting the carrier to the upper side of the vacuum adsorption fixing platform is further arranged on the base, and a jacking mechanism is arranged at the bottom of the vacuum adsorption fixing platform; the carrier is a hard substrate or a carrier, the carrier is used for carrying a soft substrate, and the carrier is provided with an air passage communicated with the vacuum adsorption fixing platform, so that the carrier can automatically transmit different width specifications of substrates in and out, ensure the flatness of the substrate adsorption, and ensure the flatness of the substrate during patch processing.

[0004] However, the traditional vacuum adsorption fixing platform must have a product or use a prosthesis to cover the adsorption hole without placing a product at each position to achieve the effect of product adsorption fixation, if the product adsorption hole is not covered, it will cause adsorption fixation failure, which is not conducive to use. UTILITY MODEL CONTENT

[0005] In view of the deficiencies of the prior art, the utility model provides a vacuum adsorption fixing platform structure, which solves the problems mentioned in the above background.

[0006] The utility model provides the following technical scheme: the utility model discloses a vacuum adsorption fixing platform structure, which comprises:

[0007] A vacuum connection platform and a product adsorption platform arranged on the upper end of the vacuum connection platform are provided, a plurality of groups of vacuum connection channels are formed in the vacuum connection platform, a plurality of groups of product adsorption holes are formed in the product adsorption platform, and the vacuum connection channels and the product adsorption holes are arranged one by one in correspondence.

[0008] A throttling baffle is arranged between the vacuum connection platform and the product adsorption platform, and a throttling hole corresponding to the product adsorption hole is arranged on the throttling baffle.

[0009] As a preferred scheme, the diameter of the throttling hole is smaller than the diameter of the product adsorption hole.

[0010] As a preferred solution, the product adsorption hole has a diameter of 0.5-2mm, and the throttle hole has a diameter of 0.05-0.2mm.

[0011] As a preferred solution, the product adsorption hole has a diameter of 1.2mm, and the throttle hole has a diameter of 0.15mm.

[0012] As a preferred solution, the product adsorption platform is further provided with a buffer air chamber in communication with the product adsorption hole, which serves as an air flow buffer.

[0013] As a preferred solution, the buffer air chamber has an inner diameter greater than that of the product adsorption hole.

[0014] As a preferred solution, a plurality of vacuum connection channels are in communication with each other and connected to a vacuum device through a vacuum air pipe.

[0015] As a preferred solution, the product adsorption holes are arranged in a grid pattern.

[0016] As a preferred solution, the product adsorption hole and the throttle hole have a circular cross section.

[0017] As a preferred solution, the throttle partition plate is a laser-perforated plate or a powder sintered plate.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] The present application increases a throttle partition plate between the vacuum connection platform and the product adsorption platform, so that the product can be stably adsorbed without using a dummy to cover the adsorption hole when the product is not full, which is convenient for subsequent use. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 FIG. 1 is a perspective view of the present application;

[0021] Fig. 2 FIG. 2 is an exploded schematic view of the present application;

[0022] Fig. 3 FIG. 3 is a partial cross-sectional view of the present application.

[0023] In the drawings: 1, vacuum connection platform; 11, vacuum connection channel; 2, product adsorption platform; 21, product adsorption hole; 22, buffer air chamber; 3, throttle partition plate; 31, throttle hole; 4, vacuum air pipe. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0025] Please refer to Figs. 1-3 The vacuum adsorption fixing platform structure comprises:

[0026] The vacuum connection platform 1 is provided with a plurality of groups of vacuum connection channels 11, and the product adsorption platform 2 is provided with a plurality of groups of product adsorption holes 21, and the vacuum connection channels 11 and the product adsorption holes 21 are arranged one by one in correspondence.

[0027] The throttle partition plate 3 is arranged between the vacuum connection platform 1 and the product adsorption platform 2, and the throttle partition plate 3 is provided with a plurality of throttle holes 31 arranged one by one in correspondence with the product adsorption holes 21.

[0028] The vacuum adsorption fixing platform structure has a plurality of groups of vacuum connection channels 11 to form a plurality of vacuum paths, can create adsorption force at different positions, so as to adapt to products of various shapes and specifications, the product adsorption platform 2 is located above the vacuum connection platform 1, the product adsorption holes 21 are arranged to enable the platform to adsorb products in a limited area, improve the accuracy and efficiency of product positioning in the production process, the throttle partition plate 3 is arranged between the adsorption holes and the vacuum connection channels 11, air flow management is enhanced, air flow instability is effectively avoided, and adsorption capacity and production efficiency are further improved.

[0029] And by increasing the throttle partition plate 3 between the vacuum connection platform 1 and the product adsorption platform 2, stable adsorption effect can be achieved without using a false body to cover the adsorption hole when the product is not full, which is convenient for subsequent use.

[0030] As Figs. 2-3 The diameter of the throttle hole 31 is smaller than the diameter of the product adsorption hole 21, the design of the throttle hole 31 is coordinated with the diameter of the product adsorption hole 21, and the diameter of the throttle hole 31 is designed to be smaller than the diameter of the product adsorption hole 21. The purpose of this design is to reduce the passing area of the air flow, so that sufficient adsorption force can be formed in the vacuum adsorption process even if part of the product is not covered, so as to maintain the stable adsorption of the product. This improvement will greatly reduce the risk of adsorption failure caused by the fact that the adsorption hole is not covered by the product, thereby improving the reliability of the production process.

[0031] AsFig. 3 As shown, the product adsorption hole 21 has a hole diameter of 0.5-2mm, and the throttle hole 31 has a hole diameter of 0.05-0.2mm. Preferably, the product adsorption hole 21 has a hole diameter of 1.2mm, and the throttle hole 31 has a hole diameter of 0.15mm. In a specific design implementation, the product adsorption hole 21 has a hole diameter ranging from 0.5mm to 2mm, which is flexible to adapt to the needs of different components; and the throttle hole 31 has a hole diameter ranging from 0.05mm to 0.2mm. This parameter configuration ensures that the product adsorption hole 21 can provide strong adsorption force under normal working conditions, and the throttle hole 31 limits the flow of gas to ensure the stability and controllability of the gas flow, thereby improving the overall working efficiency and stability of the equipment.

[0032] In actual use, the standard hole diameter of the product adsorption hole 21 is set to 1.2mm, and the hole diameter of the throttle hole 31 is 0.15mm, forming ideal adsorption force and gas flow characteristics. This specific value setting takes into account the volume and weight of common electronic components, ensuring that small components can be effectively adsorbed and prevented from moving during the adsorption process under normal working conditions, while avoiding adsorption failure caused by unstable gas flow, thereby improving the overall efficiency of the production line.

[0033] As shown in Fig. 3 The product adsorption platform 2 is also provided with a buffer gas chamber 22 connected to the product adsorption hole 21 for gas flow buffering, and the inner diameter of the buffer gas chamber 22 is greater than the hole diameter of the product adsorption hole 21. The buffer gas chamber 22 provided on the product adsorption platform 2 includes a structure design connected to the product adsorption hole 21, which provides buffering for changes in gas flow. This design effectively reduces the gas flow impact that may occur during rapid adsorption or operation changes, improving the safety and stability of the adsorption system and preventing products from being affected by sudden gas flow during the adsorption process, which is particularly important for precision electronic components.

[0034] At the same time, the inner diameter of the buffer gas chamber 22 is set to be greater than the hole diameter of the product adsorption hole 21, so that a uniform gas flow distribution can be created when the gas flows through the buffer chamber. This design not only helps to reduce the sudden change of gas flow speed, but also improves the stability of the gas flow when it reaches the adsorption hole, greatly improving the adsorption effect and ensuring that the product can be stably adsorbed under various working conditions.

[0035] As shown in Figs. 1-2As shown, multiple sets of vacuum connection channels 11 are interconnected and connected to the vacuum equipment through vacuum tubes 4. In the design of the vacuum connection channels 11, multiple vacuum connection channels 11 are interconnected and connected to the vacuum equipment through vacuum tubes 4. This structural design enables the entire adsorption system to provide uniform attractive force in different areas and quickly respond to changes in product placement during the production process, improving the flexibility and efficiency of production. In addition, the centralized management of the vacuum equipment also simplifies the maintenance procedures and reduces the difficulty of operation.

[0036] like Figs. 1-3 As shown, the product adsorption holes 21 are arranged in a grid pattern, and the cross-sectional shape of the product adsorption holes 21 and the throttling holes 31 is circular.

[0037] This grid-like layout design ensures that the distance between each product adsorption hole 21 is evenly distributed, ensuring that each element can obtain equal adsorption force during the adsorption process. In addition, this method also helps to reduce local density differences in the vacuum system during operation, thereby improving the overall adsorption efficiency and the working stability of the equipment.

[0038] In addition, the cross-sectional shape of the product adsorption hole 21 and the throttling hole 31 is circular. This design choice ensures the linearity of the flow when the airflow passes through, effectively reduces the generation of turbulence, and ensures that the ideal airflow state is maintained at all times during the vacuum adsorption process. This shape choice not only improves production efficiency, but also reduces the wear and maintenance frequency of the equipment to a certain extent.

[0039] The throttling baffle 3 is either a laser-drilled plate or a powder sintered plate. Laser drilling technology allows for high-precision setting of hole diameter and hole spacing, while powder sintered plates have excellent strength and durability. The choice of these two materials enables the throttling baffle 3 to maintain stable performance even in high-intensity working environments, and can better meet the stringent requirements of chip manufacturing equipment for high reliability and long static operation.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum suction fixing platform structure, characterized by: The utility model relates to a product adsorption device, including: A vacuum connection platform (1) and a product adsorption platform (2) arranged on the upper end of the vacuum connection platform (1), a plurality of groups of vacuum connection channels (11) are arranged on the vacuum connection platform (1), a plurality of groups of product adsorption holes (21) are arranged on the product adsorption platform (2), the vacuum connection channel (11) and the product adsorption hole (21) are arranged one by one in a corresponding manner; A throttle baffle (3) is arranged between the vacuum connection platform (1) and the product adsorption platform (2), the throttle baffle (3) is provided with a throttle hole (31) corresponding to the product adsorption hole (21) one by one.

2. The vacuum chucking stage structure of claim 1, wherein: The aperture of the throttle hole (31) is smaller than the aperture of the product adsorption hole (21).

3. The vacuum chucking stage structure of claim 2, wherein: The aperture of the product adsorption hole (21) is 0.5-2mm, and the aperture of the throttle hole (31) is 0.05-0.2mm.

4. The vacuum chucking stage structure according to claim 3, wherein: The aperture of the product adsorption hole (21) is 1.2mm, and the aperture of the throttle hole (31) is 0.15mm.

5. The vacuum chucking stage structure of claim 1, wherein: The product adsorption platform (2) is further provided with a buffer air chamber (22) communicated with the product adsorption hole (21) for air flow buffering.

6. The vacuum chucking stage structure of claim 5, wherein: The inner diameter of the buffer air chamber (22) is greater than the aperture of the product adsorption hole (21).

7. The vacuum chucking stage structure of claim 1, wherein: A plurality of groups of the vacuum connection channels (11) are communicated with each other and connected with a vacuum device through a vacuum air pipe (4).

8. The vacuum chucking stage structure of claim 1, wherein: The product adsorption holes (21) are arranged in a grid shape.

9. The vacuum chucking stage structure of claim 1, wherein: The cross-sectional shape of the product adsorption hole (21) and the throttle hole (31) is circular.

10. The vacuum chucking stage structure of claim 1, wherein: The throttle baffle (3) is a laser drilling plate or a powder sintering plate.

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