High-speed circuit board convenient for heat dissipation

Abstract

The utility model relates to a high-speed circuit board, in particular to a high-speed circuit board convenient for heat dissipation. Comprising a high-speed circuit board, a heat dissipation plate and a heat dissipation frame, the high-speed circuit board is arranged at the top end of the heat dissipation frame, the heat dissipation plate is arranged at the top end of the high-speed circuit board, a plurality of rectangular openings are formed in the heat dissipation plate, a plurality of ventilation openings are formed in the high-speed circuit board, and the ventilation openings correspond to the openings of the heat dissipation plate respectively. Heat dissipation of the high-speed circuit board is achieved by installing the heat dissipation plate and the heat dissipation frame, the copper substrate is adopted as the material of the high-speed circuit board, the heat dissipation effect of the high-speed circuit board can be greatly improved, heat in the heat dissipation frame can be taken away by cooling liquid in the cooling water pipe, and heat dissipation efficiency is improved. The heat dissipation openings and the ventilation openings can take away part of heat through flowing of air.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of high-speed circuit board, specifically to a kind of high-speed circuit board of convenient heat dissipation. BACKGROUND

[0002] High-speed circuit board, also known as high-speed PCB or high-frequency PCB, is a printed circuit board designed for efficient handling of high-speed signal transmission. With the rapid development of technology in the fields of communication, computer, data storage and consumer electronics, the demand for signal transmission speed and data processing capacity is increasing, thus promoting the widespread application and development of high-speed circuit board.

[0003] With the progress of modern science and technology, the number of electronic components integrated on the circuit board is increasing, and the heat generated by the circuit board during operation is also significantly increasing, which puts higher requirements on the heat dissipation performance of the circuit board. Although traditional heat dissipation methods, such as natural convection using natural air flow to carry away heat, or forced air cooling through fan devices to force air flow to improve heat dissipation efficiency, are effective for general circuit boards. However, for high-speed circuit boards, these methods often fail to meet their heat dissipation needs. SUMMARY

[0004] In order to overcome the shortcomings of existing circuit boards using natural air flow to carry away heat or forced air cooling for high-speed circuit board heat dissipation, but the effect is not good, the purpose of the utility model is to provide a kind of high-speed circuit board of convenient heat dissipation.

[0005] The technical solution of the utility model is: a kind of high-speed circuit board of convenient heat dissipation, including high-speed circuit board, heat dissipation plate and heat dissipation frame, the top of heat dissipation frame is equipped with high-speed circuit board, the top of high-speed circuit board is equipped with heat dissipation plate, a plurality of rectangular openings are provided on heat dissipation plate, a plurality of ventilation openings are provided on high-speed circuit board, and ventilation openings correspond to openings of heat dissipation plate respectively.

[0006] As a preferred technical solution of the utility model, it further includes a cooling auxiliary mechanism, which includes a cooling water pipe, an inlet pipe and an outlet pipe, slots are opened on the front and rear left and right four end faces of the heat dissipation frame, and the cooling water pipe is arranged in the slots, the outlet pipe and the inlet pipe are arranged on the left end of the heat dissipation frame, and the right ends of the outlet pipe and the inlet pipe are connected with the cooling water pipe.

[0007] As a preferred technical solution of the utility model, the high-speed circuit board is a copper substrate.

[0008] As a preferred technical solution of the utility model, the heat dissipation frame is made of copper as the basic material.

[0009] As a preferred technical solution of the utility model, the heat dissipation plate is provided with a positioning groove in the circumferential direction, and the high-speed circuit board is provided with a protrusion matched with the positioning groove in the circumferential direction.

[0010] As a preferred technical scheme of the utility model, the four sides of the heat dissipation frame are provided with heat dissipation openings at intervals, and the heat dissipation openings penetrate the heat dissipation frame.

[0011] Beneficial effects: the utility model discloses through install heat dissipation plate and heat dissipation frame to realize the heat dissipation of high speed circuit board, adopt copper substrate as the material of high speed circuit board, can greatly improve the heat dissipation effect of high speed circuit board. The cooling liquid in the cooling water pipe can take away the heat in the heat dissipation frame, and the heat dissipation opening and the ventilation opening can take away part of the heat through the flow of air. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the three-dimensional structure schematic view of the utility model.

[0013] Figure 2 It is the three-dimensional structure schematic view of the heat dissipation frame, heat dissipation opening and cooling water pipe of the utility model.

[0014] Figure 3 It is the three-dimensional structure schematic view of the cooling water pipe, water inlet pipe and water outlet pipe of the utility model.

[0015] Figure 4 It is the sectional view of the cooling water pipe of the utility model.

[0016] Marked as in the drawing: 1, high speed circuit board, 2, ventilation opening, 3, heat dissipation plate, 4, heat dissipation frame, 5, heat dissipation opening, 6, cooling water pipe, 7, water inlet pipe, 8, water outlet pipe. DETAILED DESCRIPTION

[0017] The utility model will be further described in detail below in combination with the drawings and specific embodiments, but not limit the protection scope and application scope of the utility model.

[0018] A kind of high speed circuit board of convenient heat dissipation, as shown in Figures 1-3 It includes high speed circuit board 1, heat dissipation plate 3 and heat dissipation frame 4, heat dissipation frame 4 adopts copper as basic material, copper is a kind of metal with excellent heat conductivity, the four sides of heat dissipation frame 4 are provided with heat dissipation opening 5 at intervals, heat dissipation opening 5 penetrates heat dissipation frame 4, and part of the heat can be taken away by the flow of air through heat dissipation opening 5, the top of heat dissipation frame 4 is equipped with high speed circuit board 1, high speed circuit board 1 is copper substrate, and copper substrate has good thermal conductivity, the periphery of heat dissipation plate 3 is provided with positioning groove, and the periphery of high speed circuit board 1 is provided with the protrusion matched with the positioning groove, the top of high speed circuit board 1 is equipped with heat dissipation plate 3, and heat dissipation plate 3 can improve the heat dissipation effect of high speed circuit board 1, a plurality of rectangular openings are provided on heat dissipation plate 3, a plurality of ventilation openings 2 are provided on high speed circuit board 1, and ventilation openings 2 correspond to the openings of heat dissipation plate 3 respectively.

[0019] As shown in Figure 3 And Figure 4As shown, the cooling auxiliary mechanism comprises a cooling water pipe 6, a water inlet pipe 7 and a water outlet pipe 8, grooves are formed on the front and rear left and right four end faces of the heat dissipation frame 4, the cooling water pipe 6 is arranged in the grooves, the water outlet pipe 8 and the water inlet pipe 7 are arranged on the left end of the heat dissipation frame 4, the right ends of the water outlet pipe 8 and the water inlet pipe 7 are connected with the cooling water pipe 6, when the heat generated by the high-speed circuit board 1 is conducted to the heat dissipation frame 4, the cooling liquid in the cooling water pipe 6 can take away the heat in the heat dissipation frame 4, and the water outlet pipe 8 and the water inlet pipe 7 can be externally connected with the cooling liquid equipment.

[0020] The water outlet of the water inlet pipe 7 is externally connected with the water outlet of the cooling equipment, the water inlet of the water outlet pipe 8 is externally connected with the water inlet of the cooling liquid equipment, a fan or other refrigeration equipment should be externally connected above the ventilation opening 2, the cooling liquid equipment is opened, the high-speed circuit board 1 is in the working state, the high-speed circuit board 1 generates a large amount of heat, a part of the heat is taken away by the air through the heat dissipation plate 3, a part of the heat is taken away by the refrigeration equipment above the ventilation opening 2, a part of the heat is conducted to the heat dissipation frame 4 and taken away through the heat dissipation opening 5, the cooling liquid enters the cooling water pipe 6 through the water inlet pipe 7, flows out from the water outlet pipe 8 after passing through the periphery of the heat dissipation frame 4, and returns to the cooling equipment, in the process, the cooling liquid continuously takes away the heat in the heat dissipation frame 4, when the equipment connected with the high-speed circuit board 1 is not working, the cooling liquid equipment is closed, and when the heat dissipation plate 3 is installed, the positioning groove on the heat dissipation plate 3 is sleeved outside the protrusion on the high-speed circuit board 1, so that the heat dissipation plate 3 can be conveniently positioned.

[0021] Although the utility model has been described with reference to the example embodiment, it should be understood that the utility model is not limited to the disclosed example embodiment. The scope of the following claims should be given the broadest interpretation so as to encompass all variations and equivalent structures and functions.

Claims

1. A high-speed circuit board with convenient heat dissipation, characterized in that: The application relates to a high-speed circuit board cooling device, which comprises a high-speed circuit board (1), a heat dissipation plate (3) and a heat dissipation frame (4), the top end of the heat dissipation frame (4) is provided with the high-speed circuit board (1), the top end of the high-speed circuit board (1) is provided with the heat dissipation plate (3), a plurality of rectangular openings are arranged on the heat dissipation plate (3), a plurality of ventilation openings (2) are arranged on the high-speed circuit board (1), and the ventilation openings (2) correspond to the openings of the heat dissipation plate (3) respectively.

2. The high speed circuit board of claim 1, wherein: The application further comprises a cooling auxiliary mechanism, which comprises cooling water pipes (6), water inlet pipes (7) and water outlet pipes (8), grooves are formed on the front and back and left and right four end faces of the heat dissipation frame (4), the cooling water pipes (6) are arranged in the grooves, the water outlet pipes (8) and the water inlet pipes (7) are arranged on the left end of the heat dissipation frame (4), and the right ends of the water outlet pipes (8) and the water inlet pipes (7) are connected with the cooling water pipes (6).

3. The high-speed circuit board with convenient heat dissipation as described in claim 2, characterized in that: The high-speed circuit board (1) is a copper substrate.

4. A high-speed circuit board with convenient heat dissipation as described in claim 3, characterized in that: The heat dissipation frame (4) is made of copper as a basic material.

5. A high-speed circuit board with convenient heat dissipation as described in claim 4, characterized in that: The heat dissipation plate (3) is provided with positioning grooves in the circumferential direction, and the high-speed circuit board (1) is provided with protrusions matched with the positioning grooves in the circumferential direction.

6. A high speed circuit board with convenient heat dissipation as claimed in claim 5, wherein: The heat dissipation frame (4) is provided with heat dissipation openings (5) at intervals around the heat dissipation frame (4), and the heat dissipation openings (5) penetrate through the heat dissipation frame (4).

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