Electronic equipment

Abstract

The utility model relates to an electronic device which comprises a middle frame, a vapor chamber and a battery assembly, the vapor chamber is arranged on the middle frame, and the vapor chamber is connected with a mainboard; the battery assembly is arranged on the middle frame and comprises a hard shell, the hard shell is connected with the vapor chamber, and heat of the mainboard can be conducted to the hard shell through the vapor chamber. Thus, the hard shell of the battery assembly can be used for conducting heat to the bottom or the back shell and other areas of the electronic equipment, the area range of temperature conduction is effectively expanded, the temperature uniformity of the electronic equipment can be improved, and the performance of the electronic equipment can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of terminals, and in particular, to an electronic device. BACKGROUND

[0002] Electronic devices such as mobile phones are usually provided with a mainboard. During the operation of the electronic device, heat is generated in the area of the mainboard. In order to avoid the performance of the electronic device being affected by excessive heat inside the electronic device, the heat in the area of the mainboard is usually conducted to other areas to achieve uniform temperature, so as to reduce the temperature of the area of the mainboard. However, the uniform temperature method in the related art has the problem of poor uniform temperature. CONTENT OF THE UTILITY MODEL

[0003] In order to overcome the problems in the related art, the present disclosure provides an electronic device.

[0004] The present disclosure provides an electronic device, which comprises a middle frame, a heat spreading plate arranged on the middle frame and connected with a mainboard, and a battery assembly arranged on the middle frame, wherein the battery assembly comprises a hard shell connected with the heat spreading plate, and the heat of the mainboard can be conducted to the hard shell through the heat spreading plate.

[0005] In some embodiments of the present disclosure, the middle frame comprises a first surface and a second surface opposite to each other, the mainboard is arranged on the first surface, the battery assembly is arranged on the second surface, the middle frame is provided with a hollow structure, the heat spreading plate is embedded in the hollow structure, the heat spreading plate comprises a third surface and a fourth surface opposite to each other, the third surface is connected with the mainboard, and the fourth surface is connected with the hard shell.

[0006] In some embodiments of the present disclosure, the hollow structure is provided with a first limiting part, the heat spreading plate is provided with a second limiting part corresponding to the position of the first limiting part, and the first limiting part and the second limiting part are matched to fix the heat spreading plate in the hollow structure.

[0007] In some embodiments of the present disclosure, the side wall surface of the hollow structure is provided with a first step structure, the first step structure constitutes the first limiting part, the first step structure comprises a first step surface and a second step surface connected to each other, the first step surface is connected to the first surface, the second step surface is connected to the side wall surface of the hollow structure, and the side wall surface of the hollow structure is connected to the second surface; the second step structure is arranged at a position corresponding to the first step structure on the vapor chamber, the second step structure constitutes the second limiting part, the second step structure comprises a third step surface and a fourth step surface connected to each other, the third step surface is connected to the side surface of the vapor chamber, the side surface of the vapor chamber is connected to the third surface, and the fourth step surface is connected to the fourth surface; wherein the first step surface is opposite to the side surface of the vapor chamber, the second step surface is opposite to the third step surface, and the fourth step surface is opposite to the side wall surface of the hollow structure.

[0008] In some embodiments of the present disclosure, the hollow structure comprises opposite first and second side wall surfaces, and the first limiting part is arranged on the first and second side wall surfaces.

[0009] In some embodiments of the present disclosure, the middle frame comprises a support part and a bezel arranged on the edge of the support part, the support part comprises opposite first and second surfaces, the hollow structure is arranged on the support part, the bezel and the first surface form a first accommodating groove, the main board is arranged in the first accommodating groove, the bezel and the second surface form a second accommodating groove, and the battery assembly is arranged in the second accommodating groove.

[0010] In some embodiments of the present disclosure, the electronic device further comprises a first adhesive layer arranged between the main board and the vapor chamber to connect the main board and the vapor chamber, and a second adhesive layer arranged between the vapor chamber and the hard shell to connect the vapor chamber and the hard shell.

[0011] In some embodiments of the present disclosure, the first adhesive layer is a heat-conducting gel, and / or the second adhesive layer is a heat-conducting double-sided adhesive tape.

[0012] In some embodiments of the present disclosure, the vapor chamber comprises a first plate and a second plate connected to each other, the first plate and the second plate are arranged in a staggered manner, the first plate is connected to the main board, and the second plate is connected to the hard shell.

[0013] In some embodiments of the present disclosure, the hard shell comprises a steel structure.

[0014] The technical scheme provided by the embodiments of the present disclosure can have the following beneficial effects:

[0015] The electronic device provided by the present disclosure is characterized in that the heat plate is connected to the mainboard, and the shell of the battery assembly is a hard shell, so that the heat plate can be connected to the hard shell, and the heat of the mainboard can be conducted to the hard shell through the heat plate. In this way, the hard shell of the battery assembly can be used to conduct heat to the bottom or back shell of the electronic device, effectively expanding the area range of temperature conduction, thereby improving the temperature uniformity of the electronic device, and further improving the performance of the electronic device.

[0016] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0018] Figure 1 is a cross-sectional view of an electronic device in the related art;

[0019] Figure 2 is a cross-sectional view of an electronic device according to an exemplary embodiment;

[0020] Figure 3 is a structural schematic diagram of an electronic device according to an exemplary embodiment.

[0021] In the drawings:

[0022] 1-electronic device; 11-middle frame; 111-supporting part; 1111-first surface; 1112-second surface; 112-hollow structure; 123-bezel; 124-first accommodating groove; 125-second accommodating groove; 12-mainboard; 13-battery assembly; 131-hard shell; 14-heat plate; 141-third surface; 142-fourth surface; 143-first plate; 144-second plate; 15-first step structure; 151-first step surface; 152-second step surface; 16-second step structure; 161-third step surface; 162-fourth step surface; 17-first adhesive layer; 18-second adhesive layer; 19-thermally conductive gel. DETAILED DESCRIPTION

[0023] The exemplary embodiments will be described in detail herein with reference to the drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0024] Electronic devices such as mobile phones are usually provided with a mainboard. During the operation of the electronic device, heat is generated in the area of the mainboard. In order to avoid the performance of the electronic device being affected by excessive heat inside the electronic device, the heat in the area of the mainboard is usually conducted to other areas to achieve temperature equalization, so as to reduce the temperature in the area of the mainboard. However, the temperature equalization method in the related art has the problem of poor temperature equalization. For example, as shown in Figure 1 The electronic device 1 in the related art includes a middle frame 11, the middle frame 11 includes opposite first and second surfaces. In order to consider the stacking thickness and weight, a hollow structure 112 is usually arranged on the middle frame 11, a vapor chamber 14 is arranged in the hollow structure 112, and a mainboard 12 is arranged on the first surface of the middle frame 11 and connected with the vapor chamber 14 through a heat-conducting gel 19, so as to conduct the heat on the mainboard 12 to the vapor chamber 14. Since the battery assembly 13 arranged on the second surface of the middle frame 11 in the electronic device 1 in the related art usually adopts a soft package battery, the shell of the soft package battery is not convenient to be connected with the vapor chamber 14, and it is difficult to conduct the heat on the vapor chamber 14 to the bottom or back shell area of the electronic device 1 by using the battery assembly 13. Therefore, in the above-mentioned related art, the heat on the vapor chamber 14 is only conducted to the middle frame through the lap joint of the two sides of the vapor chamber 14 and the hollow structure 113, and the range of the heat conduction area is limited, thereby resulting in poor temperature equalization of the electronic device 1.

[0025] In order to solve the above technical problems, the present disclosure provides an electronic device, a vapor chamber is connected with a mainboard, and a shell of a battery assembly is a hard shell, so that the vapor chamber can be connected with the hard shell, and the heat of the mainboard can be conducted to the hard shell through the vapor chamber. In this way, the heat can be conducted to the bottom or back shell area of the electronic device by using the hard shell of the battery assembly, the range of the heat conduction area is effectively expanded, thereby the temperature equalization of the electronic device can be improved, and the performance of the electronic device is further improved.

[0026] An example embodiment of the present disclosure provides an electronic device, which can be a mobile device such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), or a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or a self-service machine.

[0027] As shown in Figure 2As shown, the electronic device 1 comprises a middle frame 11, a vapor chamber 14 and a battery assembly 13. The vapor chamber 14 is arranged on the middle frame 11, and the vapor chamber 14 is connected with the mainboard 12. For example, the vapor chamber 14 can be connected with the mainboard 12 by welding, bonding or the like. In this way, the heat on the mainboard 12 can be conducted to the vapor chamber 14, and then the heat is conducted to the middle frame 11 through the vapor chamber 14, so as to realize temperature equalization, reduce the temperature of the mainboard 12, and facilitate the performance release of the electronic device 1.

[0028] The battery assembly 13 is arranged on the middle frame 11, and the battery assembly 13 comprises a hard shell 131, which can be a steel structure for example.

[0029] By adopting the hard shell 131 for the shell of the battery assembly 13, the connection with the vapor chamber 14 is facilitated, and the hard shell 131 has good heat conduction performance, so as to facilitate the heat conduction. The hard shell 131 is connected with the vapor chamber 14, so that the heat of the mainboard 12 can be conducted to the hard shell 131 through the vapor chamber 14. For example, the hard shell 131 can also be connected with the vapor chamber 14 by welding, bonding or the like.

[0030] By adopting such a setting form, the hard shell 131 of the battery assembly 13 can be used to conduct the heat to the bottom or back shell of the electronic device 1, effectively expanding the area range of temperature conduction, so as to improve the temperature equalization of the electronic device 1, and further facilitate the performance improvement of the electronic device 1. For example, through comparison simulation, compared with the traditional scheme, the electronic device 1 of the present disclosure can increase the whole machine heat dissipation capacity by about 1 mA / ℃. It can be understood that mA / ℃ is a hardware heat dissipation capacity unit, which represents how many mA of power consumption can be borne by the surface of the electronic device 1 per 1℃ rise, and the higher the value is, the better the whole machine heat equalization effect is, and the surface temperature rise is less under the same power consumption.

[0031] In combination with Figure 2In an embodiment, the middle frame 11 includes a first surface 1111 and a second surface 1112 opposite to each other. The main board 12 is arranged on the first surface 1111, and the battery assembly 13 is arranged on the second surface 1112. The middle frame 11 is provided with a hollow structure 112, and the vapor chamber 14 is embedded in the hollow structure 112. The vapor chamber 14 includes a third surface 141 and a fourth surface 142 opposite to each other, the third surface 141 is connected with the main board 12, and the fourth surface 142 is connected with the hard shell 131. In this way, on the one hand, the structure of the electronic device 1 is more compact, which can effectively reduce the overall thickness of the electronic device 1, thereby facilitating the thin design of the electronic device 1. On the other hand, by embedding the vapor chamber 14 in the hollow structure 112, the vapor chamber 14 can be connected with the main board 12 and the hard shell battery of the battery assembly 13 at the same time, which can simplify the structure of the electronic device 1, effectively reduce the occupation of the internal space of the electronic device 1, and facilitate the miniaturization and lightweight design of the electronic device 1.

[0032] In combination Figure 2 In an embodiment, the hollow structure 112 is provided with a first limiting portion, and the vapor chamber 14 is provided with a second limiting portion corresponding to the position of the first limiting portion. The first limiting portion and the second limiting portion are matched to fix the vapor chamber 14 in the hollow structure 112. For example, the first limiting portion can be a buckle structure, and the second limiting portion can be a card slot structure matched with the buckle structure. The buckle structure is connected with the card slot structure to fix the vapor chamber 14. Alternatively, the first limiting portion can also be a boss structure, and the second limiting portion can be a platform structure matched with the boss structure. The boss structure is arranged on the platform structure to fix the vapor chamber 14. As long as the vapor chamber 14 can be fixed in the hollow structure 112, no specific limitation is made herein.

[0033] With such a setting form, the stability of the vapor chamber 14 arranged in the hollow structure 112 can be effectively improved, and damage to the internal components such as the main board 12 or the battery assembly 13 caused by displacement of the vapor chamber 14 under external force can be avoided, thereby effectively improving the reliability of the electronic device 1.

[0034] In combination Figure 2 In an embodiment, the side wall surface of the hollow structure 112 is provided with a first step structure 15, and the first step structure 15 constitutes the first limiting portion. The first step structure 15 includes a first step surface 151 and a second step surface 152 connected with each other. The first step surface 151 is connected with the first surface 1111, and the second step surface 152 is connected with the side wall surface of the hollow structure 112. The side wall surface of the hollow structure 112 is connected with the second surface 1112.

[0035] The second step structure 16 is arranged at a position corresponding to the first step structure 15 on the vapor chamber 14, and the second step structure 16 constitutes a second limiting part. The second step structure 16 includes a third step surface 161 and a fourth step surface 162 connected with each other, the third step surface 161 is connected with a side surface of the vapor chamber 14, the side surface of the vapor chamber 14 is connected with the third surface 141, and the fourth step surface 162 is connected with the fourth surface 142.

[0036] After the vapor chamber 14 is embedded in the hollow structure 112, the first step surface 151 is opposite to the side surface of the vapor chamber 14, the second step surface 152 is opposite to the third step surface 161, and the fourth step surface 162 is opposite to the side wall surface of the hollow structure 112. In this way, the vapor chamber 14 is fixed in the hollow structure 112. In this way, the structure of the first limiting part and the second limiting part is simple, which is convenient for production and processing.

[0037] Exemplarily, the first limiting part and the second limiting part can be connected through a heat-conducting gel, that is, the first step surface 151 and the side surface of the vapor chamber 14 are connected through the heat-conducting gel, and the second step surface 152 and the third step surface 161 are also connected through the heat-conducting gel. By adopting such a setting form, on the one hand, the stability of the vapor chamber 14 arranged in the hollow structure 112 can be further improved, thereby being beneficial to improving the reliability of the electronic device 1. On the other hand, the efficiency of heat conduction between the vapor chamber 14 and the middle frame 11 can be improved, thereby improving the efficiency of uniform temperature of the electronic device 1 and being beneficial to improving the user experience.

[0038] In addition, by arranging the first step structure 15 and the second step structure 16 that are matched with each other, the contact area between the vapor chamber 14 and the middle frame 11 can be increased, thereby further improving the efficiency of heat conduction between the vapor chamber 14 and the middle frame 11, and further improving the efficiency of uniform temperature of the electronic device 1.

[0039] In combination Figure 2 In an embodiment, the hollow structure 112 includes a first side wall surface and a second side wall surface opposite to each other, and the first limiting part is arranged on the first side wall surface and the second side wall surface. Correspondingly, the vapor chamber 14 is provided with the second limiting part at positions corresponding to the two first limiting parts, and the first limiting part and the second limiting part are matched one by one to fix the vapor chamber 14 in the hollow structure 112. In this way, on the one hand, the stability of the vapor chamber 14 arranged in the hollow structure 112 can be improved, thereby being beneficial to reducing the occupation of the internal space of the electronic device 1, and the uniformity of force received by the vapor chamber 14 can be improved, thereby further improving the stability of the vapor chamber 14 arranged in the hollow structure 112, thereby being beneficial to improving the reliability of the electronic device 1. On the other hand, the contact area between the vapor chamber 14 and the middle frame 11 can be further increased, thereby being beneficial to further improving the uniform temperature of the electronic device 1.

[0040] In combination Figure 2 In an embodiment, the middle frame 11 comprises a support portion 111 and a bezel 123 arranged on the edge of the support portion 111. The support portion 111 comprises a first surface 1111 and a second surface 1112 opposite to each other, and the hollow structure 112 is arranged on the support portion 111. The bezel 123 and the first surface 1111 form a first accommodating groove 124, and the main board 12 is arranged in the first accommodating groove 124. The bezel 123 and the second surface 1112 form a second accommodating groove 125, and the battery assembly 13 is arranged in the second accommodating groove 125. By adopting such an arrangement form, the installation and fixation of the main board 12 and the battery assembly 13 can be better realized, and at the same time, the sealing property of the electronic device 1 can be improved, so that the reliability of the electronic device 1 can be further improved.

[0041] In combination Figure 2 In an embodiment, the electronic device 1 further comprises a first adhesive layer 17 and a second adhesive layer 18. The first adhesive layer 17 is arranged between the main board 12 and the vapor chamber 14, so as to connect the main board 12 and the vapor chamber 14. By such a design, on the one hand, the connection stability between the main board 12 and the vapor chamber 14 can be effectively improved, and the separation of the main board 12 and the vapor chamber 14 under the influence of external force can be avoided, so that the heat conduction efficiency between the main board 12 and the vapor chamber 14 can be improved, and the efficiency of reducing the temperature of the main board 12 can be improved. On the other hand, the connection mode between the main board 12 and the vapor chamber 14 is simple, which is convenient for assembly and is also conducive to reducing the production cost of the electronic device 1. In addition, by arranging the first adhesive layer 17 to connect the main board 12 and the vapor chamber 14, the main board 12 can be effectively prevented from being damaged by being poked, so as to be conducive to the reliability of the electronic device 1.

[0042] The second adhesive layer 18 is arranged between the vapor chamber 14 and the hard shell 131, so as to connect the vapor chamber 14 and the hard shell 131. By adopting such an arrangement form, on the one hand, the connection stability between the hard shell 131 and the vapor chamber 14 can be effectively improved, and the separation of the hard shell 131 and the vapor chamber 14 under the influence of external force can be avoided, so that the heat conduction efficiency between the hard shell 131 and the vapor chamber 14 can be improved, and the temperature uniformity can be improved. On the other hand, the connection mode between the hard shell 131 and the vapor chamber 14 is simple, which is convenient for assembly and is also conducive to reducing the production cost of the electronic device 1.

[0043] In an embodiment, the first adhesive layer 17 is a heat-conductive gel. In this way, on the one hand, the first adhesive layer 17 can improve the heat conduction efficiency between the mainboard 12 and the vapor chamber 14 while playing a connecting role, thereby facilitating the further improvement of the uniformity of the electronic device 1. On the other hand, compared with the heat-conductive double-sided tape, the use of the heat-conductive gel to connect the mainboard 12 and the vapor chamber 14 can further avoid damage to the mainboard 12, thereby improving the reliability of the electronic device 1.

[0044] In another embodiment, the second adhesive layer 18 is a heat-conductive double-sided tape. In this way, on the one hand, the second adhesive layer 18 can improve the heat conduction efficiency between the hard shell 131 of the battery assembly 13 and the vapor chamber 14 while playing a connecting role, thereby facilitating the further improvement of the uniformity of the electronic device 1. On the other hand, the use of the heat-conductive double-sided tape to connect the hard shell 131 and the vapor chamber 14 is simple to operate, thereby facilitating the improvement of the assembly efficiency of the electronic device 1.

[0045] Since the electronic device 1 further has a camera module arranged inside, usually, the mainboard 12 and the camera module are arranged in the inside of the electronic device 1 near two sides of the electronic device 1, thereby making the structure of the electronic device 1 more compact. The battery assembly 13 has a large volume and is usually arranged at the middle part of the electronic device 1. Based on this, in combination with the above-mentioned arrangement of the mainboard 12 and the camera module, the mainboard 12 and the camera module are arranged on the same side of the electronic device 1, thereby further improving the compactness of the electronic device 1. Figure 3 In an embodiment, the vapor chamber 14 includes a first plate 143 and a second plate 144 connected to each other, the first plate 143 and the second plate 144 are arranged in a staggered manner, the first plate 143 is connected to the mainboard 12, and the second plate 144 is connected to the hard shell 131. In this way, the first plate 143 is adapted to the position of the mainboard 12, so as to facilitate the connection with the mainboard 12. At the same time, the volume of the vapor chamber 14 can be reduced, thereby reducing the occupation of the internal space of the electronic device 1.

[0046] In an embodiment, the hard shell 131 includes a steel structure. In this way, on the one hand, compared with aluminum, the steel structure has more advantages in safety, temperature resistance, and service life, thereby effectively improving the reliability of the battery assembly 13. On the other hand, since the steel shell has the characteristics of corrosion resistance, strong pressure resistance, good sealing performance, and the like, it can effectively prevent problems such as electrolyte leakage and gas leakage, thereby further improving the reliability of the battery assembly 13.

[0047] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

[0048] It should be understood that the present disclosure is not limited to the precise structures as herein described and illustrated in the drawings, and that various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the claims that follow.

Claims

1. An electronic device, comprising: The electronic device comprises: a middle frame; a vapor chamber arranged on the middle frame and connected with a mainboard; a battery assembly arranged on the middle frame, the battery assembly comprising a hard shell connected with the vapor chamber, and heat of the mainboard being able to be conducted to the hard shell through the vapor chamber.

2. The electronic device of claim 1, wherein, The middle frame comprises a first surface and a second surface opposite to each other, the mainboard is arranged on the first surface, the battery assembly is arranged on the second surface, the middle frame is provided with a hollow structure, the vapor chamber is embedded in the hollow structure, and the vapor chamber comprises a third surface and a fourth surface opposite to each other, the third surface is connected with the mainboard, and the fourth surface is connected with the hard shell.

3. The electronic device of claim 2, wherein, The hollow structure is provided with a first limiting portion, the vapor chamber is provided with a second limiting portion corresponding to the position of the first limiting portion, and the first limiting portion and the second limiting portion are matched to fix the vapor chamber in the hollow structure.

4. The electronic device of claim 3, wherein, The side wall surface of the hollow structure is provided with a first step structure, the first step structure constitutes the first limiting portion, the first step structure comprises a first step surface and a second step surface connected with each other, the first step surface is connected with the first surface, the second step surface is connected with the side wall surface of the hollow structure, and the side wall surface of the hollow structure is connected with the second surface. The vapor chamber is provided with a second step structure corresponding to the position of the first step structure, the second step structure constitutes the second limiting portion, the second step structure comprises a third step surface and a fourth step surface connected with each other, the third step surface is connected with the side surface of the vapor chamber, the side surface of the vapor chamber is connected with the third surface, and the fourth step surface is connected with the fourth surface. The first step surface is opposite to the side surface of the vapor chamber, the second step surface is opposite to the third step surface, and the fourth step surface is opposite to the side wall surface of the hollow structure.

5. The electronic device of claim 3, wherein, The hollow structure comprises a first side wall surface and a second side wall surface opposite to each other, and the first limiting portion is arranged on the first side wall surface and the second side wall surface.

6. The electronic device of claim 2, wherein, The middle frame comprises a support portion and a frame arranged on the edge of the support portion, the support portion comprises the first surface and the second surface opposite to each other, the hollow structure is arranged on the support portion, the frame forms a first accommodating groove with the first surface, the mainboard is arranged in the first accommodating groove, the frame forms a second accommodating groove with the second surface, and the battery assembly is arranged in the second accommodating groove.

7. The electronic device of any one of claims 1 to 6, wherein, The electronic device further comprises: a first adhesive layer arranged between the mainboard and the vapor chamber to connect the mainboard and the vapor chamber; a second adhesive layer arranged between the vapor chamber and the hard shell to connect the vapor chamber and the hard shell.

8. The electronic device of claim 7, wherein, The first adhesive layer is a heat-conducting gel; and / or The second adhesive layer is a heat-conducting double-sided adhesive tape.

9. The electronic device of any one of claims 1 to 6, wherein, The uniform heating plate comprises a first plate block and a second plate block connected with each other, the first plate block and the second plate block are arranged in a staggered manner, the first plate block is connected with the main plate, and the second plate block is connected with the hard shell.

10. The electronic device of any one of claims 1 to 6, wherein, The hard shell comprises a steel structure.

Images