Electrostatic chuck separating device
By designing the upper and lower substrates of the electrostatic chuck separation device, and utilizing heating and negative pressure technology, the upper plate and the base are separated without damage. This solves the problems of material damage and environmental pollution in traditional methods and provides a safe and effective separation solution.
Patent Information
- Application Number
- CN202520274636.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing technologies can easily damage the material surface when separating the upper plate and base of an electrostatic chuck, and the use of chemical agents may cause pollution to the environment and materials.
The design employs an upper and lower substrate, and separates the upper plate and the base through heating and positioning components. Heating is achieved using a heating coil and temperature probe, while the upper plate is fixed and separated by a negative pressure chamber and an adsorption tank, avoiding direct contact and the use of chemical agents.
It achieves non-destructive separation of electrostatic chucks, reduces material surface wear and environmental pollution risks, and is simple and safe to operate.
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Figure CN223728759U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor equipment, concretely relates to electrostatic chuck separating device. BACKGROUND
[0002] The upper disc and the base of the electrostatic chuck are fixed by glue, when peeling off the two, the traditional peeling technology is to use a sheet to heat the glue between the two and then cut, so as to realize separation, but because the sheet directly contacts the material surface in the cutting process, it is easy to cause defects such as wear and tear and scratches on the material surface, and then cause damage or function decline of the material surface. Alternatively, a certain amount of chemical agent, such as deionized water, can also be used to help separate the two, however, the use of chemical agents not only may pollute the environment, but also may have corrosive effect on high-precision materials.
[0003] The statements herein only provide background technology related to the utility model, and do not necessarily constitute prior art. CONTENT OF THE UTILITY MODEL
[0004] The utility model aims at providing an electrostatic chuck separating device, which can separate the upper disc and the base of the electrostatic chuck without damaging them.
[0005] To achieve the above-mentioned purpose, the utility model provides an electrostatic chuck separating device for separating the upper disc and the base of the electrostatic chuck, the electrostatic chuck separating device comprises upper and lower substrates arranged oppositely;
[0006] The upper substrate is provided with a heating assembly and a positioning assembly, the positioning assembly is used for fixing the upper disc on the lower surface of the upper substrate, and the base is opposite to the lower substrate; the heating assembly is used for heating the upper substrate, so as to separate the upper disc and the base;
[0007] The lower substrate is used for bearing the base falling after separation.
[0008] Optionally, the heating assembly comprises a heating coil and a temperature measuring probe, the heating coil is spiral, and is arranged in the inner central region of the upper substrate; the temperature measuring probe is arranged on the upper substrate and is used for monitoring the temperature of the upper substrate.
[0009] Optionally, the positioning assembly comprises:
[0010] An adsorption groove is arranged in the central region of the lower surface of the upper substrate, the adsorption groove is upwardly recessed and can accommodate the upper disc;
[0011] A plurality of adsorption holes are arranged on the groove bottom surface of the adsorption groove.
[0012] A negative pressure cavity is arranged inside the upper substrate, and the adsorption hole is communicated with the negative pressure cavity;
[0013] A gas valve is arranged on the upper surface of the upper substrate, one end of the gas valve is communicated with the negative pressure cavity, and the other end is connected with an external vacuum pump, so that the gas in the negative pressure cavity can be pumped out to form a negative pressure.
[0014] Optionally, the edge of the adsorption groove is provided with an annular sealing device.
[0015] Optionally, the annular sealing device is an annular sealing strip, the top surface of the annular sealing strip is fixed to the groove bottom surface of the adsorption groove, and the bottom surface of the annular sealing strip extends downward.
[0016] Optionally, the bottom surface of the annular sealing strip protrudes from the lower surface of the upper substrate by 0.3mm-0.6mm.
[0017] Optionally, the upper surface of the lower substrate is provided with a rubber pad for receiving the dropped base.
[0018] Optionally, the surface of the upper substrate is coated with an anodic oxidation layer.
[0019] Optionally, the edge of the lower substrate is provided with a plurality of support columns extending upward, and the lower surface of the upper substrate is provided with a plurality of accommodating holes corresponding to the support columns, and the accommodating holes are blind holes.
[0020] Optionally, both ends of the heating coil are respectively provided with an electrode column connected with an external power source, so that the heating coil generates heat; the electrode column is arranged on the upper surface of the upper substrate and penetrates through the top wall of the upper substrate to be connected with the heating coil.
[0021] Compared with the prior art, the technical scheme of the electrostatic chuck separating device has the following advantages and beneficial effects:
[0022] The upper substrate is used for positioning and heating the electrostatic chuck, so as to separate the upper disc and the base of the electrostatic chuck, the lower substrate is used for receiving the dropped base, so as to avoid damaging the electrostatic chuck in the process of separating the two, and the operation is simple; without using chemical reagents, the potential harm to the environment and the operator is reduced;
[0023] By arranging the rubber pad on the upper surface of the lower substrate, the dropped base is buffered, and the risk of breaking and damaging the electrostatic chuck when falling is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0024] Fig. 1 It is a perspective view of the electrostatic chuck separating device of the utility model;
[0025] Fig. 2The utility model discloses a partial section view schematic diagram of electrostatic chuck separating device.
[0026] Fig. 3 The utility model discloses the structure schematic diagram of upper base plate. Specific implementation
[0027] The following will combine the technical scheme of the utility model embodiment, the construction feature, the purpose reached and the effect of the utility model embodiment and be detailedly explained. Figs. 1-3 The utility model embodiment, the technical scheme, the construction feature, the purpose reached and the effect of the utility model embodiment are explained in detail.
[0028] Need to explain, the drawing adopts very simplified form and all use non-precise proportion, only use to facilitate, clear, the purpose of auxiliary explanation the utility model embodiment, is not used to limit the limited condition of the utility model implementation, therefore does not have the substantial meaning of technology, any structure's modification, the change of proportion relationship or size's adjustment, under the condition of not influencing the effect and the purpose reached that the utility model can produce, all should still fall in the range that the technology content disclosed by the utility model can cover.
[0029] Need to explain, in the utility model, such as first and second and so on relation terminology only use to distinguish one entity or operation with another entity or operation, and not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "contain" or its any other variant is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes the explicitly listed elements, but also includes other elements not explicitly listed, or includes the elements inherent to such process, method, article or equipment.
[0030] The electrostatic chuck includes the upper disc and the base, and the two are bonded by glue. The existing method for separating the two is easy to damage the surface of the upper disc and the base, and even affect the function. To solve the problem, the utility model discloses an electrostatic chuck separating device, which can separate the two without damaging the upper disc and the base.
[0031] The technical scheme of the electrostatic chuck separating device of the utility model will be described in detail in combination with specific embodiments and drawings.
[0032] As Fig. 1 And Fig. 2As shown, the electrostatic chuck separating device of the present embodiment comprises a lower substrate 1 and an upper substrate 4 mounted opposite to the lower substrate 1, the lower substrate 1 and the upper substrate 4 are arranged in parallel and have a space between them to accommodate the electrostatic chuck A. The upper substrate 4 is used to fix and heat the electrostatic chuck A, so as to separate the upper disc 10 and the base 11 of the electrostatic chuck A, and the upper surface of the lower substrate 1 is provided with a rubber pad 2 for receiving the base 11 falling from above, which plays a buffering role to prevent the base 11 from being damaged when falling.
[0033] The upper substrate 4 has a heating assembly and a positioning assembly. The positioning assembly is used to fix the upper disc 10 of the electrostatic chuck A on the lower surface of the upper substrate 4 and make the base 11 opposite to the lower substrate 1; the heating assembly comprises a heating coil 12 and a temperature measuring probe 15, the heating coil 2 is spiral-shaped, arranged inside the upper substrate 4 and located in the central region, so as to heat the entire upper substrate 4 more uniformly; the temperature measuring probe 15 is arranged on the upper substrate 4 for monitoring the temperature of the upper substrate 4, and the temperature measuring point of the temperature measuring probe 15 is preferably located inside the upper substrate 4. By cooperation of the heating coil 2 and the temperature measuring probe 15, the temperature of the upper substrate 4 can be heated from room temperature to 250°C, and then the electrostatic chuck A fixed on the upper substrate 4 is heated, so that the glue between the upper disc 10 and the base 11 loses adhesion after heating to separate the upper disc 10 and the base 11.
[0034] The heating coil 12 has an electrode column 13 at each end to connect with an external power source to make the heating coil 12 heat up; the electrode column 13 is arranged on the upper surface of the upper substrate 4 and penetrates through the top wall of the upper substrate 4 to connect with the heating coil 12.
[0035] The upper surface of the upper substrate 4 also has an upper cover 14 above the heating coil 12, which can be removed for maintenance or replacement of the heating coil 12.
[0036] As shown, Fig. 3 The positioning assembly comprises an adsorption groove 5 arranged in the central region of the lower surface of the upper substrate 1, the adsorption groove 5 is upwardly recessed, the size of the adsorption groove 5 is the same as the upper surface of the upper disc 10, so that the adsorption groove 5 can accommodate the upper disc 10 of the electrostatic chuck A, and a plurality of adsorption holes 6 are arranged on the groove bottom surface of the adsorption groove 5. As shown, Fig. 1 and Fig. 2As shown, the upper substrate 4 is internally provided with a negative pressure cavity 8, which is located below the heating coil 12, and the adsorption holes 6 are communicated with the negative pressure cavity 8. The positioning assembly further comprises a gas valve 9, which is located on the upper surface of the upper substrate 4. One end of the gas valve 9 penetrates the top wall of the upper substrate 4 and is communicated with the negative pressure cavity 8, and the other end is connected with an external vacuum pump, so that the gas in the negative pressure cavity 8 can be pumped out, and the air pressure in the negative pressure cavity 8 is lower than the outside, so as to form a negative pressure. Since the upper disc 10 is contained in the adsorption groove 5, and the adsorption holes 6 on the bottom surface of the adsorption groove 5 are communicated with the negative pressure cavity 8, the upper disc 10 will be subjected to an upward adsorption force caused by the negative pressure in the adsorption groove 5. By adjusting the air pressure in the negative pressure cavity 8 through the vacuum pump, the adsorption force on the upper disc 10 is greater than the gravity of the electrostatic chuck A itself, so that the electrostatic chuck A is adsorbed and fixed in the adsorption groove 5.
[0037] The edge of the adsorption groove 5 is provided with an annular sealing device 7 to prevent air leakage at the edge of the contact surface between the adsorption groove 5 and the upper disc 10, so that the upper disc 10 can be more stably fixed on the upper substrate 4. In the embodiment, the annular sealing device 7 is an annular sealing strip, the top surface of the annular sealing strip is fixed on the groove bottom surface of the adsorption groove 5, and the bottom surface extends downward, so that when the upper disc 10 is adsorbed in the adsorption groove 5, the inner side surface of the annular sealing strip tightly abuts against the outer side surface of the upper disc 10 to seal the edge of the upper disc 10. Further, the bottom surface of the annular sealing strip protrudes 0.3mm-0.6mm from the lower surface of the upper substrate 4, which plays a better sealing role on the upper disc 10, and especially plays a certain supporting role on small-size electrostatic chucks A such as 6-inch and 8-inch electrostatic chucks A.
[0038] In more embodiments, the adsorption groove 5 can be slightly smaller than the upper disc 10, and the annular sealing device 7 slightly protrudes from the lower surface of the upper substrate 4 and has elasticity. When the upper disc 10 is adsorbed in the adsorption groove 5, the upper disc 10 is placed on the bottom surface of the annular sealing device 7, the negative pressure cavity 8 is pumped, and a seal is formed between the bottom surface of the annular sealing device 7 and the top surface of the upper disc 10, so that the upper disc 10 can be adsorbed on the upper substrate 4.
[0039] The upper substrate 4 and the lower substrate 1 are detachably connected. Specifically, the edge of the lower substrate 1 is provided with a plurality of supporting columns 3, which extend upward to support the upper substrate 4. The plurality of supporting columns 3 surround the rubber pad 2. The lower surface of the upper substrate 4 is provided with a plurality of accommodating holes 16 corresponding to the supporting columns 3. The accommodating holes 16 are blind holes. When the upper substrate 4 adsorbed with the electrostatic chuck A is placed on the lower substrate 1, the accommodating holes 16 only need to be aligned with the supporting columns 3. In the embodiment, the supporting columns 3 and the accommodating holes 16 are both four.
[0040] Preferably, the lower substrate 1 is made of steel, such as stainless steel.
[0041] Preferably, the surface of the upper substrate 4 is coated with an anodization layer, so as to prolong the service life of the upper substrate 4.
[0042] When the electrostatic chuck separating device is used, the process is as follows:
[0043] The temperature of the upper substrate 4 is preheated to 60-80℃ by the heating coil 12, then the upper disc 10 of the electrostatic chuck A is placed at the adsorption groove 5, and the upper disc 10 is attached to the annular sealing band 7 to form a seal;
[0044] The air valve 9 is opened, the air in the negative pressure cavity 8 is extracted, the adsorption force between the upper substrate 4 and the upper disc 10 is formed, the power of the air valve 9 is adjusted until the adsorption force generated is greater than the gravity of the electrostatic chuck A, so that the electrostatic chuck A is adsorbed and fixed on the upper substrate 4;
[0045] The upper substrate 4 with the fixed electrostatic chuck A is placed on the lower substrate 1 through the cooperation of the placing hole 16 and the supporting column 3;
[0046] The temperature of the upper substrate 4 is raised to 120℃ or higher (up to 250℃) by the heating coil 12;
[0047] As the temperature rises and the time is prolonged, the heat is transferred to the electrostatic chuck A, the glue between the upper disc 10 and the base 11 gradually softens and loses adhesion at high temperature, so that the base 11 falls on the rubber pad 2, and the separation of the base 11 and the upper disc 10 is completed.
[0048] The above process avoids the defects and damages that may be caused in the traditional way, and can reduce wear and tear compared with the use of external sheets for heating and cutting separation; it can also effectively reduce the use of chemical agents and reduce the potential harm to the environment and operating personnel; the rubber pad 2 arranged on the upper surface of the lower substrate 4 can buffer the falling base 11 and prevent the base 11 from being damaged when it falls.
[0049] Although the content of the present application has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and alternatives of the present application will be obvious to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.
Claims
1. An electrostatic chuck separation apparatus for separating an upper plate and a base of an electrostatic chuck, the apparatus comprising: The electrostatic chuck separating device comprises an upper substrate and a lower substrate arranged oppositely; The upper substrate is provided with a heating assembly and a positioning assembly, the positioning assembly is used for fixing the upper disc on the lower surface of the upper substrate and making the base opposite to the lower substrate, and the heating assembly is used for heating the upper substrate so as to separate the upper disc and the base; The lower substrate is used for bearing the base falling after separation.
2. The electrostatic chuck separation apparatus of claim 1, wherein, The heating assembly comprises a heating coil and a temperature measuring probe, the heating coil is in a spiral shape and is arranged in the inner central region of the upper substrate, and the temperature measuring probe is arranged on the upper substrate and is used for monitoring the temperature of the upper substrate.
3. The electrostatic chuck separation apparatus of claim 1, wherein, The positioning assembly comprises: An adsorption groove is arranged in the central region of the lower surface of the upper substrate, the adsorption groove is upwardly recessed and can accommodate the upper disc; A plurality of adsorption holes are arranged on the groove bottom surface of the adsorption groove; A negative pressure cavity is arranged in the upper substrate, the adsorption holes are communicated with the negative pressure cavity; An air valve is arranged on the upper surface of the upper substrate, one end of the air valve is communicated with the negative pressure cavity, and the other end of the air valve is connected with an external vacuum pump, so that the gas in the negative pressure cavity can be exhausted to form negative pressure.
4. The electrostatic chuck separation apparatus of claim 3, wherein The edge of the adsorption groove is provided with an annular sealing device.
5. The electrostatic chuck separation apparatus of claim 4, wherein, The annular sealing device is an annular sealing strip, the top surface of the annular sealing strip is fixed on the groove bottom surface of the adsorption groove, and the bottom surface of the annular sealing strip extends downward.
6. The electrostatic chucking apparatus of claim 5, wherein The bottom surface of the annular sealing strip protrudes from the lower surface of the upper substrate by 0.3mm to 0.6mm.
7. The electrostatic chucking apparatus of claim 1, wherein The upper surface of the lower substrate is provided with a rubber pad for bearing the falling base.
8. The electrostatic chucking apparatus of claim 1, wherein The surface of the upper substrate is coated with an anodic oxidation layer.
9. The electrostatic chucking apparatus of claim 1, wherein The edge of the lower substrate is provided with a plurality of support columns which extend upward, and the lower surface of the upper substrate is provided with a plurality of corresponding accommodation holes which are blind holes.
10. The electrostatic chucking apparatus of claim 2, wherein Both ends of the heating coil are respectively provided with an electrode column which is connected with an external power supply, so that the heating coil generates heat; the electrode column is arranged on the upper surface of the upper substrate and penetrates through the top wall of the upper substrate to be connected with the heating coil.