Power module, power device, and electronic apparatus

Abstract

The utility model discloses a power module, a power device and an electronic device, and relates to the technical field of power devices, the power module comprises a ceramic substrate, a power terminal, a first chip and a first bonding wire, one end of the power terminal is provided with a bonding sheet; the first chip is arranged on one side of the ceramic substrate; one end of the first bonding wire is electrically connected with one side, back to the ceramic substrate, of the first chip, and the other end of the first bonding wire is electrically connected with the bonding sheet. The utility model aims to reduce the size of the ceramic substrate.

Description

TECHNICAL FIELD

[0001] The utility model relates to power device technical field, especially a kind of power module, power device and electronic equipment. BACKGROUND

[0002] One of the most important functions of power module packaging is to realize the connection of chip and external terminal, and the connection process mainly considers the ability of current flow. In addition, the external terminal also needs to bear vibration stress in actual working process, and the reliability of the connection method also needs to be considered. Good connection needs to be maintained when vibration or temperature impact occurs.

[0003] In the traditional scheme, the chip is first connected to the ceramic substrate by bonding wire, and the power terminal is connected to the ceramic substrate by ultrasonic terminal through ultrasonic welding process, thereby realizing the connection of chip and ceramic substrate, and further realizing the electrical signal connection of ultrasonic terminal and chip.

[0004] However, in the above connection method, the ceramic substrate needs to provide the area of the chip bonding wire and the area of the power terminal ultrasonic welding, so that the area of the ceramic substrate is larger, and the cost is higher. At the same time, two processes will bring additional processing cost and reliability risk. SUMMARY

[0005] The main purpose of the utility model is to provide a kind of power module, power device and electronic equipment, to reduce the size of ceramic substrate.

[0006] To achieve the above purpose, the utility model provides a kind of power module, comprising:

[0007] ceramic substrate;

[0008] power terminal, one end of the power terminal is provided with bonding sheet;

[0009] first chip, the first chip is arranged on one side of the ceramic substrate;And

[0010] first bonding wire, one end of the first bonding wire is electrically connected to the side of the first chip away from the ceramic substrate, and the other end of the first bonding wire is electrically connected to the bonding sheet.

[0011] In an embodiment, the power module includes a plurality of first bonding wires, and each of the plurality of first bonding wires is electrically connected to the first chip and the bonding sheet.

[0012] In an embodiment, the power module further includes a second chip and a second bonding wire, the second chip is arranged on the ceramic substrate and located on the same side of the first chip;The second bonding wire is electrically connected to the first chip and the second chip.

[0013] In an embodiment, the bonding sheet is a copper sheet.

[0014] The utility model also provides a kind of power device, comprising:

[0015] Lead frame, the lead frame is equipped with insertion hole;And

[0016] The power module as described above, the bonding sheet is inserted in the insertion hole.

[0017] In an embodiment, the lead frame is annular structure, the insertion hole is equipped on the outside of the lead frame to the inside of the lead frame;

[0018] The ceramic substrate is located in the inside of the lead frame.

[0019] In an embodiment, the lead frame is equipped with a plurality of insertion holes;The power device includes a plurality of power modules, and the bonding sheet of a plurality of power modules is inserted into a plurality of insertion holes one by one.

[0020] In an embodiment, the lead frame is plastic frame.

[0021] The utility model also provides a kind of electronic equipment, comprising the power device as described above.

[0022] The power module provided by the utility model sets bonding sheet on power terminal, so that chip can be directly connected to bonding sheet through bonding wire, without passing through ceramic substrate, so as to reduce the area for chip bonding on ceramic substrate, compared with traditional scheme, so that ceramic substrate only needs to provide the area for chip bonding wire connection, without providing the area for power terminal ultrasonic welding, which effectively reduces the size and cost of ceramic substrate, and the mode can also optimize process route, reduce processing procedure, so as to improve production efficiency, reduce processing cost, improve market competitiveness. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to the structure shown in these drawings without creative labor.

[0024] Figure 1 The structure schematic diagram of the embodiment of the power device provided by the utility model.

[0025] Explanation of reference numerals:

[0026] 100, power device; 1, power module; 11, ceramic substrate; 12, bonding sheet; 13, first chip; 14, first bonding wire; 15, second chip; 16, second bonding wire; 2, lead frame.

[0027] The realization, functional features and advantages of the utility model will be further described in combination with embodiments with reference to the drawings. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0029] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0030] In addition, if the embodiments of the utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0031] The utility model provides a kind of power module 1.

[0032] Please refer to Figure 1 In an embodiment of the utility model, the power module 1 includes ceramic substrate 11, power terminal, first chip 13 and first bonding wire 14, one end of power terminal is provided with bonding sheet 12;First chip 13 is arranged on one side of ceramic substrate 11;One end of first bonding wire 14 is electrically connected with the side of first chip 13 away from ceramic substrate 11, and the other end of first bonding wire 14 is electrically connected with bonding sheet 12.

[0033] The power module provided by the utility model can reduce the area of the ceramic substrate 11 for chip bonding, compared with the traditional scheme, so that the ceramic substrate 11 only needs to provide the area for chip bonding wire connection, and does not need to provide the area for power terminal ultrasonic welding, which effectively reduces the size and cost of the ceramic substrate 11, and the mode can also optimize the process route, reduce the processing procedure, thereby improving the production efficiency, reducing the processing cost, and improving the market competitiveness.

[0034] In an embodiment, the power module 1 includes a plurality of first bonding wires 14, and each of the plurality of first bonding wires 14 is electrically connected with the first chip 13 and the bonding sheet 12. The plurality of bonding wires can disperse the current, reduce the current density of a single bonding wire, thereby improving the reliability of the connection and reducing the risk of wire breakage. In addition, the plurality of bonding wires can increase the contact area between the chip and the bonding sheet 12, which is helpful for heat conduction, improves the heat dissipation efficiency, and reduces the temperature of the chip. In actual application, by reasonably arranging the plurality of bonding wires, the internal structure of the power module 1 can be optimized, and the space utilization rate can be improved.

[0035] In an embodiment, the power module 1 further includes a second chip 15 and a second bonding wire 16, the second chip 15 is arranged on the ceramic substrate 11 and located on the same side of the first chip 13, and the second bonding wire 16 is electrically connected with the first chip 13 and the second chip 15. The introduction of the second chip 15 enables the power module 1 to realize more complex circuit functions or higher power processing capacity, and the power module 1 can realize parallel processing, improve the overall computing capacity and response speed, in addition, the design of the second bonding wire 16 enables effective electrical connection between the first chip 13 and the second chip 15, ensuring the stability and reliability of signal transmission. This connection mode can reduce signal delay and improve the overall performance of the system.

[0036] In an embodiment, the bonding sheet 12 is a copper sheet. Copper has extremely high electrical conductivity, which can effectively reduce resistance loss and ensure efficient transmission of current, and copper material is easy to process and form, and can be made into bonding sheets 12 of different shapes and sizes according to design requirements to meet the design requirements of different power modules 1. In other embodiments, the bonding sheet 12 can also be made of aluminum material.

[0037] The utility model also provides a kind of power device 100, including lead frame 2 and power module 1, the specific structure of this power module 1 refers to above-mentioned embodiment, since the power device 100 has adopted all technical solutions of above-mentioned all embodiments, at least has all beneficial effects brought by the technical scheme of above-mentioned embodiment, here no longer one by one elaboration.

[0038] In an embodiment, the lead frame 2 is in a ring shape, and the lead frame 2 is provided with a plurality of insertion holes penetrating from the outer side to the inner side of the lead frame 2. The ceramic substrate 11 is arranged on the inner side of the lead frame 2. The ring-shaped lead frame 2 can enclose the ceramic substrate 11 inside, forming a compact structure, and reducing the overall size of the power module 1.

[0039] In an embodiment, the lead frame 2 is provided with a plurality of insertion holes; the power device 100 includes a plurality of power modules 1, and the bonding pads 12 of the plurality of power modules 1 are one-to-one correspondingly inserted into the plurality of insertion holes. The bonding pads 12 of the plurality of power modules 1 can be integrated as a whole through the plurality of insertion holes of the lead frame 2, so that the number of power modules 1 can be increased or reduced as needed, and the power level of the system can be easily expanded.

[0040] In an embodiment, the lead frame 2 is a plastic frame. Using a plastic frame as the lead frame 2 can reduce cost, weight and improve insulation performance. In other embodiments, the lead frame 2 can also be replaced by other insulating materials, such as ceramic or other composite materials with good insulation performance.

[0041] The utility model also provides a kind of electronic equipment, including power device 100, the specific structure of this power device 100 refers to above-mentioned embodiment, since the electronic equipment has adopted all technical solutions of above-mentioned all embodiments, at least has all beneficial effects brought by the technical scheme of above-mentioned embodiment, here no longer one by one elaboration.

[0042] The above-mentioned is only the exemplary embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by using the utility model specification and drawings contents, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.

Claims

1. A power module, characterized by The power module comprises: a ceramic substrate; a power terminal, one end of the power terminal being provided with a bonding piece; a first chip, the first chip being arranged on one side of the ceramic substrate; and a first bonding wire, one end of the first bonding wire being electrically connected to the first chip away from the one side of the ceramic substrate, and the other end of the first bonding wire being electrically connected to the bonding piece. The power module comprises a plurality of the first bonding wires, each of the plurality of the first bonding wires being electrically connected to the first chip and the bonding piece.

2. The power module of claim 1, wherein, The power module further comprises a second chip and a second bonding wire, the second chip being arranged on the ceramic substrate and on the same side of the first chip; and the second bonding wire electrically connecting the first chip and the second chip.

3. The power module of claim 1, wherein, The bonding piece is a copper piece.

4. The power module of any one of claims 1 to 3, wherein, The power module comprises:

5. A power device, characterized by a lead frame, the lead frame being provided with a plug-in hole; and The power module according to any one of claims 1 to 4, the bonding piece being plugged into the plug-in hole. The lead frame is in a ring structure, and an outer side surface of the lead frame is provided with the plug-in hole penetrating to an inner side surface of the lead frame; The ceramic substrate is arranged on the inner side of the lead frame.

6. The power device of claim 5, wherein, The lead frame is provided with a plurality of the plug-in holes; and the power device comprises a plurality of the power modules, the bonding pieces of the plurality of the power modules being plugged into the plurality of the plug-in holes one by one. The lead frame is a plastic frame.

7. The power device according to claim 5 or 6, wherein The power device according to any one of claims 5 to 8.

8. The power device according to claim 5 or 6, wherein ​ 9. An electronic device, comprising: ​

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